IR3883MTRPBF - 3A 800kHz Integrated POL Buck Regulator | Infineon
MPN: IR3883MTRPBF β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.85 | $1.85 |
| 10 | $1.66 | $16.60 |
| 100 | $1.42 | $142.00 |
| 500 | $1.18 | $590.00 |
| 1,000 | $0.98 | $980.00 |
IR3883MTRPBF Overview
A buck converter (step-down switching regulator) is a DC-DC power topology that efficiently reduces a higher input voltage to a lower regulated output voltage by chopping the input with a high-side switch and smoothing the result through an LC filter. Compared with linear regulators, switching bucks dissipate far less power at large VIN-VOUT deltas, making them the preferred choice for high-current POL rails. The IR3883MTRPBF sits within the family of integrated POL regulators (Point-of-Load ICs) in the broader power management IC category, where the controller, gate drivers, and power MOSFETs are co-packaged for minimum footprint and design simplicity.
Key differentiating features include Infineon's Enhanced Stability (EaSy) engine, which provides loop compensation without external RC networks and allows the use of all-ceramic output capacitors. The on-chip PWM controller plus monolithic MOSFETs form a complete synchronous buck in a 3 x 3 mm PQFN footprint, enabling high power density. Internal 5 V LDO bias supports single-rail operation, and built-in protection features (OCP, OVP, UVLO, thermal shutdown) increase system robustness.
The architecture uses voltage-mode control with the EaSy compensation scheme to maintain stable operation across load and temperature variations. Synchronous rectification replaces the external Schottky diode with a low-side MOSFET, achieving higher efficiency than asynchronous buck topologies at light loads due to diode conduction loss elimination. The 800 kHz switching frequency is a deliberate balance between inductor size and switching loss.
Typical applications include server and telecom POL rails, FPGA and ASIC core supplies, networking switch point-of-load conversion, DDR memory VTT rails, and industrial embedded computing modules. Its small footprint and high efficiency make it well suited for space-constrained boards where multiple POL voltages are required.
When designing with the IR3883MTRPBF, place a 2.2 uF low-ESR ceramic bypass close to the VCC pin and follow Infineon's recommended inductor and output capacitor selections to remain within the EaSy stability envelope. For single-rail operation, connect VIN to PVIN directly; for an external bias, tie VIN to VCC to bypass the internal LDO.
This page synthesizes distributor pricing, drop-in compatible alternatives, and practical design notes not consolidated on the manufacturer datasheet alone.
Drop-in alternatives for IR3883MTRPBF β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
IR3883MTR1PBF
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
IR3894MTRPBF
β Drop-Inπ Reference alternative (not in catalog)
IR3895MTRPBF
β Drop-Inπ Reference alternative (not in catalog)
IR3883MTRPBF Maximum Ratings & Electrical Characteristics
| Topology | Synchronous Buck (Step-Down) |
| Output Current | 3 A |
| Switching Frequency | 800 kHz (fixed) |
| Control Method | Voltage-mode PWM with EaSy stability engine |
| Integrated MOSFETs | Yes (high-side + low-side synchronous) |
| Output Type | Adjustable |
| Internal Bias LDO | 5 V (supports single-rail operation) |
| Compensation | Internal (EaSy engine, no external RC) |
| Output Capacitor Type | All-ceramic supported |
| VCC Bypass Requirement | 2.2 uF low-ESR ceramic close to VCC pin |
| Package | PQFN-16L (3 x 3 mm) |
| Mounting Type | Surface Mount |
| Protection Features | OCP, OVP, UVLO, Thermal Shutdown |
| RoHS Status | Compliant |
IR3883MTRPBF Pin Configuration
| Pin 1 | PGND β Power ground return for the synchronous low-side MOSFET |
| Pin 2 | SW β Switch node - connects to the output inductor |
| Pin 3 | SW β Switch node (parallel pin to reduce conduction loss) |
| Pin 4 | BOOT β Bootstrap capacitor node for high-side gate drive |
| Pin 5 | VIN β Internal LDO input supply |
| Pin 6 | VCC β Internal 5V LDO output; bypass with 2.2uF ceramic |
| Pin 7 | EN/PGOOD β Enable input / Power Good output (multi-function) |
| Pin 8 | FB β Feedback (connect to VOUT resistor divider) |
| Pin 9 | VOSNS β Voltage output sense (remote sense) |
| Pin 10 | AGND β Analog ground - quiet reference for control circuits |
| Pin 11 | NC β Not connected (per datasheet) |
| Pin 12 | PGND β Power ground (exposed pad/secondary) |
| Pin 13 | PVIN β Power input voltage to high-side MOSFET |
| Pin 14 | PVIN β Power input voltage (parallel pin) |
| Pin 15 | PVIN β Power input voltage (parallel pin) |
| Pin 16 | PGND β Power ground (parallel pin) |
Typical Applications
IR3883MTRPBF is suitable for 6 applications: Server and Datacenter Point-of-Load Rails, FPGA and ASIC Core Voltage Supplies, Networking Switch and Router POL Conversion, DDR Memory VTT Rails, Industrial Embedded Computing Modules, Telecom Baseband and Radio Card Supplies.
Server and Datacenter Point-of-Load Rails
The IR3883MTRPBF fits 3 A POL rails on server motherboards because its 800 kHz switching frequency keeps the output ripple small with a sub-1 uH inductor and ceramic capacitors, while the integrated high-side and low-side MOSFETs eliminate the external FET layout step. The 0.5 V minimum output covers modern CPU, ASIC, and DDR memory core voltages, and the EaSy engine holds the control loop stable across transient load steps typical of server workloads. In a 12 V bus architecture the IR3883 sits close to the load and replaces a discrete controller-plus-FET design with a 3 x 3 mm PQFN footprint, freeing PCB area for additional memory channels.
Recommended
FPGA and ASIC Core Voltage Supplies
For FPGA and ASIC core rails the IR3883MTRPBF delivers 0.5 V to a few volts at up to 3 A from a 5 V or 12 V input. The 800 kHz fixed frequency combined with internal MOSFETs and EaSy compensation produces a clean, fast-transient rail that meets FPGA data-sheet ripple and load-step requirements without external compensation parts. Designers typically place the IR3883 directly beneath or adjacent to the FPGA to minimize the high-current power path inductance, and pair it with a small multi-layer ceramic output filter.
Recommended
Networking Switch and Router POL Conversion
In networking line cards, the IR3883MTRPBF powers PHY ICs, switch ASICs, and DDR memory from a 3.3 V or 5 V intermediate bus. Its 3 A capability covers typical PHY plus switch ASIC loads, and the PQFN-16L 3 x 3 mm footprint allows high-density POL placement behind high-pin-count BGAs. The internal EaSy engine simplifies qualification by removing compensation tuning from the design checklist, an important consideration for high-volume networking production.
Recommended
DDR Memory VTT Rails
The IR3883MTRPBF can source DDR memory VTT termination voltage at 3 A. Although VTT is typically a sinking/sourcing linear requirement, the IR3883's adjustable output down to 0.5 V and tight load regulation make it a viable POL source feeding a VTT LDO. The 800 kHz frequency keeps the switching noise well above DDR's baseband frequencies, and the small PQFN package allows the VTT generator to be placed near the DIMM connector.
Recommended
Industrial Embedded Computing Modules
Industrial COM (Computer-on-Module) and SBC designs use the IR3883MTRPBF to derive core voltages for SoCs and FPGAs from a wide 5 V to 12 V input bus. The device's OCP, OVP, UVLO, and thermal shutdown protections align with industrial reliability expectations, and the EaSy engine keeps the BOM small even when designs scale across multiple SKUs. The PQFN-16L package is compatible with standard reflow profiles used in industrial PCB assembly.
Recommended
Telecom Baseband and Radio Card Supplies
In telecom radio cards, the IR3883MTRPBF supplies baseband DSPs and mixed-signal ICs from a 5 V rail. The 800 kHz switching frequency sits well above the baseband signal band, simplifying EMI filtering, and the integrated MOSFETs minimize radiated emissions by eliminating long external power loops. The PQFN-16L 3 x 3 mm footprint supports dense layout around RF shielding cans without violating keep-out zones.
Recommended
Recommended Products Summary
Engineering reference data for IR3883MTRPBF β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | IR3883MTR1PBF | IR3894MTRPBF | IR3895MTRPBF |
|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon |
| Package | PQFN-16L (3 x 3 mm) | PQFN-16L (3 x 3 mm) | PQFN-16L (3 x 3 mm) | PQFN-16L (3 x 3 mm) |
| Topology | Synchronous Buck | Synchronous Buck | Synchronous Buck | Synchronous Buck |
| Output Current | 3 A | 3 A | 4 A | 16 A |
| Min Output Voltage | 0.5 V | 0.5 V | 0.5 V | 0.5 V |
| Integrated MOSFETs | Yes (HS + LS) | Yes (HS + LS) | Yes (HS + LS) | Yes (HS + LS) |
| Compensation | Internal EaSy | Internal EaSy | Internal | Internal |
| Approx. Unit Price (1 pc, USD) | 1.85 | 1.85 | 2.10 | 3.50 |
Key Differentiators
- Highest-current SupIRBuck in the PQFN-16L 3x3 footprint at 800 kHz (vs IR3894MTRPBF)
- Smallest footprint 3 A integrated POL buck in the Infineon SupIRBuck family (vs IR3895MTRPBF)
- EaSy engine eliminates external compensation RC tuning (vs Generic discrete buck controller plus external FETs)
Design Notes
Place the 2.2 uF low-ESR ceramic VCC bypass capacitor as close as physically possible to the VCC pin, with the ground return going directly to the AGND/PGND copper pour. Keep the SW node copper area minimal to reduce radiated EMI, and place the input ceramic capacitors adjacent to the PVIN pins with wide, short traces. The exposed thermal pad must be soldered to a continuous ground copper pour to achieve the rated thermal performance.
Estimated: at PVIN=12 V, VOUT=3.3 V, IOUT=3 A, the regulator's efficiency is approximately 90%, yielding about 2.2 W of internal dissipation. With a PQFN-16L 3 x 3 mm package on a 1 oz 4-layer board with a 1 sq inch copper pour, theta_JA is roughly 45 C/W, producing a junction temperature rise near 99 C above ambient. For operation above 70 C ambient, increase the copper pour area or reduce PVIN-VOUT delta to keep Tj within the rated limit.
Do not omit the BOOT bootstrap capacitor or use a value below the datasheet recommendation; undersized BOOT capacitance causes high-side gate-drive starvation and efficiency loss. For single-rail operation connect VIN directly to PVIN; if an external 5 V bias is available, tie VIN to VCC to bypass the internal LDO and reduce internal dissipation. Avoid routing sensitive analog traces (FB, VOSNS) near the SW node to prevent switching noise injection into the feedback path.
Compliance Information
RoHS and lead-free confirmed per Infineon product page. Halogen-free status not stated in provided data - [DATA_NEEDED]. Not AEC-Q100 qualified - this is a commercial/industrial grade part.
