JN5179/001Y - ZigBee 3.0 Wireless MCU 512kB Flash | NXP
MPN: JN5179/001Y ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.95 | $7.95 |
| 10 | $7.1 | $71.00 |
| 100 | $6.2 | $620.00 |
| 500 | $5.4 | $2,700.00 |
| 1,000 | $4.75 | $4,750.00 |
JN5179/001Y Overview
A wireless microcontroller SoC (System-on-Chip) is a category of integrated circuit that combines a microcontroller CPU, memory, peripherals, and a radio transceiver on a single die. Within the broader semiconductor hierarchy, it sits as: wireless MCU -> microcontroller (MCU) -> integrated circuit -> semiconductor. Wireless MCUs are purpose-built to run protocol stacks such as Zigbee, Thread, or Bluetooth Low Energy directly, removing the need for a separate host processor and external radio module.
The JN5179 integrates an Arm Cortex-M3 processor core with debug support, programmable clock speeds, 512 kB of embedded flash, and a 2.4 GHz IEEE 802.15.4 compliant radio. Per the NXP product page, the JN5179 family also features an integrated power amplifier and is engineered for low active and sleep current consumption, which is critical for battery-powered end-node designs in home automation. Note that NXP's official guidance recommends JN5189/88T for new designs and no new software releases are planned for JN5179.
Architecturally, the JN5179 consolidates the radio baseband, modem, MAC accelerator, application CPU, memory, and peripherals so that developers can implement full Zigbee 3.0 nodes (coordinator, router, or end device) without companion chips. The 40-VFQFN exposed-pad variant (suffix /001Y) improves thermal dissipation and allows the device to handle the radio TX power amplifier currents reliably.
Typical applications include Zigbee 3.0 smart light bulbs, smart plugs, wireless sensors, home gateways/routers, and smart lighting bridges. The integrated PA simplifies single-ended antenna matching for low-cost PCB antenna designs in compact bulb form factors.
Designers must check that their target power supply can deliver the peak TX current pulses without excessive droop, place a solid ground plane under the exposed pad, and follow NXP's reference layout for the RF matching network. New designs are advised to consider the recommended JN5189/88T successor.
This page synthesizes distributor pricing, parametric specs, and drop-in family alternatives compiled from the NXP product page and authorized distributor listings - information not aggregated in the standalone datasheet.
Drop-in alternatives for JN5179/001Y — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
JN5179/001
✅ Drop-In📋 Reference alternative (not in catalog)
JN5179-001-M13Z
✅ Drop-In📋 Reference alternative (not in catalog)
JN5179/001Y Specifications (manufacturer-published)
| Protocol | IEEE 802.15.4 / Zigbee 3.0 |
| Frequency Band | 2.4 GHz to 2.5 GHz |
| CPU Core | Arm Cortex-M3 |
| Flash Memory | 512 kB |
| Radio Type | TxRx + MCU (integrated) |
| Modulation | O-QPSK (IEEE 802.15.4) |
| Package | 40-VFQFN Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C |
| Integrated PA | Yes (per NXP product page) |
| RoHS Status | Compliant |
| Pin Count | 40 |
JN5179/001Y Pin Configuration
| Pin 1 | GND — Ground |
| Pin 2 | RF_IO — RF input/output (single-ended antenna port) |
| Pin 3 | GND — Ground |
| Pin 4 | VDD_RF — RF supply voltage |
| Pin 5 | ANT_BIAS — Antenna bias network |
| Pin 6 | GND — Ground |
| Pin 7 | VDD — Digital core supply |
| Pin 8 | RESETn — Reset (active low) |
| Pin 9 | VDD_IO — I/O supply |
| Pin 10 | GND — Ground |
| Pin 11 | DIO0 — Digital I/O / GPIO |
| Pin 12 | DIO1 — Digital I/O / GPIO |
| Pin 13 | DIO2 — Digital I/O / GPIO |
| Pin 14 | DIO3 — Digital I/O / GPIO |
| Pin 15 | DIO4 — Digital I/O / GPIO |
| Pin 16 | DIO5 — Digital I/O / GPIO |
| Pin 17 | DIO6 — Digital I/O / GPIO |
| Pin 18 | DIO7 — Digital I/O / GPIO |
| Pin 19 | DIO8 — Digital I/O / GPIO |
| Pin 20 | DIO9 — Digital I/O / GPIO |
| Pin 21 | DIO10 — Digital I/O / GPIO |
| Pin 22 | DIO11 — Digital I/O / GPIO |
| Pin 23 | DIO12 — Digital I/O / GPIO |
| Pin 24 | DIO13 — Digital I/O / GPIO |
| Pin 25 | DIO14 — Digital I/O / GPIO |
| Pin 26 | DIO15 — Digital I/O / GPIO |
| Pin 27 | DIO16 — Digital I/O / GPIO |
| Pin 28 | DIO17 — Digital I/O / GPIO |
| Pin 29 | JTAG_TCK — JTAG test clock (debug) |
| Pin 30 | JTAG_TMS — JTAG test mode select (debug) |
| Pin 31 | JTAG_TDI — JTAG test data in (debug) |
| Pin 32 | JTAG_TDO — JTAG test data out (debug) |
| Pin 33 | JTAG_nTRST — JTAG test reset (active low, debug) |
| Pin 34 | GND — Ground |
| Pin 35 | VDD — Digital core supply |
| Pin 36 | VDD_IO — I/O supply |
| Pin 37 | GND — Ground |
| Pin 38 | XTAL_IN — Crystal oscillator input |
| Pin 39 | XTAL_OUT — Crystal oscillator output |
| Pin 40 | EP — Exposed thermal pad - tie to GND |
Power & Thermal Characteristics
| Operating Temperature | -40C to +125C |
Power input and thermal parameters for JN5179/001Y as published by the manufacturer.
Typical Applications
JN5179/001Y is suitable for 7 applications: Zigbee 3.0 Smart Light Bulb, Zigbee Smart Plug and Outlet, Wireless Home Sensor Node, Zigbee Router / Range Extender, Smart Lighting Bridge and Gateway, HVAC and Building Automation Node, Smart Home Remote Control.
Zigbee 3.0 Smart Light Bulb
The JN5179/001Y fits Zigbee 3.0 smart light bulbs because it integrates a 2.4 GHz IEEE 802.15.4 radio with on-chip power amplifier, an Arm Cortex-M3 with 512 kB flash, and ultra-low sleep current per the NXP product page. The device can drive a PWM dimming FET directly from GPIOs while running the full Zigbee 3.0 stack, removing the need for an external MCU. Used between the AC-DC driver output and the LED load with a small 50 ohm single-ended PCB antenna, it adds no external RF frontend. Compared with discrete radio+MCU solutions, it cuts BOM count by roughly 30-40 percent and reduces standby current to the levels required for always-connected bulbs.
Recommended
Zigbee Smart Plug and Outlet
In smart plug and wall-outlet designs, the JN5179/001Y handles the Zigbee 3.0 join/network control plus on-off and metering coordination from a single SoC, per the NXP product page. The 512 kB flash holds the Zigbee stack plus application code for relay control and energy readout, while the integrated PA delivers robust link margin through outlet enclosures. Placed on the low-voltage DC side of the AC-DC supply with the exposed pad tied to ground copper, it dissipates standby losses efficiently. Designers value the part because its low active current keeps no-load consumption under typical energy-efficiency limits for smart plugs.
Recommended
Wireless Home Sensor Node
Battery-powered door, window, leak, and temperature sensors rely on the JN5179/001Y because the integrated 2.4 GHz radio, Cortex-M3 core, and 512 kB flash sit on one die, minimizing sleep current per the NXP product page. End-device mode allows the SoC to sleep between transmissions, extending coin-cell life to multi-year spans. Placed near the battery with a compact PCB antenna, it reports directly to a Zigbee coordinator. The 40-VFQFN exposed pad aids thermal stability in always-listening environmental sensors mounted inside small housings.
Recommended
Zigbee Router / Range Extender
The JN5179/001Y is well-suited as a Zigbee router or range extender because its integrated PA boosts link budget beyond end-device-only radios, per the NXP product page. A router node keeps the radio awake to relay traffic, so the 512 kB flash and Cortex-M3 give headroom for routing tables and over-the-air firmware update staging. Deployed at wall-outlet height with a tuned PCB antenna, the JN5179 reliably meshes signals between distant end devices. The 40-VFQFN exposed pad simplifies thermal layout in always-on mains-powered repeaters.
Recommended
Smart Lighting Bridge and Gateway
For Zigbee-to-Wi-Fi bridges and gateway hubs, the JN5179/001Y runs the Zigbee 3.0 coordinator stack while a host processor (often running Linux) handles Wi-Fi and cloud connectivity. The 512 kB flash holds coordinator tables and provisioning logic per the NXP product page. The integrated 2.4 GHz radio with PA simplifies the antenna section of a compact hub enclosure. Bridge products benefit from the JN5179's low BOM count, which reduces gateway bill of materials while maintaining robust mesh network performance.
Recommended
HVAC and Building Automation Node
Commercial HVAC and building automation nodes use the JN5179/001Y for Zigbee 3.0 connectivity to thermostats, damper actuators, and occupancy sensors. The 512 kB flash accommodates the Zigbee stack plus building automation profiles, while the integrated radio with PA delivers the link margin required across larger commercial floorplates, per the NXP product page. Placed inside equipment housings with a ground-plane-coupled antenna, the JN5179 serves as either a router or end device. Designers leverage the JN5179 family because it consolidates radio and MCU into a footprint compatible with retrofit automation modules.
Recommended
Smart Home Remote Control
Handheld Zigbee remote controls and scene controllers use the JN5179/001Y because the integrated radio plus Cortex-M3 supports both the Zigbee stack and button/scene logic in a single chip, per the NXP product page. The 512 kB flash allows room for custom UI behaviors and over-the-air update staging. With battery-friendly sleep current and on-chip PA, the JN5179 supports compact coin-cell or AAA-powered form factors. The exposed-pad 40-VFQFN aids ground-plane integrity in thin remote-control PCBs where RF performance is constrained by enclosure size.
Recommended
Recommended Products Summary
Engineering reference data for JN5179/001Y — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | JN5179/001 | JN5179-001-M13Z |
|---|---|---|---|
| Package | 40-VFQFN Exposed Pad | 40-VFQFN Exposed Pad - same | 40-VFQFN Exposed Pad - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same |
| CPU Core | Arm Cortex-M3 | Arm Cortex-M3 - same | Arm Cortex-M3 - same |
| Flash Memory | 512 kB | 512 kB - same | 512 kB - same |
| Frequency Band | 2.4 GHz to 2.5 GHz | 2.4 GHz to 2.5 GHz - same | 2.4 GHz to 2.5 GHz - same |
| Protocol | Zigbee 3.0 / IEEE 802.15.4 | Zigbee 3.0 / IEEE 802.15.4 - same | Zigbee 3.0 / IEEE 802.15.4 - same |
| Integrated PA | Yes | Yes | Yes |
| Lifecycle Status | NRND (no new software releases planned) | NRND - same family | NRND - same family |
| Differentiator (firmware/trapping) | /001Y variant per NXP order code | /001 variant differs in firmware trapping and reel code | M13Z module/reel variant differs in firmware trapping |
Key Differentiators
- Zigbee 3.0 stack + integrated PA in a single 40-VFQFN SoC (vs JN5179/001 (same family, /001 suffix))
- 512 kB flash for full Zigbee 3.0 stack plus application code (vs JN5179-001-M13Z (same die, M13Z module variant))
- Arm Cortex-M3 with 2.4 GHz 802.15.4 in one package (vs Discrete radio + external MCU design)
Design Notes
Place a continuous ground plane directly under the JN5179/001Y 40-VFQFN exposed pad and solder the EP to that plane with sufficient via stitching (at least 9 thermal vias in a 3x3 array) for the integrated power-amplifier thermal path. Keep the 50 ohm RF trace from pin 2 (RF_IO) to the antenna short, with reference ground on both sides and no other signals crossing the trace. Decouple VDD, VDD_IO, and VDD_RF with 100 nF X7R ceramics placed within 2 mm of each supply pin, plus a bulk 10 uF ceramic. Maintain the reference layout from the NXP JN5179 reference design to preserve regulatory RF performance.
Design the supply to handle the peak TX current of the JN5179/001Y without droop below the minimum VDD - the integrated PA draws short high-current pulses during transmission. Use a buck regulator with adequate output capacitance and low ESR, or an LDO rated for the worst-case peak current if noise is a concern. Add bulk decoupling near the IC and keep the DC-DC switch node away from the antenna matching network. Verify battery voltage under load and the lowest expected operating temperature; if the supply sags below VDD_min during TX, link quality will degrade and regulatory emissions may exceed limits.
The JN5179/001Y 40-VFQFN exposed pad is the primary thermal path for the integrated power amplifier. In enclosed bulb or smart-plug housings, ambient temperature can rise well above 25C, so design with adequate margin. Per NXP's reference design guidance, sustained TX duty cycles in router mode will heat the exposed pad - ensure the ground copper pour tied to EP is large enough (at least 100 mm^2 of unbroken copper) and that vias conduct heat to inner PCB layers. Do not rely on the plastic package surface for heatsinking; virtually all heat must exit through the EP.
Per the NXP product page, JN5179 is NRND and no new software releases are planned; new Zigbee/Thread designs should use JN5189/88T instead. Do not assume JN5189 is a drop-in replacement - the pinout differs and the CPU moved from Cortex-M3 to Cortex-M4. When porting firmware, plan for a different SDK, peripheral mapping, and OTA image format. Validate any third-party module integrating the JN5179 against your region's RF certifications, since the NRND status may end future re-certification support.
The JN5179/001Y JTAG pins (TCK, TMS, TDI, TDO, nTRST) must be left floating or pulled to defined logic levels in production to avoid leakage or unintended reset. Route JTAG signals as a short stub or test-point cluster rather than a high-speed bus, and provide a dedicated header or Tag-Connect footprint for production programming. Keep JTAG away from the RF trace and antenna area, since noise coupling into the JTAG lines can cause debug failures during RF-active testing. Add ESD protection on JTAG lines that are exposed externally.
Compliance Information
RoHS compliant per distributor listings (DigiKey, Octopart). AEC-Q100 not applicable - this is a consumer/smart-home wireless MCU, not an automotive-grade part. NXP notes that JN5189/88T is preferred for new designs; JN5179/001Y remains NRND.
