K4VCF325ZC-SC28 - 24Gb GDDR7 28Gbps DRAM | Samsung
MPN: K4VCF325ZC-SC28 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10.5 | $10.50 |
| 10 | $10.2 | $102.00 |
| 100 | $9.8 | $980.00 |
| 500 | $9.4 | $4,700.00 |
| 1,000 | $9 | $9,000.00 |
K4VCF325ZC-SC28 Overview
GDDR7 (Graphics Double Data Rate 7) is the seventh generation of Samsung's GDDR DRAM family, a high-bandwidth memory class optimized for GPU frame buffers, AI accelerators, and high-performance computing. Within the memory hierarchy, GDDR7 sits alongside HBM as a graphics-oriented DRAM, prioritizing per-pin data rate and cost efficiency over the ultra-wide bus of HBM stacks.
Key features of the K4VCF325ZC-SC28 include its 28 Gbps per-pin data rate (3500 MHz nominal clock with PAM3 signaling, per Samsung's GDDR7 architecture), 24 Gbit density in a single die-class package, and the standard 266-ball FBGA footprint shared with Samsung's 16 Gbit K4VAF325ZC GDDR7 family. This footprint compatibility simplifies migration between 2 GB and 3 GB chips on GPU boards designed for the SC28 speed grade.
Technically, GDDR7 moves from NRZ/PAM4-era signaling to PAM3 encoding, transmitting 1.5 bits per cycle to reach 28 Gbps-class effective rates while improving power efficiency per transferred bit compared with GDDR6 at equivalent bandwidth. The -SC28 speed suffix denotes the 28 Gbps bin; Samsung also ships SC32 and SC36 bins in the same family for higher-bandwidth GPU designs.
Typical applications include gaming and professional GPU VRAM, AI inference accelerator frame buffers, workstation graphics, and high-bandwidth memory subsystems where 3 GB per chip enables denser VRAM arrays without increasing package count.
Design consideration: the -SC28 speed grade is the slowest bin in the K4VCF325ZC family; designs targeting 32 Gbps or 36 Gbps must specify SC32 or SC36 SKUs, and PCB signal-integrity margins must be validated for the PAM3 eye at the intended data rate.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design guidance not consolidated in Samsung's official product pages.
Drop-in alternatives for K4VCF325ZC-SC28 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4VCF325ZC-SC32
✅ Drop-In📋 Reference alternative (not in catalog)
K4VCF325ZC-SC36
✅ Drop-In📋 Reference alternative (not in catalog)
K4VAF325ZC-SC28
✅ Drop-In📋 Reference alternative (not in catalog)
K4VAF325ZC-SC32
✅ Drop-In📋 Reference alternative (not in catalog)
K4VCF325ZC-SC28 Maximum Ratings & Electrical Characteristics
| Memory Type | GDDR7 SDRAM/SGRAM |
| Density | 24 Gbit (3 GB) |
| Organization | 512M x 32 |
| Data Rate | 28.0 Gbps per pin |
| Package | 266-ball FBGA |
| Speed Grade | SC28 (28 Gbps bin) |
| Manufacturer | Samsung Electronics |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Clock Frequency | 3500 MHz (nominal, per TechPowerUp for SC28 GDDR7 family) |
| Interface | GDDR7 (PAM3 signaling) |
K4VCF325ZC-SC28 266-ball fbga Pin Configuration Guide
Pin configuration for K4VCF325ZC-SC28 (266-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K4VCF325ZC-SC28.
Refer to the datasheet for full pin configuration.
Typical Applications
K4VCF325ZC-SC28 is suitable for 6 applications: Gaming GPU VRAM, AI Inference Accelerators, Professional Workstation Graphics, GPU Board Repair and Upgrade, Edge AI and Vision Systems, High-Performance Computing Memory Subsystems.
Gaming GPU VRAM
The K4VCF325ZC-SC28's 24 Gbit (3 GB) density and 28 Gbps per-pin data rate make it the enabling component for non-power-of-two VRAM configurations such as 12 GB (four chips) and 24 GB (eight chips) on a 128-bit bus. Compared with eight 2 GB K4VAF325ZC chips yielding 16 GB, eight 3 GB chips yield 24 GB on the identical 266-ball FBGA footprint, letting board designers increase capacity without PCB respin. At 28 Gbps, each chip provides up to 112 GB/s of bandwidth on a 32-bit interface, so an eight-chip arrangement delivers roughly 896 GB/s aggregate. Its SC28 speed bin suits mainstream and mid-range GPU segments where the faster SC32/SC36 bins are unnecessary.
Recommended
AI Inference Accelerators
AI inference cards benefit from the K4VCF325ZC-SC28's combination of 3 GB per-chip density and 28 Gbps data rate, which allows 24 GB and larger local frame/model buffers using eight chips on a standard GDDR7 bus. GDDR7's PAM3 signaling improves energy per transferred bit relative to GDDR6 at similar or higher bandwidth, reducing memory subsystem power in datacenter inference deployments. The 512M x 32 organization matches typical GPU-class 32-bit channels, and the SC28 bin's 3500 MHz-class clock eases signal-integrity closure on four-layer to six-layer memory routing. Boards previously qualified with K4VAF325ZC GDDR7 can adopt this footprint-compatible 3 GB part to raise model capacity.
Recommended
Professional Workstation Graphics
Workstation GPUs used for CAD, 3D rendering, and simulation require large VRAM pools to hold complex scenes; the K4VCF325ZC-SC28's 3 GB per-chip density enables 12 GB and 24 GB configurations with fewer or identical package sites versus 2 GB chips. At 28 Gbps, the memory subsystem sustains the bandwidth needed for high-resolution viewport rendering and GPU-accelerated ray tracing, while the 266-ball FBGA package keeps thermal and mechanical design consistent with existing GDDR7 board layouts. Because the -SC28 bin runs cooler than SC32/SC36 parts at matched clocks, it is a good choice for fan-optimized professional cards prioritizing acoustics.
Recommended
GPU Board Repair and Upgrade
Independent repair channels have documented K4VCF325ZC-SC28 use as a drop-in replacement chip for damaged GDDR7 modules on RTX 50-series-class boards, where the shared 266-ball FBGA footprint and 28 Gbps SC28 rating match the original Samsung memory population. Reballing and reflow follow standard BGA rework practice; successful repairs are reported on boards using Samsung SC28 GDDR7. For upgrades, the K4VCF325ZC-SC32/SC36 bins can be fitted where the memory controller supports faster timings, though BIOS and strap settings must be verified. Buyers should insist on original, functional-tested parts given the prevalence of remarked chips on marketplace channels.
Recommended
Edge AI and Vision Systems
Embedded vision and edge-AI platforms with discrete GPU or accelerator silicon can use the K4VCF325ZC-SC28 where a 3 GB local memory pool is needed for frame buffers, tensor scratchpads, or model weights. The 28 Gbps per-pin rate supplies up to 112 GB/s per 32-bit channel - sufficient for multi-stream 4K video ingest with concurrent inference - while the single-chip 3 GB density reduces component count versus lower-density GDDR6 solutions. The 266-ball FBGA footprint shared with the K4VAF325 family allows one PCB to carry either 2 GB or 3 GB chips, giving product families a common carrier board across capacity SKUs and simplifying procurement during supply fluctuations.
Recommended
High-Performance Computing Memory Subsystems
Custom HPC accelerators and FPGA-based compute cards increasingly adopt GDDR7 for its bandwidth density; the K4VCF325ZC-SC28 provides 3 GB per chip at 28 Gbps, and sixteen chips reach 48 GB with over 1.7 TB/s of aggregate bandwidth on a 512-bit bus. GDDR7's improved power efficiency per bit versus GDDR6 helps keep memory-subsystem thermal budgets within air-cooled limits, and the standard 266-ball FBGA layout is compatible with proven GDDR7 routing rules for length-matched PAM3 traces. Boards prototyped with the K4VAF325ZC series can migrate to this 3 GB part to raise on-board capacity without PCB changes, subject to controller support for the SC28 timing set.
Recommended
Recommended Products Summary
Engineering reference data for K4VCF325ZC-SC28 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4VCF325ZC-SC32 | K4VCF325ZC-SC36 | K4VAF325ZC-SC28 | K4VAF325ZC-SC32 |
|---|---|---|---|---|---|
| Package | 266-ball FBGA | 266-ball FBGA - same | 266-ball FBGA - same | 266-ball FBGA - same | 266-ball FBGA - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Type | GDDR7 SGRAM | GDDR7 SGRAM | GDDR7 SGRAM | GDDR7 SGRAM | GDDR7 SGRAM |
| Density | 24 Gbit (3 GB) | 24 Gbit (3 GB) | 24 Gbit (3 GB) | 16 Gbit (2 GB) | 16 Gbit (2 GB) |
| Data Rate | 28.0 Gbps per pin | 32 Gbps per pin | 36 Gbps per pin | 28.0 Gbps per pin | 32 Gbps per pin |
| Organization | 512M x 32 | 512M x 32 | 512M x 32 | 512M x 32 | 512M x 32 |
| Speed Grade | SC28 | SC32 | SC36 | SC28 | SC32 |
Key Differentiators
- First high-volume 3 GB GDDR7 density (vs K4VAF325ZC-SC28)
- Cost-optimized speed bin (vs K4VCF325ZC-SC36)
- Upgrade headroom within the same footprint (vs K4VCF325ZC-SC32)
Design Notes
GDDR7 uses PAM3 signaling at 28 Gbps, producing a three-level eye that is more sensitive to intersymbol interference than GDDR6 NRZ. Follow Samsung's GDDR7 reference routing rules: length-match address/command and data groups within the controller-specified windows, maintain controlled impedance, and minimize stubs under the 266-ball FBGA. Validate eye diagrams on worst-corner boards before production; do not assume GDDR6 layout practice carries over unchanged.
The -SC28 suffix is a speed bin, not a family code. SC32 and SC36 parts in the same K4VCF325ZC family are faster and generally deratable, but an SC28 chip cannot be overclocked to SC32/SC36 ratings. Buying the wrong bin for a flagship GPU design will cap bandwidth. Additionally, marketplace channels carry remarked chips; qualify suppliers and insist on original, functional-tested Samsung parts with traceability.
Estimated: memory power scales roughly with data rate, so an SC28 chip dissipates less than SC32/SC36 siblings at equivalent activity. Even so, GDDR7 packages under sustained graphics loads require solid thermal paths: use adequate copper pour under the FBGA, thermally couple the board to the GPU heatsink assembly, and verify junction temperature against the Samsung datasheet limit under worst-case workload, not just nominal frame rates.
Compliance Information
Alibaba listing states RoHS compliant and functional. Other compliance attributes not stated in provided data.
