K4VCF325ZC-SC28 - 24Gb GDDR7 28Gbps DRAM | Samsung
N.º da peça: K4VCF325ZC-SC28 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $10.5 | $10,50 |
| 10 | $10.2 | $102,00 |
| 100 | $9.8 | $980,00 |
| 500 | $9.4 | $4.700,00 |
| 1.000 | $9 | $9.000,00 |
K4VCF325ZC-SC28 Visão geral
GDDR7 (Graphics Double Data Rate 7) is the seventh generation of Samsung's GDDR DRAM family, a high-bandwidth memory class optimized for GPU frame buffers, AI accelerators, and high-performance computing. Within the memory hierarchy, GDDR7 sits alongside HBM as a graphics-oriented DRAM, prioritizing per-pin data rate and cost efficiency over the ultra-wide bus of HBM stacks.
Key features of the K4VCF325ZC-SC28 include its 28 Gbps per-pin data rate (3500 MHz nominal clock with PAM3 signaling, per Samsung's GDDR7 architecture), 24 Gbit density in a single die-class package, and the standard 266-ball FBGA footprint shared with Samsung's 16 Gbit K4VAF325ZC GDDR7 family. This footprint compatibility simplifies migration between 2 GB and 3 GB chips on GPU boards designed for the SC28 speed grade.
Technically, GDDR7 moves from NRZ/PAM4-era signaling to PAM3 encoding, transmitting 1.5 bits per cycle to reach 28 Gbps-class effective rates while improving power efficiency per transferred bit compared with GDDR6 at equivalent bandwidth. The -SC28 speed suffix denotes the 28 Gbps bin; Samsung also ships SC32 and SC36 bins in the same family for higher-bandwidth GPU designs.
Typical applications include gaming and professional GPU VRAM, AI inference accelerator frame buffers, workstation graphics, and high-bandwidth memory subsystems where 3 GB per chip enables denser VRAM arrays without increasing package count.
Design consideration: the -SC28 speed grade is the slowest bin in the K4VCF325ZC family; designs targeting 32 Gbps or 36 Gbps must specify SC32 or SC36 SKUs, and PCB signal-integrity margins must be validated for the PAM3 eye at the intended data rate.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design guidance not consolidated in Samsung's official product pages.
Alternativas drop-in para K4VCF325ZC-SC28 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
K4VCF325ZC-SC32
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
K4VCF325ZC-SC36
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
K4VAF325ZC-SC28
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
K4VAF325ZC-SC32
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
K4VCF325ZC-SC28 Classificações máximas e características elétricas
| Tipo de memória | GDDR7 SDRAM/SGRAM |
| Density | 24 Gbit (3 GB) |
| Organização da memória | 512M x 32 |
| Taxa de dados | 28.0 Gbps per pin |
| Encapsulamento | 266-ball FBGA |
| Speed Grade | SC28 (28 Gbps bin) |
| Manufacturer | Samsung Electronics |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Clock Frequency | 3500 MHz (nominal, per TechPowerUp for SC28 GDDR7 family) |
| Interface | GDDR7 (PAM3 signaling) |
Guia de Configuração de Pinos do K4VCF325ZC-SC28 266-ball fbga
Configuração de pinos para K4VCF325ZC-SC28 (pacote 266-ball fbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para K4VCF325ZC-SC28.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
K4VCF325ZC-SC28 é adequado para 6 aplicaçãos: Gaming GPU VRAM, AI Inference Accelerators, Professional Workstation Graphics, GPU Board Repair and Upgrade, Edge AI and Vision Systems, High-Performance Computing Memory Subsystems.
Gaming GPU VRAM
The K4VCF325ZC-SC28's 24 Gbit (3 GB) density and 28 Gbps per-pin data rate make it the enabling component for non-power-of-two VRAM configurations such as 12 GB (four chips) and 24 GB (eight chips) on a 128-bit bus. Compared with eight 2 GB K4VAF325ZC chips yielding 16 GB, eight 3 GB chips yield 24 GB on the identical 266-ball FBGA footprint, letting board designers increase capacity without PCB respin. At 28 Gbps, each chip provides up to 112 GB/s of bandwidth on a 32-bit interface, so an eight-chip arrangement delivers roughly 896 GB/s aggregate. Its SC28 speed bin suits mainstream and mid-range GPU segments where the faster SC32/SC36 bins are unnecessary.
Recomendado
AI Inference Accelerators
AI inference cards benefit from the K4VCF325ZC-SC28's combination of 3 GB per-chip density and 28 Gbps data rate, which allows 24 GB and larger local frame/model buffers using eight chips on a standard GDDR7 bus. GDDR7's PAM3 signaling improves energy per transferred bit relative to GDDR6 at similar or higher bandwidth, reducing memory subsystem power in datacenter inference deployments. The 512M x 32 organization matches typical GPU-class 32-bit channels, and the SC28 bin's 3500 MHz-class clock eases signal-integrity closure on four-layer to six-layer memory routing. Boards previously qualified with K4VAF325ZC GDDR7 can adopt this footprint-compatible 3 GB part to raise model capacity.
Recomendado
Professional Workstation Graphics
Workstation GPUs used for CAD, 3D rendering, and simulation require large VRAM pools to hold complex scenes; the K4VCF325ZC-SC28's 3 GB per-chip density enables 12 GB and 24 GB configurations with fewer or identical package sites versus 2 GB chips. At 28 Gbps, the memory subsystem sustains the bandwidth needed for high-resolution viewport rendering and GPU-accelerated ray tracing, while the 266-ball FBGA package keeps thermal and mechanical design consistent with existing GDDR7 board layouts. Because the -SC28 bin runs cooler than SC32/SC36 parts at matched clocks, it is a good choice for fan-optimized professional cards prioritizing acoustics.
Recomendado
GPU Board Repair and Upgrade
Independent repair channels have documented K4VCF325ZC-SC28 use as a drop-in replacement chip for damaged GDDR7 modules on RTX 50-series-class boards, where the shared 266-ball FBGA footprint and 28 Gbps SC28 rating match the original Samsung memory population. Reballing and reflow follow standard BGA rework practice; successful repairs are reported on boards using Samsung SC28 GDDR7. For upgrades, the K4VCF325ZC-SC32/SC36 bins can be fitted where the memory controller supports faster timings, though BIOS and strap settings must be verified. Buyers should insist on original, functional-tested parts given the prevalence of remarked chips on marketplace channels.
Recomendado
Edge AI and Vision Systems
Embedded vision and edge-AI platforms with discrete GPU or accelerator silicon can use the K4VCF325ZC-SC28 where a 3 GB local memory pool is needed for frame buffers, tensor scratchpads, or model weights. The 28 Gbps per-pin rate supplies up to 112 GB/s per 32-bit channel - sufficient for multi-stream 4K video ingest with concurrent inference - while the single-chip 3 GB density reduces component count versus lower-density GDDR6 solutions. The 266-ball FBGA footprint shared with the K4VAF325 family allows one PCB to carry either 2 GB or 3 GB chips, giving product families a common carrier board across capacity SKUs and simplifying procurement during supply fluctuations.
Recomendado
High-Performance Computing Memory Subsystems
Custom HPC accelerators and FPGA-based compute cards increasingly adopt GDDR7 for its bandwidth density; the K4VCF325ZC-SC28 provides 3 GB per chip at 28 Gbps, and sixteen chips reach 48 GB with over 1.7 TB/s of aggregate bandwidth on a 512-bit bus. GDDR7's improved power efficiency per bit versus GDDR6 helps keep memory-subsystem thermal budgets within air-cooled limits, and the standard 266-ball FBGA layout is compatible with proven GDDR7 routing rules for length-matched PAM3 traces. Boards prototyped with the K4VAF325ZC series can migrate to this 3 GB part to raise on-board capacity without PCB changes, subject to controller support for the SC28 timing set.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para K4VCF325ZC-SC28 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | K4VCF325ZC-SC32 | K4VCF325ZC-SC36 | K4VAF325ZC-SC28 | K4VAF325ZC-SC32 |
|---|---|---|---|---|---|
| Package | 266-ball FBGA | 266-ball FBGA - same | 266-ball FBGA - same | 266-ball FBGA - same | 266-ball FBGA - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Type | GDDR7 SGRAM | GDDR7 SGRAM | GDDR7 SGRAM | GDDR7 SGRAM | GDDR7 SGRAM |
| Density | 24 Gbit (3 GB) | 24 Gbit (3 GB) | 24 Gbit (3 GB) | 16 Gbit (2 GB) | 16 Gbit (2 GB) |
| Data Rate | 28.0 Gbps per pin | 32 Gbps per pin | 36 Gbps per pin | 28.0 Gbps per pin | 32 Gbps per pin |
| Organization | 512M x 32 | 512M x 32 | 512M x 32 | 512M x 32 | 512M x 32 |
| Speed Grade | SC28 | SC32 | SC36 | SC28 | SC32 |
Principais diferenciais
- First high-volume 3 GB GDDR7 density (vs K4VAF325ZC-SC28)
- Cost-optimized speed bin (vs K4VCF325ZC-SC36)
- Upgrade headroom within the same footprint (vs K4VCF325ZC-SC32)
Notas de projeto
GDDR7 uses PAM3 signaling at 28 Gbps, producing a three-level eye that is more sensitive to intersymbol interference than GDDR6 NRZ. Follow Samsung's GDDR7 reference routing rules: length-match address/command and data groups within the controller-specified windows, maintain controlled impedance, and minimize stubs under the 266-ball FBGA. Validate eye diagrams on worst-corner boards before production; do not assume GDDR6 layout practice carries over unchanged.
The -SC28 suffix is a speed bin, not a family code. SC32 and SC36 parts in the same K4VCF325ZC family are faster and generally deratable, but an SC28 chip cannot be overclocked to SC32/SC36 ratings. Buying the wrong bin for a flagship GPU design will cap bandwidth. Additionally, marketplace channels carry remarked chips; qualify suppliers and insist on original, functional-tested Samsung parts with traceability.
Estimated: memory power scales roughly with data rate, so an SC28 chip dissipates less than SC32/SC36 siblings at equivalent activity. Even so, GDDR7 packages under sustained graphics loads require solid thermal paths: use adequate copper pour under the FBGA, thermally couple the board to the GPU heatsink assembly, and verify junction temperature against the Samsung datasheet limit under worst-case workload, not just nominal frame rates.
Informações de conformidade
Alibaba listing states RoHS compliant and functional. Other compliance attributes not stated in provided data.
