K4B4G1646F-BYK0 - 4Gb DDR3L SDRAM 256Mx16 | Samsung
MPN: K4B4G1646F-BYK0 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.52 | $2.52 |
| 10 | $2.35 | $23.50 |
| 100 | $2.1 | $210.00 |
| 500 | $1.95 | $975.00 |
| 1,000 | $1.8 | $1,800.00 |
Drop-in alternatives for K4B4G1646F-BYK0 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
K4B4G1646E-BYK0
β Drop-Inβ 99,999 In Stock
$1.8 / Unit
View Datasheet βK4B4G1646D-BYK0
β Drop-Inπ Reference alternative (not in catalog)
K4B4G1646E-BCMA
β Drop-Inπ Reference alternative (not in catalog)
MT41K256M16HA-125:A1
β Drop-Inπ Reference alternative (not in catalog)
H5TC4G63AFR-PBA
β Drop-Inβ 99,999 In Stock
$5.9 / Unit
View Datasheet βK4B4G1646F-BYK0 Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Memory Size | 4 Gb |
| Memory Organization | 256M x 16 |
| Supply Voltage | 1.35V / 1.5V |
| Data Rate | 1866 Mbps |
| Clock Frequency | 933 MHz |
| Package | 96-ball FBGA |
| Operating Temperature | 0Β°C to 95Β°C (TC) |
| Interface | Parallel |
| Burst Length | 8 and 4 |
| CAS Latency | Programmable |
| On-Die Termination | Yes |
| ZQ Calibration | Yes |
| Auto Precharge | Yes |
| Self-Refresh | Yes |
| RoHS | Compliant |
K4B4G1646F-BYK0 Pin Configuration
| Pin A1 | VDD β Power supply |
| Pin A2 | DQ0 β Data input/output 0 |
| Pin A3 | DQ1 β Data input/output 1 |
| Pin A4 | VSS β Ground |
| Pin A5 | DQ2 β Data input/output 2 |
| Pin A6 | DQ3 β Data input/output 3 |
| Pin A7 | VDD β Power supply |
| Pin A8 | DQ4 β Data input/output 4 |
| Pin A9 | DQ5 β Data input/output 5 |
| Pin A10 | VSS β Ground |
| Pin A11 | DQ6 β Data input/output 6 |
| Pin A12 | DQ7 β Data input/output 7 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4B4G1646F-BYK0 is suitable for 6 applications: Laptop Memory, Embedded Systems, Networking Equipment, Automotive Infotainment, Industrial PCs, Servers.
Laptop Memory
The K4B4G1646F-BYK0 is ideal for laptop memory modules (SO-DIMM) due to its low 1.35V operation, reducing power consumption and extending battery life. Its 4Gb density allows 8GB modules with 16 chips, and the 1866 Mbps data rate supports modern processors. The FBGA package enables compact module designs, and the wide temperature range ensures reliability in portable devices.
Recommended
Embedded Systems
In embedded systems, the K4B4G1646F-BYK0 provides high-density memory for applications like industrial controllers and networking equipment. Its 1.35V operation reduces heat generation, and the 96-ball FBGA package is suitable for space-constrained PCBs. The device supports standard DDR3L features like ZQ calibration and on-die termination, simplifying design. Its 0-95Β°C range covers most industrial environments.
Recommended
Networking Equipment
The K4B4G1646F-BYK0 is used in routers, switches, and firewalls for packet buffering and routing tables. Its high bandwidth (1866 Mbps) and low latency support high-throughput data processing. The 1.35V supply reduces power in always-on equipment, and the FBGA package offers good thermal performance. The device's reliability and long lifecycle make it suitable for infrastructure deployments.
Recommended
Automotive Infotainment
In automotive infotainment systems, the K4B4G1646F-BYK0 provides memory for navigation, media playback, and connectivity. Its 1.35V operation reduces power draw from the vehicle's electrical system, and the 0-95Β°C range covers cabin temperature extremes. The FBGA package withstands vibration, and the high data rate supports smooth graphics. Samsung's automotive-grade variants are available for stricter requirements.
Recommended
Industrial PCs
The K4B4G1646F-BYK0 is used in industrial PCs for factory automation and process control. Its 4Gb density allows large memory footprints for data logging and HMI applications. The 1.35V supply reduces heat in sealed enclosures, and the wide temperature range ensures operation in harsh environments. The device's long availability supports extended product lifecycles common in industrial equipment.
Recommended
Servers
In entry-level servers, the K4B4G1646F-BYK0 is used in UDIMM modules for cost-effective memory expansion. Its 1866 Mbps data rate supports dual-channel configurations, and the 1.35V operation reduces data center power consumption. The FBGA package allows high-density modules, and the device's reliability is critical for 24/7 operation. ECC variants are available for error correction.
Recommended
Recommended Products Summary
Engineering reference data for K4B4G1646F-BYK0 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4B4G1646E-BYK0 | K4B4G1646D-BYK0 | MT41K256M16HA-125:A1 | H5TC4G63AFR-PBA |
|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology | SK Hynix |
| Memory Size | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V / 1.5V | 1.35V / 1.5V | 1.35V / 1.5V | 1.35V / 1.5V | 1.35V / 1.5V |
| Data Rate | 1866 Mbps | 1866 Mbps | 1866 Mbps | 1866 Mbps | 1866 Mbps |
| Operating Temperature | 0Β°C to 95Β°C | 0Β°C to 95Β°C | 0Β°C to 95Β°C | 0Β°C to 95Β°C | 0Β°C to 95Β°C |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Low voltage operation (1.35V) (vs Standard DDR3 parts at 1.5V)
- High density 4Gb in 16-bit organization (vs 2Gb parts like K4B2G1646F-BYK0)
- Samsung F-die revision (vs E-die (K4B4G1646E-BYK0))
Design Notes
For high-speed DDR3L routing, maintain 50-ohm single-ended impedance and 100-ohm differential impedance for DQS signals. Keep trace lengths matched within 50 mils for address/command and 25 mils for data groups. Use ground planes beneath the FBGA to minimize noise.
Decouple VDD and VDDQ with 0.1uF and 1uF capacitors placed close to the balls. Use a dedicated power plane for VDDQ to reduce noise. The 1.35V supply should be stable within +/-5% to ensure reliable operation.
The FBGA package dissipates heat through the solder balls and PCB. Ensure adequate thermal vias under the package to conduct heat to inner layers. For high ambient temperatures, consider airflow or heatsinks to keep TC below 95Β°C.
Compliance Information
RoHS compliance confirmed from datasheet. Other compliance data not available.
