K9F4G08U0B-PCB0 - 4Gbit NAND Flash, 3.3V TSOP-48 | Samsung
料号： K9F4G08U0B-PCB0 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $5.8 | $5.80 |
| 10 | $5.2 | $52.00 |
| 100 | $4.55 | $455.00 |
| 500 | $3.9 | $1,950.00 |
| 1,000 | $3.4 | $3,400.00 |
K9F4G08U0B-PCB0 概述
A NAND flash memory is a non-volatile storage technology that retains data when power is removed and uses a NAND-connected cell array to deliver high density at low cost per bit. NAND devices expose a serial command/address/data protocol and erase in blocks, making them well suited to bulk data storage (firmware, media, logs) rather than byte-level random access. The K9F4G08U0B-PCB0 sits in the hierarchy as SLC NAND -> parallel NAND -> flash memory -> non-volatile memory -> semiconductor memory. Compared with NOR flash, NAND offers higher density and lower cost per bit at the expense of slower random read and more complex software (FTL / wear-leveling).
Key features of the K9F4G08U0B-PCB0 include a 2 Kbyte (+64 byte spare) page size for read/program, automatic program and erase with on-chip page buffer, a 128 Kbyte (+4 Kbyte spare) block architecture, and standard TSOP-48 mechanical compatibility with previous-generation K9F2G08 / K9K8G08 devices. The package suffix -PCB0 indicates the 3.3 V commercial-grade lead-free TSOP1 (48-TSOP1-1220F), as opposed to the -PIB0 industrial-temperature variant or the -I / -SI 52-ball ULGA / VFBGA variants. The IC is command-set compatible with the ONFI 1.0 / legacy Samsung NAND interface family.
Architecturally, the device uses a NAND string of 32 cells per bitline with page-mode read, and includes an on-chip charge pump to generate the high voltages required for program and erase. The spare 64-byte area per page is used for ECC, bad-block marking, and wear-leveling metadata; external controllers therefore typically pair this NAND with an ECC engine capable of at least 1-bit per 512-byte sector (4-bit or stronger is recommended for reliability).
Typical applications include boot and bulk storage in set-top boxes, printers, industrial gateways, networking equipment, automotive infotainment, and embedded Linux / WinCE / RTOS data-logging designs. The 512 MB (x8) density is sufficient for storing firmware images, file systems (UBIFS, JFFS2, YAFFS), and large media buffers.
When using this part, designers must implement software or hardware ECC, bad-block management, and block wear-leveling above the NAND; the bare IC does not include a controller. Decoupling on VCC and VCCQ with 100 nF + 1 µF capacitors placed close to the package pins is recommended.
This page synthesizes distributor pricing, drop-in TSOP-48 alternatives, and practical design notes not aggregated on a single manufacturer page, including a same-package compatibility map for the K9F4G08 / K9K8G08 / K9F2G08 families.
直接替换替代料： K9F4G08U0B-PCB0 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： K9F4G08U0B-PCB0 （相同外形与封装尺寸） ——差异在于 Block Size, Density, Interface, Memory Type, Package.
快速对比工具——选择替代料号进行并排对比：
K9F4G08U0B-PIB0
✅ 直接替换📋 参考替代料（不在目录中）
K9K8G08U1B-PCB0
✅ 直接替换📋 参考替代料（不在目录中）
K9F2G08U0B-PCB0
✅ 直接替换📋 参考替代料（不在目录中）
K9F4G08U0A-PIB0
✅ 直接替换📋 参考替代料（不在目录中）
K9F4G08U0C-SIB0
✅ 直接替换📋 参考替代料（不在目录中）
K9F4G08U0B-ICB0
✅ 直接替换📋 参考替代料（不在目录中）
K9F4G08U0B-PCB0 最大额定值与电气特性
| 存储器类型 | NAND Flash (SLC, asynchronous) |
| Density | 4 Gbit (512 MB) |
| 存储组织 | (512M + 16M) x 8 bit |
| Page Size | (2 K + 64) byte |
| Block Size | (128 K + 4 K) byte |
| Data Register | (2K + 64) x 8 bit |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| 接口 | 8-bit multiplexed NAND I/O |
| 封装 | TSOP1-48 (12 mm x 20 mm, lead-free) |
| 安装类型 | Surface Mount |
| Operating Temperature (commercial) | 0C to +70C |
| Program/Erase | Automatic, on-chip page buffer |
| ECC Requirement | External (1-bit/512B minimum, 4-bit recommended) |
| RoHS 状态 | Lead-free (Pb-free), RoHS compliant |
| Package Suffix Code | -PCB0 (TSOP1, 3.3 V, commercial, lead-free) |
K9F4G08U0B-PCB0 引脚配置
| 引脚 1 | NC — Not connected (per datasheet) |
| 引脚 2 | NC — Not connected (per datasheet) |
| 引脚 3 | NC — Not connected (per datasheet) |
| 引脚 4 | NC — Not connected (per datasheet) |
| 引脚 5 | NC — Not connected (per datasheet) |
| 引脚 6 | NC — Not connected (per datasheet) |
| 引脚 7 | NC — Not connected (per datasheet) |
| 引脚 8 | NC — Not connected (per datasheet) |
| 引脚 9 | NC — Not connected (per datasheet) |
| 引脚 10 | NC — Not connected (per datasheet) |
| 引脚 11 | NC — Not connected (per datasheet) |
| 引脚 12 | NC — Not connected (per datasheet) |
| 引脚 13 | NC — Not connected (per datasheet) |
| 引脚 14 | WE# — Write Enable (active low) |
| 引脚 15 | WP# — Write Protect (active low) |
| 引脚 16 | NC — Not connected (per datasheet) |
| 引脚 17 | NC — Not connected (per datasheet) |
| 引脚 18 | NC — Not connected (per datasheet) |
| 引脚 19 | NC — Not connected (per datasheet) |
| 引脚 20 | NC — Not connected (per datasheet) |
| 引脚 21 | NC — Not connected (per datasheet) |
| 引脚 22 | NC — Not connected (per datasheet) |
| 引脚 23 | NC — Not connected (per datasheet) |
| 引脚 24 | NC — Not connected (per datasheet) |
| 引脚 25 | NC — Not connected (per datasheet) |
| 引脚 26 | NC — Not connected (per datasheet) |
| 引脚 27 | NC — Not connected (per datasheet) |
| 引脚 28 | NC — Not connected (per datasheet) |
| 引脚 29 | NC — Not connected (per datasheet) |
| 引脚 30 | NC — Not connected (per datasheet) |
| 引脚 31 | NC — Not connected (per datasheet) |
| 引脚 32 | NC — Not connected (per datasheet) |
| 引脚 33 | NC — Not connected (per datasheet) |
| 引脚 34 | NC — Not connected (per datasheet) |
| 引脚 35 | NC — Not connected (per datasheet) |
| 引脚 36 | NC — Not connected (per datasheet) |
| 引脚 37 | NC — Not connected (per datasheet) |
| 引脚 38 | NC — Not connected (per datasheet) |
| 引脚 39 | NC — Not connected (per datasheet) |
| 引脚 40 | NC — Not connected (per datasheet) |
| 引脚 41 | NC — Not connected (per datasheet) |
| 引脚 42 | NC — Not connected (per datasheet) |
| 引脚 43 | NC — Not connected (per datasheet) |
| 引脚 44 | NC — Not connected (per datasheet) |
| 引脚 45 | NC — Not connected (per datasheet) |
| 引脚 46 | NC — Not connected (per datasheet) |
| 引脚 47 | NC — Not connected (per datasheet) |
| 引脚 48 | NC — Not connected (per datasheet) |
典型应用
K9F4G08U0B-PCB0 适用于 7 应用s: Set-Top Box Boot and Storage, Industrial Gateway Data Logging, Printer Firmware and Font Storage, Networking Equipment Storage, Automotive Infotainment Bulk Storage, Embedded Linux Data Logger, Smart Meter Firmware Bank.
Set-Top Box Boot and Storage
The K9F4G08U0B-PCB0 is well suited to set-top box designs where 512 MB of non-volatile storage is needed for the bootloader, kernel, root file system, and channel/EPG data. Its 2 Kbyte page size pairs efficiently with UBIFS and JFFS2 file systems; the asynchronous x8 interface connects directly to an external NAND controller or to an SoC with a NAND flash controller. Power consumption during read at 3.3 V is modest, making it usable in always-on storage roles, while the 128 Kbyte block size matches typical wear-leveling algorithms in Linux MTD drivers. Designers must pair it with an ECC engine and bad-block management in the host firmware.
推荐
Industrial Gateway Data Logging
In industrial gateways and edge controllers, the K9F4G08U0B-PCB0 provides bulk non-volatile storage for Modbus buffers, event logs, and OTA staging images. Its commercial-grade 0C to +70C temperature range is acceptable for indoor enclosures; for harsher sites the K9F4G08U0B-PIB0 industrial variant should be substituted. The 4 Gbit capacity accommodates months of compressed telemetry before log rotation, and the page-mode read protocol keeps firmware read paths simple. External 4-bit ECC per 512 bytes is recommended to maintain data retention across the device's 100 K P/E cycle endurance rating.
推荐
Printer Firmware and Font Storage
Office printers and multifunction devices use the K9F4G08U0B-PCB0 to store firmware, font tables, and page buffers across power cycles. The 512 MB density is more than sufficient for firmware updates plus several megabytes of resident fonts and macros, and the 48-pin TSOP1 package is a standard footprint across multiple Samsung NAND generations, simplifying BOM unification. Read access is fast enough for typical font lookup patterns; program/erase is performed by an embedded controller that also handles wear-leveling and bad-block replacement. Industrial temperature variants support factory-floor installations.
推荐
Networking Equipment Storage
Routers, switches, and small-cell base stations use the K9F4G08U0B-PCB0 to hold configuration files, log archives, and Linux root file systems. Its asynchronous interface connects directly to SoCs from the networking SoC family that include ONFI 1.0-compatible NAND controllers, enabling standard kernels to mount UBI volumes without custom drivers. The 3.3 V supply is compatible with the I/O rails used by these SoCs, so no level shifting is needed. Industrial-temperature -PIB0 variants are recommended for outdoor cell-site deployments.
推荐
Automotive Infotainment Bulk Storage
Automotive infotainment head units and instrument clusters can use the K9F4G08U0B-PCB0 for storing navigation maps, media files, and cluster graphics. For under-dash and cabin environments the commercial temperature grade is sufficient; for engine-bay or under-hood ECUs the -PIB0 industrial variant or -Q suffix automotive-grade parts are mandated. The x8 asynchronous interface integrates with automotive SoCs that provide ONFI-compatible controllers and hardware ECC. Designers should follow AEC-Q100 design rules for surrounding analog and power components even if this NAND part itself is not AEC-Q100 qualified.
推荐
Embedded Linux Data Logger
Embedded Linux data loggers - environmental recorders, fleet telemetry boxes, and remote sensor aggregators - use the K9F4G08U0B-PCB0 for root file system plus rolling data capture. UBI/UBIFS provide wear-leveling across the 128 Kbyte erase blocks, and the 2 Kbyte data register enables efficient page-aligned writes. Pairing with an MCU that has hardware ECC (BCH or Hamming) is recommended; software ECC in mainline Linux kernels is also supported but consumes CPU. The TSOP1-48 footprint is widely supported by off-the-shelf CPU modules and SBCs, reducing design risk.
推荐
Smart Meter Firmware Bank
Smart electricity, water, and gas meters use the K9F4G08U0B-PCB0 to store firmware images for OTA upgrade and historical consumption records. The 4 Gbit density allows years of hourly logs to be retained on-device, reducing cloud bandwidth requirements. Industrial-temperature variants (-PIB0) are mandatory for outdoor meter installations. External ECC and tamper-resistant firmware update flows are typically implemented in the meter's secure MCU, and bad-block management is handled by the on-board FTL layer in the application firmware.
推荐
推荐产品汇总
工程参考数据： K9F4G08U0B-PCB0 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | K9F4G08U0B-PIB0 | K9K8G08U1B-PCB0 | K9F2G08U0B-PCB0 | K9F4G08U0A-PIB0 | K9F4G08U0C-SIB0 |
|---|---|---|---|---|---|---|
| Package | TSOP1-48 (12 x 20 mm) | TSOP1-48 (same) | TSOP1-48 (same) | TSOP1-48 (same) | TSOP1-48 (same) | TSOP1-48 (same) |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Density | 4 Gbit (512 MB) | 4 Gbit (same) | 8 Gbit (+100%) | 2 Gbit (-50%) | 4 Gbit (same) | 4 Gbit (same) |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Organization | (512M + 16M) x 8 | (512M + 16M) x 8 | (1G + 32M) x 8 | (256M + 8M) x 8 | (512M + 16M) x 8 | (512M + 16M) x 8 |
| Page Size | (2K + 64) byte | (2K + 64) byte | (2K + 64) byte | (2K + 64) byte | (2K + 64) byte | (2K + 64) byte |
| Temperature Grade | Commercial 0C to +70C | Industrial -40C to +85C | Commercial | Commercial | Industrial | Commercial |
| Interface | Async x8 NAND | Async x8 NAND | Async x8 NAND | Async x8 NAND | Async x8 NAND | Async x8 NAND |
关键差异点
- Drop-in compatibility across the Samsung K9F4G08 / K9K8G08 / K9F2G08 family （对比 K9F2G08U0B-PCB0)
- Higher density alternative in same footprint （对比 K9K8G08U1B-PCB0)
- Industrial-temperature variant for harsh environments （对比 K9F4G08U0B-PIB0)
设计说明
The K9F4G08U0B-PCB0 does NOT include on-die ECC. Designers MUST add at least 1-bit ECC per 512 bytes in software or in the host NAND controller, and 4-bit ECC is recommended for designs targeting 100 K P/E cycle endurance. Without ECC, bit errors during normal operation will silently corrupt data. Many commercial SoC NAND controllers (e.g., those in the PIC32MZ family) provide BCH hardware engines that pair well with this NAND.
Decouple VCC and VCCQ with both a 100 nF and a 1 µF low-ESR ceramic capacitor placed within 5 mm of the package pins. During program and erase operations the internal charge pump draws peak currents that can sag the 3.3 V rail; bulk decoupling of 10 µF on the rail feeding the NAND is recommended. Keep the VCCQ (I/O supply) tied to the same 3.3 V rail as VCC unless the host SoC requires a separate VCCQ domain.
Use controlled-impedance routing (50 ohm single-ended) for the 8-bit NAND I/O bus and match trace lengths to within ±2 mm to avoid setup/hold violations on RE# and WE#. Keep the WE#, RE#, CLE, ALE, CE# traces short; route them over a continuous ground plane. Avoid routing these signals across split power planes or near switching regulators. The TSOP1-48 footprint is 0.5 mm pitch - confirm your PCB house can reliably manufacture 0.4 mm via-to-trace clearance.
Estimated: at 3.3 V VCC and continuous read at 25 mA active current, the K9F4G08U0B-PCB0 dissipates approximately 82.5 mW. The TSOP1-48 package has theta_JA of approximately 60-70 C/W on a 4-layer PCB, yielding a junction temperature rise of ~5-6C above ambient, well within the 0C to +70C commercial rating. No heatsink is required. For write/erase peaks (~50 mA), peak dissipation is ~165 mW and the rise is ~10C, still acceptable.
Factory bad blocks are present in every K9F4G08U0B-PCB0 die; the bad-block markers are written into the first spare-area byte of the first and last pages of each affected block. The boot firmware MUST scan and build a bad-block table on first power-up and skip those blocks thereafter. Skipping this step causes early-life failures on the field. Use a Linux MTD or an equivalent FTL that respects the bad-block markers.
合规信息
Lead-free (Pb-free) per -PCB0 suffix. RoHS and REACH compliance per Samsung product declaration. AEC-Q100 not qualified; for automotive use, request an automotive-qualified Samsung K9F family variant or use the -PIB0 industrial variant with additional system-level qualification.
