KLM8G1GETF-B041 - 8GB eMMC 5.1 Flash, 153-FBGA | Samsung
MPN: KLM8G1GETF-B041 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $27.12 | $27.12 |
| 10 | $25.76 | $257.60 |
| 100 | $24.41 | $2,441.00 |
| 500 | $23.18 | $11,590.00 |
| 1,000 | $22.02 | $22,020.00 |
Drop-in alternatives for KLM8G1GETF-B041 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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KLM4G1FETE-B041
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$3.5 / Unit
View Datasheet βASFC8G31MA-51BIN
β Drop-Inπ Reference alternative (not in catalog)
KLM8G1GETF-B041 Maximum Ratings & Electrical Characteristics
| Memory Type | eMMC (embedded MultiMediaCard), MLC NAND |
| Memory Size | 64 Gbit (8 GByte) |
| Interface | eMMC 5.1 (MMC protocol v5.1), x1/x4/x8-bit bus |
| Supply Voltage - NAND (VDDF/VCC) | 3 V |
| Supply Voltage - Interface (VDD/VCCQ) | 1.8 V or 3 V (dual) |
| Package | 153-Pin FBGA |
| Operating Temperature | -25C to +85C |
| Mounting Type | Surface Mount (BGA) |
| Wear Leveling | Built-in |
| Bad Block Management | Built-in |
| ECC Error Correction | Built-in |
| Hardware Reset | Yes |
| Secure Write Protection | Yes |
| Standard Compliance | eMMC 5.1 specification compatible (JEDEC standard interface) |
| Brand Family | Samsung eMMC eSTORAGE |
KLM8G1GETF-B041 153-pin fbga Pin Configuration Guide
Complete pinout information for KLM8G1GETF-B041 (153-pin fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for KLM8G1GETF-B041.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
KLM8G1GETF-B041 is suitable for 6 applications: Smartphone and Tablet Main Storage, Industrial HMI and Data Loggers, Smart Home and IoT Hubs, Set-Top Boxes and Smart TVs, Automotive Infotainment (Non-Safety), Networking Equipment and Routers.
Smartphone and Tablet Main Storage
Samsung's eMMC eSTORAGE family, including the KLM8G1GETF-B041, was designed for slim mobile products, with the datasheet citing superior power efficiency and fast speed. Its 8 GB MLC capacity suits mainstream smartphones and tablets running Android or RTOS stacks, and the eMMC 5.1 controller offloads wear leveling, ECC, and bad block management from the host SoC, reducing driver complexity. In the circuit, the device connects via CLK, CMD, and DAT0-DAT7 to the application processor, with VCCQ selectable at 1.8V for lower I/O power or 3V for legacy hosts. The -25C to +85C range covers typical consumer environments, and hardware reset allows reliable recovery after system crashes.
Recommended
Industrial HMI and Data Loggers
Industrial human-machine interfaces and data loggers benefit from the KLM8G1GETF-B041's -25C to +85C operating range and its integrated secure write protection, which prevents accidental or malicious overwriting of boot and configuration partitions. The built-in wear leveling extends endurance under the small random writes typical of logging workloads, while ECC continuously corrects MLC NAND bit errors. On the board, the eMMC occupies a compact 153-FBGA footprint near the MCU or MPU, powered from 3V VCC/VDDF and 1.8V or 3V VCCQ. Because the part is EOL, industrial designers should qualify the footprint-compatible ASFC8G31MA-51BIN second source during the same validation cycle.
Recommended
Smart Home and IoT Hubs
IoT gateways and smart home hubs need local non-volatile storage for firmware images, device credentials, and buffered telemetry, and the KLM8G1GETF-B041's 8 GB eMMC 5.1 provides this within a small BGA footprint. The MMC protocol v5.1 interface works with the native eMMC controllers found in common Linux-capable SoCs, so no external controller or FTL software is needed - the on-chip controller handles ECC, bad block management, and wear leveling. Hardware reset permits watchdog-driven recovery in unattended deployments, and secure write protection safeguards the bootloader region. Its 3V/1.8V dual-supply scheme matches typical IoT power trees, keeping overall system power efficiency high.
Recommended
Set-Top Boxes and Smart TVs
Set-top boxes and smart TV platforms use eMMC as the primary storage for the operating system, channel databases, and application caches. The KLM8G1GETF-B041's x8-bit data bus under MMC v5.1 provides the sequential and random-read bandwidth these platforms demand for fast boot and responsive UI, while Samsung's power-efficient eSTORAGE design helps meet standby power budgets. The MLC NAND with managed wear leveling withstands the write patterns of EPG updates and cache churn. Integration requires only CLK, CMD, and DAT[7:0] routing to the SoC, plus decoupling on the 3V VCC and 1.8V/3V VCCQ rails, making it a compact, low-external-component-count storage solution.
Recommended
Automotive Infotainment (Non-Safety)
In-vehicle infotainment and navigation head units without safety-critical requirements can use eMMC for map data, media assets, and the OS image. The KLM8G1GETF-B041's +85C upper limit covers most cabin-mounted electronics environments, and its -25C floor is acceptable for interior modules. The integrated controller's wear leveling and ECC sustain longevity across ignition-cycled write bursts, while hardware reset supports the robust power-fail behavior demanded by vehicle crank events. Note that this part is not documented as AEC-Q100 qualified in the provided data, so automotive projects must perform their own qualification and should verify whether a Q-grade eMMC variant is required by the tier-1 specification.
Recommended
Networking Equipment and Routers
Wireless routers, gateways, and NVR-class networking equipment store firmware, configuration, and log data on eMMC. The KLM8G1GETF-B041's 8 GB capacity comfortably hosts dual-firmware (A/B) images plus persistent logs, and its eMMC 5.1 protocol interface connects directly to the SoC's eMMC host controller, eliminating glue logic. Built-in bad block management and ECC remove the reliability burden from host software, and secure write protection defends the bootloader against flash-borne attacks - increasingly important for network-edge devices. The compact 153-FBGA package fits dense router PCBs, and the dual 3V/1.8V supply rails integrate into standard networking power architectures.
Recommended
Recommended Products Summary
Engineering reference data for KLM8G1GETF-B041 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | KLM4G1FETE-B041 | ASFC8G31MA-51BIN |
|---|---|---|---|
| Package | 153-Pin FBGA | 153-FBGA (same family footprint) | 153-FBGA - same footprint per Alliance comparison PDF |
| Brand | Samsung Electronics | Samsung Electronics | Alliance Memory (Micron-brand listed in Manufacturer Reference) |
| Capacity | 8 GB (64 Gbit) | 4 GB | 8 GB |
| Interface Standard | eMMC 5.1 (MMC protocol v5.1) | eMMC 5.1 | eMMC 5.1 |
| NAND Type | MLC NAND | MLC NAND | [DATA_NEEDED] |
| Supply Voltage | VCC 3V; VCCQ 1.8V/3V | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | -25C to +85C | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | EOL / NRND (reported discontinued June 2026) | [DATA_NEEDED] | Active (marketed as second source) |
Key Differentiators
- Samsung-integrated flash management reduces host software burden (vs Raw NAND solutions (e.g., K6X0808C1D-family SRAM/NAM setups))
- Still purchasable in volume despite EOL reports (vs ASFC8G31MA-51BIN)
- x8-bit bus flexibility with dual VCCQ (vs KLM4G1FETE-B041)
Design Notes
Never assume suffix interchangeability within the Samsung KLM family: IClee's part-number analysis warns that suffix digits such as -B041 versus -B001 can encode entirely different ball grid arrays, making same-base-number parts physically incompatible with your PCB. Before approving any second source or alternate lot, compare the 153-ball map in the datasheet ball-by-ball (CLK, CMD, DAT0-DAT7, RST_n, VCC, VCCQ) against your layout netlist.
Design the power tree with two rails: 3V for the NAND area (VCC/VDDF) and 1.8V or 3V for the host interface (VCCQ/VDD). Prefer 1.8V VCCQ in new designs to reduce I/O switching power in mobile and battery products. Follow the power-up sequence defined in the Samsung datasheet - supplying VCCQ before VCC or floating RST_n during power ramp can leave the eMMC controller in an undefined state and cause boot failures.
Route the CLK, CMD, and DAT[7:0] lines as a matched-length group for x8 operation; eMMC 5.1 high-speed modes are sensitive to skew between clock and data strobes. Provide a solid ground reference under the bus, place 100 nF decoupling close to each VCC/VCCQ ball, and reserve a thermal via array under the FBGA for reflow inspection. Because the part is EOL, consider designing the land pattern to also accept the ASFC8G31MA-51BIN second source for supply continuity.
Compliance Information
Compliance status was not stated in the provided web data; consult the official Samsung product page or datasheet for RoHS/REACH declarations. Not documented as AEC-Q100 qualified.
