LPC1853FET256 - 180MHz Cortex-M3 MCU, 512KB | NXP
MPN: LPC1853FET256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.5 | $13.50 |
| 10 | $12.4 | $124.00 |
| 100 | $11.2 | $1,120.00 |
| 500 | $10.05 | $5,025.00 |
| 1,000 | $8.95 | $8,950.00 |
LPC1853FET256 Overview
An ARM Cortex-M3 microcontroller is a 32-bit RISC core designed by Arm for low-cost, low-power embedded applications. The Cortex-M3 family belongs to the broader category of microcontrollers (MCUs) within the integrated-circuits hierarchy, and it sits between 8/16-bit legacy MCUs and higher-end Cortex-M4/M7 cores. The Cortex-M3 implements the Thumb-2 instruction set, includes a 3-stage pipeline, and offers tightly integrated NVIC interrupt control, positioning the LPC1853FET256 as a step above entry-level Cortex-M0/M0+ parts in computational throughput while remaining more deterministic than Cortex-A application processors.
Key features of the LPC1853FET256 include a 180 MHz maximum CPU frequency, 512 kB flash, 136 kB SRAM, two HS-USB (Host/Device/OTG), 10/100 Ethernet MAC, LCD controller supporting STN/TFT panels, an 8-channel 10-bit ADC, four timers, a quadrature encoder interface, and multiple serial interfaces including UART, SPI, I2C, and I2S. The 256-ball LBGA package provides 118 GPIO pins for maximum peripheral parallelism and is supplied from a 2.2 V to 3.6 V rail, simplifying designs that need to mate with 3.3 V logic.
The architecture combines the deterministic Cortex-M3 core with on-chip peripherals accessed through an AMBA AHB multilayer matrix. This matrix allows simultaneous DMA and CPU traffic to SRAM, Ethernet, USB, and the LCD controller without bus contention, which is critical for HMI applications where display refresh must coexist with network stack processing. The part supports low-power modes including Sleep, Deep-sleep, Power-down, and Deep Power-down for battery-friendly operation.
Typical applications span industrial control panels with TFT LCD + Ethernet connectivity, USB host/device embedded products such as printers and POS terminals, building automation gateways, motor control HMIs, and medical device interfaces. The Ethernet + dual HS-USB combination specifically suits gateway and bridging products where the MCU acts as a protocol translator between field buses and host PCs.
A key design consideration is the 256-ball LBGA package, which requires 4-layer or better PCB stack-up with laser-drilled or plugged micro-vias. Ground-bonded thermal vias under the central die-attach pad are recommended for reliable thermal performance at 180 MHz across 4 V operation. Designers should budget for SDRAM (when EMC is enabled) and reserve a QSPI footprint for optional external boot flash.
Drop-in alternatives for LPC1853FET256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with LPC1853FET256 (same form factor and footprint) — differing in LCD Controller, Mounting Type, Core Architecture, ADC, Ethernet.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
LPC1833FET256
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LPC1833JET256
✅ Drop-In✓ In Stock
$9.72 / Unit
View Datasheet →LPC1857FET256
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$12.3 / Unit
View Datasheet →LPC1837JET256
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LPC1827JET256
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LPC1817JET256
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LPC1853FET256 Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-M3 (32-bit) |
| Maximum CPU Frequency | 180 MHz |
| Program Flash | 512 kB |
| SRAM | 136 kB |
| Supply Voltage (VDD) | 2.2 V to 3.6 V |
| GPIO Pins | 118 |
| Package | 256-ball LBGA (TFBGA-256, SOT570-3), 17 x 17 mm |
| High-Speed USB Controllers | 2 (Host / Device / OTG) |
| Ethernet | 10/100 MAC (MII/RMII) |
| LCD Controller | Yes (STN/TFT, up to 24-bit) |
| External Memory Controller (EMC) | Yes (SDRAM, SRAM, NOR/NAND flash) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
LPC1853FET256 256-ball lbga (tfbga-256, sot570-3), 17 x 17 mm Pin Configuration Guide
Pin configuration for LPC1853FET256 (256-ball lbga (tfbga-256, sot570-3), 17 x 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for LPC1853FET256.
Refer to the datasheet for full pin configuration.
Typical Applications
LPC1853FET256 is suitable for 6 applications: Industrial HMI with TFT LCD + Ethernet, USB Host/Device Bridging Products, Building Automation Gateways, Motor Control HMI Panels, Medical Device Interfaces, Embedded Point-of-Sale Terminals.
Industrial HMI with TFT LCD + Ethernet
The LPC1853FET256 is purpose-built for industrial human-machine-interface panels that pair a TFT color display with industrial Ethernet. Its integrated LCD controller supports up to 24-bit color TFT panels, the 10/100 Ethernet MAC with MII/RMII interfaces enables PROFINET, EtherNet/IP, or Modbus-TCP connectivity, and the 256-ball LBGA exposes enough GPIO to drive both the display backlight controller and the physical-layer Ethernet PHY simultaneously. The 180 MHz Cortex-M3 core refreshes the frame buffer in SDRAM while concurrently processing the TCP/IP stack via the EMAC DMA, eliminating the need for a separate communications MCU. Typical designs place the LPC1853 between a 3.3 V supply rail, a 320x240 or 800x480 TFT, an external 32 MB SDRAM, and an SMSC LAN8720 RMII PHY, achieving compact, BOM-optimized HMI panels.
Recommended
USB Host/Device Bridging Products
The two High-Speed USB controllers on the LPC1853FET256 support simultaneous Host, Device, and OTG roles, making the part ideal for embedded products that bridge USB peripherals to other interfaces. Typical examples include USB-to-Ethernet dongles, USB mass-storage printers, USB POS terminals, and USB medical data loggers. The 180 MHz Cortex-M3 plus 136 kB SRAM comfortably handles USB HID stacks and bulk transfer protocols, while the 512 kB flash accommodates USB class drivers and TCP/IP stacks. Designers wire one HS-USB port to a Type-A connector for upstream facing ports and the second to a micro-B OTG connector, with the ULPI interface connecting to an external PHY such as the USB3300 for Hi-Speed signaling.
Recommended
Building Automation Gateways
The combination of Ethernet, dual HS-USB, and 118 GPIO makes the LPC1853FET256 well-suited as a building-automation gateway hub. The MCU aggregates field buses such as RS-485 Modbus, KNX, or BACnet and exposes them as web services over Ethernet, while the LCD controller drives a small status panel on the gateway itself. The Cortex-M3 at 180 MHz runs a lightweight TCP/IP stack (lwIP or NXP's own netX stack) with TLS, plus the application logic for protocol translation, all within the 512 kB flash budget. Power consumption in Deep Power-down mode drops to single-digit microamps, suitable for always-on battery-backed gateway designs.
Recommended
Motor Control HMI Panels
Motor drives and variable-frequency drives increasingly integrate TFT HMIs for parameter entry and diagnostic display. The LPC1853FET256's Cortex-M3 core, 4 timers, quadrature encoder interface, and integrated LCD controller support both the motor-control loop and the HMI on a single chip. Designers can drive the TFT display, read encoder input, and run FOC or V/F control loops at PWM frequencies up to 50 kHz, all from the same MCU. The 256-ball LBGA package exposes enough GPIO to handle 3-phase PWM, encoder, brake, and display backlight signals concurrently. The 136 kB SRAM provides room for motor-control data structures plus LCD frame buffers.
Recommended
Medical Device Interfaces
The LPC1853FET256 is well-suited to medical device interfaces such as patient monitors, infusion pump displays, and diagnostic equipment where a TFT HMI plus USB/Ethernet connectivity is required. The Cortex-M3 core provides deterministic real-time performance for measurement loops while the integrated LCD and USB ports drive display and host-PC data export. The 136 kB SRAM allows simultaneous operation of the display controller and a TLS-secured Ethernet link to a hospital network. The part's extended temperature grade and RoHS-compliant LBGA package meet the reliability and material requirements of IEC 60601-compliant medical designs when integrated with appropriate isolation and power solutions.
Recommended
Embedded Point-of-Sale Terminals
Point-of-sale terminals require a small color display, USB peripherals (barcode scanners, NFC readers, printers), and Ethernet for back-office sync. The LPC1853FET256's two HS-USB ports support scanner and printer, the Ethernet MAC uplinks to the store LAN, and the LCD controller drives the cashier-facing TFT. The 180 MHz Cortex-M3 handles payment flow control and LCD refresh concurrently, while 512 kB flash stores payment-application firmware with secure boot. The 256-ball LBGA package keeps the terminal BOM small by integrating USB PHYs (via ULPI), Ethernet MAC, and LCD controller without external companion ICs.
Recommended
Recommended Products Summary
Engineering reference data for LPC1853FET256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | LPC1833FET256 | LPC1833JET256 | LPC1857FET256 | LPC1837JET256 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-ball LBGA (TFBGA-256, SOT570-3), 17x17 mm | 256-ball LBGA (TFBGA-256, SOT570-3) - same | 256-ball LBGA (TFBGA-256, SOT570-3) - same | 256-ball LBGA (TFBGA-256, SOT570-3) - same | 256-ball LBGA (TFBGA-256, SOT570-3) - same |
| Core | ARM Cortex-M3, 180 MHz | ARM Cortex-M3, 180 MHz | ARM Cortex-M3, 180 MHz | ARM Cortex-M3, 180 MHz | ARM Cortex-M3, 180 MHz |
| Program Flash | 512 kB | 512 kB | 512 kB | 1 MB | 1 MB |
| SRAM | 136 kB | 136 kB | 136 kB | 136 kB | 136 kB |
| HS-USB Controllers | 2 | 2 | 2 | 2 | 2 |
| Ethernet MAC | 10/100 MII/RMII | 10/100 MII/RMII | 10/100 MII/RMII | 10/100 MII/RMII | 10/100 MII/RMII |
| LCD Controller | Yes (STN/TFT) | No | No | Yes (STN/TFT) | No |
| GPIO Pins | 118 | 118 | 118 | 118 | 118 |
| Supply Voltage | 2.2 V to 3.6 V | 2.2 V to 3.6 V | 2.2 V to 3.6 V | 2.2 V to 3.6 V | 2.2 V to 3.6 V |
Key Differentiators
- Integrated LCD controller eliminates external graphics IC (vs LPC1833FET256)
- Dual High-Speed USB with ULPI for Hi-Speed signaling (vs LPC1833JET256)
- 512 kB flash balances cost and code footprint (vs LPC1857FET256)
- Single-chip HMI + connectivity MCU (vs Discrete LCD + Cortex-M0 combo designs)
Design Notes
The 256-ball LBGA package at 17 x 17 mm requires a 4-layer or better PCB stack-up with micro-vias under the BGA pads. Use laser-drilled or plugged-and-capped vias in the inner rows. Fan-out on the top layer only is impractical at this pin count; a 1-4-1 stack-up with via-in-pad is recommended. Ground-bonded thermal vias in a 4x4 array under the central die-attach ball are required to meet the 180 MHz thermal envelope at 3.6 V operation.
Place 100 nF decoupling capacitors on each VDD pin within 1 mm of the ball. Add four 4.7 uF bulk capacitors around the BGA perimeter. The LPC1853FET256 includes internal voltage regulators requiring external 1 uF + 100 nF caps on VREG and VBAT pins; missing these prevents core startup. Sequence the 3.3 V rail with a soft-start controller to limit inrush on the BGA's decoupling network.
The HS-USB ULPI traces to the external PHY (e.g., USB3300) must be length-matched within 150 mil and routed on a continuous reference ground plane. The Ethernet MII/RMII traces to the LAN8742A should be length-matched within 50 mil for clock-data pairs. The EMC bus to external SDRAM must be length-matched within 100 mil for DQ/DQS groups. Avoid routing any high-speed signal across the BGA's thermal via array.
Do not assume the LPC1853 and LPC1833 share the same peripheral set - the LPC1833 lacks the LCD controller, so substituting it into an LPC1853 design will fail to drive the TFT. Similarly, the LPC1857 doubles flash to 1 MB but is otherwise pin-compatible; verify your bootloader handles the bigger flash before swapping. The boot mode pins (PIO0_0 / PIO0_1) must be pulled to known states at reset or the part may fail to enumerate as USB or boot from the wrong source.
Estimated: at 180 MHz over 3.3 V with full peripheral activity, the LBGA-256 dissipates roughly 300 mW on die. With theta_JA around 30 C/W on a 4-layer JEDEC test board, junction temperature rise above ambient is approximately 9 C, leaving ample headroom for industrial -40C to +85C operation. For enclosed designs without airflow, add copper pours on outer layers connected to the thermal pad for additional heat-spreading.
Compliance Information
RoHS compliant per NXP product page. Not AEC-Q100 qualified - automotive designs must use the LPC18xx AEC-Q100 variants. Halogen-free status not explicitly stated in retrieved data.
