LPC2364FBD100K - 72MHz ARM7 MCU, 128KB Flash, Ethernet/USB/CAN | NXP
MPN: LPC2364FBD100K ✓ ActiveLPC2364FBD100K Overview
A microcontroller (MCU) is a complete single-chip computer containing a CPU core, program memory, data memory and a set of on-chip peripherals. The LPC2364FBD100K is built around the ARM7TDMI-S core, an older 32-bit RISC architecture that executes 32-bit code through a 128-bit-wide memory interface and an accelerator structure, reaching the maximum clock rate while keeping interrupt latency predictable. In the taxonomy, an MCU is a microcontroller, a type of embedded processor, falling under semiconductors and integrated circuits.
Key features of this part include 128 KB of flash for In-System Programming and In-Application Programming, 34 KB of SRAM, a 10 Mbit/100 Mbit-capable Ethernet MAC with dedicated DMA channels, USB 2.0 device, host and OTG operation, two CAN 2.0B controllers, three SSP/SPI channels, three I2C channels, an I2S interface, a 10-bit DAC, two PWM channels, four general-purpose timers and a general-purpose DMA controller. A 10-bit ADC with eight channels supports analog sensor front ends.
The LPC2300 architecture separates the ARM7TDMI-S core from the peripherals, and the accelerator lets the core execute 32-bit code at full speed while the 128-bit memory bus sustains simultaneous instruction fetches and DMA transfers. The part accepts an external crystal or oscillator up to 72 MHz and supports PLL-based clock generation, with typical power consumption in the tens of milliwatts at active operation and far lower figures in sleep or power-down modes.
Typical applications include industrial Ethernet data loggers and gateways, USB-to-CAN industrial bridges, networked PLC and HMI controller boards, motor and stepper control peripherals, building and access-control panels, and USB-connected test and measurement instruments. Any design needing simultaneous Ethernet, USB and CAN traffic on one chip benefits from integrating three protocol engines instead of adding discrete controllers.
When laying out the board, keep the 25 MHz or 12 MHz crystal and its load capacitors within a few millimeters of pins OSC1 and OSC2, route the Ethernet magnetic-link and line transformer signals as a controlled-impedance differential pair, and place the Ethernet PHY and its 1.2 V core regulator close to the MCU. The LQFP-100 footprint has a fine 0.5 mm pitch, so confirm solder mask and paste stencil parameters before volume production.
This page combines manufacturer specification data, distributor pricing structure, same-footprint drop-in alternatives from the LPC2300 family and cross-brand ARM Cortex-M equivalents, plus practical layout and design notes that go beyond the basic manufacturer datasheet listing.
Drop-in alternatives for LPC2364FBD100K — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with LPC2364FBD100K (same form factor and footprint) — differing in Package, ADC, Flash Memory, SRAM, CAN Controllers.
LPC2364FBD100
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LPC2365FBD100K
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LPC2366FBD100K
✅ Drop-In ⚠️ Specs UnverifiedContact for price
View Datasheet →LPC2368FBD100K
✅ Drop-In ⚠️ Specs UnverifiedContact for price
View Datasheet →STM32F107VCT6
✅ Drop-InContact for price
View Datasheet →ATSAM3X8EA-AU
✅ Drop-InContact for price
View Datasheet →LPC2364FBD100K Maximum Ratings & Electrical Characteristics
| Core | ARM7TDMI-S 16-bit/32-bit RISC |
| Maximum CPU Frequency | 72 MHz |
| Flash Memory | 128 KB (128K x 8) |
| SRAM | 34 KB |
| Ethernet MAC | Integrated 10/100 Mbit Ethernet MAC |
| USB | USB 2.0 device, host and OTG controller |
| CAN Controllers | 2 channels |
| UART | 4 channels |
| SPI / SSP | 3 channels |
| I2C | 3 channels |
| ADC | 8-channel, 10-bit |
| DAC | 10-bit |
| Timers | 4 general-purpose timers, 2 PWM channels |
| DMA Controller | General-purpose DMA |
| Audio Interface | I2S |
| Package | LQFP-100 (14 x 14 mm), gull-wing |
| Temperature Grade | Industrial |
| Programming | ISP and IAP (In-System / In-Application Programming) |
| Mounting Type | Surface Mount |
LPC2364FBD100K lqfp-100 (14 x 14 mm), gull-wing Pin Configuration Guide
Pin configuration for LPC2364FBD100K (lqfp-100 (14 x 14 mm), gull-wing package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for LPC2364FBD100K.
Refer to the datasheet for full pin configuration.
Typical Applications
LPC2364FBD100K is suitable for 6 applications: Industrial Ethernet Data Logger and Gateway, USB-to-CAN Industrial Bridge, PLC and HMI Controller Board, Motor and Stepper Control Peripheral, Building Access and Security Panel, USB-Connected Test and Measurement Instrument.
Industrial Ethernet Data Logger and Gateway
The LPC2364FBD100K suits this class of equipment because it puts an Ethernet MAC, USB 2.0 and a 72 MHz ARM7TDMI-S core in a single 14 x 14 mm LQFP-100, freeing board area for sensor inputs and storage. The on-chip general-purpose DMA transfers logged data to the Ethernet MAC and USB controller without loading the CPU, so sampling and protocol tasks run concurrently. The 8-channel 10-bit ADC captures analog sensor lines directly, while 128 KB of flash and ISP/IAP allow remote firmware update over Ethernet or USB in the field. Typical logger nodes sample a few hundred samples per second and stream them to a supervisory PC, which keeps the design compact and reduces the external component count compared with a discrete Ethernet controller.
Recommended
USB-to-CAN Industrial Bridge
A USB-to-CAN bridge needs two independent protocol engines and deterministic message handling, and the LPC2364FBD100K provides USB 2.0 device/host/OTG plus two CAN 2.0B controllers alongside a 72 MHz ARM7TDMI-S core. With 34 KB of SRAM, full CAN message queues fit comfortably in memory, and the general-purpose DMA moves USB traffic with minimal CPU intervention, which matters when several thousand frames per second must be forwarded. The 10-bit DAC and multi-channel ADC are useful for monitoring bridge temperature and supply rails. The 100-lead LQFP package is large enough that a small connector-heavy board remains manufacturable, and ISP/IAP lets the bridge receive gateway firmware updates over the same USB link.
Recommended
PLC and HMI Controller Board
Programmable logic and human-machine interface controllers benefit from the LPC2364FBD100K because four UARTs, three I2C channels and three SSP/SPI channels cover displays, keypads, memory cards and expansion boards without extra chips. The 72 MHz ARM7TDMI-S core executes the scan cycle and communications stack from 128 KB of flash, and the 34 KB of SRAM holds the task stacks, ring buffers for serial traffic and the display frame buffer. Two PWM channels and four general-purpose timers drive panel backlight dimming, buzzer timing and stepper-driven front panels. With the industrial temperature grade, the part is suitable for factory-floor enclosure temperatures where consumer-grade parts would drift in performance or fail outright.
Recommended
Motor and Stepper Control Peripheral
Dedicated motion-control peripherals need deterministic timer and PWM resources plus fast serial connectivity, all of which the LPC2364FBD100K provides: four general-purpose timers, two PWM channels, three SSP/SPI channels and a general-purpose DMA controller. The 72 MHz ARM7TDMI-S core handles motion profile computation while the DMA handles encoder or stepper position feedback streams, so the control loop is not starved by bus traffic. The 8-channel 10-bit ADC accepts current-sense and hall-sensor inputs, and the two CAN channels let the drive report status and accept setpoints over a fieldbus. Because the part also carries Ethernet and USB, one board can serve as a networked drive that exposes configuration over USB while running in an EtherCAT-adjacent industrial network.
Recommended
Building Access and Security Panel
Access-control and security panels are often networked door controllers that must run continuously on limited power while handling readers, keypads, relays and an alarm bus. The LPC2364FBD100K suits this because the Ethernet MAC and USB 2.0 give wired and maintenance-port connectivity, the two CAN channels suit multi-node lock bus architectures, and the four UARTs drive RFID or 125 kHz reader modules. Deep sleep and power-down modes, with wake from timer or GPIO, cut idle current so the panel can run from a single small supply, and the 10-bit ADC is useful for monitoring the backup battery and door position. The industrial temperature grade covers unheated corridors and outdoor panels.
Recommended
USB-Connected Test and Measurement Instrument
Bench instruments use the LPC2364FBD100K for the same reason they use the other members of the LPC2300 family: a fast core, fast external memory interfacing and USB 2.0 in one package. The general-purpose DMA streams capture buffers from the ADC or from external peripherals to the USB host with minimal CPU involvement, which keeps throughput high even while the firmware manages a display, a keypad and instrument state. USB device, host and OTG modes allow the instrument to read USB memory sticks directly or appear as a peripheral to a host PC. With 128 KB of flash for the instrument application plus boot code, and ISP/IAP over USB for field calibration updates, the design is straightforward to maintain in production and service.
Recommended
Recommended Products Summary
Engineering reference data for LPC2364FBD100K — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | LPC2365FBD100K | LPC2366FBD100K | LPC2368FBD100K | STM32F107VCT6 | SAM3X8E |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | STMicroelectronics | Microchip Technology |
| Package | LQFP-100 (14 x 14 mm) | LQFP-100 (14 x 14 mm) - same | LQFP-100 (14 x 14 mm) - same | LQFP-100 (14 x 14 mm) - same | LQFP-100 (14 x 14 mm) - same | LQFP-100 (14 x 14 mm) - same |
| CPU Core | ARM7TDMI-S at 72 MHz | ARM7TDMI-S at 72 MHz - same | ARM7TDMI-S at 72 MHz - same | ARM7TDMI-S at 72 MHz - same | ARM Cortex-M3 at 72 MHz - different core, port required | ARM Cortex-M3 at 84 MHz - different core, port required |
| Flash Memory | 128 KB | 256 KB | 512 KB | 512 KB | 128 KB | 256 KB |
| SRAM | 34 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Ethernet MAC | Yes, integrated 10/100 Mbit | Yes, integrated 10/100 Mbit | Yes, integrated 10/100 Mbit | Yes, integrated 10/100 Mbit | Yes, integrated 10/100 Mbit | Yes, integrated 10/100 Mbit |
| ADC | 8-channel, 10-bit | 8-channel, 10-bit | 8-channel, 10-bit | 8-channel, 10-bit | 12-channel, 12-bit | 12-channel, 12-bit |
| USB | USB 2.0 device, host and OTG | USB 2.0 device, host and OTG | USB 2.0 device, host and OTG | USB 2.0 device, host and OTG | USB 2.0 device, host and OTG | USB 2.0 device and host |
| Programmable Flash | 128 KB with ISP and IAP | 256 KB with ISP and IAP | 512 KB with ISP and IAP | 512 KB with ISP and IAP | 128 KB with system bootloader | 256 KB with bootloader |
| External Memory Interface | None | None | None | Yes, external memory interface available | Yes, FSMC available | Yes, external bus available |
Key Differentiators
- Three wired protocol engines in one package (vs STM32F107VCT6)
- Upgrade path inside the same footprint without board changes (vs LPC2366FBD100K)
- Industrial temperature qualification with identical pinout (vs LPC2364FBD100)
- Wider analog capture resolution than the LPC2300 baseline (vs SAM3X8E)
Design Notes
The LPC2364FBD100K is a 100-lead LQFP with a 0.5 mm lead pitch, so the footprint geometry and solder-mask aperture must match the NXP package drawing exactly. Keep the crystal and its load capacitors within about 5 mm of the OSC1 and OSC2 pins and route the oscillator traces away from Ethernet and CAN traces. Provide a solid ground plane under the device and place all decoupling capacitors on the same layer as the pins they serve, with a 100 nF capacitor at each supply pin and bulk capacitance of roughly 10 uF per supply rail close to the group of pins it supports.
The Ethernet MAC needs a controlled-impedance differential pair for the MII or RMII lines and a magnetic-link network close to the connector. Terminate the differential pair with the network specified for your PHY, keep the pair length matched, and route it over a continuous ground plane with no stubs or vias on the pair. The USB differential pair likewise needs matched length and 90 ohm differential impedance, and both USB and Ethernet pairs should be kept away from the switching nodes of any external DC-DC converter feeding the 3.3 V and 2.5 V rails.
The device requires a 3.3 V core supply and dedicated 3.3 V and 2.5 V analog supplies for the Ethernet PHY interface. Sequence these rails so that the analog supplies come up before the core, and respect the maximum ramp-rate and sequencing requirements listed in the manufacturer datasheet. Because the Ethernet PHY interface is sensitive, decouple the 2.5 V analog rail with a ferrite bead or small-resistance resistor plus local 1 uF and 10 uF capacitors, and confirm ripple at the ADC reference pin stays below the 10-bit conversion noise floor your accuracy budget allows.
Two upgrade paths catch designers out. First, moving from the LPC2364 to the LPC2365 or LPC2366 doubles or quadruples flash, and the 128-bit memory interface means the zero wait-state flash cycle count can exceed the original optimum, so re-check the flash wait-state settings and the vector table layout in firmware. Second, moving to a Cortex-M alternative such as the STM32F107VCT6 or SAM3X8E is a firmware port, not a component swap: the GPIO naming, clock tree, vector table, interrupt priorities and DMA request mappings all differ, and the pin multiplexing of the Ethernet, USB and CAN functions must be re-verified against the alternative's datasheet.
Compliance Information
The LPC2364FBD100K is an industrial-temperature ARM7 microcontroller for embedded and communications equipment; no RoHS, REACH, lead-free or conflict-minerals statements for this specific ordering code were confirmed on the manufacturer product page. AEC-Q100 automotive qualification is not claimed for this ordering code. Confirm material compliance and halogen-free status with the manufacturer before release to production.
