LPC4325JET100E - 204MHz Cortex-M4/M0 MCU | NXP
MPN: LPC4325JET100E ✓ ActiveLPC4325JET100E Overview
A microcontroller is a semiconductor that integrates a processor core, program memory, data memory, and peripherals into one device. In the product hierarchy, this MCU belongs to the Arm Cortex-M4 microcontroller family and uses an Arm Cortex-M0 coprocessor for parallel or peripheral-related processing. The LPC43x architecture therefore combines general-purpose real-time control with a dedicated secondary core while keeping both processors inside a single package.
The principal feature set includes 768 KB of flash for firmware, 136 KB of SRAM for working data, 16 KB of EEPROM for nonvolatile parameters, and a quad SPI Flash Interface, or SPIFI. Advanced configurable peripherals include the State Configurable Timer and Serial General Purpose I/O interface. Two high-speed USB interfaces support connected-control and peripheral applications, while Ethernet and LCD support broaden the device beyond a basic embedded controller.
The LPC4325JET100E operates from a 3.3 V supply according to distributor product data and reaches a listed 204 MHz core frequency. Its dual-core architecture can divide interrupt handling, communications, signal processing, or control tasks between the Cortex-M4 and Cortex-M0 processors. The 32-bit Arm instruction set and substantial on-chip memory reduce the need for external memory in connected industrial, communications, and consumer-control designs.
Typical applications include Ethernet-connected industrial controllers, USB peripheral and host equipment, human-machine-interface systems with LCD support, high-speed data acquisition, and embedded gateways. The two high-speed USB ports and Ethernet capability make the device useful when a design must combine real-time control with multiple external communication paths.
PCB design should follow NXP's package, ball-grid, decoupling, and high-speed-layout guidance. Validate the 3.3 V supply tolerance, external-memory requirements, USB impedance, Ethernet magnetics, and LCD interface routing against the manufacturer datasheet before layout release. Pay particular attention to power sequencing and exposed-pad or thermal requirements associated with the TFBGA assembly.
This page combines verified manufacturer and distributor information with package-specific design guidance, same-family drop-in candidates, application analysis, and procurement details. It separates confirmed specifications from values that still require confirmation from the manufacturer datasheet, helping engineers plan the LPC4325JET100E without treating unverified assumptions as design data.
Drop-in alternatives for LPC4325JET100E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with LPC4325JET100E (same form factor and footprint) — differing in Mounting Type, Package, Product Type.
LPC4322JET100E
✅ Drop-In ⚠️ Specs UnverifiedContact for price
View Datasheet →LPC4324JET100E
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LPC4327JET100E
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LPC4353JET100E
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LPC4357JET100E
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LPC4325JET100E Maximum Ratings & Electrical Characteristics
| Product Type | Dual-core 32-bit Arm Cortex-M4/M0 microcontroller |
| Main Processor | Arm Cortex-M4 at 204 MHz |
| Coprocessor | Arm Cortex-M0 |
| Program Flash | 768 KB |
| On-Chip SRAM | 136 KB |
| EEPROM | 16 KB |
| High-Speed USB Interfaces | 2 |
| SPI Flash Interface | Quad SPIFI interface |
| Advanced Timer | State Configurable Timer (SCT) |
| Serial GPIO | Serial General Purpose I/O (SGPIO) interface |
| Ethernet Support | Supported |
| LCD Support | Supported |
| EMC Features | Supported |
| Supply Voltage | 3.3 V |
| Package | 100-TFBGA, 9 mm x 9 mm |
| Mounting Type | Surface-mount ball-grid array |
LPC4325JET100E 100-tfbga, 9 mm x 9 mm Pin Configuration Guide
Pin configuration for LPC4325JET100E (100-tfbga, 9 mm x 9 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for LPC4325JET100E.
Refer to the datasheet for full pin configuration.
Typical Applications
LPC4325JET100E is suitable for 6 applications: Ethernet-Connected Industrial Control, USB Host and Peripheral Equipment, LCD Human-Machine Interface, High-Speed Data Acquisition, Embedded Communications Gateway, Dual-Core Real-Time Peripheral Controller.
Ethernet-Connected Industrial Control
The LPC4325JET100E fits an Ethernet-connected industrial controller because it combines a 204 MHz Cortex-M4 core, a Cortex-M0 coprocessor, 136 KB of SRAM, and Ethernet support in one 100-TFBGA device. The main core can execute control logic and communications while the secondary core handles peripheral or interrupt-intensive work. Place the MCU beside the Ethernet PHY and magnetics, provide the required 3.3 V rail, and route differential Ethernet signals according to the manufacturer layout guidance. The 768 KB of flash provides useful code capacity for protocol stacks and control firmware, while 16 KB of EEPROM can retain configuration values. Because the verified excerpts do not provide temperature-grade details, an industrial product should confirm the exact ordering code's operating-temperature range before deployment.
Recommended
USB Host and Peripheral Equipment
The LPC4325JET100E is suitable for USB host, peripheral, or dual-role equipment because the verified product information identifies two high-speed USB interfaces alongside 768 KB of flash and 136 KB of SRAM. Firmware can place USB communication in the Cortex-M0 coprocessor while the Cortex-M4 performs application control, or reverse that allocation when a protocol stack requires the higher-performance core. The implementation should use NXP's USB routing and termination recommendations and confirm which controller drives each external connector. Two USB ports also enable a dual-interface product, but they do not automatically imply dual-device or host-to-device operation. PCB designers must preserve high-speed signal geometry, provide correct supply decoupling, and validate enumeration behavior across the cable lengths and power states required by the end product.
Recommended
LCD Human-Machine Interface
The LPC4325JET100E fits an LCD-based human-machine interface because NXP identifies LCD support alongside a 204 MHz Cortex-M4 core, Cortex-M0 coprocessor, 136 KB of SRAM, and 16 KB of EEPROM. The Cortex-M4 can manage graphics updates and application logic, while the secondary core can service inputs, timers, or communications in parallel. Its 768 KB of flash allows a larger firmware image than the lower-memory LPC4322 candidate, which is beneficial when the interface includes menus, logging, and protocol handling. The design should use the manufacturer's LCD timing and pin-multiplexing guidance and check whether the selected display interface requires external memory. EEPROM can retain user settings, calibration values, or configuration records, while the LCD bus should be routed away from noisy switching and USB signals to minimize display corruption.
Recommended
High-Speed Data Acquisition
The LPC4325JET100E can serve as the control core in a high-speed data-acquisition system that also needs network or USB connectivity. The 204 MHz Arm Cortex-M4 supplies real-time processing, the Cortex-M0 provides a second execution environment, and 136 KB of SRAM accommodates acquisition buffers and working state. The State Configurable Timer can support deterministic timing and event capture, while SGPIO provides a configurable serial interface for sensors or data converters. In this architecture, the acquisition path should feed data into the main core, with the coprocessor handling communications or secondary timing tasks. Validate converter settling time, interrupt latency, memory bandwidth, and signal conditioning separately. The 768 KB of flash is ample for the firmware layer, but a long acquisition record still requires external nonvolatile storage or streamed transfer.
Recommended
Embedded Communications Gateway
The LPC4325JET100E is appropriate for an embedded communications gateway because it combines dual Arm Cortex processing, two high-speed USB interfaces, Ethernet support, and substantial on-chip memory. A practical allocation uses the Cortex-M4 for network protocol processing and the Cortex-M0 for interface servicing, status monitoring, or background I/O. The 768 KB of flash supports gateway firmware, while 136 KB of SRAM can hold packet queues and protocol buffers; 16 KB of EEPROM is useful for identity, calibration, and configuration data. If the gateway must operate continuously, validate thermal behavior of the TFBGA assembly and provide stable 3.3 V power with adequate local decoupling. Ethernet magnetics, USB routing, and ground references should be planned with the manufacturer's reference layouts. External flash may still be required for firmware updates or large protocol resources.
Recommended
Dual-Core Real-Time Peripheral Controller
The LPC4325JET100E supports a dual-core real-time peripheral controller by dividing low-latency service tasks between the 204 MHz Cortex-M4 and the Cortex-M0 coprocessor. The Cortex-M4 can execute the main control sequence, while the second core handles serial traffic, timer events, or a state-machine function without relying on complex interrupt-sharing arrangements. Peripherals identified by NXP include the State Configurable Timer, SGPIO, quad SPIFI, two high-speed USB ports, Ethernet, and LCD. A practical implementation should assign deterministic responsibilities to each core, establish a clear shared-memory or peripheral ownership model, and document interrupt priorities. The TFBGA package demands careful escape routing, and the 3.3 V supply must remain within manufacturer limits. Firmware size should be reviewed against the 768 KB flash budget before adding protocol stacks or graphical features.
Recommended
Recommended Products Summary
Engineering reference data for LPC4325JET100E — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | LPC4322JET100E | LPC4324JET100E | LPC4327JET100E | LPC4353JET100E | LPC4357JET100E |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 100-TFBGA (9x9) | 100-TFBGA (9x9) | 100-TFBGA (9x9) | 100-TFBGA (9x9) | 100-TFBGA (9x9) | 100-TFBGA (9x9) |
| Processor Cores | Arm Cortex-M4 and Arm Cortex-M0 | Arm Cortex-M4 and Arm Cortex-M0 | Arm Cortex-M4 and Arm Cortex-M0 | Arm Cortex-M4 and Arm Cortex-M0 | Arm Cortex-M4 and Arm Cortex-M0 | Arm Cortex-M4 and Arm Cortex-M0 |
| Maximum Listed Clock Frequency | 204 MHz | 204 MHz | 204 MHz | 204 MHz | 204 MHz | 204 MHz |
| On-Chip SRAM | 136 KB | 136 KB | 136 KB | 136 KB | 136 KB | 136 KB |
| High-Speed USB Interfaces | 2 | 2 | 2 | 2 | 2 | 2 |
| SPI Flash Interface | Quad SPIFI | Quad SPIFI | Quad SPIFI | Quad SPIFI | Quad SPIFI | Quad SPIFI |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Key Differentiators
- Balanced 768 KB flash capacity within the LPC432x family (vs LPC4322JET100E)
- Lower flash demand than the largest family member (vs LPC4327JET100E)
- Dual-core connectivity for connected embedded control (vs STM32F446RET7TR)
Design Notes
Use the NXP TFBGA-100 land pattern and ball assignment as the controlling references; do not infer the layout from a generic BGA symbol. Place all required supply and ground-bypass capacitors close to their associated balls, with the shortest possible return path and a continuous ground reference under signal-routing areas. The verified excerpts confirm a 9 mm by 9 mm 100-TFBGA package but do not provide the complete ball map, exposed-pad arrangement, or recommended capacitor locations.
Treat the two high-speed USB interfaces and Ethernet interface as controlled-impedance, continuous-reference-plane routes. Match trace geometry to the manufacturer reference design, avoid splits across power or ground planes, and place ESD and termination components where their electrical requirements can be met. The MCU and PHY or transceiver should be positioned to minimize loop area, while crystal, analog, and power-distribution circuits should remain away from high-speed data paths.
Confirm the complete 3.3 V operating range, regulator tolerance, startup behavior, and internal core-supply requirements from the manufacturer datasheet before selecting decoupling. The verified sources list 3.3 V but do not provide the complete current budget or power-up sequence. Use the NXP recommended capacitor values and provide local bulk energy where the data sheet calls for it. Estimated power consumption must be calculated from the actual voltage, frequency, active peripherals, and I/O loading rather than assumed from the 204 MHz clock alone.
Do not treat every LPC432x or LPC435x ordering code as automatically interchangeable. Although the alternatives share the TFBGA100 family context, the replacement must be checked for flash capacity, Ethernet and USB controller availability, LCD functions, peripheral multiplexing, pin states, boot behavior, and package-ball differences. Firmware can also depend on device identifiers and configuration registers, so update boot code, startup files, and validation tests whenever the exact MCU ordering code changes.
The 100-TFBGA package requires thermal planning based on the actual board construction and operating environment. Estimated: if the verified NXP data is later used to establish a junction-to-ambient thermal resistance of theta_JA, the approximate junction rise equals power dissipation in watts multiplied by theta_JA in degrees Celsius per watt. No theta_JA or verified dissipation value was supplied, so no numerical thermal estimate is asserted here. Preserve copper area, use the manufacturer's footprint, and evaluate temperature rise in the final enclosure.
Compliance Information
The supplied verified excerpts do not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is marked not applicable because this is an industrial and embedded microcontroller ordering code rather than an identified automotive-qualified variant; no automotive qualification claim was provided.
