LPC4370FET256E - Tri-Core 204MHz MCU with 282kB SRAM | NXP
MPN: LPC4370FET256E ✓ ActiveLPC4370FET256E Overview
A microcontroller is a programmable system-on-chip that integrates a processor core, memory interfaces, peripherals, and communication controllers onto one package. The LPC4370 belongs to the Arm Cortex-M4 microcontroller family and extends the platform with two Cortex-M0 subsystems for peripheral management. This hierarchy places it within embedded processors, where deterministic control, connectivity, and configurable peripherals are combined in a single device.
Verified feature data identifies 282 kB of SRAM, Ethernet connectivity, two high-speed USB controllers, an 80 Msps 12-bit ADC, LCD support, configurable timers, and serial GPIO. The three-core arrangement can separate real-time I/O or protocol handling from higher-level application processing. Its 204 MHz Cortex-M4 core provides substantial computation for communications gateways, industrial controllers, and connected embedded equipment.
The LPC4370 uses advanced configurable peripherals such as the State Configurable Timer and Serial General Purpose I/O interface. These resources can be adapted to application-specific timing, trigger, routing, or communication requirements rather than relying only on fixed peripheral functions. The two high-speed USB controllers, Ethernet interface, and 12-bit ADC also reduce the need for external interface devices when the board design requires several data acquisition and communications paths.
Typical applications include industrial automation, Ethernet-connected control systems, high-speed data acquisition, human-machine interfaces with LCD support, and embedded gateways. The 256-LBGA package exposes a large number of I/O and peripheral resources, but its fine-pitch construction requires careful PCB layout, inspection, and assembly capability.
Designers should confirm external memory configuration, pin multiplexing, power integrity, differential-signal routing, and thermal performance against the manufacturer datasheet. Because this part is ROMless, a boot strategy and external nonvolatile storage must be planned at the system level. Software compatibility, peripheral errata, and toolchain support should also be checked before production release.
This page combines verified manufacturer and distributor information with package, sourcing, comparison, and design considerations. It identifies where the LPC4370FET256E fits and explicitly marks specifications that require confirmation rather than presenting unsupported values as facts.
Drop-in alternatives for LPC4370FET256E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with LPC4370FET256E (same form factor and footprint) — differing in Mounting Type, Package.
LPC4350FET256
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LPC4357FET256
✅ Drop-In ⚠️ Specs UnverifiedContact for price
View Datasheet →LPC4360FET256
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LPC4367FET256
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LPC4340FET256
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LPC4370FET256E Maximum Ratings & Electrical Characteristics
| Product Type | 32-bit tri-core Arm Cortex-M4 and Cortex-M0 microcontroller |
| Maximum CPU Frequency | 204 MHz |
| Processor Cores | 1 Arm Cortex-M4 core and 2 Arm Cortex-M0 cores |
| Internal SRAM | 282 kB |
| On-Chip ROM | 64 kB |
| Program Memory | ROMless; external nonvolatile memory required |
| Supply Voltage | 3.3 V |
| ADC Resolution | 12 bit |
| ADC Maximum Sampling Rate | 80 Msps |
| Ethernet Support | Yes |
| High-Speed USB Controllers | 2 |
| LCD Support | Yes |
| Configurable Timer Support | State Configurable Timer (SCT) |
| Serial GPIO Interface | Serial General Purpose I/O (SGPIO) |
| Package | 256-LBGA, 17 x 17 mm |
| Mounting Type | Surface mount |
LPC4370FET256E 256-lbga, 17 x 17 mm Pin Configuration Guide
Pin configuration for LPC4370FET256E (256-lbga, 17 x 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for LPC4370FET256E.
Refer to the datasheet for full pin configuration.
Typical Applications
LPC4370FET256E is suitable for 6 applications: Industrial Ethernet Control Gateway, High-Speed Data Acquisition System, Human-Machine Interface Controller, USB-to-Embedded Communications Bridge, Multi-Protocol Embedded Gateway, Configurable Real-Time Control Platform.
Industrial Ethernet Control Gateway
The LPC4370FET256E fits an industrial Ethernet gateway because its 204 MHz Arm Cortex-M4 core can execute communications and application tasks while the two Cortex-M0 cores manage suitable peripheral operations. The verified NXP product information confirms Ethernet support, 282 kB of SRAM, and two high-speed USB controllers. In a gateway implementation, the MCU can terminate an Ethernet connection, buffer local control data, service USB peripherals, and coordinate an LCD status interface. The practical benefit is consolidation of multiple communication paths in one 3.3 V device. Board-level design must still provide an approved Ethernet PHY, appropriate magnetics, USB routing, external boot memory, and industrial-grade environmental qualification.
Recommended
High-Speed Data Acquisition System
The LPC4370FET256E is suitable for high-speed data acquisition because the verified datasheet description specifies an 80 Msps, 12-bit ADC while the Cortex-M4 core reaches 204 MHz. The 282 kB of SRAM can hold acquisition buffers, while the Cortex-M0 subsystem can handle trigger or peripheral-management tasks selected by the application. The device may sit between an analog front end and a storage, communications, or processing subsystem, reducing the need for a separate high-speed converter controller. The key trade-off is that analog accuracy, input bandwidth, reference quality, and signal conditioning remain external design responsibilities; the MCU supplies conversion capability and processing, not a complete front end.
Recommended
Human-Machine Interface Controller
The LPC4370FET256E can serve as the central controller in an LCD-equipped human-machine interface because NXP identifies LCD support alongside its 204 MHz processor and 282 kB of SRAM. The Cortex-M4 can manage graphics updates, local logic, and communications, while an additional Cortex-M0 subsystem may support input scanning or deterministic peripheral control. Serial GPIO can also provide configurable routing for display and keypad signals. A practical design should reserve external memory for graphics and firmware, use the manufacturer LCD timing and electrical guidance, and isolate display data from noisy power or communication sections. The MCU simplifies the control architecture but does not remove the need for suitable display drivers, connectors, and panel-specific interface circuitry.
Recommended
USB-to-Embedded Communications Bridge
The LPC4370FET256E is appropriate for a USB-to-embedded bridge because it provides two high-speed USB controllers and a 204 MHz Cortex-M4 core. One USB interface can expose a host or peripheral-facing connection while the other supports a different device role or internal peripheral path, subject to the controller implementation and pin multiplexing. The 282 kB of SRAM allows protocol buffers and state machines to operate without continuous external-memory access, improving deterministic response. This application benefits from simultaneous control and data movement because the two Cortex-M0 cores can offload suitable tasks. Layout must follow NXP USB routing guidance, including controlled impedance, return paths, ESD protection, and separation between high-speed data and sensitive analog circuitry.
Recommended
Multi-Protocol Embedded Gateway
The LPC4370FET256E fits a multi-protocol embedded gateway because its three-core architecture combines a 204 MHz Cortex-M4 with two Cortex-M0 cores, while Ethernet and dual high-speed USB expand its communications options. The larger core can run the gateway's protocol stack, data model, and routing logic, while the smaller cores can execute isolated I/O or device-management tasks. With 282 kB of SRAM, the controller can maintain protocol state and packet buffers without relying entirely on external memory. This architecture can reduce component count in equipment that must bridge industrial Ethernet, USB peripherals, and local control signals. Firmware partitioning must still address startup synchronization, peripheral ownership, memory arbitration, and deterministic latency requirements.
Recommended
Configurable Real-Time Control Platform
The LPC4370FET256E supports configurable real-time control because NXP identifies State Configurable Timers and the Serial General Purpose I/O interface alongside the 204 MHz Cortex-M4 and two Cortex-M0 cores. Engineers can allocate timer inputs, outputs, triggers, and signal routing to application-specific sequencing while the main core executes supervisory logic. The 282 kB of SRAM is useful for motion profiles, event histories, and protocol buffers, and the 12-bit ADC can acquire process or positioning data. This combination is attractive for machinery and test equipment requiring multiple synchronized channels. Timing closure, interrupt latency, watchdog policy, and peripheral ownership must be validated together because software scheduling can influence real-time performance as much as the advertised clock rate.
Recommended
Recommended Products Summary
Engineering reference data for LPC4370FET256E — comparison, design guidance, and compliance information.
Selection Guide
Do not select an alternative solely from its package name. The LPC4350FET256, LPC4357FET256, LPC4360FET256, LPC4367FET256, and LPC4340FET256 candidates are same-brand family options that require validation of ball assignments, core topology, memory interfaces, boot behavior, peripheral mapping, and software support. If an alternative lacks Ethernet, dual USB, the specified ADC, or sufficient SRAM, it may require additional chips or firmware changes and therefore is not functionally equivalent despite the shared package format. For a new 256-LBGA design, favor the LPC4370FET256E when its verified feature set aligns with the requirements; for an existing board, qualify a replacement only after direct comparison with the original datasheet and errata.
Comparison with Alternatives
| Parameter | This Product | LPC4350FET256 | LPC4357FET256 | LPC4360FET256 | LPC4367FET256 | LPC4340FET256 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-LBGA (17 x 17 mm) | 256-LBGA (17 x 17 mm) | 256-LBGA (17 x 17 mm) | 256-LBGA (17 x 17 mm) | 256-LBGA (17 x 17 mm) | 256-LBGA (17 x 17 mm) |
Key Differentiators
- Three-core processing architecture (vs LPC4350FET256)
- Substantial integrated connectivity (vs LPC4357FET256)
- Integrated 12-bit high-speed conversion (vs LPC4360FET256)
- Large working-memory pool (vs LPC4367FET256)
Design Notes
The 256-LBGA package requires a manufacturer-qualified footprint, escape routing strategy, and assembly process with suitable fine-pitch inspection. Place decoupling and clock components close to their associated balls, preserve the recommended return paths, and route Ethernet and high-speed USB interfaces as controlled-impedance nets. Because the supplied data does not contain a complete pin table, engineers must use the NXP package drawing and reference design rather than infer connections from the 17 x 17 mm body size.
Design the 3.3 V rail for both the processor core and attached I/O loads, following the NXP recommended decoupling and power-up sequence. The verified data confirms a 3.3 V nominal supply but does not provide current limits, sequencing requirements, or power-domain details. Do not size the regulator from the nominal voltage alone; obtain the relevant datasheet current tables and assess startup, Ethernet PHY current, USB bus loads, and external memory power simultaneously.
Treat the two high-speed USB interfaces, Ethernet PHY interface, 80 Msps ADC inputs, and LCD signals as separate layout domains. Keep analog acquisition routing away from switching and USB return currents, use short ground references, and follow the ADC reference and acquisition network recommended by NXP. Verify signal integrity and EMC on the final multilayer stack-up rather than relying only on nominal controller capabilities, particularly when high-speed USB and ADC conversion operate simultaneously.
Do not treat a similarly packaged LPC43xx device as a confirmed drop-in replacement merely because it uses a 256-LBGA footprint. Confirm every ball assignment, power pin, boot strap, external-memory interface, debug connection, and peripheral multiplexing before substituting a candidate. Also verify boot media and firmware startup because LPC4370FET256E is ROMless; a board that boots correctly with the original device may require a different image or initialization sequence with another family member.
The verified data does not provide junction temperature, thermal resistance, or maximum power dissipation, so a numerical thermal estimate would be unsupported. Determine those values from the NXP datasheet and the actual PCB stack-up, then account for the 256-LBGA's limited top-side heat-transfer path. Place temperature-sensitive analog and memory components away from the controller, provide copper and vias according to the manufacturer layout guidance, and validate the assembled enclosure under worst-case processor and peripheral load.
Compliance Information
The supplied verified snippets identify the product as active but do not provide explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. These fields therefore remain unknown rather than being inferred from general NXP practices.
