NXP Semiconductors

LPC43S50FET180E - 204MHz Dual-Core MCU | NXP | 180-TFBGA

MPN: LPC43S50FET180E ✓ Active
3.3 V Vdss 180-ball TFBGA, 12 x 12 mm Package 204 MHz Speed ROMless; external memory required Memory
MOQ: 1 |

LPC43S50FET180E Overview

The NXP Semiconductors LPC43S50FET180E is a 32-bit dual-core Arm Cortex-M4/M0 flashless microcontroller for embedded applications, operating up to 204 MHz in a 180-ball TFBGA package measuring 12 x 12 mm. It includes 264 kB of SRAM, an AES security engine, Ethernet, two high-speed USB controllers, LCD support, SCTimer/PWM peripherals, and an SGPIO interface. The E suffix identifies the lead-free ordering variant listed by NXP.

A microcontroller is an integrated semiconductor that combines a processor core, memory, communication peripherals, and control logic on one device. The LPC43S50FET180E belongs to the Cortex-M4/M0 embedded-processing hierarchy, combining a higher-performance Cortex-M4 core with a Cortex-M0 coprocessor. This architecture supports real-time control workloads that benefit from deterministic peripheral access, interrupt handling, and flexible timer-based signal generation without requiring external flash.

The device runs at up to 204 MHz and provides 264 kB of SRAM for working data. Its integrated AES engine supports hardware-assisted cryptographic operations. Advanced configurable peripherals include the State Configurable Timer/PWM module and the Serial General-Purpose I/O interface, which can simplify motor, lighting, communications, and industrial-control designs. Two high-speed USB controllers add flexible host or device connectivity, while integrated Ethernet supports networked embedded equipment.

The dual-core architecture can partition control and communication work between the Cortex-M4 and Cortex-M0 cores. The Cortex-M4 core handles performance-intensive processing, while the Cortex-M0 core can manage lower-level tasks independently. This division can reduce synchronization overhead when firmware is carefully partitioned, although shared-memory access and inter-core synchronization still require deliberate design. The manufacturer product page identifies the part for embedded applications with a broad combination of connectivity and control peripherals.

Typical uses include industrial automation, Ethernet-connected controllers, USB peripherals and hosts, human-machine-interface controllers with LCD output, and motor or power-control systems using the SCTimer/PWM blocks. The 180-TFBGA package offers a high pin count for parallel interfaces and dedicated peripheral connections, but it requires careful escape routing, multilayer PCB construction, and precise component placement.

When designing the PCB, follow the NXP package drawing and pin-assignment table for every ball connection. Route high-speed USB and Ethernet signals as controlled-impedance traces, provide the specified decoupling network, and reserve adequate copper for power and ground distribution. Because the device is flashless, system firmware must be loaded into the 264 kB of SRAM or paired with an external memory interface rather than assuming internal program flash.

This page consolidates the exact LPC43S50FET180E identification, manufacturer feature description, verified distributor references, package details, engineering application guidance, and same-footprint replacement analysis into one decision resource. It also distinguishes confirmed drop-in compatibility from options that would require board-level redesign, firmware changes, or validation before use.

Drop-in alternatives for LPC43S50FET180E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

LPC4350FET180,551

✅ Drop-In
📦 180-ball TFBGA
Same NXP 180-ball TFBGA class and Cortex-M4/M0 architecture; SRAM, peripheral mapping, and pin assignments require datasheet verification

📋 Reference alternative (not in catalog)

LPC43S50FET180E Maximum Ratings & Electrical Characteristics

Product Type 32-bit dual-core microcontroller IC
Main Processor Core Arm Cortex-M4
Coprocessor Core Arm Cortex-M0
Maximum Processor Frequency 204 MHz
Internal SRAM 264 kB
Program Memory ROMless; external memory required
Package 180-ball TFBGA, 12 x 12 mm
High-Speed USB Controllers 2
Ethernet Support Yes
LCD Support Yes
Security Engine AES hardware engine
Advanced Timer/PWM Peripheral State Configurable Timer/PWM
Serial GPIO Interface SGPIO
Memory Protection Unit 8 regions
Interrupt Controller Nested Vectored Interrupt Controller
Supply Voltage 3.3 V
Mounting Type Surface mount
Automotive Qualification AEC-Q100

LPC43S50FET180E 180-ball tfbga, 12 x 12 mm Pin Configuration Guide

Pin configuration for LPC43S50FET180E (180-ball tfbga, 12 x 12 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

180-ball tfbga, 12 x 12 mm package pinout diagram for LPC43S50FET180E

No detailed pinout data available for LPC43S50FET180E.

Refer to the datasheet for full pin configuration.

Typical Applications

LPC43S50FET180E is suitable for 6 applications: Industrial Automation Controller, Ethernet-Connected Embedded Equipment, USB Host and Device Controller, Human-Machine Interface Controller, Security-Aware Embedded Control, Motor, Lighting, and PWM Control.

🏭

Industrial Automation Controller

The LPC43S50FET180E fits industrial automation equipment that combines deterministic control with network and service connectivity. Its Cortex-M4 processor can run up to 204 MHz for control algorithms, while the Cortex-M0 coprocessor can handle an independently partitioned monitoring or communication workload. The 264 kB of SRAM supports data buffers and external-memory operation, while Ethernet, two high-speed USB controllers, and SGPIO provide multiple communication paths. The SCTimer/PWM peripherals can also support precise actuator timing. Because the device is flashless, the controller should use a controlled external boot-memory design and validate startup timing, brownout behavior, and firmware recovery paths.

🌐

Ethernet-Connected Embedded Equipment

The LPC43S50FET180E is appropriate for embedded Ethernet equipment that needs more processing capability than a basic microcontroller and several connectivity options. The Cortex-M4 core can handle protocol processing and application logic at up to 204 MHz, while integrated Ethernet supports network communication. The dual high-speed USB controllers provide additional peripheral expansion options, and the 264 kB SRAM can support packet buffers and external memory operation. In a production design, use the manufacturer's Ethernet reference design, validate magnetics or PHY selection, provide controlled-impedance routing, and confirm EMC requirements rather than treating Ethernet capability as a complete physical-layer solution.

🖥️

USB Host and Device Controller

The two high-speed USB controllers make the LPC43S50FET180E relevant to USB host, device, and dual-role embedded products. The 204 MHz Cortex-M4 core provides performance for protocol handling, enumeration, data transfer, and application tasks, while the Cortex-M0 core can support a separate control function when firmware isolation is designed correctly. The 180-ball TFBGA exposes enough connectivity for USB data, power, clock, and auxiliary signals. Layout should follow the NXP USB guidance, include controlled-impedance routing, preserve return-path continuity, and verify connector, ESD, clock, and power requirements during system validation.

📺

Human-Machine Interface Controller

The LPC43S50FET180E can serve as the central controller in an LCD-equipped human-machine interface because it combines an Arm Cortex-M4/M0 architecture with LCD support. The main core can run graphics, input handling, and application logic, while the second core can assist with peripheral control or isolated background processing. Its 264 kB SRAM and external-memory architecture allow larger firmware and display data to be handled outside internal flash. For industrial panels, validate LCD timing and bus compatibility, isolate noisy display and power-conversion circuitry, provide ESD protection on user-accessible connectors, and review the complete ball assignment before layout release.

🛡️

Security-Aware Embedded Control

The LPC43S50FET180E fits embedded systems that require cryptographic hardware alongside real-time control. Its AES engine provides a hardware-assisted path for encryption and decryption workloads, while the 204 MHz Cortex-M4 core can execute the surrounding protocol and application logic. The Cortex-M0 coprocessor can support a separated control or monitoring task, and 264 kB of SRAM supports working data in a flashless architecture. Designers should still define a secure boot and key-management strategy, isolate confidential material, protect external memory where necessary, and confirm that the intended threat model is covered rather than treating the AES block as a complete security solution.

⚡

Motor, Lighting, and PWM Control

The LPC43S50FET180E is well suited to configurable timing and PWM applications because it includes the State Configurable Timer/PWM peripheral and SGPIO. The Cortex-M4 core can execute motion or lighting algorithms at up to 204 MHz, while the coprocessor can handle auxiliary tasks when firmware partitioning is justified. Ethernet and USB allow configuration, monitoring, and diagnostics to be added without a separate host processor. In a motor-control design, include proper gate-driver isolation, current sensing, fault shutdown, and electromagnetic-compatibility planning. Use the manufacturer timer examples to configure event routing and timing rather than relying on software interrupt latency for safety-critical response functions.

What is the LPC43S50FET180E?
The LPC43S50FET180E is a 204 MHz, 32-bit dual-core Arm Cortex-M4/M0 flashless microcontroller from NXP Semiconductors. It combines 264 kB of SRAM, two high-speed USB controllers, Ethernet, LCD support, an AES engine, SCTimer/PWM peripherals, and SGPIO in a 180-ball 12 x 12 mm TFBGA package. According to the NXP product page, it targets embedded applications requiring substantial connectivity and configurable control peripherals.
What are the key specifications of LPC43S50FET180E that engineers should know?
The LPC43S50FET180E combines an Arm Cortex-M4 main core, an Arm Cortex-M0 coprocessor, a 204 MHz maximum clock, and 264 kB of SRAM. Its 180-ball TFBGA package also exposes two high-speed USB controllers, Ethernet, LCD, an AES engine, SCTimer/PWM, and SGPIO. The NXP product page identifies this as a flashless device, so an external boot-memory implementation and appropriate firmware-loading procedure are required.
What processor cores does LPC43S50FET180E use?
The LPC43S50FET180E uses an Arm Cortex-M4 main processor core and an Arm Cortex-M0 coprocessor. The Cortex-M4 core operates at frequencies up to 204 MHz, while the Cortex-M0 core provides an independent secondary execution domain for suitable control tasks. The NXP product information identifies this dual-core Cortex-M4/M0 combination as a defining feature of the LPC43S50 family.
Does LPC43S50FET180E have internal flash and SRAM?
The LPC43S50FET180E provides 264 kB of SRAM but is identified as a flashless microcontroller. Firmware therefore cannot simply reside in internal program flash as it would on a conventional flash-equipped MCU. The design must use an external boot-memory arrangement or another supported external-memory strategy, while the NXP product page confirms the 264 kB SRAM capacity.
What connectivity does LPC43S50FET180E provide?
The LPC43S50FET180E provides two high-speed USB controllers, Ethernet, LCD support, and an SGPIO interface. According to the NXP product page, these resources make the device suitable for networked embedded systems, USB hosts or devices, and human-machine interfaces. Exact PHY, connector, signal-routing, and electrical requirements should be selected from the manufacturer's datasheet and reference designs.
Where can I download the LPC43S50FET180 datasheet PDF?
The official LPC43S50FET180 product page is available at https://www.nxp.com/part/LPC43S50FET180 and is the correct starting point for the manufacturer datasheet and supporting documents. Use the LPC43S50 family documentation for detailed electrical characteristics, memory maps, pin assignments, and programming information. Confirm that the document revision applies to the LPC43S50FET180E ordering code before releasing a production design.
Where can I find the LPC43S50FET180E pinout and package drawing?
The LPC43S50FET180E pinout and land pattern must be taken from the NXP LPC43S50FET180 product documentation and its 180-ball TFBGA package drawing. The verified package description identifies a 12 x 12 mm TFBGA with 180 terminals, but individual ball names are not reproduced on this page. Assign every power, ground, clock, and signal connection from the manufacturer's pin-description table rather than inferring positions from package appearance.
LPC43S50FET180E vs LPC4350FET180,551 - which is better for an existing PCB?
The LPC4350FET180,551 is the closest same-brand comparison candidate identified for the LPC43S50FET180E and is listed as a 32-bit Cortex-M0/M4 device in a 180-ball package. However, the available comparison does not establish every peripheral, memory, pin, and electrical detail as identical. Before treating it as a drop-in replacement, compare the complete pin list, SRAM configuration, Ethernet and USB implementation, package dimensions, and firmware startup support in the NXP documentation.
What is the best drop-in replacement for LPC43S50FET180E?
The LPC4350FET180,551 is the only same-footprint replacement candidate identified by the targeted cross-reference search, and it appears to use the same 180-ball MCU package and Cortex-M4/M0 architecture. A true drop-in substitution still requires ball-by-ball and peripheral-level validation against the NXP datasheets. Do not approve a replacement solely from the shared BGA180 package designation, because memory and mixed-signal peripheral assignments may differ.
Can LPC4350FET180,551 replace LPC43S50FET180E without PCB changes?
The LPC4350FET180,551 is a plausible no-PCB-change candidate because both devices are associated with the LPC43 family, 32-bit Cortex-M4/M0 architecture, and 180-ball packaging. Direct interchangeability is not established by that information alone. Check every ball assignment, supply pin, clock requirement, Ethernet PHY interface, USB routing, SRAM limit, peripheral mapping, and boot configuration in the manufacturer documentation before substitution.
When should I choose LPC43S50FET180E instead of another LPC43-series MCU?
Choose the LPC43S50FET180E when the design specifically requires its confirmed 204 MHz Cortex-M4/M0 architecture, 264 kB of SRAM, two high-speed USB controllers, Ethernet, LCD support, AES engine, and SCTimer/PWM resources. Select a different LPC43 variant when its flash, Ethernet configuration, security features, package size, or peripheral mix better matches the product. The shared family platform is useful only when firmware and board requirements are also aligned.
Is LPC43S50FET180E suitable for industrial and automotive embedded systems?
The LPC43S50FET180E is suitable for complex embedded control systems requiring Ethernet, two high-speed USB controllers, LCD support, cryptography, and configurable timers. The part is also associated with AEC-Q100 automotive information in the verified distributor listing, but qualification scope, grade, and temperature grade must be confirmed against the exact ordering code. Industrial designs should also verify operating-temperature and endurance requirements before production release.
How much power does LPC43S50FET180E consume?
Power consumption depends on the selected clock frequency, enabled peripherals, I/O activity, memory configuration, voltage, and operating mode, so no fixed consumption value can be assigned to LPC43S50FET180E from the product summary alone. Use the manufacturer datasheet for core, I/O, analog, and memory current limits and include the external-memory subsystem in system power calculations. Validate the worst-case operating mode on the assembled PCB rather than estimating from the 204 MHz headline frequency.
Where can I buy LPC43S50FET180E online and what is the lead time?
Use the Request a Quote form on this XAIPART page to request LPC43S50FET180E availability, current lead time, and order quantities. The distributor search confirms active market listings but does not provide a qualifying quantity-break price table for the exact MPN. Current stock, minimum order quantity, packaging allocation, and production lead time should therefore be confirmed through the quote workflow before a purchase commitment is made.
How do I design the PCB around the 180-TFBGA LPC43S50FET180E?
Design the LPC43S50FET180E PCB from the manufacturer's 180-ball package drawing and reference design rather than from a generic BGA layout. Use a multilayer board with short return paths, place decoupling capacitors adjacent to the relevant supply balls, route high-speed USB and Ethernet as controlled-impedance nets, and provide clean power and ground planes. The 12 x 12 mm TFBGA also demands fine-pitch assembly capability and inspection suited to densely spaced balls.

Engineering reference data for LPC43S50FET180E — comparison, design guidance, and compliance information.

Selection Guide

Choose the LPC43S50FET180E when an embedded product needs the confirmed combination of a 204 MHz Arm Cortex-M4 core, Cortex-M0 coprocessor, 264 kB of SRAM, two high-speed USB controllers, Ethernet, LCD support, AES acceleration, and SCTimer/PWM resources. It is particularly suitable for industrial controllers, USB-connected products, network equipment, and human-machine interfaces that can use a 180-ball TFBGA and an external-memory boot strategy. Consider the LPC4350FET180,551 only after its complete ball list, SRAM configuration, peripheral set, electrical limits, and firmware requirements have been matched to the target. Neither part is a simple choice based on package size alone, because software support and peripheral differences can outweigh package reuse. For designs needing internal flash, lower pin count, or a different package, select another MCU rather than forcing a board redesign around this device.

Comparison with Alternatives

Parameter This Product LPC4350FET180,551
Package 180-ball TFBGA, 12 x 12 mm 180-ball TFBGA
Brand NXP Semiconductors NXP Semiconductors
Processor Architecture Arm Cortex-M4/M0 dual-core Arm Cortex-M4/M0 dual-core

Key Differentiators

  • Confirmed dual-core processing (vs LPC4350FET180,551)
  • 264 kB of internal SRAM (vs LPC4350FET180,551)
  • Integrated connectivity set (vs LPC4350FET180,551)

Design Notes

Use the NXP 180-ball TFBGA land pattern and pin-description table as the authority for placement and routing. A multilayer board is strongly preferable for this device because the Cortex-M4/M0, Ethernet, two high-speed USB controllers, LCD interface, and AES engine require numerous power and signal connections. Keep the footprint dimensions, ball-pitch tolerances, solder-mask definition, and paste pattern tied to the exact package revision rather than a generic BGA180 footprint.

Route USB, Ethernet, and other high-speed signals with continuous reference planes and the impedance prescribed by the manufacturer design guidance. Avoid plane splits beneath high-speed nets, minimize stubs, and provide low-inductance connections to external-memory and PHY components. Maintain short return paths for clock and data signals, especially because the 180-ball package leaves limited escape-routing space and the dual-core architecture can create demanding traffic on shared external-memory buses.

Follow the NXP recommended decoupling network and power-up sequencing without substituting generic capacitor networks. Separate sensitive analog, digital, and I/O supply paths where the datasheet defines distinct pins, and place supply bypass capacitors adjacent to the relevant balls. Because LPC43S50FET180E is flashless and external memory is part of the functional system, validate startup, reset, brownout, and boot-memory behavior across the complete supply range rather than testing only the MCU core rail.

Do not treat the 180-ball TFBGA package or shared Cortex-M4/M0 architecture as proof that another LPC43 device is a drop-in replacement. Confirm ball assignments, supply requirements, memory-map behavior, SRAM capacity, peripheral multiplexing, Ethernet and USB implementation, security configuration, and bootloader expectations. Firmware may also require retuning even when the PCB is unchanged, particularly when moving between devices with different peripheral sets or memory sizes.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Qualified
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

The verified distributor listing associates the LPC43S50FET180E with AEC-Q100 automotive qualification. The exact qualification grade and temperature range should be confirmed from the ordering information. RoHS, REACH, lead-free, halogen-free, and conflict-minerals status are not established by the available manufacturer product summary.

Data verified on: 2026-11-07 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors LPC43S50FET180E LPC4350FET180,551 Arm Cortex-M4 Arm Cortex-M0 Arm Cortex-M4/M0 microcontroller embedded processor semiconductor 32-bit microcontroller dual-core microcontroller flashless microcontroller 180-ball TFBGA TFBGA package family surface-mount package 264 kB SRAM Ethernet high-speed USB LCD controller AES engine SCTimer/PWM SGPIO Memory Protection Unit Nested Vectored Interrupt Controller AEC-Q100
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