LS1021AXE7MQB - Layerscape 32-bit ARM SoC, 1.2GHz Dual-Core | NXP
MPN: LS1021AXE7MQB ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $87.5 | $87.50 |
| 10 | $78.2 | $782.00 |
| 100 | $68.75 | $6,875.00 |
| 500 | $62.4 | $31,200.00 |
| 1,000 | $57.9 | $57,900.00 |
LS1021AXE7MQB Overview
A QorIQ LS1021A communications processor belongs to the application-processor class of embedded networking SoCs, sitting in the layered taxonomy of system-on-chip -> communications processor -> networking SoC -> Layerscape class. Layerscape is NXP's first software-aware, core-agnostic networking architecture that targets enterprise networking, industrial IoT gateways, and small-form-factor networking appliances that previously required discrete CPU plus NIC designs. The LS1021A is widely positioned for fanless and energy-efficient designs where integration density and ARM ecosystem software matter more than raw thread count.
Key integrated features include DDR3/DDR4 memory controller with ECC, two 10-gigabit-capable virtual TSEC Ethernet controllers, two PCIe Gen2 controllers, USB 3.0, SATA 3.0, LCD controller, UART, SPI, I2C, CAN, security engine (SEC) with trusted boot, and a QUICC Engine (uQE) for legacy TDM/HDLC telecom connectivity. The dual-core design with hardware virtualization support targets virtualization-aware gateway workloads such as virtual CPE, SD-WAN, and network-attached industrial controllers where deterministic low-latency communication is required.
Architecturally the LS1021A pairs ARM Cortex-A7 cores with NXP's networking IP blocks (SEC, uQE, vTSEC, DPAA-lite acceleration), enabling wire-speed packet handling while freeing the ARM cores for control-plane and application processing. Industrial-temperature grade (-40C to +105C), Rev 2.0 silicon, and an exposed-die FCBGA package make this MPN a robust choice for thermally constrained industrial enclosures and rugged networking equipment.
Typical applications include industrial IoT gateways, enterprise routers, fanless network appliances, virtual CPE platforms, single-board computers for industrial automation, and LTE/5G small-cell edge controllers. The hardware encryption engine also suits secure VPN concentrators and energy-grid communication endpoints. When designing with this MPN, verify thermal budgets against expected sustained packet-processing loads and confirm DDR3/4 signal-integrity routing before PCB layout commitment. This page synthesizes distributor pricing, drop-in alternative guidance, and design notes not aggregated on any single manufacturer or distributor product page.
Drop-in alternatives for LS1021AXE7MQB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with LS1021AXE7MQB (same form factor and footprint) — differing in Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
LS1020AXE7MQB
✅ Drop-In📋 Reference alternative (not in catalog)
LS1021ASE7MQB
✅ Drop-In📋 Reference alternative (not in catalog)
LS1021AXE7KQB
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →LS1021AXE7MQT
✅ Drop-In📋 Reference alternative (not in catalog)
LS1021AXE7MQB Maximum Ratings & Electrical Characteristics
| Series | QorIQ LS1 (Layerscape) |
| Core Architecture | ARM Cortex-A7, dual-core, 32-bit |
| Maximum Core Frequency | 1.2 GHz |
| Operating Temperature | -40C to +105C (industrial) |
| Package | 525-FCPBGA, 19x19 mm |
| Mounting Type | Surface Mount |
| Memory Controller | DDR3 / DDR4 with ECC (per datasheet) |
| Ethernet | 2x virtual TSEC (vTSEC) 10G-capable |
| PCIe | 2x PCIe Gen2 controllers |
| USB | USB 3.0 |
| SATA | SATA 3.0 |
| Display | LCDC (LCD controller) |
| CAN | Yes (CAN interfaces) |
| Security Engine | SEC (trusted boot, hardware crypto) |
| QUICC Engine | uQE (legacy TDM/HDLC support) |
| Silicon Revision | Rev 2.0 (per distributor description) |
| RoHS Status | Compliant (per distributor) |
LS1021AXE7MQB 525-fcpbga, 19x19 mm Pin Configuration Guide
Pin configuration for LS1021AXE7MQB (525-fcpbga, 19x19 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for LS1021AXE7MQB.
Refer to the datasheet for full pin configuration.
Typical Applications
LS1021AXE7MQB is suitable for 6 applications: Industrial IoT Gateways, Enterprise / SMB Routers, Virtual CPE / SD-WAN Edge, Fanless Industrial Network Appliances, Single-Board Computers for Industrial Automation, Secure VPN Concentrators.
Industrial IoT Gateways
The LS1021AXE7MQB's dual Cortex-A7 cores at 1.2 GHz with hardware virtualization and DDR3/DDR4 ECC support make it well-suited for industrial IoT gateways that aggregate sensor data, run protocol translation (Modbus, OPC-UA, CAN), and push telemetry to cloud backends. The -40C to +105C industrial temperature grade enables deployment in factory-floor enclosures without active cooling. Design tip: route the two PCIe Gen2 lanes to industrial Ethernet PHY bridges (e.g., SJA1105) for determinism.
Recommended
Enterprise / SMB Routers
The two virtual TSEC (vTSEC) 10G-capable Ethernet controllers of the LS1021AXE7MQB provide enough throughput for SMB edge routers doing 1G-2.5G WAN aggregation. Linux kernel support (NXP Layerscape SDK) plus QUICC Engine (uQE) for legacy TDM/HDLC maintains interoperability with installed telecom gear. Expected routing performance scales with packet size: roughly line-rate at 1G, partial line-rate at 2.5G with optimized zero-copy drivers.
Recommended
Virtual CPE / SD-WAN Edge
With dual Cortex-A7 cores supporting hardware virtualization, the LS1021AXE7MQB can run lightweight NFV workloads (Vyatta, OVS, KVM) for virtual CPE deployments where a service provider terminates multiple customer tunnels on a single appliance. The SEC engine accelerates IPsec/IKE without CPU overhead, holding data-plane throughput at near line-rate. Trade-off: at 1.2 GHz the SoC caps at roughly 500 Mbps IPsec; for higher WAN uplifts consider the LS1043A.
Recommended
Fanless Industrial Network Appliances
Power-efficient dual Cortex-A7 at 1.2 GHz and industrial-temperature operation mean the LS1021AXE7MQB is engineered for fanless industrial network appliances such as protocol converters, BACnet bridges, and energy-grid communication terminals. With typical TDP figures in the 5-7W range at full load and the 525-FCPBGA's thermal pad, a solid copper 4-layer PCB footprint and a small finned heatsink suffice for convection-cooled enclosures. Use the QUICC Engine for HDLC-over-TDM if connecting to legacy SCADA RTUs.
Recommended
Single-Board Computers for Industrial Automation
A compact SBC built around the LS1021AXE7MQB exposes two PCIe lanes, USB 3.0, SATA 3.0, dual Ethernet, LCD, and GPIO for industrial SBC designs used in HMI controllers and machine-vision pre-processors. The Cortex-A7 cores handle Linux plus deterministic real-time extensions (Xenomai or PREEMPT-RT) at modest power. Expected performance: 1080p LCD driving at 60 fps with simultaneous OPC-UA publish to a cloud endpoint.
Recommended
Secure VPN Concentrators
The NXP SEC engine inside the LS1021AXE7MQB accelerates AES, 3DES, SHA, and public-key operations, offloading IPsec/TLS termination from the Cortex-A7 cores. With this acceleration, a single LS1021A can saturate a 1G IPsec tunnel while leaving CPU headroom for routing, monitoring, and management. Combine with hardware root-of-trust via the trusted boot for tamper-resistant VPN concentrator appliances in regulated environments (finance, healthcare, energy). Trade-off: only ~500 Mbps IPsec at 1.2 GHz; for multi-gigabit IPsec use LS1046A.
Recommended
Recommended Products Summary
Engineering reference data for LS1021AXE7MQB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | LS1020AXE7MQB | LS1021ASE7MQB | LS1021AXE7KQB | LS1021AXE7MQT |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 525-FCPBGA (19x19 mm) | 525-FCPBGA (19x19 mm) - same | 525-FCPBGA (19x19 mm) - same | 525-FCPBGA (19x19 mm) - same | 525-FCPBGA (19x19 mm) - same |
| Core Architecture | Dual-core Cortex-A7, 32-bit | Single-core Cortex-A7, 32-bit | Dual-core Cortex-A7, 32-bit (same) | Dual-core Cortex-A7, 32-bit (same) | Dual-core Cortex-A7, 32-bit (same) |
| Maximum Core Frequency | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz |
| Operating Temperature | -40C to +105C (industrial) | -40C to +105C (industrial) | 0C to +105C (commercial) | -40C to +105C (industrial) | -40C to +105C (industrial) |
| Memory Controller | DDR3 / DDR4 with ECC | DDR3 / DDR4 with ECC | DDR3 / DDR4 with ECC | DDR3 / DDR4 with ECC | DDR3 / DDR4 with ECC |
| Ethernet Controllers | 2x vTSEC (10G-capable) | 2x vTSEC (10G-capable) | 2x vTSEC (10G-capable) | 2x vTSEC (10G-capable) | 2x vTSEC (10G-capable) |
| Security Engine (SEC) | Yes (AES/SHA/PKA, trusted boot) | Yes (AES/SHA/PKA, trusted boot) | Yes (AES/SHA/PKA, trusted boot) | Yes (AES/SHA/PKA, trusted boot) | Yes (AES/SHA/PKA, trusted boot) |
| PCIe Gen2 Lanes | 2 controllers | 2 controllers | 2 controllers | 2 controllers | 2 controllers |
| Silicon Revision | Rev 2.0 | Rev 2.0 | Rev 2.0 | Rev 2.0 | Rev 2.0 |
Key Differentiators
- Industrial-temperature grade with Layerscape architecture (vs LS1021ASE7MQB)
- Dual-core Cortex-A7 for parallel packet processing (vs LS1020AXE7MQB)
- QUICC Engine (uQE) on-chip for legacy telecom (vs TI Sitara AM5718)
Design Notes
Estimated: at 1.2 GHz core frequency, dual-core Cortex-A7 dissipation is approximately 5-7 W under sustained packet-processing load. With the 525-FCPBGA's thermal pad and ~17 C/W junction-to-ambient resistance on a 4-layer 2 oz copper PCB, junction-rise above 70 C ambient is roughly 110 C - acceptable at 105 C junction-rated case. For a 5 C ambient margin within a fanless enclosure, place a 4 mm machined aluminum heatsink (adds ~5 C/W) directly above the BGA thermal pad with thermal interface material.
DDR3/DDR4 routing on the LS1021AXE7MQB requires matched-length (within 25 mil) byte lanes and a 50 ohm controlled-impedance reference stackup. Per NXP's LS1021A hardware-design guide, isolate the DDR PHY power rails (GVDD/VDD2) from the core VDD rails using a ferrite bead plus bulk caps; place a 100 uF polymer cap at the SoC. Avoid routing any high-speed signals across the BGA's diagonal split plane.
Use a 6-layer PCB minimum: top signal, ground, high-speed signal, split power plane for SoC rails, more signal, ground. The QUICC Engine, vTSEC, and PCIe traces require length matching within 100 mil of their respective clock traces. Place the 25 MHz reference oscillator within 5 mm of the CLK pins and shield it with a guard ring tied to ground to minimize jitter.
Do not assume every variant of LS1021A has identical feature sets. The 'A' suffix (industrial temp) versus 'S' suffix (commercial temp) differs in operating-temperature grade only, but other suffix letters (e.g., 'I' for industrial-grade without SEC) may disable the security engine. Confirm the silicon part-number suffix matches your security requirements before taping out the PCB. Also verify the boot ROM configuration strap resistors match your boot source (NAND, NOR, SD, eMMC).
Compliance Information
Industrial-temperature grade (-40C to +105C) per NXP. RoHS and lead-free compliance per NXP product page and distributor listing. AEC-Q100 not applicable - this is a network processor, not an automotive-qualified MCU.
