M321R4GA3EB2-CWM - 32GB DDR5-5600 ECC RDIMM | Samsung
MPN: M321R4GA3EB2-CWM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $109 | $109.00 |
| 10 | $104 | $1,040.00 |
| 100 | $98 | $9,800.00 |
| 500 | $94 | $47,000.00 |
| 1,000 | $89 | $89,000.00 |
Drop-in alternatives for M321R4GA3EB2-CWM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M321R4GA3EB0-CWM
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✅ Drop-In📋 Reference alternative (not in catalog)
M321R4GA3EB2-CWM Maximum Ratings & Electrical Characteristics
| Memory Capacity | 32 GB |
| Memory Type | DDR5 SDRAM ECC Registered (RDIMM) |
| Data Rate | 5600 MT/s (PC5-44800) |
| Form Factor | 288-pin RDIMM |
| Organization | 2Rx8 (dual rank, x8) |
| Operating Voltage | 1.1 V |
| CAS Latency | CL46 |
| DRAM Composition | 20 x 2Gx8 FBGA DRAM components |
| Ranks | 2 |
| Error Correction | On-die ECC (ODECC) + registered parity/CRC |
| DRAM Die | E-die (12nm-class process) |
| JEDEC Compliance | JEDEC PC5-44800R compliant |
| Module Supply | 12 V input with on-module PMIC (1.1 V DRAM rail) |
| Compatible Platforms | Dell PowerEdge, HPE ProLiant, Lenovo ThinkSystem, Supermicro DDR5 servers |
| RoHS Status | Compliant |
| Peak Bandwidth | Approx. 44.8 GB/s per module |
M321R4GA3EB2-CWM standard Pin Configuration Guide
Complete pinout information for M321R4GA3EB2-CWM (standard package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M321R4GA3EB2-CWM.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M321R4GA3EB2-CWM is suitable for 6 applications: Data Center General-Purpose Servers, Edge Compute Nodes, Virtualization and Low-VM-Density Hosts, Enterprise Workstations, Storage and Backup Appliances, Network and Telecom Infrastructure.
Data Center General-Purpose Servers
The M321R4GA3EB2-CWM is purpose-built for general-purpose data-center servers, where its 32GB capacity, 5600 MT/s data rate, and ECC protection deliver the reliability and bandwidth density that always-on infrastructure demands. As a 2Rx8 RDIMM with registered command/address signaling, it reduces electrical loading on the memory controller so that all DIMM slots can be populated at full speed - critical for 8-16 DIMM-per-CPU platforms. The on-die ECC (ODECC) of DDR5 corrects single-bit errors within each 2Gx8 FBGA DRAM die, improving uptime versus DDR4, while the 1.1V E-die silicon keeps per-module power low, directly reducing data-center cooling overhead. Population rule of thumb: install matched 32GB 2Rx8 modules in the vendor-specified order (typically furthest slot first) to maintain channel balance and reach the full ~44.8 GB/s per-module bandwidth.
Recommended
Edge Compute Nodes
Edge compute and micro-data-center deployments benefit directly from the M321R4GA3EB2-CWM's combination of high capacity per DIMM and low operating voltage. In compact, sometimes passively-cooled edge enclosures, the E-die 12nm-class DRAM's reduced parasitic capacitance and thermal dissipation at 1.1V help keep module temperatures within JEDEC limits without aggressive airflow - a common constraint in edge cabinets. The 32GB capacity per module allows modest-DIMM-count edge servers (2-4 slots) to reach 64-128GB total, sufficient for container runtimes, local inference, and CDN caching workloads. Because the module is a standard JEDEC PC5-44800R RDIMM, it qualifies across Supermicro, Dell, and HPE edge-optimized platforms without vendor-unique SKUs, simplifying spare-parts logistics for distributed fleets where on-site service capacity is limited.
Recommended
Virtualization and Low-VM-Density Hosts
For virtualization hosts running low-VM-density workloads - departmental hypervisors, VDI pools, or small private-cloud nodes - the M321R4GA3EB2-CWM's 32GB per DIMM allows reaching 256-512GB host memory on cost-effective 8-16 slot platforms without stepping up to pricier 64GB+ LRDIMMs. DDR5's doubled bank groups improve the random-access concurrency that hypervisor page-table walks and memory-overcommit features stress, while ECC registered operation satisfies the mandatory-ECC requirement of all major hypervisors for production support. At 5600 MT/s the module supplies ~44.8 GB/s of bandwidth, adequate for consolidated workloads where latency consistency matters more than raw throughput. Pair identical modules across channels to keep NUMA memory symmetric; mismatched populations cause unbalanced node memory and degraded VM placement decisions by the scheduler.
Recommended
Enterprise Workstations
High-end enterprise workstations built on workstation-class Intel Xeon W or AMD Threadripper PRO platforms accept ECC RDIMMs, and the M321R4GA3EB2-CWM fits these sockets as a JEDEC-standard 288-pin DDR5 module. For CAD, financial modeling, simulation, and content-creation workloads, ECC eliminates silent memory errors that corrupt long compute jobs, while 5600 MT/s bandwidth accelerates large dataset movement versus DDR4-3200 predecessors. The 32GB 2Rx8 configuration balances capacity and cost: a 4-DIMM workstation reaches 128GB, adequate for most professional workflows, with room to grow by adding matched pairs. Confirm the platform's QVL before ordering, as some workstation boards validate only specific module builds; the GA3/EB2 subfamily is broadly qualified on current-generation Xeon W and Threadripper PRO boards per distributor compatibility documentation.
Recommended
Storage and Backup Appliances
Enterprise storage controllers and backup appliances from vendors such as Dell PowerEdge storage nodes and Supermicro storage servers use RDIMM for both caching metadata and buffering replication traffic. The M321R4GA3EB2-CWM's registered ECC architecture ensures that cached index data and write-back buffers are protected by on-die ECC, reducing the risk of silent corruption in tiered-storage metadata - a critical reliability requirement when cache contents represent committed writes. Its 32GB capacity at DDR5-5600 (PC5-44800) provides the sustained bandwidth that deduplication and compression engines need, which are often memory-bandwidth-bound at ~44.8 GB/s per module. For appliance OEMs, the JEDEC-standard RDIMM form factor simplifies second-source qualification using the Samsung family variants or compatibility-tested third-party equivalents.
Recommended
Network and Telecom Infrastructure
Carrier-grade routers, 5G UPF nodes, and SDN switches built on server-class CPUs use registered DDR5 memory for flow tables, session state, and control-plane buffers. The M321R4GA3EB2-CWM suits these roles where sustained bandwidth at 5600 MT/s and hard ECC are required but LRDIMM latency is undesirable - RDIMM offers lower access latency than load-reduced modules, benefiting packet-processing lookups. The E-die 1.1V silicon supports the extended-life thermal expectations of telecom racks, and NEBS-style platforms commonly qualify JEDEC-standard RDIMMs like this module through vendor cross-references (e.g., Supermicro MEM-DR5 validation paths documented for the EB2 family). For telecom BOMs requiring dual sourcing, the Samsung family variants provide drop-in second sources without board redesign, since all 288-pin DDR5 RDIMMs share a single JEDEC connector definition.
Recommended
Recommended Products Summary
Engineering reference data for M321R4GA3EB2-CWM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M321R4GA3EB0-CWM | M321R4GA0EB2-CWM | M321R4GA3EB2-CCP | M321R4GA0EB2-CCP | MR51200-328K1-M321R4GA3EB2-CCP-V27 |
|---|---|---|---|---|---|---|
| Package | 288-pin RDIMM | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | NEMIX RAM (third-party) |
| Capacity | 32 GB | 32 GB | 32 GB | 32 GB | 32 GB | 32 GB |
| Data Rate | 5600 MT/s (PC5-44800) | 5600 MT/s | 5600 MT/s | 6400 MT/s (PC5-51200) | 6400 MT/s (PC5-51200) | 6400 MT/s (PC5-51200) |
| Organization / Ranks | 2Rx8 (dual rank x8) | 2Rx8 | 2Rx8 | 2Rx8 | 2Rx8 | 2Rx8 |
| Operating Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| DRAM Die / Process | E-die (12nm-class) | E-die (12nm-class) | [DATA_NEEDED] | E-die (12nm-class) | [DATA_NEEDED] | [DATA_NEEDED] |
| Error Correction | On-die ECC + registered parity/CRC | On-die ECC + registered | On-die ECC + registered | On-die ECC + registered | On-die ECC + registered | Registered ECC |
| JEDEC Compliance | PC5-44800R | PC5-44800R | PC5-44800R | PC5-51200R | PC5-51200R | PC5-51200 |
Key Differentiators
- Newer E-die silicon with lower thermal output (vs M321R4GA3PB0-CWM)
- JEDEC-standard 5600 MT/s for broadest platform qualification (vs M321R4GA3EB2-CCP)
- Registered ECC architecture for production hypervisor support (vs Consumer UDIMMs (e.g., M425R-series))
- Samsung factory silicon with multi-source drop-in options (vs MR51200-328K1-M321R4GA3EB2-CCP-V27)
Design Notes
Never mix module types within a channel: DDR5 platforms require all populated DIMMs to be RDIMMs, and mixing 5600 MT/s (PC5-44800) with 6400 MT/s (PC5-51200) modules such as the M321R4GA3EB2-CCP forces the entire channel down to the lower common speed or the platform's validated maximum. Match rank (2Rx8) and organization (x8) across all modules for NUMA balance. Follow the server vendor's population order - typically the slot farthest from the CPU first - to satisfy registered-DIMM signal-integrity training requirements.
Per Samsung die-comparison documentation, the E-die (12nm-class) silicon in the M321R4GA3EB2-CWM dissipates less heat than earlier P-die builds at the same 1.1V, thanks to tighter timing margins and lower parasitic capacitance. Still, fully populated 16-DIMM servers with dual-rank modules create substantial aggregate heat; verify chassis airflow satisfies the JEDEC module thermal envelope, and use the platform's DIMM temperature telemetry (via SPD hub / PMIC telemetry on DDR5) to detect throttling before it degrades performance.
DDR5 modules regulate their own 1.1V DRAM rail via an on-module PMIC fed from the 12V slot supply, unlike DDR4 where the chipset/board supplied VDD directly. This improves rail integrity per module but means PMIC configuration (default JEDEC vs performance profiles) is set on-module - firmware-level PMIC control requires platform support. Estimated: a fully loaded dual-rank 32GB DDR5-5600 module draws roughly 5-8W depending on utilization; budget PSU and VRM capacity accordingly for 16-24 DIMM configurations.
RDIMMs require no board-level design work in qualified servers, but for custom-carrier or tester designs, the 288-pin DDR5 DIMM connector and register/SPD hub placement must follow the JEDEC DDR5 RDIMM specification. Ensure the SPD hub I2C/I3C bus is accessible for module inventory and thermal data; DDR5 moved SPD functionality into an active hub that must be powered for module detection at boot - a common bring-up failure on first-revision custom boards.
Compliance Information
RoHS compliance per Samsung module standard practice and distributor listings; JEDEC PC5-44800R compliance verified from multiple distributor sources. REACH/halogen-free status not stated in provided data.
