K9FGGY8J5A-CCK0 - Samsung NAND Flash Memory | SSD Storage
MPN: K9FGGY8J5A-CCK0 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.9 | $119.00 |
| 100 | $11.2 | $1,120.00 |
| 500 | $10.6 | $5,300.00 |
| 1,000 | $9.95 | $9,950.00 |
Drop-in alternatives for K9FGGY8J5A-CCK0 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K9FGGY8J5A-BCK0
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View Datasheet →K9EUGY8S0M-CCK0
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View Datasheet →K9EUGY8S0M-BCK0
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View Datasheet →K9DUGY8S0M-CCK0
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View Datasheet →K9DUGY8S0M-BCK0
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View Datasheet →K9CFGY8U5A-CCK0
✅ Drop-In📋 Reference alternative (not in catalog)
K9FGGY8J5A-CCK0 Maximum Ratings & Electrical Characteristics
| Manufacturer | Samsung Electronics |
| Product Family | K9-series NAND Flash |
| Memory Type | NAND Flash (non-volatile) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (CCK0 suffix denotes lead-free packing per Samsung ordering-code system) |
K9FGGY8J5A-CCK0 [data_needed: package type (fbga)] Pin Configuration Guide
Complete pinout information for K9FGGY8J5A-CCK0 ([data_needed: package type (fbga)] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: package type (fbga)] package pinout diagram for K9FGGY8J5A-CCK0](/assets/package-diagrams/default.svg?v=1788069619)
No detailed pinout data available for K9FGGY8J5A-CCK0.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K9FGGY8J5A-CCK0 is suitable for 6 applications: Solid-State Drive Media, Industrial Embedded Storage, Networking and Telecom Equipment, Consumer Electronics and Set-Top Boxes, Automotive Infotainment Storage (Non-Safety), Test, Measurement, and Data Acquisition.
Solid-State Drive Media
The K9FGGY8J5A-CCK0 functions as the raw storage medium in solid-state drives, where an external SSD controller (such as those from Marvell, Silicon Motion, or Phison) manages page/block operations, ECC, wear-leveling, and FTL (flash translation layer) functions. Samsung K9-family NAND is a staple media choice for both consumer and industrial SSD builds because of Samsung's vertical integration and consistent die quality. In an SSD context, the NAND's page size and program/erase characteristics directly determine controller firmware tuning: program times on the order of hundreds of microseconds per page and erase times of a few milliseconds per block set the bounds of sustained write performance. Designers must match the controller's supported NAND list to this specific ordering code, and verify the CCK0 speed grade timing (tR, tPROG, tDBS) in the Samsung datasheet. Multi-channel controllers typically populate 4-8 of these devices per drive to parallelize bandwidth across channels, multiplying effective throughput well beyond a single die's I/O rate.
Recommended
Industrial Embedded Storage
In industrial controllers, PLCs, gateways, and data loggers, the K9FGGY8J5A-CCK0 provides high-density non-volatile storage managed by an embedded host CPU with NAND flash control logic or a dedicated companion controller. Industrial designs favor Samsung K9-family raw NAND for its long product lifecycle, documented bad-block management schemes, and stable supply through authorized channels. The raw NAND approach lets industrial OEMs implement their own wear-leveling and power-fail protection strategies, which is critical for applications writing logs continuously in environments with unstable power. Key design parameters include the NAND's endurance rating (P/E cycles per block, to be confirmed from the datasheet for this die generation), data retention at elevated temperatures, and the ECC strength the host must implement - modern fine-pitch Samsung NAND typically demands strong BCH or LDPC correction. Because commercial-grade NAND usually covers 0C to +70C, extended-temperature designs must verify the industrial temperature variant ordering code with Samsung before qualification.
Recommended
Networking and Telecom Equipment
Routers, switches, and telecom line cards use K9-family NAND flash such as the K9FGGY8J5A-CCK0 to store firmware images, configuration, and log data, typically in a NOR+NAND combination where NOR provides execute-in-place boot code and NAND provides bulk storage. Raw NAND suits these designs because the boot flow can relocate code from NAND to DRAM after the NOR boot stage, exploiting NAND's much lower cost per gigabyte for large firmware and data partitions. Samsung K9 devices expose a standard multiplexed command/address bus (CLE, ALE, WE, RE, CE, R/B) that integrates easily with SoC NAND controllers from major networking processor vendors. Designers must ensure the SoC's NAND driver supports this die generation's timing modes and ONFI/toggle parameter page, and must reserve sufficient ECC overhead in the OOB (out-of-band) area per the datasheet's ECC requirements. High write-uptime log partitions should implement static wear-leveling to avoid premature block wear on configuration storage.
Recommended
Consumer Electronics and Set-Top Boxes
Set-top boxes, smart TVs, and streaming devices employ K9-family NAND flash such as the K9FGGY8J5A-CCK0 as bulk storage for the operating system, applications, and recorded content. Raw NAND managed by the main SoC is the dominant cost-optimized storage architecture in this segment, since managed-NAND (eMMC) carries a controller cost premium. The K9 family's high density per package minimizes board area, an important constraint in thin consumer form factors. Consumer designs typically configure the NAND in multi-die stacked or multi-package arrays behind the SoC's NAND controller, with the firmware's FTL providing wear-leveling and power-loss resilience. Volume consumer production benefits from Samsung's commodity NAND supply cycles, though pricing fluctuates with quarterly NAND contract markets - buyers should hedge with framework agreements. Because consumer devices see low write duty cycles, the NAND's endurance rating comfortably exceeds lifetime requirements when basic wear-leveling is implemented, and the CCK0 speed grade is generally adequate for boot-time and app-launch performance targets.
Recommended
Automotive Infotainment Storage (Non-Safety)
Non-safety automotive infotainment and telematics head units can use K9-family NAND flash as media behind an automotive-qualified SSD or eMMC controller that meets the temperature and quality requirements of the vehicle environment. In such architectures the Samsung raw NAND die provides the bit cost advantage while the wrapper solution supplies the AEC-grade qualification, extended temperature support (-40C to +85C or +105C), and power-interruption robustness that raw NAND alone does not guarantee. Designers must confirm the specific ordering code's temperature grade with Samsung, as standard commercial NAND may not cover automotive ambient ranges. The NAND's page program time (typically a few hundred microseconds) and block erase time (a few milliseconds) shape map-update strategies in the FTL, and write-interrupt schemes must tolerate power loss mid-program without corrupting neighboring pages. Layered ECC (LDPC) matched to this die generation's RBER profile is mandatory for reliable 10-15 year automotive service life.
Recommended
Test, Measurement, and Data Acquisition
Bench instruments, oscilloscopes, and high-speed data acquisition systems use K9-family NAND flash such as the K9FGGY8J5A-CCK0 to buffer and store captured waveforms and measurement records. Raw NAND in striping configurations can deliver the sustained write bandwidth needed to stream acquisition data continuously: populating multiple devices across independent controller channels multiplies aggregate throughput and avoids the capture-dropout caused by NAND program busy times. The deterministic behavior of Samsung K9 command sequences (page program, block erase, multi-plane operations) lets instrument firmware schedule erase operations during idle windows, keeping latency spikes out of the acquisition path. Designers should enable cache-read and multi-plane features where the die supports them, per the datasheet, to further smooth effective bandwidth. Because acquired data volumes are high, endurance budgeting against the datasheet P/E cycle rating determines calibration-data partition placement (preferably on sparingly-written blocks) versus waveform scratch areas.
Recommended
Recommended Products Summary
Engineering reference data for K9FGGY8J5A-CCK0 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K9FGGY8J5A-BCK0 | K9EUGY8S0M-CCK0 | K9DUGY8S0M-CCK0 | K9CFGY8U5A-CCK0 |
|---|---|---|---|---|---|
| Package | [DATA_NEEDED: package type (FBGA)] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Product Family | K9F/K9G NAND Flash | K9F/K9G - same die | K9E generation | K9D generation | K9C generation (32Gb x8 MLC per distributor data) |
| Packing Suffix | CCK0 (lead-free packing/speed option) | BCK0 | CCK0 | CCK0 | CCK0 |
| Density | [DATA_NEEDED: density] | Same die as target | [DATA_NEEDED] | [DATA_NEEDED] | 32 Gb (per distributor listing) |
| Organization | [DATA_NEEDED: organization] | Same die as target | [DATA_NEEDED] | [DATA_NEEDED] | x8 (8G x 8 per distributor listing) |
| Cell Type | [DATA_NEEDED: SLC/MLC/TLC/QLC] | Same die as target | [DATA_NEEDED] | [DATA_NEEDED] | MLC (per distributor listing) |
| Drop-in Compatibility vs Target | Reference | True drop-in (same die, suffix only) | Family substitute - verify timing/footprint | Family substitute - verify timing/footprint | Family substitute - verify footprint/density |
| RoHS / Lead-Free | Compliant (CCK0 suffix) | Compliant (BCK0 suffix) | Compliant (CCK0 suffix) | Compliant (CCK0 suffix) | Compliant (CCK0 suffix) |
| ECC Requirement | [DATA_NEEDED: ECC scheme/strength] | Same die as target | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Same-die suffix variant availability (vs K9FGGY8J5A-BCK0)
- Commodity Samsung NAND supply ecosystem (vs K9CFGY8U5A-CCK0)
- Higher generation density per package (vs K9DUGY8S0M-CCK0)
Design Notes
Never substitute Samsung K9-family ordering codes by density alone. Characters within the code (e.g., FGGY8J5A vs CFGY8U5A) encode generation, organization, and die configuration, and the CCK0/BCK0 suffix encodes packing and speed grade. A drop-in substitution requires identical footprint, organization, timing set (tR, tPROG, tBERS, tDBS), and ONFI/toggle mode support. Always cross-check the candidate's datasheet parameter page against the controller's supported NAND list before releasing a BOM change; controller firmware timing registers and ECC configuration must be updated when the die generation changes.
K9-family NAND uses a multiplexed command/address/data bus where signal integrity on RE/WE strobes directly limits maximum reliable I/O frequency. Keep trace lengths matched between strobe and data lines within the datasheet skew budget, route as controlled impedance, and place series termination near the driver if traces exceed roughly 10 cm. At high toggle-mode speeds, read-enable round-trip delay becomes the gating factor; use the controller's read-reed-reed (read-retry) compensation features. Verify VCCQ decoupling with at least 0.1 uF per data pin group plus bulk capacitance to suppress simultaneous-switching noise during dense page transfers.
NAND program and erase operations draw transient current bursts from VCC as internal charge pumps generate high voltages for cell programming. Size the VCC bulk capacitance (typically 10 uF or more per package, confirm from datasheet) so that voltage droop during multi-plane program operations stays within the specified VCC tolerance, otherwise program errors or charge-pump failures can occur. In multi-package arrays, stagger program scheduling across dies in controller firmware to reduce peak rail current, and verify the PCB power plane can deliver the worst-case aggregate program current across all populated NAND channels.
Compliance Information
CCK0 suffix denotes Samsung lead-free packing option per ordering-code system. Formal RoHS/REACH certificates should be requested from Samsung per production lot.
