MC68EN360ZQ25VL-FR - M683xx QUICC CPU32+ 25MHz MPU | NXP
MPN: MC68EN360ZQ25VL-FR ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $122.3 | $122.30 |
| 10 | $117.5 | $1,175.00 |
| 100 | $108.4 | $10,840.00 |
| 500 | $95.75 | $47,875.00 |
| 1,000 | $86.2 | $86,200.00 |
MC68EN360ZQ25VL-FR Overview
What is a QUICC microprocessor? QUICC (Quad Integrated Communication Controller) is Motorola/Freescale/NXP's flagship 32-bit communications-controller architecture that combines a CPU32+ processor core with the Communications Processor Module (CPM). The CPM offloads serial-channel handling from the CPU through dedicated RISC engines (CP), enabling concurrent management of multiple HDLC/SDLC, UART, and Ethernet channels without burdening the main core. The QUICC family sits within the broader taxonomy: microprocessor (MPU) -> embedded microprocessor -> communications controller -> system-on-chip. This positioning makes QUICC devices the forerunners of modern SoCs with integrated networking peripherals.
Key features of the MC68EN360ZQ25VL-FR include the CPU32+ 32-bit core, integrated DRAM controller, 10 Mbps Ethernet MAC, four serial communications controllers (SCCs) supporting HDLC/SDLC/UART protocols, and a system integration module (SIM60). The 25 MHz clock speed delivers approximately 25 MIPS of processing throughput, and the 3.3V supply keeps power dissipation manageable for embedded systems of the late 1990s / early 2000s era.
The architecture employs a Harvard-style split between the CPU32+ core and the CPM. The CPM contains its own RISC processor, serial channel buffers, and timing controllers, allowing the chip to sustain full-duplex communication on all four SCCs plus Ethernet simultaneously with negligible CPU intervention. Memory is configured via the SIM60 with support for DRAM, SRAM, and flash, plus eight chip selects for external peripherals.
Typical applications include ISDN router/gateway designs, frame-relay access devices, multi-port serial communication concentrators, industrial control systems with networking, and legacy telecommunications infrastructure. The integrated 10 Mbps Ethernet MAC and four SCCs make it particularly suited to early-internet-edge routers, DSLAM line cards, and protocol bridges.
When designing with the MC68EN360ZQ25VL-FR, engineers should follow the layout guidelines in the NXP/Freescale application notes for BGA decoupling and high-speed signal routing. The 357-ball PBGA is a high-pin-count package that demands multilayer PCB stack-up with dedicated power and ground planes; failure to observe signal-integrity recommendations can cause CPM timing violations.
This page synthesizes distributor stock levels, drop-in same-package alternatives, RoHS status and application guidance not consolidated in the manufacturer datasheet alone, helping engineers evaluate lifecycle risk for this legacy communications MPU.
Drop-in alternatives for MC68EN360ZQ25VL-FR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC68EN360ZQ25VL-FR (same form factor and footprint) — differing in Co-Processors / DSP, Ethernet, Manufacturer, Package, Processor Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC68MH360ZQ25VL
✅ Drop-In✓ In Stock
$74.6 / Unit
View Datasheet →MC68EN360VR25VL
✅ Drop-In📋 Reference alternative (not in catalog)
MC68EN360ZQ25VL
✅ Drop-In✓ In Stock
$92.4 / Unit
View Datasheet →MC68360AI25
✅ Drop-In📋 Reference alternative (not in catalog)
MC68EN360CAG25
✅ Drop-In📋 Reference alternative (not in catalog)
MC68EN360ZQ25VL-FR Maximum Ratings & Electrical Characteristics
| Processor Type | M683xx 32-Bit CPU32+ |
| Core | CPU32+ (1 core, 32-bit) |
| Speed (Clock Frequency) | 25 MHz |
| Operating Supply Voltage | 3.3 V |
| Series | M683xx (QUICC) |
| Co-Processors / DSP | Communications; CPM (Communications Processor Module) |
| RAM Controllers | DRAM |
| Graphics Acceleration | No |
| Ethernet | 10 Mbps |
| Number of Cores / Bus Width | 1 core, 32-bit |
| Package / Case | 357-PBGA (357-BBGA), 25x25 mm |
| Packaging | Tray |
| Mounting Type | Surface Mount |
| Lead Free Status | Contains Lead |
| RoHS Status | Non-Compliant |
MC68EN360ZQ25VL-FR 357-pbga (357-bbga), 25x25 mm Pin Configuration Guide
Pin configuration for MC68EN360ZQ25VL-FR (357-pbga (357-bbga), 25x25 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC68EN360ZQ25VL-FR.
Refer to the datasheet for full pin configuration.
Typical Applications
MC68EN360ZQ25VL-FR is suitable for 6 applications: ISDN Router / Gateway, Multi-Port Serial Communication Concentrator, Industrial Control with Networking, Frame-Relay Access Device (FRAD), Legacy Telecommunications Infrastructure, POS Terminal / Embedded Transaction Device.
ISDN Router / Gateway
The MC68EN360ZQ25VL-FR is purpose-built for ISDN router and gateway applications where the integrated CPM delivers four SCC channels plus 10 Mbps Ethernet in a single chip. Its 25 MHz CPU32+ core sustains the IP forwarding and routing tables of small-office routers of the late 1990s / early 2000s era, while dedicated CPM hardware handles PPP, HDLC framing, and V.120 ISDN encapsulation without loading the main core. Placed on a 4-layer PCB with DRAM controller driving 16-32 MB EDO or fast-page RAM, the part gives a router design roughly 25 MIPS of headroom for the control plane and IP stack. Compared to a discrete 68K plus external HDLC controller design, this single chip reduces board area by 40-60% and BOM cost.
Recommended
Multi-Port Serial Communication Concentrator
Four independent SCC channels make the MC68EN360ZQ25VL-FR well-suited for serial concentrator designs that aggregate multiple RS-232/RS-485 or V.35 trunks into a single Ethernet uplink. The CPM's dedicated RISC engine manages full-duplex HDLC on all four SCCs concurrently at up to 7.5 Mbit/s per channel, offloading framing and CRC from the CPU32+ core. This lets the part run a small RTOS plus a TCP/IP stack while sustaining wire-speed serial throughput. The 357-PBGA package provides adequate grounding for the multiple high-speed transceivers typically found alongside it.
Recommended
Industrial Control with Networking
The MC68EN360ZQ25VL-FR integrates Ethernet and multiple SCC channels that allow industrial controllers to expose Modbus, PROFIBUS or DF1 protocols over Ethernet with deterministic serial-to-IP bridging. The 3.3V supply, 25 MHz CPU32+ core, and CPM-driven serial channels give industrial designs a single-chip networking solution that replaces older 68K-plus-Ethernet-chip architectures. With an operating range of 0°C to 70°C and a robust BGA package, the part is well-suited to factory-floor controller enclosures; wide-temperature variants exist for outdoor installations.
Recommended
Frame-Relay Access Device (FRAD)
Designed into frame-relay access devices in the late 1990s, the MC68EN360ZQ25VL-FR handles up to four FRAD ports simultaneously through its SCCs running HDLC framing at 2-4 Mbps per channel. The 10 Mbps Ethernet MAC terminates the LAN-side uplink while the CPM sustains aggregate serial throughput exceeding 8 Mbps of frame-relay traffic - well above the typical T1/E1 WAN rates of that era. With the CPU32+ core running SNMP and frame-relay management software, this part powered branch-office FRADs throughout the 1990s.
Recommended
Legacy Telecommunications Infrastructure
Telecommunications OEMs deployed the MC68EN360ZQ25VL-FR as the control-plane processor in DSLAM line cards, channel banks, and small PBX systems. Its DRAM controller, 10 Mbps Ethernet, and four SCCs map directly to the channel-bank architecture with E1/T1 trunks on the SCC side and 10BASE-T Ethernet for management and provisioning. The 357-PBGA package supports the high-density multilayer backplanes typical of telco equipment. With 3.3V power and proven CPM peripherals, this chip remains in service equipment today.
Recommended
POS Terminal / Embedded Transaction Device
Point-of-sale terminals of the early 2000s used the MC68EN360ZQ25VL-FR to drive magnetic-stripe readers, smart-card interfaces, and Ethernet back-haul in a single chip. The CPU32+ core runs the transaction stack and key-management code, while dedicated CPM SCCs handle the asynchronous protocol to readers and the Ethernet MAC manages the IP-link to the store controller. The integrated DRAM controller supports up to 64 MB of EDO DRAM directly, eliminating the need for an external memory controller and keeping the BOM low.
Recommended
Recommended Products Summary
Engineering reference data for MC68EN360ZQ25VL-FR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC68MH360ZQ25VL | MC68EN360VR25VL | MC68EN360ZQ25VL | MC68360AI25 | MC68EN360CAG25 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core | CPU32+, 32-bit, 1 core | CPU32+, 32-bit, 1 core (enhanced CPM) | CPU32+, 32-bit, 1 core | CPU32+, 32-bit, 1 core (identical die) | CPU32+, 32-bit, 1 core (aluminum-bonded) | CPU32+, 32-bit, 1 core (later revision) |
| Clock Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Co-Processor | CPM with 4 SCCs + 10 Mbps Ethernet | CPM (enhanced) with 4 SCCs + 10 Mbps Ethernet | CPM with 4 SCCs + 10 Mbps Ethernet | CPM with 4 SCCs + 10 Mbps Ethernet | CPM (original) with 4 SCCs + 10 Mbps Ethernet | CPM (later rev.) with 4 SCCs + 10 Mbps Ethernet |
| Ethernet | 10 Mbps MAC | 10 Mbps MAC | 10 Mbps MAC | 10 Mbps MAC | 10 Mbps MAC | 10 Mbps MAC |
| Temperature Range | 0°C to 70°C (commercial) | 0°C to 70°C (commercial) | Extended (wider range, exact value not disclosed) | 0°C to 70°C (commercial) | 0°C to 70°C (commercial) | 0°C to 70°C (commercial) |
| RoHS Status | Non-Compliant (contains lead) | Non-Compliant (legacy part) | Non-Compliant (legacy part) | Non-Compliant (legacy part) | Non-Compliant (legacy part) | Non-Compliant (legacy part) |
| Packaging Form | Tray (-FR suffix = factory reel) | Tray | Tray | Tray | Tray | Tray |
Key Differentiators
- Integrated Communications Processor Module (CPM) offloads serial-channel handling from the CPU (vs Generic 32-bit MPU without CPM)
- 357-PBGA (25x25 mm) is a high-density package supporting 32-bit external memory bus plus all peripherals (vs Lower-pin-count QUICC variants like MC68360FE16)
- 25 MHz CPU32+ core with 3.3V supply - balanced power/performance for embedded communications (vs Lower-frequency QUICC derivatives like MC68EN360FE25)
- FR (factory-reel) packaging variant is drop-in compatible with the standard MC68EN360ZQ25VL (vs MC68360AI25 (aluminum-bonded revision on same footprint))
Design Notes
The 357-ball PBGA (25x25 mm) demands a multilayer PCB stack-up with at least one dedicated ground plane and one power plane. Per NXP application notes for the M68360 family, place 0.1 µF ceramic decoupling capacitors within 0.5 inch of every power pin group, plus bulk 10 µF tantalum capacitors at each power-supply rail entry. Use microvia-in-pad or dog-bone fanouts for BGA balls; trace impedance should match the 50 Ω single-ended / 100 Ω differential target for Ethernet MII traces. Failure to observe these guidelines can cause CPM timing violations and intermittent serial-channel errors.
Estimated: at 3.3 V supply, 25 MHz clock, and full Ethernet plus four SCC channels active, the MC68EN360ZQ25VL-FR dissipates approximately 1.4-1.8 W internal power (typical design figures from NXP datasheet section on power consumption). The 25x25 PBGA exposed-pad - if present on this specific variant - should be soldered to a copper pour of at least 1 square inch on the top layer to keep junction temperature rise below 15°C in still air. No external heatsink is required for typical embedded applications.
Do not assume all MC68EN360 silicon revisions behave identically at the register level - early 'AAG' die revisions have known errata for SCC3 buffer alignment that are fixed in the later 'CAG' revision. Verify the silicon mask revision via the chip's system integration module before locking firmware. Also note that the -FR suffix on NXP/Freescale MC68EN360 parts denotes factory-reel packaging, NOT a temperature grade, so do not interpret -FR as wide-temperature.
The MII (Media Independent Interface) between the MC68EN360ZQ25VL-FR and the external PHY runs at 25 MHz and must be length-matched within ±0.5 mm (≈50 ps) to prevent Ethernet MII receive errors. Keep MII traces over a continuous ground plane, away from the SCC-driver outputs, and route clock and data together with matched loading. For designs running HDLC on SCCs above 4 Mbps, apply the same length-matching rule to the SCC_TX/RX pairs.
Compliance Information
Contains lead per distributor data; RoHS non-compliant. Not AEC-Q100 qualified (telecom/industrial MPU, not automotive). REACH, halogen, and conflict-minerals status not specifically disclosed in the verified data.
