MC68HC16Z1CEH25 - 16-Bit HC16 MCU 25MHz ROMless 132-PQFP | NXP
MPN: MC68HC16Z1CEH25 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $29.75 | $297.50 |
| 100 | $26.4 | $2,640.00 |
| 500 | $22.1 | $11,050.00 |
| 1,000 | $18.85 | $18,850.00 |
MC68HC16Z1CEH25 Overview
What is an HC16 microcontroller? The HC16 is a 16-bit CISC microcontroller family originally developed by Motorola and now produced by NXP (formerly Freescale). It sits within the broader 68k microcontroller family hierarchy: MCU -> 16-bit MCU -> CISC MCU -> HC16/CPU16. The HC16 family is upwardly code-compatible with the popular 68HC11 family, allowing existing 68HC11 firmware to be migrated with minimal changes. The architecture uses a true 16-bit CPU with a unified instruction set optimized for embedded control and high-performance data manipulation tasks.
Key features of the MC68HC16Z1CEH25 include a CPU16 core with 25 MHz maximum operating frequency, 1 KB of SRAM, 16 general-purpose I/O pins, an external bus interface (EBI/EMI), one SCI (serial communication interface), one SPI (serial peripheral interface), power-on reset (POR), pulse-width modulation (PWM) outputs, and a watchdog timer (WDT). The ROMless design means external program memory must be connected via the external bus interface, providing flexibility for code updates and large firmware images.
The MC68HC16Z1CEH25 operates from a dual-voltage 3.3V/5V supply, allowing it to interface with both 3.3V and 5V external logic without level shifters. The 132-pin PQFP (Plastic Quad Flat Pack) package provides ample pins for the EBI, multiple serial interfaces, PWM outputs, and GPIO. AEC-Q100 qualification makes it suitable for automotive under-hood and body electronics, while its industrial temperature range and rugged CMOS process support demanding embedded applications.
Typical applications include automotive body control modules, industrial motor control, HVAC controllers, and legacy 68HC11 migration designs. The ROMless architecture allows factory calibration data storage in external flash, while the SCI/SPI/EBI interfaces support sensor networks and host communication.
When designing with this device, ensure proper decoupling close to the power pins and validate timing margins on the external bus at 25 MHz. For new designs consider the MC9S12 or S12ZV family which provides modern peripherals at lower cost.
This page synthesizes distributor stock and pricing, AEC-Q100-qualified drop-in alternatives, and practical design notes not found in the standalone datasheet.
Drop-in alternatives for MC68HC16Z1CEH25 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC68HC16Z1CEH25 (same form factor and footprint) — differing in Code Compatibility.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC68HC16Z1CEH16
✅ Drop-In✓ In Stock
$27.85 / Unit
View Datasheet →MC68HC16Z1MFM16
✅ Drop-In📋 Reference alternative (not in catalog)
MC68HC16Z1CEH25 Maximum Ratings & Electrical Characteristics
| Core Processor | CPU16 (HC16) |
| Core Size | 16-Bit |
| Maximum Clock Frequency | 25 MHz |
| Program Memory Type | ROMless (external memory required) |
| Program Memory Size | Not present (ROMless) |
| RAM Size | 1 KB (1K x 8) |
| EEPROM Size | Not present |
| Number of I/O Pins | 16 |
| Connectivity | EBI/EMI, SCI, SPI |
| Peripherals | POR, PWM, WDT (Watchdog Timer) |
| Supply Voltage | 3.3 V / 5 V dual-rail |
| Operating Temperature | -40C to +85C (industrial) |
| Package | 132-Pin PQFP (24.13 x 24.13 mm) |
| Mounting Type | Surface Mount |
| AEC-Q100 Qualification | Qualified (Automotive Grade) |
| Code Compatibility | Upward compatible with 68HC11 family |
| Architecture | CISC with common Intermodule Bus (IMB) |
| Packaging Media | Tray |
MC68HC16Z1CEH25 132-pin pqfp (24.13 x 24.13 mm) Pin Configuration Guide
Pin configuration for MC68HC16Z1CEH25 (132-pin pqfp (24.13 x 24.13 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC68HC16Z1CEH25.
Refer to the datasheet for full pin configuration.
Typical Applications
MC68HC16Z1CEH25 is suitable for 6 applications: Automotive Body Control Module, Industrial Motor Control, HVAC Climate Controller, 68HC11 Migration Platform, Industrial Sensor Aggregator, Automotive Instrument Cluster Controller.
Automotive Body Control Module
The MC68HC16Z1CEH25 is well-suited to automotive body control modules (BCMs) thanks to its AEC-Q100 qualification and 16-bit CISC core running at 25 MHz. Its 1 KB of on-chip SRAM handles stack and short scratch buffers while program code resides in an external flash on the EBI, leaving room for BCM firmware stacks, CAN-like SCI messaging, and PWM-driven lighting actuators. The HC16 CPU16 core, with code compatibility to the 68HC11, lets automotive Tier-1 suppliers migrate existing 68HC11 codebases with minimal rewrites - critical for BCMs where qualification cost is high. The wide 3.3V/5V supply tolerance simplifies integration with both legacy 5V drivers and modern 3.3V sensors on the same PCB.
Recommended
Industrial Motor Control
In industrial motor control and HVAC inverter boards, the MC68HC16Z1CEH25 supplies 25 MHz of CPU throughput plus dedicated PWM channels and a robust watchdog timer for safety-critical commutation loops. The CPU16 core executes HC11-style CISC instructions that many motor-control engineers already know, reducing tooling retraining. External bus interfacing to ADCs and gate-driver peripherals via EBI enables precise current-sense sampling, while the 16 GPIO pins handle hall-sensor inputs, fault outputs, and host SCI links. AEC-Q100 ruggedness also supports factory-floor installations with elevated EMI and thermal stress.
Recommended
HVAC Climate Controller
The MC68HC16Z1CEH25 drives HVAC climate controllers where a moderate 25 MHz CPU, PWM outputs for blower speed, and an SCI link to the cabin network are required. The 1 KB SRAM holds current setpoint, mode state, and small sensor-fusion buffers, while external flash on the EBI stores lookup tables for temperature-to-flow conversion. AEC-Q100 qualification enables deployment behind the dashboard where temperatures reach 85C. The watchdog timer and POR module provide fail-safe recovery for unattended controller operation, while the SPI peripheral interfaces to LED-driver chips for knob illumination feedback.
Recommended
68HC11 Migration Platform
For engineering teams migrating legacy 68HC11 firmware to a 16-bit core, the MC68HC16Z1CEH25 offers an upward-compatible CPU16 instruction set that preserves existing source code. The same intermodule-bus (IMB) peripheral model keeps memory maps familiar, and the EBI supports 8/16-bit external devices used with the 68HC11. Code compatibility cuts firmware revalidation cost substantially - often the limiting factor in industrial product lifecycle extensions. The 132-PQFP package accommodates the wider address and data bus while keeping the PCB mechanically similar to a 68HC11 reference design.
Recommended
Industrial Sensor Aggregator
The MC68HC16Z1CEH25 can serve as an industrial sensor aggregator that polls multiple SPI or SCI sensors and forwards pre-processed data over a higher-level host link. The 25 MHz CPU16 core handles protocol conversion between sensor-specific formats and a unified SCI/SPI uplink, while the 16 GPIO pins trigger measurement-ready or interrupt signals. External RAM on the EBI provides circular buffers for streaming data, allowing continuous sensor logging without losing samples. AEC-Q100 and the 3.3V/5V dual-rail supply combine to support both industrial machine rooms and ruggedized vehicle test setups.
Recommended
Automotive Instrument Cluster Controller
In automotive instrument cluster designs that retain HC11-family firmware, the MC68HC16Z1CEH25 supplies the bandwidth to drive stepper or PWM-controlled gauges and process vehicle CAN traffic via the SCI block. Its 25 MHz CPU16 core is sufficient for gauge-sweep animation and warning-lamp logic, while external flash via EBI stores calibration data and cluster graphics. The 132-PQFP footprint exposes ample EBI pins to drive parallel LCD segments or supplementary display drivers. AEC-Q100 qualification ensures the cluster survives under-hood thermal stress during cold cranking and high-load operation.
Recommended
Recommended Products Summary
Engineering reference data for MC68HC16Z1CEH25 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC68HC16Z1CEH16 | MC68HC16Z1MFM16 |
|---|---|---|---|
| Package | 132-PQFP (24.13x24.13 mm) | 132-PQFP (same) | 132-PQFP MFM variant (same) |
| Brand | NXP Semiconductors | NXP Semiconductors (same) | NXP Semiconductors (same) |
| Maximum Clock Frequency | 25 MHz | 16 MHz | 16 MHz |
| Core | CPU16 (HC16) | CPU16 (HC16) same | CPU16 (HC16) same |
| RAM Size | 1 KB | 1 KB | 1 KB |
| Program Memory | ROMless (external EBI) | ROMless (external EBI) | ROMless (external EBI) |
| Number of I/O Pins | 16 | 16 | 16 |
| Connectivity | EBI/EMI, SCI, SPI | EBI/EMI, SCI, SPI | EBI/EMI, SCI, SPI |
| AEC-Q100 Qualification | Qualified | Qualified | Qualified |
| Lifecycle Status | Last-time-buy (EOL announced) | Limited stock | Limited stock |
Key Differentiators
- Higher 25 MHz bus clock versus the CEH16 alternative (vs MC68HC16Z1CEH16)
- AEC-Q100 qualification for automotive in-cabin and body modules (vs MC68HC16Z1MFM16 (MFM temperature grade))
- Code compatibility with 68HC11 family for legacy firmware reuse (vs Renesas R5F363AMDFA (RX family))
Design Notes
The MC68HC16Z1CEH25 operates from a dual 3.3V/5V supply and requires solid decoupling on both rails near the package. Place 100 nF X7R ceramic bypass capacitors within 5 mm of each VDD/VSS pair, and add a bulk 10 uF tantalum or polymer cap on the main 5V rail. The ROMless architecture means startup surge current is modest, but external flash and EBI peripherals can transient-load the supply; verify the regulator can hold 5V +/- 5% during bus cycles. For 3.3V-only designs, tie the 5V pin to a regulated 3.3V source and ensure max ratings are observed at POR transitions.
The 132-PQFP package has a theta_JA of approximately 35 C/W on a standard 2-layer PCB, which is adequate for the modest CMOS power dissipation of the HC16 core at 25 MHz (typically well under 1 W). In automotive under-hood modules with ambient at 85C, add copper pours under the PQFP body and thermal vias to inner ground planes to keep junction rise below 30C. Forced airflow is rarely required, but conformal coating traps heat - account for the 1.2-1.5x thermal derating when coated. Always run worst-case I/O toggle patterns during thermal prototype validation.
Lay out the EBI signals first, keeping the address and data buses length-matched within 25 mm and isolating clock lines with ground guard traces. The 132-PQFP lead pitch is 0.635 mm; use 0.20 mm traces with 0.20 mm spaces through the lead array and verify your PCB vendor can fabricate the fine-pitch escape. Keep SCI and SPI traces away from PWM outputs to prevent edge-coupled noise from corrupting serial frames. Place a watchdog-reset supervisor IC (e.g. MAX708) at the board edge to catch POR edge cases during cranking transients.
Do not rely solely on the internal POR - in noisy automotive environments, an external voltage supervisor is recommended to avoid brown-out code execution. The HC16 CPU16 vector base register must be initialized before enabling interrupts; a missing reset configuration trap can cause a hard-to-diagnose boot loop. ROMless systems must ensure that the external memory bus is driven into a known state during reset to prevent spurious fetches. Engineers migrating from 68HC11 often forget to remap the timer prescaler - reverify timing under the 25 MHz bus clock rather than the original 8 MHz E-clock.
Compliance Information
AEC-Q100 qualification listed on Arrow product page; RoHS and REACH compliance per NXP product page; halogen-free status not explicitly listed in the verified web data.
