MC7457RX1000NC - PowerPC G4 MPU 1.0GHz 483-FCCBGA | NXP Semiconductors
MPN: MC7457RX1000NC ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $713.34 | $713.34 |
| 10 | $680 | $6,800.00 |
| 100 | $625 | $62,500.00 |
| 500 | $580 | $290,000.00 |
| 1,000 | $545 | $545,000.00 |
MC7457RX1000NC Overview
A microprocessor (MPU) is a single-chip CPU that fetches, decodes, and executes instructions; the PowerPC G4 is an implementation of the PowerPC instruction set architecture (ISA) widely used in embedded computing, networking, aerospace, and defense. Within the hierarchy MPU -> microprocessor -> processor -> integrated circuit, the MPC7457 occupies the high-performance tier, with deep pipelines, out-of-order execution, dedicated L1 I-cache and D-cache, and an integrated L2 cache controller. The FCCBGA (flip-chip ceramic BGA) package provides robust thermal performance and is qualified for high-reliability military and industrial applications.
Key specifications include a 1.0 GHz clock frequency, a 167 MHz external bus, a 64-bit data path, single-core 32-bit architecture with 128-bit AltiVec unit, and operating temperature support up to 105 °C. Compared to its predecessor MPC7455, the MPC7457 is footprint-compatible when the core is operated at 1.3 V, and according to NXP, it offers substantially higher throughput per watt than earlier PowerPC parts.
Typical applications include embedded networking equipment (routers, switches, base stations), military and aerospace electronics, industrial control systems, high-performance storage controllers, and legacy PowerPC-based single-board computers. The 483-FCCBGA package and 1.3 V core supply simplify board design relative to older PowerPC parts that required multiple voltage rails.
When designing with the MC7457RX1000NC, ensure the board follows NXP's reference design for the MPC7457; the part dissipates significant power at 1 GHz, so a thermal management strategy combining the ceramic BGA's thermal pad with board-level copper is essential. The part is mature and is typically sourced from authorized distributors or licensed aftermarket suppliers.
This page synthesizes distributor pricing, drop-in alternatives from the MPC74xx family, and practical design notes not found in the manufacturer's short-form marketing summary.
Drop-in alternatives for MC7457RX1000NC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC7457RX1267LC
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC7457RX1333NC
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC7457RX867NC
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC7457HX1000LC
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC7447RX1000NC
✅ Drop-In📋 Reference alternative (not in catalog)
MC7457RX1000NC Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale/Motorola) |
| Part Family | MPC7457 PowerPC G4 |
| Architecture | RISC (PowerPC) |
| Core | PowerPC G4 (single core) |
| Data Bus Width | 64-bit |
| Instruction Set Width | 32-bit |
| SIMD Unit | AltiVec (128-bit) |
| Core Clock Frequency | 1.0 GHz |
| Bus Clock Frequency | 167 MHz |
| Process Technology | 0.13 um CMOS |
| Core Supply Voltage | 1.3 V |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V |
| Package Type | FCCBGA (flip-chip ceramic BGA), 29 x 29 mm |
| Pin / Ball Count | 483 |
| Ball Pitch | 1.27 mm |
| Package Height | 3.22 mm |
| Operating Temperature | Up to 105 °C (industrial / military grade) |
| Mounting Type | Surface Mount (BGA) |
MC7457RX1000NC 3.22 mm Pin Configuration Guide
Pin configuration for MC7457RX1000NC (3.22 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC7457RX1000NC.
Refer to the datasheet for full pin configuration.
Typical Applications
MC7457RX1000NC is suitable for 7 applications: High-Performance Embedded Networking, Military and Aerospace SBCs, Industrial Automation Controllers, Storage Controllers and RAID, Legacy Single-Board Computer Upgrades, Test and Measurement Equipment, Print and Imaging Pipeline Controllers.
High-Performance Embedded Networking
The MC7457RX1000NC fits routers and switches that need deterministic packet throughput at gigabit rates. The AltiVec 128-bit SIMD engine accelerates IPsec and IPv4/v6 forwarding, while the 167 MHz PowerPC system bus connects directly to NXP networking companion chips. Compared to ARM alternatives, the PowerPC G4 still leads in per-MHz ALU/vector math throughput for legacy codebases, which is why many carriers retain this MPU in long-life telecom platforms. Designers should pair it with a TC layer and DDR memory controller and respect the 1.3 V core supply. This is a fit for sustainment programs in access and aggregation networks.
Recommended
Military and Aerospace SBCs
The MC7457RX1000NC is well-suited to ruggedized single-board computers and avionics sub-systems thanks to the ceramic FCCBGA package, 105 °C operating temperature, and long-term availability via Rochester Electronics. The 483-ball ceramic BGA delivers excellent thermal performance for conduction-cooled chassis that follow VITA/VPX layouts, and the part supports ECC memory for mission-critical reliability. Compared to newer ARM SoCs, the MPC7457 remains relevant in defense platforms where code, certification, and supply chain are already qualified and re-design is undesired.
Recommended
Industrial Automation Controllers
For industrial controllers that demand deterministic real-time performance, the MC7457RX1000NC's PowerPC G4 core plus AltiVec vector unit can offload DSP-style loops such as motor-control math and servo-loop signal processing. Its 1.0 GHz clock provides margin for closed-loop cycle times well under 100 µs, and the FCCBGA package survives factory-floor thermal and vibration conditions. Compared to plain microcontrollers, the MPU class performance supports PLC/PAC applications needing complex motion or vision front-ends without going to an external DSP.
Recommended
Storage Controllers and RAID
The MC7457RX1000NC works well in RAID and SAN controllers where AltiVec accelerates XOR/parity calculations and CRC checks at line rate. The 64-bit data bus feeds multi-gigabit SAS/SATA traffic without bottleneck, and the 167 MHz bus clock plus 1.0 GHz core match typical enterprise storage throughput envelopes. Designers typically pair it with multiple PHY parts and a DMA engine, while the MPU orchestrates I/O and metadata. Long-term supply through Rochester Electronics is critical for OEM service contracts.
Recommended
Legacy Single-Board Computer Upgrades
The MC7457RX1000NC is a direct upgrade path for boards originally designed around the MPC7455, providing higher throughput with the same 483-FCCBGA footprint and 1.3 V core rail when the host supply is already configured for 1.3 V operation. This makes it ideal for refresh programs that modernize compute while keeping I/O, firmware, and chassis unchanged. The upgrade typically increases throughput 30-50 % versus the MPC7455 at equivalent frequency bins, while preserving all existing software investments.
Recommended
Test and Measurement Equipment
Bench instruments such as protocol analyzers, oscilloscopes, and signal generators benefit from the MC7457RX1000NC's AltiVec vector throughput when computing FFTs, filters, and modulation/demodulation in real time. The MCU also controls front-panel HMI logic and instrument calibration simultaneously, thanks to ample headroom over the 1.0 GHz core clock. Compared to FPGAs, the MPU offers a friendlier software toolchain for complex state machines while still leveraging SIMD for DSP-style inner loops.
Recommended
Print and Imaging Pipeline Controllers
The MC7457RX1000NC supports high-end production printers and image-processing pipelines where AltiVec provides the throughput needed for 2D/3D image transforms, color conversion, and real-time RIP operations. The ceramic BGA's thermal envelope matches the high-duty-cycle environment of commercial printing, and the part drives multiple high-speed peripherals (DRAM, host bus, imaging sensors) over its 64-bit bus. Designers in this space value long-term supply continuity from authorized aftermarket suppliers.
Recommended
Recommended Products Summary
Engineering reference data for MC7457RX1000NC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC7457RX1267LC | MC7457RX1333NC | MC7457RX867NC | MPC7457HX1000LC | MC7447RX1000NC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 483-FCCBGA (29x29 mm) | 483-FCCBGA (29x29 mm) - same | 483-FCCBGA (29x29 mm) - same | 483-FCCBGA (29x29 mm) - same | 483-FCCBGA (29x29 mm) - same | 483-FCCBGA (29x29 mm) - same |
| Core Frequency | 1.0 GHz | 1.267 GHz | 1.333 GHz | 867 MHz | 1.0 GHz | 1.0 GHz |
| Bus Frequency | 167 MHz | 167 MHz | 167 MHz | 167 MHz | 167 MHz | 167 MHz |
| Core Voltage | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.0 V |
| Data Bus Width | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit |
| AltiVec SIMD | 128-bit | 128-bit | 128-bit | 128-bit | 128-bit | 128-bit |
| L2 Cache | Present (MPC7457 hierarchy) | Present | Present | Present | Present | Reduced / integrated L2 controller absent |
| Process Technology | 0.13 µm CMOS | 0.13 µm CMOS | 0.13 µm CMOS | 0.13 µm CMOS | 0.13 µm CMOS | 0.13 µm CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- AltiVec 128-bit SIMD engine for vector acceleration (vs MC7447RX1000NC)
- Multiple speed bins in the same footprint (vs MC7457RX867NC (lower-cost) or MC7457RX1333NC (higher-performance))
- Drop-in replacement path for the MPC7455 at 1.3 V core (vs MPC7455 predecessor part)
Design Notes
At 1.0 GHz the MC7457RX1000NC dissipates substantial power (datasheet figures should be confirmed in the MPC7457 hardware specification addendum). Always mount a heatsink or heat-spreader with a thermal interface material on the FCBGA's exposed thermal pad; without it the junction temperature will exceed the 105 °C maximum under sustained compute load. Use NXP's thermal application note values for theta_JA in your airflow regime.
The MC7457RX1000NC requires a sequenced 1.3 V core rail plus 1.5 V / 1.8 V / 2.5 V I/O rails. Follow NXP's recommended power-up sequence (core before I/O) and power-down sequence (I/O before core) to prevent latch-up. Use a multi-rail controller IC matched to the tolerances in the datasheet, and provision decoupling on every power pin per the reference design.
The 483-ball FCCBGA at 1.27 mm pitch requires a 4-6 layer PCB with controlled-impedance routing for the 64-bit data bus and 167 MHz MPX bus signals. Use the NXP BSDL and IBIS models for board bring-up and signal-integrity simulation. Via-in-pad is recommended for the BGA break-out; component population should follow the JEDEC J-STD-033 moisture-sensitivity guidelines and the part should be dry-pack handled.
Do not assume the MC7457 is interchangeable with the MPC7455 without checking core voltage: the MPC7457 requires 1.3 V on VDD core while some MPC7455 boards run at 1.0 V, which would prevent boot. Also confirm that firmware/boot code supports the APOLLO 7 silicon revision indicated by the part number suffix, and that JTAG boundary-scan tooling is using the BSDL file from NXP, not a third-party mirror.
Compliance Information
RoHS, lead-free, and halogen-free status were not present in the verified distributor results; consult NXP's material declaration. AEC-Q100 is not applicable because this is a high-performance MPU, not an automotive-grade IC. Long-term authorized aftermarket supply is available through Rochester Electronics for military/industrial programs.
