MC9S08EL16CTJ - 8-bit S08 MCU 16KB Flash 40MHz TSSOP-20 | NXP
MPN: MC9S08EL16CTJ ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.79 | $4.79 |
| 10 | $4.31 | $43.10 |
| 100 | $3.83 | $383.00 |
| 500 | $3.43 | $1,715.00 |
| 1,000 | $3.05 | $3,050.00 |
MC9S08EL16CTJ Overview
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, memory, and peripherals. Within the power-management and embedded hierarchy, MCUs sit below microprocessors and above discrete logic, providing programmable control for connected devices. The S08EL family extends the legacy HC08 instruction set with the BGND instruction for background debugging, and the S08EL is specifically optimized for slave-side LIN nodes in automotive and industrial sensor clusters.
Key features include 16 KB Flash program memory, 1 KB RAM, 512 bytes EEPROM, an HCS08 CPU at 40 MHz bus clock, 16 general-purpose I/O pins, and a peripheral set comprising PWM, watchdog timer (WDT), low-voltage detection (LVD), power-on reset (POR), and connectivity blocks for I2C, LIN, SCI (UART), and SPI. The SLIC block handles LIN framing autonomously, freeing the CPU for application logic and improving deterministic response to LIN bus events.
The MC9S08EL16CTJ uses a 3.3 V/5 V dual-voltage supply architecture and an industrial-grade operating temperature range that allows it to be deployed in harsh environments. Its low-power run and wait modes make it suitable for always-on or battery-backed nodes that spend most of their time in standby and wake on LIN or GPIO events.
Typical applications include automotive LIN slave nodes such as window regulators, mirror controllers, seat adjusters, HVAC damper drivers, and sensor clusters. Industrial uses include low-cost LIN-connected sensors, household appliances with LIN networking, and replacement of legacy HC908 designs with a pin-compatible upgrade path.
When designing with this device, ensure the supply rail is decoupled with a 0.1 uF ceramic capacitor close to VDD and VSS, follow the in-circuit debugger (ICD) recommendations, and respect the maximum rated bus frequency. The 20-pin TSSOP footprint simplifies layout, but pin allocation for the SLIC, SCI, and timer channels should be reviewed against the LIN physical layer driver.
This page synthesizes distributor pricing, drop-in alternatives from the same S08EL/S08SL family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for MC9S08EL16CTJ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S08EL16CTJ (same form factor and footprint) — differing in Package, Connectivity, Core Processor, Instruction Set, EEPROM Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S08EL32CTJ
✅ Drop-In✓ In Stock
$4.1829 / Unit
View Datasheet →S9S08EL32F1CTJR
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08SL8CTJ
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08SH16MTJ
✅ Drop-In✓ In Stock
$2.95 / Unit
View Datasheet →S9S08SG16E1MTJR
✅ Drop-In📋 Reference alternative (not in catalog)
S9S08EL32F1CTJ
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.25 / Unit
View Datasheet →MC9S08EL16CTJ Maximum Ratings & Electrical Characteristics
| Core Processor | S08 (HCS08) |
| Core Size | 8-bit |
| Maximum CPU Frequency | 40 MHz |
| Program Memory Size | 16 KB (16K x 8) Flash |
| RAM Size | 1 KB |
| EEPROM Size | 512 x 8 (512 bytes) |
| Number of I/O | 16 |
| Supply Voltage | 2.7 V to 5.5 V (3.3 V / 5 V operation) |
| Connectivity | I2C, LINbus (via SLIC), SCI (UART), SPI |
| Peripherals | LVD, POR, PWM, WDT, SLIC (Slave LIN Interface Controller) |
| Package | 20-pin TSSOP (4.40 mm body width) |
| Mounting Type | Surface Mount |
| Instruction Set | HC08 with added BGND instruction |
| RoHS Status | Compliant (per distributor listings) |
MC9S08EL16CTJ Pin Configuration
| Pin 1 | PTB0/KWP0/TCLK0 — Port B bit 0 / Keyboard wake-up / Timer clock |
| Pin 2 | PTB1/KWP1 — Port B bit 1 / Keyboard wake-up |
| Pin 3 | PTB2/KWP2/SDA — Port B bit 2 / Keyboard wake-up / I2C SDA |
| Pin 4 | PTB3/KWP3/SCL — Port B bit 3 / Keyboard wake-up / I2C SCL |
| Pin 5 | VDD — Supply voltage (2.7 V to 5.5 V) |
| Pin 6 | VSS — Ground reference |
| Pin 7 | PTA0/TXD — Port A bit 0 / SCI transmit |
| Pin 8 | PTA1/RXD — Port A bit 1 / SCI receive |
| Pin 9 | PTA2/MISO — Port A bit 2 / SPI MISO |
| Pin 10 | PTA3/MOSI — Port A bit 3 / SPI MOSI |
| Pin 11 | PTA4/SPSCK — Port A bit 4 / SPI clock |
| Pin 12 | PTA5/LIN_TX — Port A bit 5 / SLIC LIN transmit |
| Pin 13 | PTA6/LIN_RX — Port A bit 6 / SLIC LIN receive |
| Pin 14 | PTA7/PWM — Port A bit 7 / PWM output |
| Pin 15 | RESET_b — Active-low reset input |
| Pin 16 | BKGD/MS — Background debug / Mode select |
| Pin 17 | PTB4/ACMPO — Port B bit 4 / Analog comparator output |
| Pin 18 | PTB5/ADP5 — Port B bit 5 / ADC channel |
| Pin 19 | PTB6/ADP6 — Port B bit 6 / ADC channel |
| Pin 20 | PTB7/ADP7 — Port B bit 7 / ADC channel |
Typical Applications
MC9S08EL16CTJ is suitable for 6 applications: Automotive LIN Slave Node (Body Electronics), Industrial LIN-Connected Sensor Clusters, Household Appliance Control Modules, Battery-Backed Always-On Sensor Nodes, Legacy HC908 Migration Path, Cost-Sensitive PWM and Motor Driver Front Ends.
Automotive LIN Slave Node (Body Electronics)
The MC9S08EL16CTJ is purpose-built for automotive LIN slave nodes such as window regulators, mirror controllers, seat adjusters, and HVAC damper drivers. Its hardware SLIC autonomously handles LIN 2.x framing - break, sync, PID, and checksum - which frees the 40 MHz HCS08 CPU for application logic and delivers deterministic bus response within the LIN timing budget. With 16 KB Flash and 512 B EEPROM, the part stores calibration tables and node configuration persistently across power cycles. The 16 GPIO easily cover typical body-electronic loads, and the 2.7 V-5.5 V supply range tolerates automotive 12 V-derived rails.
Recommended
Industrial LIN-Connected Sensor Clusters
For factory-floor sensor clusters and industrial actuators wired on a LIN backbone, the MC9S08EL16CTJ combines the SLIC for slave-side LIN with the 40 MHz HCS08 CPU for sensor acquisition and conditioning. The 1 KB RAM is sufficient to buffer LIN frames while the 512 B EEPROM stores calibration constants and unit IDs per node. Its 2.7 V to 5.5 V operation supports both 3.3 V regulated industrial buses and 5 V legacy rails. Compared with a software-implemented LIN stack, the hardware SLIC cuts interrupt load by an order of magnitude on this 8-bit core.
Recommended
Household Appliance Control Modules
Washing machines, dishwashers, ovens, and refrigerators increasingly use LIN sub-bus nodes for keypad panels, displays, and small motor drivers - and the MC9S08EL16CTJ is a strong fit at 16 KB Flash. The SLIC lets a control board talk to a remote keypad or display module over LIN with minimal CPU overhead, while the 16 PWM-capable GPIO drive LEDs, buzzers, and small DC loads. Its low-power run and wait modes suit always-on appliance nodes that wake on LIN or keypad interrupts. The industrial temperature grade tolerates the warm enclosures of kitchen appliances.
Recommended
Battery-Backed Always-On Sensor Nodes
The MC9S08EL16CTJ's low-power run and wait modes make it a natural choice for battery-backed or energy-harvesting sensor nodes that wake periodically on a LIN or GPIO event. The 16 KB Flash holds a small RTOS or state machine, while the 512 B EEPROM stores logged events across sleep periods. The 2.7 V minimum supply lets it run from a single Li-ion cell or a 3.3 V regulated rail. The hardware SLIC reduces wake-time CPU burden so the device returns to sleep faster, extending battery life compared to a software LIN stack.
Recommended
Legacy HC908 Migration Path
Designers with installed HC908 LIN slave firmware can migrate to the MC9S08EL16CTJ with minimal code rework because the HCS08 core retains the HC08 instruction set plus the added BGND instruction for background debug. The 20-pin TSSOP footprint, peripheral register layout, and toolchain (CodeWarrior / Eclipse-based NXP IDE) shorten the qualification cycle. The S08EL brings modern low-power modes and a hardware SLIC that offloads LIN work the HC908 had to do in software. This makes the MC9S08EL16CTJ a near drop-in upgrade for end-of-life HC908 LIN designs.
Recommended
Cost-Sensitive PWM and Motor Driver Front Ends
With PWM, WDT, LVD, POR, and up to 16 GPIO, the MC9S08EL16CTJ can act as a small motor or LED driver front end, with LIN connectivity for remote commands from a body or appliance master. The 40 MHz CPU runs small PID or trapezoidal commutation loops at typical PWM rates, while the SLIC keeps the LIN traffic off the application timing. The 2.7 V to 5.5 V supply range lets the part share a 5 V or 3.3 V rail with the gate drivers. The TSSOP-20 footprint fits small PCBs typical of inline driver modules.
Recommended
Recommended Products Summary
Engineering reference data for MC9S08EL16CTJ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S08EL32CTJ | S9S08EL32F1CTJR | MC9S08SL8CTJ | MC9S08SH16MTJ | S9S08SG16E1MTJR |
|---|---|---|---|---|---|---|
| Package | 20-TSSOP | 20-TSSOP - same | 20-TSSOP - same | 20-TSSOP - same | 20-TSSOP - same | 20-TSSOP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS08, 8-bit, 40 MHz | HCS08, 8-bit, 40 MHz | HCS08, 8-bit, 40 MHz | HCS08, 8-bit, 40 MHz | HCS08, 8-bit, 40 MHz | HCS08, 8-bit, 40 MHz |
| Program Flash | 16 KB | 32 KB | 32 KB | 8 KB | 16 KB | 16 KB |
| SLIC (Hardware LIN Slave) | Yes | Yes | Yes | Yes | No (software LIN) | No |
| Automotive Grade | No (industrial) | No (industrial) | Yes (AEC-Q100) | No (industrial) | No (industrial) | No (industrial) |
| Lifecycle Status (2026-10-20) | NRND | NRND | Active | NRND | NRND | Active |
Key Differentiators
- Integrated hardware SLIC for autonomous LIN slave handling (vs MC9S08SH16MTJ)
- 16 KB Flash fits larger LIN slave stacks while staying in TSSOP-20 (vs MC9S08SL8CTJ)
- Industrial-grade 2.7 V-5.5 V supply supports both 3.3 V and 5 V rails (vs S9S08SG16E1MTJR)
- Drop-in upgrade path within the S08EL family doubles Flash (vs MC9S08EL32CTJ)
Design Notes
Estimated: at VDD = 5 V and a typical 40 MHz active current of ~10 mA, the S08EL core draws about 50 mW. In wait mode the part drops to the low-microamp range per the S08EL datasheet, which is critical for LIN nodes that spend most of their time asleep. Place a 0.1 uF decoupling capacitor as close as possible to the VDD pin (pin 5) and a bulk capacitor on the 5 V or 3.3 V rail feeding the LIN transceiver. For battery-backed nodes, size the bulk capacitor so the part can complete a LIN transaction before the supply droops below 2.7 V.
The 20-pin TSSOP (0.173 inch / 4.40 mm body) is a fine-pitch surface-mount package requiring solder-paste stencils around 0.1 mm to 0.125 mm thickness for reliable reflow. Route the LIN_TX and LIN_RX lines as a short differential pair to the LIN transceiver, keeping them away from PWM and PWM-driven gate-driver traces to avoid noise coupling. Expose the BKGD/MS pin (pin 16) to a test pad so the NXP ICD (in-circuit debugger) can attach without rework. Keep the RESET_b pin (pin 15) short and add the recommended pull-up to VDD.
Do not assume the S08EL SLIC handles LIN automatically without firmware initialization - the SLIC registers must be configured for the target baud rate, breakpoint, and checksum mode or bus errors will occur. Avoid tying unused PTA/PTB pins directly to ground; configure them as outputs or inputs with the internal pull-up enabled to minimize sleep current. When migrating from HC908, note that some peripheral registers were renamed - consult the NXP S08EL reference manual before reusing legacy code. Finally, do not exceed 5.5 V on VDD or expose LIN pins to load-dump transients above the LIN transceiver's absolute maximum.
The TSSOP-20 package has a theta_JA in the 100 C/W range for a 4-layer JEDEC test board, which is fine for the ~50 mW active power of this MCU. In a sealed LIN module with no airflow, derate by at least 25% and confirm junction temperature stays below 125 C at the maximum ambient. The chip does not require a heatsink, but laying a small copper pour under the exposed pad (if present) lowers the thermal resistance.
Compliance Information
Per NXP product page and distributor listings, the MC9S08EL16CTJ is RoHS compliant and lead-free. Industrial temperature grade only - choose S9S08EL32F1CTJR for AEC-Q100 automotive. Halogen-free status not explicitly stated in the provided data and is marked unknown.
