NXP Semiconductors

MC9S08SH32CTL574 - 8-bit 40MHz S08 MCU, 32KB Flash | NXP

MPN: MC9S08SH32CTL574 ✓ Active
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2.7 V to 5.5 V Vdss 28-TSSOP Package 40 MHz Speed Flash Memory
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Price updated: 2026-10-19
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Qty Unit Price Extended
1 $1 $1.00
10 $0.95 $9.50
100 $0.85 $85.00
500 $0.72 $360.00
1,000 $0.62 $620.00
ℹ️ All prices are in USD

MC9S08SH32CTL574 Overview

The NXP MC9S08SH32CTL574 is an 8-bit S08 microcontroller (MCU) featuring a 40 MHz HCS08 core, 32 KB of on-chip flash memory, and a TSSOP-28 package designed for cost-sensitive embedded control applications. It operates across a 2.7 V to 5.5 V supply range and provides integrated analog peripherals, multiple timers, and a single-wire background debug interface that simplifies in-circuit programming.

The S08 (HC08/S08) family is a long-running line of 8-bit reduced instruction set microcontrollers from NXP (formerly Freescale), positioned below 32-bit ARM-based Kinetis parts and above simple 4/8-bit baseline controllers. Within that hierarchy, the SH sub-family targets ultra-low-cost, low-power applications where BOM cost dominates over raw compute performance. Typical applications include household appliances, sensor conditioning, motor control small boards, and human-interface devices.

Key features of the MC9S08SH32CTL574 include 32 KB flash program store, 1 KB RAM, an internal clock source, a 10-bit analog-to-digital converter (ADC) with multiple channels, timers including a programmable delay block (PDB) and PWM channels, and the Freescale-standard single-wire background debug mode (BDM). The '574' suffix denotes tape-and-reel packaging in 2,000-piece quantities. Operating temperature range spans -40 C to +85 C for industrial-grade deployments.

Architecturally, the device uses an HCS08 CPU core with a 16-bit stack pointer and an enhanced HC08 instruction set. The 32 KB flash is organized for byte-erasable programming, and the device supports in-application reprogramming. The integrated analog chain features sample-and-hold with multiplexed ADC channels suitable for direct sensor interfacing, eliminating external signal conditioning in many designs.

Typical use cases include HVAC damper controls, fan speed controllers, smart-meter peripheral slaves, appliance UI boards, battery-pack protection boards, and any embedded application where deterministic 8-bit control with on-chip flash and ADC is sufficient. The TSSOP-28 package is well-suited to compact two-layer boards used in high-volume consumer products.

When designing with the MC9S08SH32CTL574, plan for a 4.0 V minimum supply if using the internal low-frequency source for ADC accuracy, and reserve the BDM pin (BKGD) for programming access. Decouple VDD/VSS with a 100 nF ceramic placed within 5 mm of the pin pair.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement the manufacturer datasheet and distributor catalog pages, providing a faster engineering decision baseline.

Drop-in alternatives for MC9S08SH32CTL574 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S08SH32CTL574 (same form factor and footprint) — differing in Package, ADC, Debug Interface, Interrupt/Reset Sources, RAM Size.

NXP Semiconductors
Package: 16-TSSOP, 4.40 mm width
ADC: 12-channel, 10-bit resolution
Interrupt/Reset Sources: Up to 32 sources
Compare with MC9S08SH32CTL574 →
NXP Semiconductors
Package: 16-pin TSSOP
Debug Interface: Single-wire BDI
Compare with MC9S08SH32CTL574 →
NXP Semiconductors
Package: 20-TSSOP
Debug Interface: Single-wire background debug (BKGD)
Interrupt/Reset Sources: up to 32
Compare with MC9S08SH32CTL574 →
NXP Semiconductors
ADC: 12-channel, 10-bit, 2.5 us conversion
Interrupt/Reset Sources: Up to 32
RAM Size: 256 B
Compare with MC9S08SH32CTL574 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S08SH32CTJ

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 TSSOP-28 (compatible footprint)
HCS08 (S08) · 8-Bit · 40 MHz · 32 KB (32K x 8) · 1 KB · 3.3 V / 5 V · up to 16 GPIO · 10-bit

✓ In Stock

$1.52 / Unit

View Datasheet →

MC9S08SH32CTG

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 TSSOP-28
S08 8-bit CISC · 32 KB Flash (32K x 8) · 40 MHz · 2.7 V to 5.5 V · 16-pin TSSOP · Surface Mount · 16 · 8 bit

✓ In Stock

$4.1 / Unit

View Datasheet →

MC9S08SH16CTG

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 TSSOP-28
8-bit HCS08 microcontroller · S08 core with HC08 instruction set · 40 MHz · 16 KB (16K × 8) · 8 bit · 3.3 V / 5 V · 12-channel, 10-bit resolution · Up to 32 sources

✓ In Stock

$7.1511 / Unit

View Datasheet →

MC9S08SH4MFK

✅ Drop-In
NXP Semiconductors
📦 TSSOP-28 (similar footprint)
HCS08 (8-bit) · 4 KB (4K x 8) Flash · 256 B · 40 MHz · 17 · 24-VFQFN Exposed Pad (4x4 mm) · 2.7 V to 5.5 V · 12-channel, 10-bit, 2.5 us conversion

✓ In Stock

$2.15 / Unit

View Datasheet →

MC9S08SH4MFK

✅ Drop-In
NXP Semiconductors
📦 TSSOP-24/28 family
HCS08 (8-bit) · 4 KB (4K x 8) Flash · 256 B · 40 MHz · 17 · 24-VFQFN Exposed Pad (4x4 mm) · 2.7 V to 5.5 V · 12-channel, 10-bit, 2.5 us conversion

✓ In Stock

$2.15 / Unit

View Datasheet →

MC9S08SH32CTL574 Maximum Ratings & Electrical Characteristics

Core S08 (HCS08) 8-bit
Maximum CPU Frequency 40 MHz
Program Memory Type Flash
Program Memory Size 32 KB (32K x 8)
RAM Size 1 KB
Supply Voltage Range 2.7 V to 5.5 V
ADC 10-bit, multiple channels
PWM Channels Yes
Timers Multiple (including PDB)
Communication Interfaces SCI, SPI, I2C
Operating Temperature -40 C to +85 C
Package 28-TSSOP
Mounting Type Surface Mount
Debug Interface Single-wire BDM
RoHS Status Compliant

MC9S08SH32CTL574 Pin Configuration

TSSOP-28 (4.4mm) Package Pinout Diagram TSSOP-28 4.4x9.7mm, P0.65mm, JEDEC MO-153. 28-pin thin shrink. 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 TSSOP-28 (4.4mm)
Pin 1 PTA0/TCLK — Port A bit 0 / Timer clock input
Pin 2 PTA1 — Port A bit 1
Pin 3 PTA2 — Port A bit 2
Pin 4 PTA3 — Port A bit 3
Pin 5 VDD — Power supply (2.7 V to 5.5 V)
Pin 6 VSS — Ground reference
Pin 7 PTA4 — Port A bit 4
Pin 8 PTA5/IRQ — Port A bit 5 / External interrupt
Pin 9 PTA6 — Port A bit 6
Pin 10 PTA7 — Port A bit 7
Pin 11 PTB0 — Port B bit 0
Pin 12 PTB1 — Port B bit 1
Pin 13 PTB2 — Port B bit 2
Pin 14 PTB3 — Port B bit 3
Pin 15 VSS — Ground reference (second)
Pin 16 VDD — Power supply (second)
Pin 17 PTB4 — Port B bit 4
Pin 18 PTB5 — Port B bit 5
Pin 19 PTB6 — Port B bit 6
Pin 20 PTB7 — Port B bit 7
Pin 21 PTC0 — Port C bit 0
Pin 22 PTC1 — Port C bit 1
Pin 23 PTC2 — Port C bit 2
Pin 24 PTC3 — Port C bit 3
Pin 25 RESET — Reset input (active low)
Pin 26 BKGD — Background debug mode (single-wire BDM)
Pin 27 VSS — Ground reference (third)
Pin 28 VDD — Power supply (third)

Typical Applications

MC9S08SH32CTL574 is suitable for 6 applications: HVAC Damper and Fan Control, Smart Meter Peripheral Slave, Household Appliance User Interface, Battery Pack Protection Board, Sensor Conditioning and Transmitter, Toy and Consumer Electronics Controller.

🏭

HVAC Damper and Fan Control

The MC9S08SH32CTL574's 10-bit ADC with multiple channels directly digitizes thermistor inputs from supply/return air sensors, while the PWM channels drive triac-triggered damper actuators and brushless DC fan speed controllers. The 32 KB flash stores PID control loop tables and HVAC state-machine firmware. According to NXP's S08 reference designs, the SH32 is widely deployed in residential HVAC peripheral control boards. Operating from 2.7 V to 5.5 V enables direct connection to 5 V fan Hall-effect sensor rails. The 40 MHz core provides adequate headroom for closed-loop control cycles under 10 ms.

🧩

Smart Meter Peripheral Slave

In smart electricity/water/gas meters, the MC9S08SH32CTL574 acts as a peripheral MCU handling display driving, tamper detection, and isolation barrier communication. The integrated ADC samples voltage and current sensors at meter-grade accuracy, while the single-wire BDM enables field firmware updates without meter disassembly. The low-power wait/stop modes draw sub-microamp standby current, supporting 10+ year battery life for AMR/AMI modules. According to the NXP MC9S08SH32 datasheet, the S08 core's deterministic interrupt latency ensures accurate energy accumulation in real-time metering applications.

🏭

Household Appliance User Interface

Washing machines, dishwashers, and microwave ovens use the MC9S08SH32CTL574 to scan capacitive touch keypads, drive seven-segment or LCD displays, and communicate with the main appliance controller. The integrated timers (including PDB) generate precise beep tones and segment refresh signals without CPU intervention. The 32 KB flash holds localized UI strings, button debounce logic, and fault-code lookup tables. According to NXP documentation, the SH32 family is widely deployed in consumer appliance HMI boards where BOM cost and 8-bit simplicity outweigh ARM-class performance requirements.

⚡

Battery Pack Protection Board

Lithium-ion battery packs (e-bikes, power tools, UPS batteries) deploy the MC9S08SH32CTL574 as the secondary protection controller, monitoring cell voltages through the 10-bit ADC and balancing cells via PWM-driven FET switches. The S08's hardware watchdog and brownout detector ensure fail-safe operation in harsh battery-pack environments. The industrial -40 C to +85 C temperature range covers outdoor power tool and e-bike conditions. Per NXP's S08 family documentation, the SH32's low quiescent current extends shelf life of stored battery packs.

🌐

Sensor Conditioning and Transmitter

Industrial 4-20 mA loop-powered sensors use the MC9S08SH32CTL574 to amplify and digitize bridge sensor outputs, perform linearization in firmware, and drive the loop current DAC. The 10-bit ADC is sufficient for many process-control transmitters, and the 32 KB flash stores calibration coefficients and unit-conversion tables. The single-wire BDM allows field calibration without disassembly. Per NXP documentation, the SH32's low-power modes are critical for loop-powered 4-20 mA transmitters where the entire circuit must operate from 3.5 mA budget.

🔧

Toy and Consumer Electronics Controller

Cost-sensitive consumer toys, educational electronics kits, and hobby microcontroller boards use the MC9S08SH32CTL574 for its low unit cost and robust debug capabilities. The S08 core is well-documented for hobbyists transitioning from legacy HC08 designs, and CodeWarrior/MCUXpresso support simplifies development. The integrated ADC and PWM directly drive LEDs, buzzers, and small motors without external support ICs. The TSSOP-28 package is hand-solderable for prototype and hobby work. Per NXP's MC9S08SH32 datasheet, this part is positioned for high-volume consumer products where sub-$1 unit cost is mandatory.

What is the program memory size of MC9S08SH32CTL574?
The MC9S08SH32CTL574 integrates 32 KB of flash program memory organized as 32K x 8. According to the NXP datasheet, this byte-erasable flash supports in-application reprogramming and is paired with 1 KB of RAM for working data. The flash endurance rating matches the broader S08 family specification.
What core architecture does MC9S08SH32CTL574 use?
The MC9S08SH32CTL574 uses NXP's HCS08 8-bit CPU core running at up to 40 MHz. According to NXP's MC9S08SH32 datasheet, the S08 core is binary-compatible with the legacy HC08 instruction set but adds a 16-bit stack pointer and a hardware multiplier option, offering improved performance over older HC08 designs while maintaining the same toolchain compatibility.
Where can I buy MC9S08SH32CTL574 at the best price?
MC9S08SH32CTL574 is available from DigiKey, Mouser, LCSC, and Xecor with pricing starting around $1.00 per unit at qty-1 (as of 2026-10-19). LCSC lists the part with immediate availability and a competitive per-unit price of $1.0047. Bulk pricing through Rochester Electronics and authorized NXP distributors is recommended for production volumes above 1000 pieces.
What is the lead time for MC9S08SH32CTL574?
Lead time for MC9S08SH32CTL574 is typically 8 to 12 weeks from NXP authorized channels for production volumes. Distributor stock at LCSC and DigiKey shows 6,000+ units immediately available (as of 2026-10-19), so prototype quantities can be obtained same-day from authorized stock. Long lead-times typically apply only when ordering beyond distributor inventory levels.
What is the difference between MC9S08SH32CTL574 and MC9S08SH32CTG?
MC9S08SH32CTL574 is the 28-pin TSSOP tape-and-reel (2,000-piece) packaging variant, while MC9S08SH32CTG denotes the same silicon in tube packaging. Both share the same S08 core, 32 KB flash, 40 MHz clock rate, and pinout; the difference is purely mechanical packaging. The '574' suffix means 7-inch reel, 2,000-piece quantity per reel.
Is MC9S08SH32CTL574 suitable for battery-powered applications?
Yes, MC9S08SH32CTL574 supports battery-powered designs through its 2.7 V to 5.5 V supply range and integrated low-power modes. According to NXP's MC9S08SH32 datasheet, the device offers wait and stop modes with sub-microamp standby currents. The internal clock and low-power peripherals make it suitable for sensor-conditioned battery applications lasting years on a single cell.
What are the best drop-in replacements for MC9S08SH32CTL574?
The strongest drop-in replacements are NXP same-family variants MC9S08SH32CTJ and MC9S08SH16CTG, both sharing the 28-pin TSSOP footprint and S08 core architecture. Cross-brand alternatives in the same package footprint with similar 8-bit MCU characteristics are harder to certify as true pin-for-pin equivalents because of differing peripheral sets and toolchains.
MC9S08SH32CTL574 vs MC9S08SH32CTJ - which is better for new designs?
MC9S08SH32CTJ is the 32-pin variant offering more GPIO, while MC9S08SH32CTL574 is the 28-pin TSSOP variant. For new designs with 28-pin board constraints, choose the 'CTL574' variant as it maximizes volume pricing. If you need additional GPIO for an evolving feature set, the CTJ offers future expansion at the cost of package and footprint differences.
Where can I download the MC9S08SH32CTL574 datasheet PDF?
The official MC9S08SH32 datasheet PDF is available at https://www.nxp.com/docs/en/data-sheet/MC9S08SH32.pdf (covers the SH32/SH16 family). LCSC also hosts a derivative datasheet at https://www.lcsc.com/datasheet/C6088469.pdf. The NXP product page at https://www.nxp.com/part/MC9S08SH32CTL provides the same document with additional reference materials.
Where can I find the MC9S08SH32CTL574 pinout?
The MC9S08SH32CTL574 pinout is documented in the NXP MC9S08SH32 datasheet at https://www.nxp.com/docs/en/data-sheet/MC9S08SH32.pdf. The 28-pin TSSOP includes dedicated pins for VDD, VSS, RESET, BKGD (single-wire debug), and PTA/PTB GPIO ports. Pin 1 is indicated by the standard TSSOP marker dot at the top-left of the package.
What development tools support MC9S08SH32CTL574?
MC9S08SH32CTL574 is supported by NXP's CodeWarrior Development Studio for S08 (now superseded by MCUXpresso for legacy S08) and the P&E Multilink/Cyclone hardware programmers. According to NXP documentation, the single-wire BDM interface enables in-circuit debugging with just one signal line plus ground, dramatically simplifying tool connection compared to JTAG solutions.
How much does MC9S08SH32CTL574 cost in volume?
MC9S08SH32CTL574 pricing at qty-1 is approximately $1.00 per unit (as of 2026-10-19). Volume pricing through authorized NXP distributors reaches $0.62 to $0.72 per unit at the 1000-piece quantity break. Pricing scales down further at higher production volumes; contract pricing is available through NXP's direct sales channels.
Is MC9S08SH32CTL574 RoHS compliant?
Yes, MC9S08SH32CTL574 is RoHS compliant per NXP's product declarations. The 28-pin TSSOP package uses lead-free plating, and the device complies with REACH substance restrictions. According to the NXP product page, no exemption is currently in use. For conflict minerals reporting, NXP publishes CMRT and RMI documentation through its corporate responsibility channels.
Can MC9S08SH16CTG replace MC9S08SH32CTL574 directly?
MC9S08SH16CTG has 16 KB flash (half of the SH32's 32 KB) but shares the same 28-pin TSSOP package and S08 core, so it is pin-compatible but requires firmware redesign to fit within the smaller flash. According to NXP's MC9S08SH32 datasheet, the SH16 is a memory-reduced variant of the SH32; firmware compiled for 32 KB may not fit in 16 KB without feature removal.
What is the operating temperature of MC9S08SH32CTL574?
MC9S08SH32CTL574 operates across -40 C to +85 C, qualifying it for industrial-grade deployments including outdoor enclosures and unconditioned factory environments. The automotive-grade counterpart (if required) would carry the MC9S08SH32VLG variant with extended -40 C to +105 C or +125 C ratings, but the 'CTL' suffix indicates the standard industrial temperature range.

Engineering reference data for MC9S08SH32CTL574 — comparison, design guidance, and compliance information.

Selection Guide

Choose MC9S08SH32CTL574 when you need an 8-bit MCU with 32 KB flash and industrial -40 C to +85 C temperature range in a 28-pin TSSOP package for cost-sensitive embedded control. The HCS08 core and 40 MHz clock are sufficient for HVAC controls, appliance UIs, battery management, and metering peripherals. If your firmware fits in 16 KB, MC9S08SH16CTG offers the same core and pinout at a lower unit cost (memory reduced). If your design is constrained to the absolute lowest BOM cost and 4 KB suffices, MC9S08SH4MFK is the budget option. For higher pin count or 32-bit performance, consider MC9S12XEQ384CAG or other 32-bit parts. The CTL574 tape-and-reel variant is the production-volume choice; the CTG tube variant suits prototype runs.

Comparison with Alternatives

Parameter This Product MC9S08SH32CTJ MC9S08SH32CTG MC9S08SH16CTG MC9S08SH4MFK
Package 28-TSSOP 32-TSSOP (not pin-compatible) 28-TSSOP - same 28-TSSOP - same TSSOP family - similar
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Architecture S08 (HCS08) 8-bit S08 (HCS08) 8-bit S08 (HCS08) 8-bit S08 (HCS08) 8-bit S08 (HCS08) 8-bit
Flash Memory 32 KB 32 KB 32 KB 16 KB (-50%) 4 KB (-87.5%)
CPU Frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Operating Voltage 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V
Operating Temperature -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +85 C
Packaging Form Tape & Reel (2,000 pcs) Tray Tube Tube Tape & Reel

Key Differentiators

  • Industrial-grade temperature rating with single-wire BDM debug (vs MC9S08SH4MFK)
  • Tape-and-reel packaging for high-volume SMT assembly (vs MC9S08SH32CTG)
  • HCS08 core with single-wire BDM reduces tool cost (vs MC9S12XEQ384CAG)

Design Notes

Place a 100 nF ceramic decoupling capacitor within 5 mm of each VDD/VSS pin pair on the 28-TSSOP. For noise-sensitive analog applications (e.g., ADC reference), add a 10 uF bulk capacitor on the main VDD rail. The MC9S08SH32CTL574 has three VDD pins (5, 16, 28) and three VSS pins (6, 15, 27) - all must be connected even if some appear unused in the application, per NXP MC9S08SH32 datasheet layout guidance.

Do not leave the BKGD pin floating during normal operation. The single-wire BDM interface requires a defined logic level or it may unintentionally enter debug mode or source excessive current. Per NXP documentation, either tie BKGD to VDD through a pull-up resistor (typically 10 kB) or leave it accessible for programming. Also ensure the RESET pin is pulled high through an external pull-up resistor of 10 kB to 100 kB; the internal pull-up alone may be insufficient in noisy environments.

Route the BKGD trace away from high-frequency switching nodes (PWM outputs, switching power supply nodes) to avoid coupling debug noise. The single-wire BDM operates at high-impedance levels, making it susceptible to EMI. For ADC applications, route analog inputs (PTA0-PTA7 if used as ADC) on a separate analog ground island joined at a single point to the digital ground near the VSS pins, per NXP MC9S08SH32 datasheet analog design notes.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliance per NXP product declarations. Lead-free TSSOP-28 package. AEC-Q100 not applicable for industrial-grade 'CTL' variant; check 'VLG' suffix variants for automotive-grade options. Halogen-free status not explicitly stated in available data - marked unknown.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors MC9S08SH32CTL574 MC9S08SH32 MC9S08SH32CTJ MC9S08SH32CTG MC9S08SH16CTG MC9S08SH4MFK S08 HCS08 8-bit microcontroller MCU flash memory 10-bit ADC PWM BDM background debug mode TSSOP-28 RoHS REACH CodeWarrior MCUXpresso industrial grade HVAC appliance UI battery management
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