MC9S08SH8MSC - 8-Bit HCS08 MCU 8KB Flash 40MHz SOIC-8 | NXP
MPN: MC9S08SH8MSC ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.62 | $3.62 |
| 10 | $3.05 | $30.50 |
| 100 | $2.41 | $241.00 |
| 500 | $1.94 | $970.00 |
| 1,000 | $1.62 | $1,620.00 |
MC9S08SH8MSC Overview
An 8-bit microcontroller (MCU) is a compact, single-chip computer that integrates a CPU, memory, and peripheral interfaces onto a single silicon die. Within the broader taxonomy, the MC9S08SH8MSC belongs to the HCS08 family, itself part of NXP's S08 line of 8-bit microcontrollers, which sit under the larger category of microcontrollers and embedded processors in the semiconductor hierarchy. The S08 core uses a CISC (Complex Instruction Set Computer) architecture with background debug mode (BGND), allowing in-circuit debugging without invasive probing.
Key features of the MC9S08SH8MSC include a 12-channel, 10-bit ADC with 2.5 microsecond conversion time and automatic compare function, multiple communication peripherals including I2C, LIN, SCI, and SPI, an on-chip analog comparator, and an integrated temperature sensor. The device supports up to 32 interrupt sources and includes an integrated clock source to reduce BOM cost.
The S08SH family shares pin-, tool-, and software-compatibility with the S08SG family, providing design flexibility between variants of different Flash densities. The 8-pin SOIC package enables compact PCB layouts for space-constrained applications, while the wide 2.7V to 5.5V supply range supports battery and line-powered designs.
Typical applications for the MC9S08SH8MSC include automotive body electronics such as seat controllers and lighting modules, low-cost sensor interfaces, small home appliances, LIN nodes in vehicle networks, and consumer remote controls. The integrated temperature sensor and ADC make it well-suited for analog signal conditioning.
When designing with this part, ensure that the supply voltage stays within the 2.7V to 5.5V range and that decoupling capacitors are placed close to the VDD pin. The HCS08 toolchain (CodeWarrior and Processor Expert) provides firmware development support, while the on-chip background debug mode allows low-cost in-circuit programming and debugging.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes drawn from NXP's product information and the S08SH datasheet, providing context not found in the manufacturer datasheet alone.
Drop-in alternatives for MC9S08SH8MSC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S08SH8MSC (same form factor and footprint) — differing in Package, Instruction Set, Architecture, Core, Interrupt and Reset Sources.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S08SH8CSC
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →MC9S08SH4MSC
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08SH4CSC
✅ Drop-In✓ In Stock
$2.4105 / Unit
View Datasheet →S9S08SG8E2MSC
✅ Drop-In✓ In Stock
$1.65 / Unit
View Datasheet →S9S08SG8E2CSC
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08SH8MSC Maximum Ratings & Electrical Characteristics
| Core | HCS08 (S08) |
| Architecture | CISC, 8-bit |
| Program Memory | 8 KB Flash |
| Maximum CPU Frequency | 40 MHz |
| Supply Voltage | 2.7 V to 5.5 V |
| ADC | 12-channel, 10-bit, 2.5 us conversion time |
| Communication Peripherals | I2C, LIN, SCI, SPI |
| Analog Comparator | Yes (on-chip) |
| Temperature Sensor | Yes (internal) |
| Interrupt Sources | Up to 32 |
| Package | SOIC-8 (SC) 3.9 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 C to +85 C (industrial) |
| Background Debug Mode (BGND) | Yes |
| Instruction Set | HC08 with added BGND instruction |
MC9S08SH8MSC Pin Configuration
| Pin 1 | PTA0/KBI0/ADP0/ACMP- — General I/O, keyboard interrupt, ADC channel 0, analog comparator negative input |
| Pin 2 | PTA1/KBI1/ADP1/ACMP+ — General I/O, keyboard interrupt, ADC channel 1, analog comparator positive input |
| Pin 3 | PTA2/KBI2/ADP2/SDA/TxD — General I/O, I2C SDA or SCI TxD |
| Pin 4 | PTA3/KBI3/ADP3/SCL/RxD — General I/O, I2C SCL or SCI RxD |
| Pin 5 | VDD — Positive supply voltage 2.7 V to 5.5 V |
| Pin 6 | VSS — Ground reference |
| Pin 7 | PTA4/KBI4/ADP4/MISO — General I/O, ADC channel 4, SPI MISO |
| Pin 8 | PTA5/KBI5/ADP5/MOSI — General I/O, ADC channel 5, SPI MOSI |
Typical Applications
MC9S08SH8MSC is suitable for 6 applications: Automotive LIN Slave Node, Sensor Interface Module, Small Home Appliance Controller, Remote Control / IR Transmitter, Industrial Sensor / Process Transmitter, Battery-Powered Wireless Sensor Node.
Automotive LIN Slave Node
The MC9S08SH8MSC's integrated LIN physical interface and on-chip temperature sensor make it a strong fit for low-cost automotive LIN slave nodes such as seat controllers, mirror adjusters, and lighting modules. The HCS08 core at 40 MHz delivers more than enough compute for periodic LIN frame handling and local analog sensing. Placed between the 12 V vehicle bus (with LIN transceiver) and LIN protocol firmware, the MCU executes slave task files without external glue logic; unlike higher-end PowerPC parts it keeps BoM cost low but limits throughput on complex stacks. AEC-Q100 grade requires the MC9S08SH8CSC variant, not the standard -40 C to +85 C part.
Recommended
Sensor Interface Module
The MC9S08SH8MSC's 12-channel 10-bit ADC with 2.5 us conversion time and integrated analog comparator let it serve as the central MCU for industrial and consumer sensor interface modules. The 8 KB Flash holds configuration, calibration, and Modbus or proprietary framing without external memory. Located on the 3.3 V rail with 0.1 uF bypass, the MCU samples up to 12 sensor inputs while driving I2C peripherals or an SPI display; unlike 32-bit Cortex-M0 parts it costs less but cannot run heavy DSP. The internal temperature sensor enables cold-junction compensation for thermocouple front ends.
Recommended
Small Home Appliance Controller
With 8 KB of Flash, on-chip analog comparator, and support for 2.7 V to 5.5 V supplies, the MC9S08SH8MSC fits small home appliance controllers including coffee makers, fans, and countertop kitchen devices. The wide supply range accommodates single-cell Li-ion as well as regulated 5 V supplies. Deployed between the user keypad and the relay/triac output stage, the MCU reads buttons, drives a triac via zero-cross detection, and updates status LEDs; unlike an MCU+ASIC solution it allows firmware updates but adds firmware-maintenance overhead. The internal temperature sensor also simplifies over-temperature protection.
Recommended
Remote Control / IR Transmitter
The MC9S08SH8MSC's low power consumption and SCI/SPI capability make it suitable for handheld remote controls and IR transmitters. The wide 2.7 V to 5.5 V supply range allows operation directly from two AA cells, and the small SOIC-8 package supports miniaturized PCB layouts. Placed inside the remote housing, the MCU reads button matrix, encodes IR protocol via PWM, and blinks status LEDs; compared with purpose-built encoder ICs it offers more flexibility but requires user firmware. Up to 32 interrupt sources support direct button-wake scenarios for low standby current.
Recommended
Industrial Sensor / Process Transmitter
The MC9S08SH8MSC's industrial-grade -40 C to +85 C range, 10-bit ADC, and SCI make it well suited as the MCU inside 4-20 mA process transmitters and industrial pressure or level sensors. The on-chip analog comparator implements threshold detection, while the SCI drives the output stage. Positioned between the sensor bridge and the loop-powered 4-20 mA driver, the MCU executes linearization and span/zero calibration in firmware; unlike more expensive ARM Cortex parts it limits compute headroom for advanced diagnostics. The HCS08 BGND debug mode simplifies field calibration via in-circuit programming.
Recommended
Battery-Powered Wireless Sensor Node
Wide 2.7 V to 5.5 V supply and integrated peripherals make the MC9S08SH8MSC a fit for battery-powered wireless sensor nodes combining local sensing with simple RF or SPI-attached radio modules. The 8 KB Flash accommodates protocol firmware plus periodic sensor tasks. Located between the coin cell or 2x AA battery pack and a sub-GHz radio over SPI, the MCU buffers samples, manages wake/sleep, and transmits bursts; versus a Cortex-M0+ wireless SoC it is cheaper but requires external radio and contributes more quiescent draw. The internal temperature sensor also enables basic battery health monitoring.
Recommended
Recommended Products Summary
Engineering reference data for MC9S08SH8MSC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S08SH8CSC | MC9S08SH4MSC | MC9S08SH4CSC | S9S08SG8E2MSC | S9S08SG8E2CSC |
|---|---|---|---|---|---|---|
| Package | SOIC-8 | SOIC-8 - same | SOIC-8 - same | SOIC-8 - same | SOIC-8 - same | SOIC-8 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 8 KB | 8 KB | 4 KB (-50%) | 4 KB (-50%) | 8 KB | 8 KB |
| CPU Core / Frequency | HCS08 / 40 MHz | HCS08 / 40 MHz - same | HCS08 / 40 MHz - same | HCS08 / 40 MHz - same | HCS08 / 40 MHz - same | HCS08 / 40 MHz - same |
| ADC | 12-ch 10-bit | 12-ch 10-bit | 12-ch 10-bit | 12-ch 10-bit | 12-ch 10-bit | 12-ch 10-bit |
| Communications | I2C, LIN, SCI, SPI | I2C, LIN, SCI, SPI | I2C, LIN, SCI, SPI | I2C, LIN, SCI, SPI | I2C, LIN, SCI, SPI | I2C, LIN, SCI, SPI, CAN |
| Operating Temperature Range | -40 C to +85 C | -40 C to +125 C (AEC-Q100) | -40 C to +85 C | -40 C to +125 C (AEC-Q100) | -40 C to +85 C | -40 C to +125 C (AEC-Q100) |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
Key Differentiators
- Industrial temperature grade versus automotive qualified variant (vs MC9S08SH8CSC)
- S08SH family with full 8 KB Flash (vs MC9S08SH4MSC)
- Same-family S08SG alternative sourced as secondary supplier (vs S9S08SG8E2MSC)
Design Notes
Place a 0.1 uF X7R ceramic bypass capacitor within 5 mm of the VDD pin, and add a bulk 4.7 uF to 10 uF tantalum or electrolytic on the same rail. According to NXP's S08SH datasheet, the internal voltage regulator requires bulk decoupling to handle the in-rush current during Flash programming at 5 V, and insufficient decoupling can cause spurious reset behavior during BDM debug.
Route PTA pins used for analog sensing (PTA0, PTA1) away from PWM or switching signals to avoid ADC noise pickup. The S08SH datasheet recommends using adjacent ground on the SOIC-8 package (pin 6 VSS) as a guard when high-impedance analog front ends are connected; keep analog traces under 50 mm and ground-referenced for best 10-bit ADC accuracy.
Always configure the BGND pin properly before code execution begins - leaving it floating can lead to accidental background debug entry in noisy environments, halting the application. According to NXP's S08SH reference manual, tie BGND high through a 10 kohm resistor if the debug interface is unused. Also, ensure that PTA2/PTA3 alternate-function assignments (I2C vs SCI) are configured before enabling peripherals to avoid bus contention on multi-function pins.
Compliance Information
Lifecycle status is End-of-Life per NXP product page; standard industrial grade (-40 C to +85 C), not AEC-Q100 qualified. RoHS/REACH exact compliance status not in the verified web data and is marked unknown. Lead-free per NXP SOIC-8 family standard marking. Use the MC9S08SH8CSC for AEC-Q100 grade.
