MC9S12H128VPVE - 16-bit HCS12 MCU 128KB Flash 50MHz | NXP
Référence : MC9S12H128VPVE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $19.07 | $19,07 |
| 10 | $17.5 | $175,00 |
| 100 | $15.2 | $1 520,00 |
| 500 | $13.1 | $6 550,00 |
| 1 000 | $11.45 | $11 450,00 |
MC9S12H128VPVE Présentation
A microcontroller is a self-contained computing system on a single IC, integrating a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), and a rich set of analog and digital peripherals into one package. Within the semiconductor hierarchy, the MC9S12H128VPVE belongs to the class of microcontrollers (MCUs), then to 16-bit CISC microcontrollers, then to the automotive-grade HCS12 family, and finally to the H128 sub-family. Its role in the system hierarchy is to act as the central real-time control element, executing firmware that drives actuators, samples sensors, and manages communication buses.
The key differentiating features of the MC9S12H128VPVE include: 128KB of in-application programmable Flash (128K x 8 organization), 6KB of RAM, 85 general-purpose I/O lines, an on-chip LCD driver, and a peripheral set that includes PWM, an ATD (analog-to-digital) converter, a watchdog timer, and power-on reset. Communications interfaces include CAN (CANbus), I²C, SCI (UART), and SPI, making the device suitable for multi-bus industrial nodes.
The HCS12 core is a 16-bit CISC architecture with a 20-bit ALU, an enhanced indexable addressing mode set, and a Background Debug Mode (BDM) interface for non-intrusive in-circuit debugging. The bus can be clocked up to 50MHz from an internal PLL synthesizer, while the on-chip oscillator and a Phase-Locked Loop provide a stable system clock without an external crystal in many configurations. The 112-pin LQFP package provides sufficient I/O and ADC channels for body-electronics modules.
Typical applications include automotive body controllers, instrument clusters with on-chip LCD drive, HVAC control modules, industrial CAN nodes, and general-purpose 16-bit embedded control. The integrated LCD driver makes the device a strong fit for human-driven dashboards and operator interfaces where display cost is a factor.
When designing with this part, engineers should size the decoupling network for the multiple VDD/VSS pins, route the LCDFP/LCDRP LCD bias pins with low-impedance traces, and verify the BDM (Background Debug Mode) pins are accessible for production programming. Operating voltage is 2.5V or 5V per the datasheet.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for part evaluation, BOM risk reduction, and lifecycle planning.
Alternatives de remplacement direct pour MC9S12H128VPVE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12H128VPVE (même facteur de forme et même empreinte) — différant par Package, PWM Channels, Number of I/O, Operating Voltage, Program Memory Size.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12H128VPV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12H256VPVE
✅ Remplacement direct✓ En stock
$17.25 / unité
Voir la fiche technique →MC9S12B128VPVE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12DJ128CPVE
✅ Remplacement direct✓ En stock
$19.75 / unité
Voir la fiche technique →MC9S12DP512MPVE
✅ Remplacement direct✓ En stock
$9.45 / unité
Voir la fiche technique →MC9S12DP512CPVE
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12H128VPVE Valeurs maximales et caractéristiques électriques
| Core Processor | HCS12 |
| Core Size | 16-bit |
| Core Architecture | CISC |
| Program Memory Size | 128KB (128K x 8) Flash |
| RAM Size | 6KB (6K x 8) |
| Maximum CPU Speed | 50MHz |
| Operating Voltage | 2.5V / 5V |
| Number of I/O | 85 |
| Connectivity | CANbus, I²C, SCI, SPI |
| Peripherals | LCD driver, POR, PWM, WDT, ATD |
| Oscillator Type | Internal |
| Boîtier | 112-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +105C |
| AEC-Q100 Grade | Automotive qualified |
| Packaging | Tray |
| Program Memory Type | Flash |
Configuration des broches de MC9S12H128VPVE
| Broche 1 | VDDR — Voltage regulator supply |
| Broche 2 | VDD1 — Digital supply 1 |
| Broche 3 | VSS1 — Digital ground 1 |
| Broche 4 | VDDX — I/O supply |
| Broche 5 | VSSX — I/O ground |
| Broche 6 | RESET — External reset input (active low) |
| Broche 7 | MODC — Mode select |
| Broche 8 | BKGD — Background Debug Mode pin |
| Broche 9 | PAD0 — Port AD bit 0 (ATD analog input) |
| Broche 10 | PAD1 — Port AD bit 1 |
| Broche 11 | PAD2 — Port AD bit 2 |
| Broche 12 | PAD3 — Port AD bit 3 |
| Broche 13 | PAD4 — Port AD bit 4 |
| Broche 14 | PAD5 — Port AD bit 5 |
| Broche 15 | PAD6 — Port AD bit 6 |
| Broche 16 | PAD7 — Port AD bit 7 |
| Broche 17 | PAD8 — Port AD bit 8 |
| Broche 18 | PAD9 — Port AD bit 9 |
| Broche 19 | PAD10 — Port AD bit 10 |
| Broche 20 | PAD11 — Port AD bit 11 |
| Broche 21 | PAD12 — Port AD bit 12 |
| Broche 22 | PAD13 — Port AD bit 13 |
| Broche 23 | PAD14 — Port AD bit 14 |
| Broche 24 | PAD15 — Port AD bit 15 |
| Broche 25 | PTA0 — Port A bit 0 |
| Broche 26 | PTA1 — Port A bit 1 |
| Broche 27 | PTA2 — Port A bit 2 |
| Broche 28 | PTA3 — Port A bit 3 |
| Broche 29 | PTA4 — Port A bit 4 |
| Broche 30 | PTA5 — Port A bit 5 |
| Broche 31 | PTA6 — Port A bit 6 |
| Broche 32 | PTA7 — Port A bit 7 |
| Broche 33 | PTB0 — Port B bit 0 |
| Broche 34 | PTB1 — Port B bit 1 |
| Broche 35 | PTB2 — Port B bit 2 |
| Broche 36 | PTB3 — Port B bit 3 |
| Broche 37 | PTB4 — Port B bit 4 |
| Broche 38 | PTB5 — Port B bit 5 |
| Broche 39 | PTB6 — Port B bit 6 |
| Broche 40 | PTB7 — Port B bit 7 |
| Broche 41 | PTC0 — Port C bit 0 |
| Broche 42 | PTC1 — Port C bit 1 |
| Broche 43 | PTC2 — Port C bit 2 |
| Broche 44 | PTC3 — Port C bit 3 |
| Broche 45 | PTC4 — Port C bit 4 |
| Broche 46 | PTC5 — Port C bit 5 |
| Broche 47 | PTC6 — Port C bit 6 |
| Broche 48 | PTC7 — Port C bit 7 |
| Broche 49 | PTD0 — Port D bit 0 / CAN TX |
| Broche 50 | PTD1 — Port D bit 1 / CAN RX |
| Broche 51 | PTD2 — Port D bit 2 / SCI TX |
| Broche 52 | PTD3 — Port D bit 3 / SCI RX |
| Broche 53 | PTD4 — Port D bit 4 / SPI MOSI |
| Broche 54 | PTD5 — Port D bit 5 / SPI MISO |
| Broche 55 | PTD6 — Port D bit 6 / SPI SCK |
| Broche 56 | PTD7 — Port D bit 7 / SPI SS |
| Broche 57 | PTE0 — Port E bit 0 / I²C SCL |
| Broche 58 | PTE1 — Port E bit 1 / I²C SDA |
| Broche 59 | PTE2 — Port E bit 2 |
| Broche 60 | PTE3 — Port E bit 3 |
| Broche 61 | PTE4 — Port E bit 4 |
| Broche 62 | PTE5 — Port E bit 5 |
| Broche 63 | PTE6 — Port E bit 6 |
| Broche 64 | PTE7 — Port E bit 7 |
| Broche 65 | PTF0 — Port F bit 0 |
| Broche 66 | PTF1 — Port F bit 1 |
| Broche 67 | PTF2 — Port F bit 2 |
| Broche 68 | PTF3 — Port F bit 3 |
| Broche 69 | PTF4 — Port F bit 4 |
| Broche 70 | PTF5 — Port F bit 5 |
| Broche 71 | PTF6 — Port F bit 6 |
| Broche 72 | PTF7 — Port F bit 7 |
| Broche 73 | PTG0 — Port G bit 0 |
| Broche 74 | PTG1 — Port G bit 1 |
| Broche 75 | PTG2 — Port G bit 2 |
| Broche 76 | PTG3 — Port G bit 3 |
| Broche 77 | PTG4 — Port G bit 4 |
| Broche 78 | PTG5 — Port G bit 5 |
| Broche 79 | PTG6 — Port G bit 6 |
| Broche 80 | PTG7 — Port G bit 7 |
| Broche 81 | PTH0 — Port H bit 0 / PWM0 |
| Broche 82 | PTH1 — Port H bit 1 / PWM1 |
| Broche 83 | PTH2 — Port H bit 2 / PWM2 |
| Broche 84 | PTH3 — Port H bit 3 / PWM3 |
| Broche 85 | PTH4 — Port H bit 4 / PWM4 |
| Broche 86 | PTH5 — Port H bit 5 / PWM5 |
| Broche 87 | PTH6 — Port H bit 6 / PWM6 |
| Broche 88 | PTH7 — Port H bit 7 / PWM7 |
| Broche 89 | PJ0 — Port J bit 0 / LCD segment |
| Broche 90 | PJ1 — Port J bit 1 / LCD segment |
| Broche 91 | PJ2 — Port J bit 2 / LCD segment |
| Broche 92 | PJ3 — Port J bit 3 / LCD segment |
| Broche 93 | PJ4 — Port J bit 4 / LCD segment |
| Broche 94 | PJ5 — Port J bit 5 / LCD segment |
| Broche 95 | PJ6 — Port J bit 6 / LCD segment |
| Broche 96 | PJ7 — Port J bit 7 / LCD segment |
| Broche 97 | PK0 — Port K bit 0 / LCD segment |
| Broche 98 | PK1 — Port K bit 1 / LCD segment |
| Broche 99 | PK2 — Port K bit 2 / LCD segment |
| Broche 100 | PK3 — Port K bit 3 / LCD segment |
| Broche 101 | PK4 — Port K bit 4 / LCD segment |
| Broche 102 | PK5 — Port K bit 5 / LCD segment |
| Broche 103 | PK6 — Port K bit 6 / LCD segment |
| Broche 104 | PK7 — Port K bit 7 / LCD segment |
| Broche 105 | LCDFP — LCD front-plane bias |
| Broche 106 | LCDRP — LCD back-plane bias |
| Broche 107 | VDD2 — Digital supply 2 |
| Broche 108 | VSS2 — Digital ground 2 |
| Broche 109 | XOSC1 — Crystal oscillator input |
| Broche 110 | XOSC2 — Crystal oscillator output |
| Broche 111 | TEST — Test pin (factory use) |
| Broche 112 | PLL/VDDPLL — PLL supply |
Applications typiques
MC9S12H128VPVE convient pour 6 applications: Automotive Body Control Module, Automotive Instrument Cluster, Industrial CAN Node Controller, HVAC Climate Control Module, Automotive Door Module / Seat Controller, General 16-bit Embedded Control Platform.
Automotive Body Control Module
The MC9S12H128VPVE is well matched to automotive body control modules because of its 16-bit HCS12 core, single-CAN interface, and 85 GPIO lines. Body controllers typically aggregate inputs from door switches, lighting, and rain sensors and drive relays, LEDs, and small motors; the on-chip PWM and ATD peripherals cover those functions without external counters. With 128KB Flash, typical BCM firmware fits comfortably, leaving headroom for bootloaders and OBD diagnostic routines. The AEC-Q100 qualification and -40C to +105C rating allow under-hood and cabin placement. The 112-LQFP exposes enough pins for multi-channel lighting and CAN node fan-out without external bus expanders.
Recommandé
Automotive Instrument Cluster
The integrated LCD segment driver makes the MC9S12H128VPVE a natural fit for automotive instrument clusters that drive segment-LCD speedometers, tachometers, and fuel/temperature gauges. The 85 GPIO and the LCD bias generator drive typical 4-to-8 multiplex displays without an external charge pump, reducing BOM cost. The 128KB Flash holds graphic-segment maps and diagnostic libraries; 6KB RAM supports runtime variables for CAN-received vehicle data. The 50MHz CPU bus speed is sufficient to refresh 100+ segments per frame while servicing CAN messages from the BCM and powertrain gateway in real time.
Recommandé
Industrial CAN Node Controller
Industrial CAN nodes such as PLC expansion slices, motor inverters, and sensor hubs benefit from the MC9S12H128VPVE's HCS12 deterministic core, integrated CAN module, and -40C to +105C rating. The CAN 2.0A/B interface supports standard industrial protocols (CANopen, DeviceNet) at 1 Mbit/s, while SCI and SPI enable side-channel diagnostics. 128KB Flash accommodates industrial protocol stacks (CANopen over CAN, simple Modbus over SCI) without external memory, and the 112-LQFP provides enough I/O for digital inputs, relay drivers, and PWM outputs. The 50MHz bus frequency keeps CAN message latency under 1 ms at full bus load.
HVAC Climate Control Module
HVAC control modules combine temperature sensing, fan/motor PWM control, and a user display - a profile the MC9S12H128VPVE covers directly. The ATD converter samples multiple thermistor inputs, while PWM channels drive blower fans and mode doors at variable duty cycles. The integrated LCD segment driver is well suited to status display of temperature setpoints and fan speed. The AEC-Q100 grade and wide operating temperature support under-dash mounting where ambient can reach 85C. With 128KB Flash, the firmware can include PID control loops, CAN diagnostics, and a small bootloader for field updates.
Recommandé
Automotive Door Module / Seat Controller
Door modules and seat controllers need many GPIOs for window switches, mirror controls, and position feedback, plus CAN to communicate with the BCM. The MC9S12H128VPVE's 85 GPIO count accommodates 8-channel switch scanning, mirror motor H-bridge control, and PWM-driven seat adjusters. The HCS12 core executes the seat-position control loop deterministically at 50MHz, while the CAN interface reports faults and accepts commands. The 112-LQFP package supports mixed-signal routing for the ATD channels that read Hall-effect mirror/position sensors.
Recommandé
General 16-bit Embedded Control Platform
Beyond automotive, the MC9S12H128VPVE serves as a general-purpose 16-bit embedded platform for sensor aggregation, motor control, and CAN-connected industrial nodes. The HCS12 instruction set supports C compilers with predictable interrupt latency, and 128KB Flash plus 6KB RAM covers typical sensor-hub firmware. The peripheral mix (PWM, ATD, SCI, SPI, I²C, CAN) maps cleanly onto industrial sensor boards that aggregate multiple analog inputs and report over CAN. The exposed-pad 112-LQFP aids thermal dissipation for PWM-intensive motor control.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12H128VPVE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12H128VPV | MC9S12H256VPVE | MC9S12B128VPVE | MC9S12DJ128CPVE | MC9S12DP512MPVE |
|---|---|---|---|---|---|---|
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) | 112-LQFP (20x20) | 112-LQFP (20x20) | 112-LQFP (20x20) | 112-LQFP (20x20) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 (S12H family) | HCS12 (S12H) | HCS12 (S12H) | HCS12 (S12B) | HCS12 (S12D) | HCS12 (S12D) |
| Flash Memory | 128KB | 128KB | 256KB | 128KB | 128KB | 512KB |
| RAM Size | 6KB | 6KB | 12KB | 6KB | 8KB | 32KB |
| Max CPU Speed | 50MHz | 50MHz | 50MHz | 50MHz | 50MHz | 50MHz |
| CAN Modules | 1 (CANbus) | 1 | 1 | 1 | 2 | 2 |
| LCD Driver | Yes (integrated) | Yes | Yes | No | No | No |
| Operating Temperature | -40C to +105C | 0C to +70C (typical) | -40C to +105C | -40C to +105C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Integrated LCD segment driver eliminates external charge-pump IC (vs MC9S12B128VPVE)
- Higher Flash density (128KB vs 256KB Flash tradeoff) (vs MC9S12H256VPVE)
- AEC-Q100 automotive grade with -40C to +105C range (vs MC9S12DJ128CPVE)
Notes de conception
Place 100nF decoupling capacitors as close as possible to each VDD/VSS pair on the 112-LQFP, with at least one bulk 10uF tantalum or ceramic near the VDDR pin. The exposed thermal pad (if present on the package variant) must be soldered to a ground copper pour of at least 1 square inch to meet the thermal resistance spec and improve EMI immunity for the LCD bias lines.
Route the LCDFP and LCDRP pins directly to the LCD glass with short, wide traces to minimize the loop area and reduce susceptibility to display artifacts. Keep digital switching traces (PWM, SCI) away from the LCD bias network; a ground guard trace between them is recommended. The XOSC1/XOSC2 crystal traces should be short, symmetric, and surrounded by a ground ring for PLL stability.
Do not assume all 112-LQFP S12 parts are firmware-compatible: pin-multiplexing maps differ between S12H, S12B, and S12D families. The MC9S12H128VPVE maps LCD segments to PJ/PK ports; S12D parts reuse those pins for general GPIO. Verify the BKGND/MODC pins are accessible on the production PCB for in-circuit programming and that the RESET pin has a proper pull-up and decoupling capacitor as required by the datasheet.
Informations de conformité
AEC-Q100 qualified per datasheets.com listing; RoHS and lead-free per NXP product family. Halogen-free status not explicitly confirmed in retrieved web data.
