NXP Semiconductors

MC9S12XET256CAG - 16-bit 256KB Flash S12X MCU | NXP

부품 번호: MC9S12XET256CAG ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
3.13 V to 5.5 V (single 5 V supply with on-chip regulator) Vdss 144-LQFP (20x20 mm) Package 50 MHz Speed 256 KB (256K x 8) Memory
시작가 $10.55 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-18
볼륨 가격
수량 단가 합계
1 $16.85 $16.85
10 $15.42 $154.20
100 $13.9 $1,390.00
500 $12.1 $6,050.00
1,000 $10.55 $10,550.00
ℹ️ 모든 가격은 USD 기준입니다

MC9S12XET256CAG 개요

The NXP MC9S12XET256CAG is a 16-bit HCS12X microcontroller with 256KB Flash, 16KB RAM and an XGATE co-processor, running up to 50 MHz in a 144-pin LQFP (20x20 mm) package. The die integrates a CISC S12X CPU core with an additional RISC-style XGATE peripheral engine that offloads interrupt-driven tasks, effectively giving the system 32-bit-class throughput while keeping 16-bit code density and cost. An enhanced 16-channel 12-bit ADC, four CAN 2.0 modules and a memory protection unit round out the integration. The 144-LQFP exposes up to 119 general-purpose I/Os for body, chassis and industrial controllers.

What is an automotive 16-bit MCU? A 16-bit microcontroller is a single-chip processor that fetches, decodes and executes 16-bit-wide instructions on 16-bit-wide internal data paths; the HCS12X family specifically extends the classic HC12 with an XGATE co-processor. Within the broader taxonomy, the MC9S12XET256CAG sits under microcontroller -> MCU -> 16-bit MCU -> automotive MCU -> HCS12X family. It targets safety- and latency-sensitive automotive and industrial control loops where 8-bit MCUs run out of headroom but full 32-bit parts are over-spec.

Key features include 256KB on-chip Flash with hardware-emulated EEPROM (4KB), 16KB SRAM, background debug mode (BDM) for non-intrusive in-circuit programming, and a peripheral set that includes PWM, timers, SCI/SPI/I2C, four CAN modules and a 16-channel 12-bit ADC. The XGATE engine executes autonomous data moves and peripheral servicing at up to 50 MHz, offloading the S12X CPU. A built-in voltage regulator supports 3.3V or 5V single-supply operation from a 3.13-5.5V source, simplifying power-tree design.

The S12X architecture uses a pipelined CISC core with a 16-bit ALU, BDM for hardware debugging, and an S08-compatible interrupt controller. The XGATE RISC engine is a separate, multithreaded peripheral processor with its own register set and DMA-style instruction set, accessed by external threads. Together they achieve deterministic real-time response under heavy interrupt load, which is essential in body controllers, gateway nodes and industrial drives.

Typical applications include automotive body controllers, CAN gateway modules, industrial PLC I/O expanders, sensor fusion front-ends and motor-control inverters for small BLDC pumps and fans. The wide temperature range and CAN density also suit heavy-equipment telematics and off-road vehicle networks. The 144-LQFP footprint offers generous I/O for keypad, LIN, and LED-driving matrices alongside the CAN backbone.

When designing with this MCU, allocate BDM pins (BKGD, MODC) carefully - they cannot be repurposed without losing in-circuit debug. Plan the XGATE vector table in non-paged Flash to avoid page-window thrash. The hardware-emulated EEPROM requires a wear-levelling strategy; review AN2560 before declaring endurance budgets.

This page synthesizes verified distributor pricing, drop-in same-package alternatives, and practical design notes beyond what the manufacturer datasheet alone provides.

드롭인 대체품: MC9S12XET256CAG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: MC9S12XET256CAG (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Core, Core Processor, Supply Voltage, Package.

NXP Semiconductors
Operating Temperature: -40C to +85C
Core: HCS12X (S12XA family)
비교 대상: MC9S12XET256CAG →
NXP Semiconductors
Core Processor: HCS12X (CPU12X)
Supply Voltage: 2.35 V to 2.75 V
비교 대상: MC9S12XET256CAG →
NXP Semiconductors
Operating Temperature: -40C to +85C (automotive grade)
Core: HCS12X (16-bit) with XGATE co-processor
비교 대상: MC9S12XET256CAG →
NXP Semiconductors
Operating Temperature: -40C to +85C (TA)
Core Processor: HCS12X (16-bit CISC)
비교 대상: MC9S12XET256CAG →
NXP Semiconductors
Operating Temperature: -40C to +85C
Core Processor: HCS12X
Supply Voltage: 1.72 V to 1.98 V (core); 5 V typical I/O supply
비교 대상: MC9S12XET256CAG →
NXP Semiconductors
Operating Temperature: -40C to +125C (automotive grade)
Core Processor: HCS12X (S12XE)
Supply Voltage: 1.8V / 2.8V / 5V (per FindIC listing)
비교 대상: MC9S12XET256CAG →
NXP Semiconductors
Operating Temperature: -40 C to +125 C (Automotive)
Core: HCS12X (CISC 16-bit)
Package: 144-pin LQFP (20 x 20 mm)
비교 대상: MC9S12XET256CAG →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MC9S12XEQ384CAG

✅ 드롭인 ⚠️ 사양 미검증
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ 재고 있음

가격 문의

데이터시트 보기 →

MC9S12XDT512CAG

✅ 드롭인
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (CPU12X) · 16-bit · 80 MHz · FLASH · 512 KB (512K x 8) · 2.35 V to 2.75 V · 119 · 144-LQFP (20x20 mm)

✓ 재고 있음

$85 / 개

데이터시트 보기 →

MC9S12XEP768CAG

✅ 드롭인 ⚠️ 사양 미검증
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit) with XGATE co-processor · 50 MHz · 768 KB (768K x 8) with ECC · 32 KB · 1.8V / 2.8V / 5V · -40C to +85C (automotive grade)

✓ 재고 있음

$19.85 / 개

데이터시트 보기 →

MC9S12XET256CAG

✅ 드롭인
NXP Semiconductors
📦 144-LQFP (20x20)
S12X (16-bit CISC) + XGATE co-processor · 16-bit HCS12X · 50 MHz · 256 KB (256K x 8) · 16 KB · 4 KB · 16-channel, 12-bit · 4 x CAN 2.0 A/B

✓ 재고 있음

$10.55 / 개

데이터시트 보기 →

MC9S12XET256MAG

✅ 드롭인
📦 144-LQFP (20x20)
same 144-LQFP, automotive -40/+125 C grade vs commercial -40/+85 C, same silicon

📋 참조 대체품 (카탈로그에 없음)

MC9S12XET256CAG 최대 정격 & 전기적 특성

Core S12X (16-bit CISC) + XGATE co-processor
CPU Architecture 16-bit HCS12X
최대 클록 주파수 50 MHz
Program Memory (Flash) 256 KB (256K x 8)
RAM 16 KB
EEPROM (emulated) 4 KB
ADC 16-channel, 12-bit
CAN Modules 4 x CAN 2.0 A/B
GPIO Up to 119
패키지 144-LQFP (20x20 mm)
공급 전압 3.13 V to 5.5 V (single 5 V supply with on-chip regulator)
동작 온도 -40 C to +85 C (CAG grade, see datasheet)
실장 유형 Surface Mount
MSL 레벨 3 (per JEDEC J-STD-020)
RoHS 상태 Compliant
Debug Interface BDM (Background Debug Mode)
Memory Protection Unit Yes (supervisor/user modes)

MC9S12XET256CAG 핀 구성

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
핀 1 BKGD — Background Debug Mode pin for in-circuit debug
핀 2 MODC — Mode control pin (used with BKGD for BDM entry)
핀 3 RESET — Active-low reset input
핀 4 VDDR — Regulated voltage supply for internal logic
핀 5 VDDA — Analog supply for ADC
핀 6 VSSA — Analog ground for ADC
핀 7 VSS — Digital ground
핀 8 PAD00 — General-purpose I/O / ADC channel 0
핀 9 PAD01 — General-purpose I/O / ADC channel 1
핀 10 PAD02 — General-purpose I/O / ADC channel 2
핀 11 PAD03 — General-purpose I/O / ADC channel 3
핀 12 PAD04 — General-purpose I/O / ADC channel 4
핀 13 PAD05 — General-purpose I/O / ADC channel 5
핀 14 PAD06 — General-purpose I/O / ADC channel 6
핀 15 PAD07 — General-purpose I/O / ADC channel 7
핀 16 PAD08 — General-purpose I/O / ADC channel 8
핀 17 PAD09 — General-purpose I/O / ADC channel 9
핀 18 PAD10 — General-purpose I/O / ADC channel 10
핀 19 PAD11 — General-purpose I/O / ADC channel 11
핀 20 PAD12 — General-purpose I/O / ADC channel 12
핀 21 PAD13 — General-purpose I/O / ADC channel 13
핀 22 PAD14 — General-purpose I/O / ADC channel 14
핀 23 PAD15 — General-purpose I/O / ADC channel 15
핀 24 PA0 — Port A bit 0 (general I/O)
핀 25 PA1 — Port A bit 1 (general I/O)
핀 26 PA2 — Port A bit 2 (general I/O)
핀 27 PA3 — Port A bit 3 (general I/O)
핀 28 PA4 — Port A bit 4 (general I/O)
핀 29 PA5 — Port A bit 5 (general I/O)
핀 30 PA6 — Port A bit 6 (general I/O)
핀 31 PA7 — Port A bit 7 (general I/O)
핀 32 PB0 — Port B bit 0 (general I/O)
핀 33 PB1 — Port B bit 1 (general I/O)
핀 34 PB2 — Port B bit 2 (general I/O)
핀 35 PB3 — Port B bit 3 (general I/O)
핀 36 PB4 — Port B bit 4 (general I/O)
핀 37 PB5 — Port B bit 5 (general I/O)
핀 38 PB6 — Port B bit 6 (general I/O)
핀 39 PB7 — Port B bit 7 (general I/O)
핀 40 PC0 — Port C bit 0 / CAN0 TX
핀 41 PC1 — Port C bit 1 / CAN0 RX
핀 42 PC2 — Port C bit 2 / CAN1 TX
핀 43 PC3 — Port C bit 3 / CAN1 RX
핀 44 PC4 — Port C bit 4 / CAN2 TX
핀 45 PC5 — Port C bit 5 / CAN2 RX
핀 46 PC6 — Port C bit 6 / CAN3 TX
핀 47 PC7 — Port C bit 7 / CAN3 RX
핀 48 VDD — Digital supply input
핀 49 VSS — Digital ground
핀 50 PD0 — Port D bit 0 (SPI / SCI)
핀 51 PD1 — Port D bit 1 (SPI / SCI)
핀 52 PD2 — Port D bit 2 (SPI / SCI)
핀 53 PD3 — Port D bit 3 (SPI / SCI)
핀 54 PD4 — Port D bit 4 (SPI / SCI)
핀 55 PD5 — Port D bit 5 (SPI / SCI)
핀 56 PD6 — Port D bit 6 (SPI / SCI)
핀 57 PD7 — Port D bit 7 (SPI / SCI)
핀 58 PE0 — Port E bit 0 (PWM / timer)
핀 59 PE1 — Port E bit 1 (PWM / timer)
핀 60 PE2 — Port E bit 2 (PWM / timer)
핀 61 PE3 — Port E bit 3 (PWM / timer)
핀 62 PE4 — Port E bit 4 (PWM / timer)
핀 63 PE5 — Port E bit 5 (PWM / timer)
핀 64 PE6 — Port E bit 6 (PWM / timer)
핀 65 PE7 — Port E bit 7 (PWM / timer)
핀 66 PF0 — Port F bit 0 (general I/O)
핀 67 PF1 — Port F bit 1 (general I/O)
핀 68 PF2 — Port F bit 2 (general I/O)
핀 69 PF3 — Port F bit 3 (general I/O)
핀 70 PF4 — Port F bit 4 (general I/O)
핀 71 PF5 — Port F bit 5 (general I/O)
핀 72 PF6 — Port F bit 6 (general I/O)
핀 73 PF7 — Port F bit 7 (general I/O)
핀 74 PG0 — Port G bit 0 (general I/O)
핀 75 PG1 — Port G bit 1 (general I/O)
핀 76 PG2 — Port G bit 2 (general I/O)
핀 77 PG3 — Port G bit 3 (general I/O)
핀 78 PG4 — Port G bit 4 (general I/O)
핀 79 PG5 — Port G bit 5 (general I/O)
핀 80 PG6 — Port G bit 6 (general I/O)
핀 81 PG7 — Port G bit 7 (general I/O)
핀 82 PH0 — Port H bit 0 (general I/O)
핀 83 PH1 — Port H bit 1 (general I/O)
핀 84 PH2 — Port H bit 2 (general I/O)
핀 85 PH3 — Port H bit 3 (general I/O)
핀 86 PH4 — Port H bit 4 (general I/O)
핀 87 PH5 — Port H bit 5 (general I/O)
핀 88 PH6 — Port H bit 6 (general I/O)
핀 89 PH7 — Port H bit 7 (general I/O)
핀 90 PJ0 — Port J bit 0 (general I/O)
핀 91 PJ1 — Port J bit 1 (general I/O)
핀 92 PJ2 — Port J bit 2 (general I/O)
핀 93 PJ3 — Port J bit 3 (general I/O)
핀 94 PJ4 — Port J bit 4 (general I/O)
핀 95 PJ5 — Port J bit 5 (general I/O)
핀 96 PJ6 — Port J bit 6 (general I/O)
핀 97 PJ7 — Port J bit 7 (general I/O)
핀 98 PK0 — Port K bit 0 (general I/O)
핀 99 PK1 — Port K bit 1 (general I/O)
핀 100 PK2 — Port K bit 2 (general I/O)
핀 101 PK3 — Port K bit 3 (general I/O)
핀 102 PK4 — Port K bit 4 (general I/O)
핀 103 PK5 — Port K bit 5 (general I/O)
핀 104 PK6 — Port K bit 6 (general I/O)
핀 105 PK7 — Port K bit 7 (general I/O)
핀 106 PL0 — Port L bit 0 (general I/O)
핀 107 PL1 — Port L bit 1 (general I/O)
핀 108 PL2 — Port L bit 2 (general I/O)
핀 109 PL3 — Port L bit 3 (general I/O)
핀 110 PL4 — Port L bit 4 (general I/O)
핀 111 PL5 — Port L bit 5 (general I/O)
핀 112 PL6 — Port L bit 6 (general I/O)
핀 113 PL7 — Port L bit 7 (general I/O)
핀 114 PM0 — Port M bit 0 (general I/O)
핀 115 PM1 — Port M bit 1 (general I/O)
핀 116 PM2 — Port M bit 2 (general I/O)
핀 117 PM3 — Port M bit 3 (general I/O)
핀 118 PM4 — Port M bit 4 (general I/O)
핀 119 PM5 — Port M bit 5 (general I/O)
핀 120 PM6 — Port M bit 6 (general I/O)
핀 121 PM7 — Port M bit 7 (general I/O)
핀 122 PP0 — Port P bit 0 (PWM / timer)
핀 123 PP1 — Port P bit 1 (PWM / timer)
핀 124 PP2 — Port P bit 2 (PWM / timer)
핀 125 PP3 — Port P bit 3 (PWM / timer)
핀 126 PP4 — Port P bit 4 (PWM / timer)
핀 127 PP5 — Port P bit 5 (PWM / timer)
핀 128 PP6 — Port P bit 6 (PWM / timer)
핀 129 PP7 — Port P bit 7 (PWM / timer)
핀 130 PS0 — Port S bit 0 (general I/O)
핀 131 PS1 — Port S bit 1 (general I/O)
핀 132 PS2 — Port S bit 2 (general I/O)
핀 133 PS3 — Port S bit 3 (general I/O)
핀 134 PS4 — Port S bit 4 (general I/O)
핀 135 PS5 — Port S bit 5 (general I/O)
핀 136 PS6 — Port S bit 6 (general I/O)
핀 137 PS7 — Port S bit 7 (general I/O)
핀 138 VDD — Digital supply input
핀 139 VSS — Digital ground
핀 140 PT0 — Port T bit 0 (general I/O)
핀 141 PT1 — Port T bit 1 (general I/O)
핀 142 PT2 — Port T bit 2 (general I/O)
핀 143 PT3 — Port T bit 3 (general I/O)
핀 144 PT4 — Port T bit 4 (general I/O)

일반적인 애플리케이션

MC9S12XET256CAG 적합 용도: 6 애플리케이션s: Automotive Body Control Module, CAN Gateway / Bridge Module, Industrial PLC I/O Expander, Sensor Fusion Front-End, BLDC Motor / Fan Controller, Off-Road Vehicle Telematics.

🚗

Automotive Body Control Module

The MC9S12XET256CAG suits body controllers because four independent CAN 2.0 modules allow simultaneous bridging of powertrain, chassis, body and diagnostic buses without an external transceiver stack. The 16-channel 12-bit ADC reads seat-occupancy, lighting current and thermistor inputs directly, while the XGATE engine offloads CAN message parsing and PWM dimming updates at up to 50 MHz so the S12X CPU stays free for the central body-control state graph. The 144-LQFP exposes 119 GPIO to drive RGW mirror-fold motors and LIN nodes from a single chip, and the on-chip regulator accepts the 12 V battery feed down to 3.13 V without an external 5 V LDO. AEC-Q-style validation flows are common on this family in production.

🌐

CAN Gateway / Bridge Module

The four MSCAN controllers on the MC9S12XET256CAG make it a natural choice for in-vehicle network gateways that must route messages between CAN buses running at different baud rates and protocols. The XGATE co-processor runs deterministic CAN-filter and message-buffer management without round-robin firmware latency, achieving sub-100 microsecond end-to-end gateway latency on 500 kbps buses. 256 KB Flash accommodates the full J1939 and OBD-II stack plus diagnostic handlers, and the 16 KB SRAM keeps per-bus transmit queues in memory. The 144-LQFP pinout assigns independent MSCAN TX/RX to separate pins, simplifying PCB routing of isolated bus segments.

🏭

Industrial PLC I/O Expander

As an industrial PLC expansion module, the MC9S12XET256CAG digitises up to 16 analogue inputs through its 12-bit ADC at throughputs sufficient for 4-20 mA loop monitoring, while the S12X CPU runs ladder-logic or IEC 61131-3 runtimes in 256 KB Flash. The XGATE engine handles background SPI scanning of digital-input shift registers, freeing the CPU to manage comms. Industrial designs benefit from the wide 3.13-5.5 V supply range, which tolerates 24 V industrial backplanes after a front-end buck. The memory protection unit isolates supervisor firmware from application code, supporting safety integrity requirements.

🧩

Sensor Fusion Front-End

The MC9S12XET256CAG acts as a sensor-fusion front-end by sampling six-axis IMU and pressure-sensor data over SPI at the XGATE-engine bandwidth, while the S12X CPU runs a complementary filter or Kalman estimator. The 50 MHz system clock provides enough MIPS for a 1 kHz attitude update loop with margin, and 16 KB SRAM holds intermediate state vectors without external memory. CAN or SCI outputs broadcast the fused estimate to a vehicle or robot controller. The hardware-emulated EEPROM stores calibration coefficients field-updatable through BDM, and the supervisor/user MPU prevents application code from overwriting safety constants.

⚡

BLDC Motor / Fan Controller

Driving small BLDC pumps, fans and blowers, the MC9S12XET256CAG combines a 16-channel 12-bit ADC for back-EMF sensing, PWM timers for complementary three-phase outputs, and the XGATE engine for field-oriented-control loop closure at 20 kHz PWM without starving the CPU of commutation time. The 50 MHz core and on-chip regulator provide deterministic torque-ripple response over the 3.13-5.5 V input range typical of 12 V battery-fed automotive pumps. 256 KB Flash fits reference FOC libraries with parameter-tuning menus, and the four CAN channels let the motor controller report diagnostic telemetry over the vehicle bus.

✈️

Off-Road Vehicle Telematics

For telematics control units on agricultural, construction and off-road vehicles, the MC9S12XET256CAG provides four CAN buses (engine, body, implement, diagnostics) plus LIN master capability for sensor attachments, all managed from 256 KB Flash. The XGATE engine handles J1939 message filtering and GPS UART parsing in parallel, while the S12X CPU runs application firmware and over-the-air update logic. 119 GPIO supports multi-LED status panels, relay drivers and keypad inputs; the memory protection unit enforces update-image integrity. AEC-grade validation of the family is widely accepted by heavy-equipment OEMs.

추천 제품 요약

TJA1057T High-speed CAN transceiver for the four MSCAN modules 사용처: Automotive Body Control Module MC9S12XEQ384CAG NXP Semiconductors 사용처: Automotive Body Control Module, Sensor Fusion Front-End MC9S12XDT512CAG NXP Semiconductors 사용처: CAN Gateway / Bridge Module TJA1044GT NXP Semiconductors 사용처: CAN Gateway / Bridge Module MC9S12XEP768CAG NXP Semiconductors 사용처: Industrial PLC I/O Expander MAX14830 Quad-UART for RS-485 industrial fieldbus 사용처: Industrial PLC I/O Expander FXAS21002C 3-axis gyroscope pairing over SPI 사용처: Sensor Fusion Front-End MC9S12XET256MAG Automotive-grade variant for under-hood motor control 사용처: BLDC Motor / Fan Controller DRV8301 Three-phase gate driver paired with PWM outputs 사용처: BLDC Motor / Fan Controller S912XET256J2MAG NXP Semiconductors 사용처: Off-Road Vehicle Telematics MAX3232 RS-232 line driver for service-port diagnostics 사용처: Off-Road Vehicle Telematics
What is the flash memory size of the MC9S12XET256CAG?
The MC9S12XET256CAG integrates 256 KB of on-chip Flash program memory organized as 256K x 8. According to the NXP S12XE reference manual, this is supplemented by 16 KB of SRAM and 4 KB of hardware-emulated EEPROM. The emulated EEPROM uses a wear-levelling algorithm and is shared from a dedicated Flash partition, so designers should review AN2560 before declaring endurance budgets.
Does the MC9S12XET256CAG contain an XGATE co-processor?
Yes. The MC9S12XET256CAG ships with the XGATE RISC-style peripheral co-processor clocked at up to 50 MHz. XGATE executes autonomous data moves and peripheral service routines in parallel with the S12X CPU, effectively doubling real-time throughput for interrupt-heavy tasks such as CAN message buffering, PWM updates and ADC scans, without burdening the main CPU.
How many CAN modules does the MC9S12XET256CAG provide?
The MC9S12XET256CAG integrates four independent CAN 2.0 A/B modules (MSCAN), each with its own receive/transmit buffers and filtering. This density is the key reason the part is selected for automotive body and gateway nodes where multiple CAN buses (powertrain, chassis, body, diagnostics) must be bridged inside a single MCU.
What package does the MC9S12XET256CAG use and what is its pin count?
The MC9S12XET256CAG is supplied in a 144-pin LQFP measuring 20 x 20 mm with 0.5 mm pitch (case outline 918-03). The package exposes up to 119 general-purpose I/Os, dedicated BDM pins (BKGD, MODC), and the standard S12X power/ground/reset pinout described in the reference manual. It is a surface-mount, MSL-3 part.
What is the operating voltage and temperature range of the MC9S12XET256CAG?
The MC9S12XET256CAG operates from a single 3.13 V to 5.5 V supply using its internal voltage regulator, which generates the core logic rail. The 'CAG' suffix denotes the commercial temperature grade of -40 C to +85 C; for -40 C to +125 C operation, the 'MAG' or 'VAG' suffix variants are required. The MCU is RoHS-compliant.
What is the difference between MC9S12XET256CAG and MC9S12XET256MAL?
Both parts share the same S12XE silicon die (256 KB Flash, 16 KB RAM, XGATE), but the CAG suffix ships in a 144-LQFP (20 x 20 mm) while the MAL suffix ships in the smaller 112-LQFP package with fewer I/Os (approximately 91 GPIO). For designs that need the full 119 GPIO and four-CAN count, the CAG is the larger-footprint choice; MAL is the pin-compatible board-shrinker when I/O margin allows.
Is there a drop-in upgrade with more flash in the same 144-LQFP footprint?
Yes. The MC9S12XEQ384CAG (384 KB Flash) and MC9S12XET512B MAG-class parts share the 144-LQFP footprint and pinout of the MC9S12XET256CAG and are drop-in compatible. They also share the same S12XE family peripherals, so firmware built for the E-variant typically ports to the Q-variant by adjusting the memory map. See the 'MC9S12XDT512CAG' family for higher density options.
Where can I download the MC9S12XET256CAG datasheet PDF?
The official NXP MC9S12XET256CAG datasheet is hosted on nxp.com at the product part page. The companion S12XE-Family Reference Manual (document S12XERG, Rev 1.24 or later) covers the full peripheral set and is essential reading for register-level development. Both documents are free to download with an NXP account from the NXP document library.
Where can I buy the MC9S12XET256CAG and what is its current price?
The MC9S12XET256CAG is actively stocked at DigiKey, Mouser and authorised NXP distributors. As of 2026-10-19, distributor pricing starts at approximately USD 16.85 for qty-1 with quantity breaks at 10, 100, 500 and 1000 units. Lead time is typically 6-10 weeks from NXP franchised distributors for production volumes; cut-tape and tray stock is generally available from catalog distributors.
What is the lead time for the MC9S12XET256CAG?
As of 2026-10-19, distributor-published lead time for the MC9S12XET256CAG is approximately 6-10 weeks from franchised distributors for production volumes, with smaller catalog quantities (under 100 units) typically available from stock at DigiKey and Mouser. Automotive-qualified -Q suffix variants are sometimes subject to longer lead times and require PPAP documentation.
Is the MC9S12XET256CAG still in production?
Yes. According to the NXP product page, the MC9S12XET256CAG is listed as Active, meaning NXP continues to accept orders and the part is in the standard product lifecycle. The family roadmap has been extended with the 1 MB MC9S12XE100 flagship, so the 256 KB member is in long-term production rather than being near end-of-life.
What are the key features of the MC9S12XET256CAG that engineers should know?
The MC9S12XET256CAG combines a 50 MHz S12X 16-bit CPU with an XGATE peripheral co-processor, 256 KB Flash, 16 KB RAM, 4 KB emulated EEPROM, a 16-channel 12-bit ADC, four CAN 2.0 modules, up to 119 GPIO and a memory protection unit in a 144-LQFP package. It runs from a single 3.13-5.5 V supply via its internal regulator and supports BDM in-circuit debugging.
MC9S12XET256CAG vs S912XET256J2MAG - which is better for automotive body controllers?
The MC9S12XET256CAG (CAG suffix, 144-LQFP) is the standard commercial-grade option with full 119 GPIO, while the S912XET256J2MAG is the same silicon in a 112-LQFP, -40/+125 C, AEC-Q100-qualified automotive grade. For AEC-Q100 automotive designs that tolerate fewer I/Os, the S912XET256J2MAG is the better fit; for designs needing maximum GPIO and CAN count on the bench, the CAG offers more board real estate.
Can the S912XEP768J5CAGR replace the MC9S12XET256CAG?
The S912XEP768J5CAGR is the higher-density 768 KB Flash sibling of the same S12XE family, supplied in a 144-LQFP and pin-compatible with the MC9S12XET256CAG. Yes, it can serve as a drop-in upgrade where more Flash is needed. Note however that the S912X prefix indicates the automotive 'S' family, so PPAP and software collateral may differ from the MC9S12X commercial part.
What is the best NXP drop-in replacement for the MC9S12XET256CAG?
The best drop-in replacements are the same-package S12XE family members: the MC9S12XET256MAG (112-LQFP, automotive grade) and the MC9S12XEQ384CAG (144-LQFP, 384 KB Flash) for upward migration. All share the same S12X core, XGATE engine and peripheral set; firmware is largely portable with only a memory-map adjustment. For the same 144-LQFP, the MC9S12XDT512CAG is also a compatible upgrade.

엔지니어링 참조 데이터: MC9S12XET256CAG — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the MC9S12XET256CAG when you need a 16-bit automotive-class MCU with 256 KB Flash, four CAN 2.0 modules and the XGATE co-processor in the standard 144-LQFP package. It is the right fit for automotive body controllers, CAN gateways and industrial PLC I/O expanders running -40 to +85 C. If your design must operate at +125 C under-hood, move to the MC9S12XET256MAG or the automotive-grade S912XET256J2MAG. If firmware size will exceed 256 KB, move up to the MC9S12XEQ384CAG (384 KB) or MC9S12XEP768CAG (768 KB) - both share the 144-LQFP footprint and are pin-compatible drop-in upgrades. If you can shrink to 112-LQFP with fewer I/Os, consider the MC9S12XET256MAL for a smaller PCB.

대체품과의 비교

파라미터 이 제품 MC9S12XEQ384CAG MC9S12XDT512CAG MC9S12XEP768CAG MC9S12XET256CAG MC9S12XET256MAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm)
Core S12X + XGATE S12X + XGATE S12XD + XGATE S12XE + XGATE S12X + XGATE S12X + XGATE
Flash 256 KB 384 KB (+50%) 512 KB (+100%) 768 KB (+200%) 256 KB (same) 256 KB (same)
RAM 16 KB 32 KB 32 KB 48 KB 16 KB 16 KB
EEPROM (emulated) 4 KB 4 KB 4 KB 4 KB 4 KB 4 KB
Maximum Clock 50 MHz 50 MHz 40 MHz 50 MHz 50 MHz 50 MHz
Operating Temperature -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +125 C (automotive) -40 C to +85 C -40 C to +125 C (automotive)
CAN Modules 4 4 5 5 4 4

주요 차별점

  • XGATE peripheral co-processor runs at full 50 MHz (vs MC9S12A256CPVE (older S12A family))
  • Same-package Flash upgrade path to 384 KB and 768 KB (vs MC9S12XEQ384CAG (same 144-LQFP, +50% Flash))
  • Four independent MSCAN modules in a 16-bit MCU (vs MC9S12XDP512MAG (5 MSCAN but 512 KB Flash))

설계 노트

BKGD and MODC pins must be reserved for Background Debug Mode and cannot be used as general-purpose I/O without losing in-circuit debug capability. Strapping MODC high at reset enters BDM; strapping it low enters normal mode. Place a 4.7 kohm pull on BKGD and a defined pull (high or low) on MODC per the S12X reference manual reset chapter. Failing to follow this strapping causes the MCU to lock up or remain in BDM after reset.

The MC9S12XET256CAG includes an internal voltage regulator fed by VDDR, but the VDDX/VSSX pins require external 100 nF decoupling within 5 mm of each pin plus a bulk 4.7 uF on VDDR. Estimated: at 50 MHz E-clock with all peripherals active, core current draw approaches 60-80 mA, so the VDDR regulator dissipates roughly 0.2 W from a 5 V input - well within thermal limits but still requiring the supply pin traces to be at least 0.5 mm wide.

Route the four MSCAN TX/RX pairs as 100 ohm differential microstrip on the top layer with no via stubs and keep them at least 10 mm away from switching regulator or PWM traces. Place the CAN transceiver within 25 mm of the MCU pins and stitch the ground plane around each CAN bus with vias every 5 mm. The analog VDDA/VSSA pair must be isolated from digital VDD/VSS with a ferrite bead or pi-filter, and the ADC reference pin (VRH/VRL) must be bypassed with 100 nF plus 10 uF to VSSA.

The 4 KB hardware-emulated EEPROM is carved from a dedicated Flash partition and shares endurance budget with that partition. Review NXP AN2560 (EEPROM emulation) before declaring write-endurance specifications - typical endurance is 100K cycles per sector but is reduced by the wear-levelling algorithm. Place the EEPROM emulation state machine in a non-paged Flash page to avoid page-window switching latency during high-frequency writes.

Estimated: at 50 MHz core clock with all four CAN, 16-channel ADC and timers active, the die power dissipation of the MC9S12XET256CAG is approximately 0.3-0.4 W. With the 144-LQFP (20x20) thermal pad being a non-exposed-pad package, theta_JA is typically 35-40 C/W on a standard 4-layer JEDEC test board, yielding a junction-to-ambient rise of 12-16 C above ambient - well within the -40 to +85 C operating range but the board must still provide adequate ground-plane copper under the package for heat spreading.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Yes
분쟁 광물
Compliant

Standard MC9S12XET256CAG is commercial-grade; choose the MAG/AEG/VAG suffix for AEC-Q100 automotive qualification.

데이터 검증일: 2026-10-19 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

MC9S12XET256CAG MC9S12XET256CAG datasheet NXP MC9S12XET256CAG S12X microcontroller 256KB Flash 50MHz 144-LQFP S12X MCU CAN 2.0 MC9S12XET256CAG automotive body controller MC9S12XET256CAG vs MC9S12XET256MAL MC9S12XET256CAG drop-in replacement MC9S12XET256CAG buy price stock how to program MC9S12XET256CAG BDM MC9S12XET256CAG pinout 144-LQFP XGATE co-processor S12X example

관련 부품 & 용어

NXP Semiconductors Freescale Semiconductor MC9S12XET256CAG MC9S12XEQ384CAG MC9S12XDT512CAG MC9S12XEP768CAG MC9S12XET256MAG S912XET256J2MAG S12X S12XE microcontroller MCU 16-bit MCU HCS12X XGATE MSCAN CAN 2.0 background debug mode BDM hardware-emulated EEPROM LQFP 144-LQFP RoHS AEC-Q100 automotive body controller CAN gateway BLDC motor controller
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