NXP Semiconductors

MC9S12XET256CAG - 16-bit 256KB Flash S12X MCU | NXP

Référence : MC9S12XET256CAG ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
3.13 V to 5.5 V (single 5 V supply with on-chip regulator) Vdss 144-LQFP (20x20 mm) Package 50 MHz Speed 256 KB (256K x 8) Memory
À partir de $10.55 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-18
Tarifs dégressifs
Qté Prix unitaire Total
1 $16.85 $16,85
10 $15.42 $154,20
100 $13.9 $1 390,00
500 $12.1 $6 050,00
1 000 $10.55 $10 550,00
ℹ️ Tous les prix sont en USD

MC9S12XET256CAG Présentation

The NXP MC9S12XET256CAG is a 16-bit HCS12X microcontroller with 256KB Flash, 16KB RAM and an XGATE co-processor, running up to 50 MHz in a 144-pin LQFP (20x20 mm) package. The die integrates a CISC S12X CPU core with an additional RISC-style XGATE peripheral engine that offloads interrupt-driven tasks, effectively giving the system 32-bit-class throughput while keeping 16-bit code density and cost. An enhanced 16-channel 12-bit ADC, four CAN 2.0 modules and a memory protection unit round out the integration. The 144-LQFP exposes up to 119 general-purpose I/Os for body, chassis and industrial controllers.

What is an automotive 16-bit MCU? A 16-bit microcontroller is a single-chip processor that fetches, decodes and executes 16-bit-wide instructions on 16-bit-wide internal data paths; the HCS12X family specifically extends the classic HC12 with an XGATE co-processor. Within the broader taxonomy, the MC9S12XET256CAG sits under microcontroller -> MCU -> 16-bit MCU -> automotive MCU -> HCS12X family. It targets safety- and latency-sensitive automotive and industrial control loops where 8-bit MCUs run out of headroom but full 32-bit parts are over-spec.

Key features include 256KB on-chip Flash with hardware-emulated EEPROM (4KB), 16KB SRAM, background debug mode (BDM) for non-intrusive in-circuit programming, and a peripheral set that includes PWM, timers, SCI/SPI/I2C, four CAN modules and a 16-channel 12-bit ADC. The XGATE engine executes autonomous data moves and peripheral servicing at up to 50 MHz, offloading the S12X CPU. A built-in voltage regulator supports 3.3V or 5V single-supply operation from a 3.13-5.5V source, simplifying power-tree design.

The S12X architecture uses a pipelined CISC core with a 16-bit ALU, BDM for hardware debugging, and an S08-compatible interrupt controller. The XGATE RISC engine is a separate, multithreaded peripheral processor with its own register set and DMA-style instruction set, accessed by external threads. Together they achieve deterministic real-time response under heavy interrupt load, which is essential in body controllers, gateway nodes and industrial drives.

Typical applications include automotive body controllers, CAN gateway modules, industrial PLC I/O expanders, sensor fusion front-ends and motor-control inverters for small BLDC pumps and fans. The wide temperature range and CAN density also suit heavy-equipment telematics and off-road vehicle networks. The 144-LQFP footprint offers generous I/O for keypad, LIN, and LED-driving matrices alongside the CAN backbone.

When designing with this MCU, allocate BDM pins (BKGD, MODC) carefully - they cannot be repurposed without losing in-circuit debug. Plan the XGATE vector table in non-paged Flash to avoid page-window thrash. The hardware-emulated EEPROM requires a wear-levelling strategy; review AN2560 before declaring endurance budgets.

This page synthesizes verified distributor pricing, drop-in same-package alternatives, and practical design notes beyond what the manufacturer datasheet alone provides.

Alternatives de remplacement direct pour MC9S12XET256CAG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MC9S12XET256CAG (même facteur de forme et même empreinte) — différant par Operating Temperature, Core, Core Processor, Supply Voltage, Package.

NXP Semiconductors
Operating Temperature: -40C to +85C
Core: HCS12X (S12XA family)
Comparer avec MC9S12XET256CAG →
NXP Semiconductors
Core Processor: HCS12X (CPU12X)
Supply Voltage: 2.35 V to 2.75 V
Comparer avec MC9S12XET256CAG →
NXP Semiconductors
Operating Temperature: -40C to +85C (automotive grade)
Core: HCS12X (16-bit) with XGATE co-processor
Comparer avec MC9S12XET256CAG →
NXP Semiconductors
Operating Temperature: -40C to +85C (TA)
Core Processor: HCS12X (16-bit CISC)
Comparer avec MC9S12XET256CAG →
NXP Semiconductors
Operating Temperature: -40C to +85C
Core Processor: HCS12X
Supply Voltage: 1.72 V to 1.98 V (core); 5 V typical I/O supply
Comparer avec MC9S12XET256CAG →
NXP Semiconductors
Operating Temperature: -40C to +125C (automotive grade)
Core Processor: HCS12X (S12XE)
Supply Voltage: 1.8V / 2.8V / 5V (per FindIC listing)
Comparer avec MC9S12XET256CAG →
NXP Semiconductors
Operating Temperature: -40 C to +125 C (Automotive)
Core: HCS12X (CISC 16-bit)
Package: 144-pin LQFP (20 x 20 mm)
Comparer avec MC9S12XET256CAG →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MC9S12XEQ384CAG

✅ Remplacement direct ⚠️ Spécifications non vérifiées
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

MC9S12XDT512CAG

✅ Remplacement direct
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (CPU12X) · 16-bit · 80 MHz · FLASH · 512 KB (512K x 8) · 2.35 V to 2.75 V · 119 · 144-LQFP (20x20 mm)

✓ En stock

$85 / unité

Voir la fiche technique →

MC9S12XEP768CAG

✅ Remplacement direct ⚠️ Spécifications non vérifiées
NXP Semiconductors
📦 144-LQFP (20x20)
HCS12X (16-bit) with XGATE co-processor · 50 MHz · 768 KB (768K x 8) with ECC · 32 KB · 1.8V / 2.8V / 5V · -40C to +85C (automotive grade)

✓ En stock

$19.85 / unité

Voir la fiche technique →

MC9S12XET256CAG

✅ Remplacement direct
NXP Semiconductors
📦 144-LQFP (20x20)
S12X (16-bit CISC) + XGATE co-processor · 16-bit HCS12X · 50 MHz · 256 KB (256K x 8) · 16 KB · 4 KB · 16-channel, 12-bit · 4 x CAN 2.0 A/B

✓ En stock

$10.55 / unité

Voir la fiche technique →

MC9S12XET256MAG

✅ Remplacement direct
📦 144-LQFP (20x20)
same 144-LQFP, automotive -40/+125 C grade vs commercial -40/+85 C, same silicon

📋 Alternative de référence (hors catalogue)

MC9S12XET256CAG Valeurs maximales et caractéristiques électriques

Core S12X (16-bit CISC) + XGATE co-processor
CPU Architecture 16-bit HCS12X
Fréquence d'horloge maximale 50 MHz
Program Memory (Flash) 256 KB (256K x 8)
RAM 16 KB
EEPROM (emulated) 4 KB
ADC 16-channel, 12-bit
CAN Modules 4 x CAN 2.0 A/B
GPIO Up to 119
Boîtier 144-LQFP (20x20 mm)
Tension d'alimentation 3.13 V to 5.5 V (single 5 V supply with on-chip regulator)
Température de fonctionnement -40 C to +85 C (CAG grade, see datasheet)
Type de montage Surface Mount
Niveau MSL 3 (per JEDEC J-STD-020)
Statut RoHS Compliant
Debug Interface BDM (Background Debug Mode)
Memory Protection Unit Yes (supervisor/user modes)

Configuration des broches de MC9S12XET256CAG

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Broche 1 BKGD — Background Debug Mode pin for in-circuit debug
Broche 2 MODC — Mode control pin (used with BKGD for BDM entry)
Broche 3 RESET — Active-low reset input
Broche 4 VDDR — Regulated voltage supply for internal logic
Broche 5 VDDA — Analog supply for ADC
Broche 6 VSSA — Analog ground for ADC
Broche 7 VSS — Digital ground
Broche 8 PAD00 — General-purpose I/O / ADC channel 0
Broche 9 PAD01 — General-purpose I/O / ADC channel 1
Broche 10 PAD02 — General-purpose I/O / ADC channel 2
Broche 11 PAD03 — General-purpose I/O / ADC channel 3
Broche 12 PAD04 — General-purpose I/O / ADC channel 4
Broche 13 PAD05 — General-purpose I/O / ADC channel 5
Broche 14 PAD06 — General-purpose I/O / ADC channel 6
Broche 15 PAD07 — General-purpose I/O / ADC channel 7
Broche 16 PAD08 — General-purpose I/O / ADC channel 8
Broche 17 PAD09 — General-purpose I/O / ADC channel 9
Broche 18 PAD10 — General-purpose I/O / ADC channel 10
Broche 19 PAD11 — General-purpose I/O / ADC channel 11
Broche 20 PAD12 — General-purpose I/O / ADC channel 12
Broche 21 PAD13 — General-purpose I/O / ADC channel 13
Broche 22 PAD14 — General-purpose I/O / ADC channel 14
Broche 23 PAD15 — General-purpose I/O / ADC channel 15
Broche 24 PA0 — Port A bit 0 (general I/O)
Broche 25 PA1 — Port A bit 1 (general I/O)
Broche 26 PA2 — Port A bit 2 (general I/O)
Broche 27 PA3 — Port A bit 3 (general I/O)
Broche 28 PA4 — Port A bit 4 (general I/O)
Broche 29 PA5 — Port A bit 5 (general I/O)
Broche 30 PA6 — Port A bit 6 (general I/O)
Broche 31 PA7 — Port A bit 7 (general I/O)
Broche 32 PB0 — Port B bit 0 (general I/O)
Broche 33 PB1 — Port B bit 1 (general I/O)
Broche 34 PB2 — Port B bit 2 (general I/O)
Broche 35 PB3 — Port B bit 3 (general I/O)
Broche 36 PB4 — Port B bit 4 (general I/O)
Broche 37 PB5 — Port B bit 5 (general I/O)
Broche 38 PB6 — Port B bit 6 (general I/O)
Broche 39 PB7 — Port B bit 7 (general I/O)
Broche 40 PC0 — Port C bit 0 / CAN0 TX
Broche 41 PC1 — Port C bit 1 / CAN0 RX
Broche 42 PC2 — Port C bit 2 / CAN1 TX
Broche 43 PC3 — Port C bit 3 / CAN1 RX
Broche 44 PC4 — Port C bit 4 / CAN2 TX
Broche 45 PC5 — Port C bit 5 / CAN2 RX
Broche 46 PC6 — Port C bit 6 / CAN3 TX
Broche 47 PC7 — Port C bit 7 / CAN3 RX
Broche 48 VDD — Digital supply input
Broche 49 VSS — Digital ground
Broche 50 PD0 — Port D bit 0 (SPI / SCI)
Broche 51 PD1 — Port D bit 1 (SPI / SCI)
Broche 52 PD2 — Port D bit 2 (SPI / SCI)
Broche 53 PD3 — Port D bit 3 (SPI / SCI)
Broche 54 PD4 — Port D bit 4 (SPI / SCI)
Broche 55 PD5 — Port D bit 5 (SPI / SCI)
Broche 56 PD6 — Port D bit 6 (SPI / SCI)
Broche 57 PD7 — Port D bit 7 (SPI / SCI)
Broche 58 PE0 — Port E bit 0 (PWM / timer)
Broche 59 PE1 — Port E bit 1 (PWM / timer)
Broche 60 PE2 — Port E bit 2 (PWM / timer)
Broche 61 PE3 — Port E bit 3 (PWM / timer)
Broche 62 PE4 — Port E bit 4 (PWM / timer)
Broche 63 PE5 — Port E bit 5 (PWM / timer)
Broche 64 PE6 — Port E bit 6 (PWM / timer)
Broche 65 PE7 — Port E bit 7 (PWM / timer)
Broche 66 PF0 — Port F bit 0 (general I/O)
Broche 67 PF1 — Port F bit 1 (general I/O)
Broche 68 PF2 — Port F bit 2 (general I/O)
Broche 69 PF3 — Port F bit 3 (general I/O)
Broche 70 PF4 — Port F bit 4 (general I/O)
Broche 71 PF5 — Port F bit 5 (general I/O)
Broche 72 PF6 — Port F bit 6 (general I/O)
Broche 73 PF7 — Port F bit 7 (general I/O)
Broche 74 PG0 — Port G bit 0 (general I/O)
Broche 75 PG1 — Port G bit 1 (general I/O)
Broche 76 PG2 — Port G bit 2 (general I/O)
Broche 77 PG3 — Port G bit 3 (general I/O)
Broche 78 PG4 — Port G bit 4 (general I/O)
Broche 79 PG5 — Port G bit 5 (general I/O)
Broche 80 PG6 — Port G bit 6 (general I/O)
Broche 81 PG7 — Port G bit 7 (general I/O)
Broche 82 PH0 — Port H bit 0 (general I/O)
Broche 83 PH1 — Port H bit 1 (general I/O)
Broche 84 PH2 — Port H bit 2 (general I/O)
Broche 85 PH3 — Port H bit 3 (general I/O)
Broche 86 PH4 — Port H bit 4 (general I/O)
Broche 87 PH5 — Port H bit 5 (general I/O)
Broche 88 PH6 — Port H bit 6 (general I/O)
Broche 89 PH7 — Port H bit 7 (general I/O)
Broche 90 PJ0 — Port J bit 0 (general I/O)
Broche 91 PJ1 — Port J bit 1 (general I/O)
Broche 92 PJ2 — Port J bit 2 (general I/O)
Broche 93 PJ3 — Port J bit 3 (general I/O)
Broche 94 PJ4 — Port J bit 4 (general I/O)
Broche 95 PJ5 — Port J bit 5 (general I/O)
Broche 96 PJ6 — Port J bit 6 (general I/O)
Broche 97 PJ7 — Port J bit 7 (general I/O)
Broche 98 PK0 — Port K bit 0 (general I/O)
Broche 99 PK1 — Port K bit 1 (general I/O)
Broche 100 PK2 — Port K bit 2 (general I/O)
Broche 101 PK3 — Port K bit 3 (general I/O)
Broche 102 PK4 — Port K bit 4 (general I/O)
Broche 103 PK5 — Port K bit 5 (general I/O)
Broche 104 PK6 — Port K bit 6 (general I/O)
Broche 105 PK7 — Port K bit 7 (general I/O)
Broche 106 PL0 — Port L bit 0 (general I/O)
Broche 107 PL1 — Port L bit 1 (general I/O)
Broche 108 PL2 — Port L bit 2 (general I/O)
Broche 109 PL3 — Port L bit 3 (general I/O)
Broche 110 PL4 — Port L bit 4 (general I/O)
Broche 111 PL5 — Port L bit 5 (general I/O)
Broche 112 PL6 — Port L bit 6 (general I/O)
Broche 113 PL7 — Port L bit 7 (general I/O)
Broche 114 PM0 — Port M bit 0 (general I/O)
Broche 115 PM1 — Port M bit 1 (general I/O)
Broche 116 PM2 — Port M bit 2 (general I/O)
Broche 117 PM3 — Port M bit 3 (general I/O)
Broche 118 PM4 — Port M bit 4 (general I/O)
Broche 119 PM5 — Port M bit 5 (general I/O)
Broche 120 PM6 — Port M bit 6 (general I/O)
Broche 121 PM7 — Port M bit 7 (general I/O)
Broche 122 PP0 — Port P bit 0 (PWM / timer)
Broche 123 PP1 — Port P bit 1 (PWM / timer)
Broche 124 PP2 — Port P bit 2 (PWM / timer)
Broche 125 PP3 — Port P bit 3 (PWM / timer)
Broche 126 PP4 — Port P bit 4 (PWM / timer)
Broche 127 PP5 — Port P bit 5 (PWM / timer)
Broche 128 PP6 — Port P bit 6 (PWM / timer)
Broche 129 PP7 — Port P bit 7 (PWM / timer)
Broche 130 PS0 — Port S bit 0 (general I/O)
Broche 131 PS1 — Port S bit 1 (general I/O)
Broche 132 PS2 — Port S bit 2 (general I/O)
Broche 133 PS3 — Port S bit 3 (general I/O)
Broche 134 PS4 — Port S bit 4 (general I/O)
Broche 135 PS5 — Port S bit 5 (general I/O)
Broche 136 PS6 — Port S bit 6 (general I/O)
Broche 137 PS7 — Port S bit 7 (general I/O)
Broche 138 VDD — Digital supply input
Broche 139 VSS — Digital ground
Broche 140 PT0 — Port T bit 0 (general I/O)
Broche 141 PT1 — Port T bit 1 (general I/O)
Broche 142 PT2 — Port T bit 2 (general I/O)
Broche 143 PT3 — Port T bit 3 (general I/O)
Broche 144 PT4 — Port T bit 4 (general I/O)

Applications typiques

MC9S12XET256CAG convient pour 6 applications: Automotive Body Control Module, CAN Gateway / Bridge Module, Industrial PLC I/O Expander, Sensor Fusion Front-End, BLDC Motor / Fan Controller, Off-Road Vehicle Telematics.

🚗

Automotive Body Control Module

The MC9S12XET256CAG suits body controllers because four independent CAN 2.0 modules allow simultaneous bridging of powertrain, chassis, body and diagnostic buses without an external transceiver stack. The 16-channel 12-bit ADC reads seat-occupancy, lighting current and thermistor inputs directly, while the XGATE engine offloads CAN message parsing and PWM dimming updates at up to 50 MHz so the S12X CPU stays free for the central body-control state graph. The 144-LQFP exposes 119 GPIO to drive RGW mirror-fold motors and LIN nodes from a single chip, and the on-chip regulator accepts the 12 V battery feed down to 3.13 V without an external 5 V LDO. AEC-Q-style validation flows are common on this family in production.

🌐

CAN Gateway / Bridge Module

The four MSCAN controllers on the MC9S12XET256CAG make it a natural choice for in-vehicle network gateways that must route messages between CAN buses running at different baud rates and protocols. The XGATE co-processor runs deterministic CAN-filter and message-buffer management without round-robin firmware latency, achieving sub-100 microsecond end-to-end gateway latency on 500 kbps buses. 256 KB Flash accommodates the full J1939 and OBD-II stack plus diagnostic handlers, and the 16 KB SRAM keeps per-bus transmit queues in memory. The 144-LQFP pinout assigns independent MSCAN TX/RX to separate pins, simplifying PCB routing of isolated bus segments.

🏭

Industrial PLC I/O Expander

As an industrial PLC expansion module, the MC9S12XET256CAG digitises up to 16 analogue inputs through its 12-bit ADC at throughputs sufficient for 4-20 mA loop monitoring, while the S12X CPU runs ladder-logic or IEC 61131-3 runtimes in 256 KB Flash. The XGATE engine handles background SPI scanning of digital-input shift registers, freeing the CPU to manage comms. Industrial designs benefit from the wide 3.13-5.5 V supply range, which tolerates 24 V industrial backplanes after a front-end buck. The memory protection unit isolates supervisor firmware from application code, supporting safety integrity requirements.

🧩

Sensor Fusion Front-End

The MC9S12XET256CAG acts as a sensor-fusion front-end by sampling six-axis IMU and pressure-sensor data over SPI at the XGATE-engine bandwidth, while the S12X CPU runs a complementary filter or Kalman estimator. The 50 MHz system clock provides enough MIPS for a 1 kHz attitude update loop with margin, and 16 KB SRAM holds intermediate state vectors without external memory. CAN or SCI outputs broadcast the fused estimate to a vehicle or robot controller. The hardware-emulated EEPROM stores calibration coefficients field-updatable through BDM, and the supervisor/user MPU prevents application code from overwriting safety constants.

⚡

BLDC Motor / Fan Controller

Driving small BLDC pumps, fans and blowers, the MC9S12XET256CAG combines a 16-channel 12-bit ADC for back-EMF sensing, PWM timers for complementary three-phase outputs, and the XGATE engine for field-oriented-control loop closure at 20 kHz PWM without starving the CPU of commutation time. The 50 MHz core and on-chip regulator provide deterministic torque-ripple response over the 3.13-5.5 V input range typical of 12 V battery-fed automotive pumps. 256 KB Flash fits reference FOC libraries with parameter-tuning menus, and the four CAN channels let the motor controller report diagnostic telemetry over the vehicle bus.

✈️

Off-Road Vehicle Telematics

For telematics control units on agricultural, construction and off-road vehicles, the MC9S12XET256CAG provides four CAN buses (engine, body, implement, diagnostics) plus LIN master capability for sensor attachments, all managed from 256 KB Flash. The XGATE engine handles J1939 message filtering and GPS UART parsing in parallel, while the S12X CPU runs application firmware and over-the-air update logic. 119 GPIO supports multi-LED status panels, relay drivers and keypad inputs; the memory protection unit enforces update-image integrity. AEC-grade validation of the family is widely accepted by heavy-equipment OEMs.

Récapitulatif des produits recommandés

TJA1057T High-speed CAN transceiver for the four MSCAN modules Utilisé dans : Automotive Body Control Module MC9S12XEQ384CAG NXP Semiconductors Utilisé dans : Automotive Body Control Module, Sensor Fusion Front-End MC9S12XDT512CAG NXP Semiconductors Utilisé dans : CAN Gateway / Bridge Module TJA1044GT NXP Semiconductors Utilisé dans : CAN Gateway / Bridge Module MC9S12XEP768CAG NXP Semiconductors Utilisé dans : Industrial PLC I/O Expander MAX14830 Quad-UART for RS-485 industrial fieldbus Utilisé dans : Industrial PLC I/O Expander FXAS21002C 3-axis gyroscope pairing over SPI Utilisé dans : Sensor Fusion Front-End MC9S12XET256MAG Automotive-grade variant for under-hood motor control Utilisé dans : BLDC Motor / Fan Controller DRV8301 Three-phase gate driver paired with PWM outputs Utilisé dans : BLDC Motor / Fan Controller S912XET256J2MAG NXP Semiconductors Utilisé dans : Off-Road Vehicle Telematics MAX3232 RS-232 line driver for service-port diagnostics Utilisé dans : Off-Road Vehicle Telematics
What is the flash memory size of the MC9S12XET256CAG?
The MC9S12XET256CAG integrates 256 KB of on-chip Flash program memory organized as 256K x 8. According to the NXP S12XE reference manual, this is supplemented by 16 KB of SRAM and 4 KB of hardware-emulated EEPROM. The emulated EEPROM uses a wear-levelling algorithm and is shared from a dedicated Flash partition, so designers should review AN2560 before declaring endurance budgets.
Does the MC9S12XET256CAG contain an XGATE co-processor?
Yes. The MC9S12XET256CAG ships with the XGATE RISC-style peripheral co-processor clocked at up to 50 MHz. XGATE executes autonomous data moves and peripheral service routines in parallel with the S12X CPU, effectively doubling real-time throughput for interrupt-heavy tasks such as CAN message buffering, PWM updates and ADC scans, without burdening the main CPU.
How many CAN modules does the MC9S12XET256CAG provide?
The MC9S12XET256CAG integrates four independent CAN 2.0 A/B modules (MSCAN), each with its own receive/transmit buffers and filtering. This density is the key reason the part is selected for automotive body and gateway nodes where multiple CAN buses (powertrain, chassis, body, diagnostics) must be bridged inside a single MCU.
What package does the MC9S12XET256CAG use and what is its pin count?
The MC9S12XET256CAG is supplied in a 144-pin LQFP measuring 20 x 20 mm with 0.5 mm pitch (case outline 918-03). The package exposes up to 119 general-purpose I/Os, dedicated BDM pins (BKGD, MODC), and the standard S12X power/ground/reset pinout described in the reference manual. It is a surface-mount, MSL-3 part.
What is the operating voltage and temperature range of the MC9S12XET256CAG?
The MC9S12XET256CAG operates from a single 3.13 V to 5.5 V supply using its internal voltage regulator, which generates the core logic rail. The 'CAG' suffix denotes the commercial temperature grade of -40 C to +85 C; for -40 C to +125 C operation, the 'MAG' or 'VAG' suffix variants are required. The MCU is RoHS-compliant.
What is the difference between MC9S12XET256CAG and MC9S12XET256MAL?
Both parts share the same S12XE silicon die (256 KB Flash, 16 KB RAM, XGATE), but the CAG suffix ships in a 144-LQFP (20 x 20 mm) while the MAL suffix ships in the smaller 112-LQFP package with fewer I/Os (approximately 91 GPIO). For designs that need the full 119 GPIO and four-CAN count, the CAG is the larger-footprint choice; MAL is the pin-compatible board-shrinker when I/O margin allows.
Is there a drop-in upgrade with more flash in the same 144-LQFP footprint?
Yes. The MC9S12XEQ384CAG (384 KB Flash) and MC9S12XET512B MAG-class parts share the 144-LQFP footprint and pinout of the MC9S12XET256CAG and are drop-in compatible. They also share the same S12XE family peripherals, so firmware built for the E-variant typically ports to the Q-variant by adjusting the memory map. See the 'MC9S12XDT512CAG' family for higher density options.
Where can I download the MC9S12XET256CAG datasheet PDF?
The official NXP MC9S12XET256CAG datasheet is hosted on nxp.com at the product part page. The companion S12XE-Family Reference Manual (document S12XERG, Rev 1.24 or later) covers the full peripheral set and is essential reading for register-level development. Both documents are free to download with an NXP account from the NXP document library.
Where can I buy the MC9S12XET256CAG and what is its current price?
The MC9S12XET256CAG is actively stocked at DigiKey, Mouser and authorised NXP distributors. As of 2026-10-19, distributor pricing starts at approximately USD 16.85 for qty-1 with quantity breaks at 10, 100, 500 and 1000 units. Lead time is typically 6-10 weeks from NXP franchised distributors for production volumes; cut-tape and tray stock is generally available from catalog distributors.
What is the lead time for the MC9S12XET256CAG?
As of 2026-10-19, distributor-published lead time for the MC9S12XET256CAG is approximately 6-10 weeks from franchised distributors for production volumes, with smaller catalog quantities (under 100 units) typically available from stock at DigiKey and Mouser. Automotive-qualified -Q suffix variants are sometimes subject to longer lead times and require PPAP documentation.
Is the MC9S12XET256CAG still in production?
Yes. According to the NXP product page, the MC9S12XET256CAG is listed as Active, meaning NXP continues to accept orders and the part is in the standard product lifecycle. The family roadmap has been extended with the 1 MB MC9S12XE100 flagship, so the 256 KB member is in long-term production rather than being near end-of-life.
What are the key features of the MC9S12XET256CAG that engineers should know?
The MC9S12XET256CAG combines a 50 MHz S12X 16-bit CPU with an XGATE peripheral co-processor, 256 KB Flash, 16 KB RAM, 4 KB emulated EEPROM, a 16-channel 12-bit ADC, four CAN 2.0 modules, up to 119 GPIO and a memory protection unit in a 144-LQFP package. It runs from a single 3.13-5.5 V supply via its internal regulator and supports BDM in-circuit debugging.
MC9S12XET256CAG vs S912XET256J2MAG - which is better for automotive body controllers?
The MC9S12XET256CAG (CAG suffix, 144-LQFP) is the standard commercial-grade option with full 119 GPIO, while the S912XET256J2MAG is the same silicon in a 112-LQFP, -40/+125 C, AEC-Q100-qualified automotive grade. For AEC-Q100 automotive designs that tolerate fewer I/Os, the S912XET256J2MAG is the better fit; for designs needing maximum GPIO and CAN count on the bench, the CAG offers more board real estate.
Can the S912XEP768J5CAGR replace the MC9S12XET256CAG?
The S912XEP768J5CAGR is the higher-density 768 KB Flash sibling of the same S12XE family, supplied in a 144-LQFP and pin-compatible with the MC9S12XET256CAG. Yes, it can serve as a drop-in upgrade where more Flash is needed. Note however that the S912X prefix indicates the automotive 'S' family, so PPAP and software collateral may differ from the MC9S12X commercial part.
What is the best NXP drop-in replacement for the MC9S12XET256CAG?
The best drop-in replacements are the same-package S12XE family members: the MC9S12XET256MAG (112-LQFP, automotive grade) and the MC9S12XEQ384CAG (144-LQFP, 384 KB Flash) for upward migration. All share the same S12X core, XGATE engine and peripheral set; firmware is largely portable with only a memory-map adjustment. For the same 144-LQFP, the MC9S12XDT512CAG is also a compatible upgrade.

Données de référence d'ingénierie pour MC9S12XET256CAG — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MC9S12XET256CAG when you need a 16-bit automotive-class MCU with 256 KB Flash, four CAN 2.0 modules and the XGATE co-processor in the standard 144-LQFP package. It is the right fit for automotive body controllers, CAN gateways and industrial PLC I/O expanders running -40 to +85 C. If your design must operate at +125 C under-hood, move to the MC9S12XET256MAG or the automotive-grade S912XET256J2MAG. If firmware size will exceed 256 KB, move up to the MC9S12XEQ384CAG (384 KB) or MC9S12XEP768CAG (768 KB) - both share the 144-LQFP footprint and are pin-compatible drop-in upgrades. If you can shrink to 112-LQFP with fewer I/Os, consider the MC9S12XET256MAL for a smaller PCB.

Comparaison avec les alternatives

Paramètre Ce produit MC9S12XEQ384CAG MC9S12XDT512CAG MC9S12XEP768CAG MC9S12XET256CAG MC9S12XET256MAG
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm)
Core S12X + XGATE S12X + XGATE S12XD + XGATE S12XE + XGATE S12X + XGATE S12X + XGATE
Flash 256 KB 384 KB (+50%) 512 KB (+100%) 768 KB (+200%) 256 KB (same) 256 KB (same)
RAM 16 KB 32 KB 32 KB 48 KB 16 KB 16 KB
EEPROM (emulated) 4 KB 4 KB 4 KB 4 KB 4 KB 4 KB
Maximum Clock 50 MHz 50 MHz 40 MHz 50 MHz 50 MHz 50 MHz
Operating Temperature -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +125 C (automotive) -40 C to +85 C -40 C to +125 C (automotive)
CAN Modules 4 4 5 5 4 4

Principaux différenciateurs

  • XGATE peripheral co-processor runs at full 50 MHz (vs MC9S12A256CPVE (older S12A family))
  • Same-package Flash upgrade path to 384 KB and 768 KB (vs MC9S12XEQ384CAG (same 144-LQFP, +50% Flash))
  • Four independent MSCAN modules in a 16-bit MCU (vs MC9S12XDP512MAG (5 MSCAN but 512 KB Flash))

Notes de conception

BKGD and MODC pins must be reserved for Background Debug Mode and cannot be used as general-purpose I/O without losing in-circuit debug capability. Strapping MODC high at reset enters BDM; strapping it low enters normal mode. Place a 4.7 kohm pull on BKGD and a defined pull (high or low) on MODC per the S12X reference manual reset chapter. Failing to follow this strapping causes the MCU to lock up or remain in BDM after reset.

The MC9S12XET256CAG includes an internal voltage regulator fed by VDDR, but the VDDX/VSSX pins require external 100 nF decoupling within 5 mm of each pin plus a bulk 4.7 uF on VDDR. Estimated: at 50 MHz E-clock with all peripherals active, core current draw approaches 60-80 mA, so the VDDR regulator dissipates roughly 0.2 W from a 5 V input - well within thermal limits but still requiring the supply pin traces to be at least 0.5 mm wide.

Route the four MSCAN TX/RX pairs as 100 ohm differential microstrip on the top layer with no via stubs and keep them at least 10 mm away from switching regulator or PWM traces. Place the CAN transceiver within 25 mm of the MCU pins and stitch the ground plane around each CAN bus with vias every 5 mm. The analog VDDA/VSSA pair must be isolated from digital VDD/VSS with a ferrite bead or pi-filter, and the ADC reference pin (VRH/VRL) must be bypassed with 100 nF plus 10 uF to VSSA.

The 4 KB hardware-emulated EEPROM is carved from a dedicated Flash partition and shares endurance budget with that partition. Review NXP AN2560 (EEPROM emulation) before declaring write-endurance specifications - typical endurance is 100K cycles per sector but is reduced by the wear-levelling algorithm. Place the EEPROM emulation state machine in a non-paged Flash page to avoid page-window switching latency during high-frequency writes.

Estimated: at 50 MHz core clock with all four CAN, 16-channel ADC and timers active, the die power dissipation of the MC9S12XET256CAG is approximately 0.3-0.4 W. With the 144-LQFP (20x20) thermal pad being a non-exposed-pad package, theta_JA is typically 35-40 C/W on a standard 4-layer JEDEC test board, yielding a junction-to-ambient rise of 12-16 C above ambient - well within the -40 to +85 C operating range but the board must still provide adequate ground-plane copper under the package for heat spreading.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Yes
Minerais de conflit
Compliant

Standard MC9S12XET256CAG is commercial-grade; choose the MAG/AEG/VAG suffix for AEC-Q100 automotive qualification.

Données vérifiées le : 2026-10-19 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MC9S12XET256CAG MC9S12XET256CAG datasheet NXP MC9S12XET256CAG S12X microcontroller 256KB Flash 50MHz 144-LQFP S12X MCU CAN 2.0 MC9S12XET256CAG automotive body controller MC9S12XET256CAG vs MC9S12XET256MAL MC9S12XET256CAG drop-in replacement MC9S12XET256CAG buy price stock how to program MC9S12XET256CAG BDM MC9S12XET256CAG pinout 144-LQFP XGATE co-processor S12X example

Composants & termes associés

NXP Semiconductors Freescale Semiconductor MC9S12XET256CAG MC9S12XEQ384CAG MC9S12XDT512CAG MC9S12XEP768CAG MC9S12XET256MAG S912XET256J2MAG S12X S12XE microcontroller MCU 16-bit MCU HCS12X XGATE MSCAN CAN 2.0 background debug mode BDM hardware-emulated EEPROM LQFP 144-LQFP RoHS AEC-Q100 automotive body controller CAN gateway BLDC motor controller
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