MCF5307FT66B - 66MHz ColdFire V3 MCU 208-FQFP | NXP
MPN: MCF5307FT66B ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $26.5 | $26.50 |
| 10 | $23.85 | $238.50 |
| 100 | $21.2 | $2,120.00 |
| 500 | $18.95 | $9,475.00 |
| 1,000 | $16.8 | $16,800.00 |
MCF5307FT66B Overview
A microcontroller (MCU) is an integrated circuit that combines a processor core, program and data memory, and a set of on-chip peripherals on a single die. Within the ColdFire V3 hierarchy, the MCF5307 sits between simple 8/16-bit controllers and higher-performance application processors. It supports external memory addressing, allowing ROMless designs to attach external Flash and SRAM as the system requires - useful when code density or in-field firmware updates are required. ColdFire implements a variable-length instruction set (ISA_B) that retains a high degree of source compatibility with legacy Motorola 68K code, easing porting efforts.
Key features of the MCF5307FT66B include a Version 3 ColdFire core with hardware multiply/accumulate, 4 KB unified SRAM, an external memory controller supporting ROM, SRAM, and DRAM, a flexible peripheral set including timers, serial interfaces, and a system integration module. Operating voltage is 3.3 V (typical) and the device integrates clock generation and reset management. The 208-FQFP (28x28 mm) surface-mount package provides 16 GPIO-equivalent lines and supports industrial temperature grades per device marking.
Technically, the MCF5307 separates its peripheral bus from the CPU core bus, enabling simultaneous DMA and CPU activity with minimal contention. The 66 MHz core clock combined with the V3 pipeline delivers sustained throughput adequate for protocol stacks such as TCP/IP, USB device class stacks, and industrial fieldbus firmware. The 208-FQFP footprint offers 16 dedicated user I/O pins plus all peripheral and address/data pins, allowing direct interface to external memory and logic.
Typical applications include industrial control and HMI terminals, factory automation controllers, embedded networking appliances, point-of-sale terminals, and upgrade platforms for legacy 68K designs. It is well-suited wherever a low-cost 32-bit MCU with a familiar instruction set and external memory expansion is preferred over SoC alternatives.
When designing with the MCF5307FT66B, allocate PCB space carefully around the 208-FQFP land pattern and route address/data bus traces with matched impedance. Use external watchdog and supervisor circuits for safety-critical applications, and place bypass capacitors adjacent to all VDD/VSS pin pairs to limit core noise on the 3.3 V rail.
This page synthesizes distributor pricing, drop-in alternatives, and design considerations specifically for the MCF5307FT66B, complementing the manufacturer datasheet with cross-reference and selection guidance.
Drop-in alternatives for MCF5307FT66B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCF5307FT66B (same form factor and footprint) — differing in Maximum Clock Frequency, Program Memory Type, Core Architecture, Data Bus Width, On-chip SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCF5307FT90B
✅ Drop-In✓ In Stock
$11.95 / Unit
View Datasheet →MCF5307AI66B
✅ Drop-In✓ In Stock
$36.49 / Unit
View Datasheet →IDT79RV4700-133DP
✅ Drop-In📋 Reference alternative (not in catalog)
MCF5307FT66B Maximum Ratings & Electrical Characteristics
| Core Architecture | ColdFire V3 (MCF530x) |
| Data Bus Width | 32-bit |
| Maximum Clock Frequency | 66 MHz |
| Program Memory Type | ROMless (external memory required) |
| On-chip SRAM | 4 KB (4K x 8) |
| Number of I/O Lines | 16 |
| Oscillator Type | External |
| Package / Case | 208-BFQFP (28x28 mm) |
| Mounting Type | Surface Mount |
| External Memory Controller | Yes (ROM/SRAM/DRAM/Flash) |
| Packaging (distributor) | Tray |
MCF5307FT66B 208-bfqfp (28x28 mm) Pin Configuration Guide
Pin configuration for MCF5307FT66B (208-bfqfp (28x28 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCF5307FT66B.
Refer to the datasheet for full pin configuration.
Typical Applications
MCF5307FT66B is suitable for 6 applications: Industrial Control and HMI Terminals, Factory Automation Controllers, Embedded Networking Appliances, Point-of-Sale Terminals, Legacy 68K Upgrade Platforms, Medical Monitoring Devices (Non-Critical).
Industrial Control and HMI Terminals
The MCF5307FT66B's ColdFire V3 core at 66 MHz and 68K-compatible ISA_B instruction set make it a strong fit for industrial HMI terminals that need to drive character or small graphic LCDs while servicing keypad and serial peripherals. The 208-FQFP package exposes 16 dedicated user I/O lines alongside the external bus pins, allowing direct connection to keypad matrices, LED drivers, and optocoupled inputs without additional bus expanders. Its 4 KB on-chip SRAM supports stack and scratch space for real-time scheduling while external DRAM/Flash attached to the integrated memory controller holds the firmware image and human-interface resources. Compared with low-end Cortex-M parts, the FT66B supplies a familiar Motorola-style toolchain path for engineers maintaining legacy equipment.
Recommended
Factory Automation Controllers
In factory automation the MCF5307FT66B acts as a deterministic slave controller on fieldbus networks, executing ladder-logic or motion sequences while communicating over UART-based protocols such as Modbus RTU, RS-485, or proprietary fieldbus. The 66 MHz core provides sufficient cycles to handle protocol parsing and PID loops at typical control loop rates of 1-10 kHz without missing interrupt deadlines. The external memory controller supports DRAM/Flash expansion for storing configuration logs and boot images in non-volatile memory. The wide operating voltage range typical of the MCF530x family plus the 208-pin surface-mount package enable dense multi-axis controller boards where each axis requires its own MCU instance.
Recommended
Embedded Networking Appliances
The MCF5307FT66B is a classic choice for embedded networking appliances such as serial-to-Ethernet bridges, protocol converters, and lightweight routers running uIP or lwIP TCP/IP stacks. The ColdFire V3 core at 66 MHz can sustain typical embedded stack workloads where throughput requirements are modest (sub-10 Mbps Ethernet), and the 68K ISA maps well to legacy networking codebases ported from older 68K designs. External SRAM and Flash attached to the memory controller hold the TCP/IP stack image, socket buffers, and configuration web pages, while the on-chip 4 KB SRAM serves as packet scratch space. Compared with newer Cortex-M7 parts the FT66B trades energy efficiency for a familiar development environment and inexpensive toolchain support.
Recommended
Point-of-Sale Terminals
Point-of-sale (POS) terminals benefit from the MCF5307FT66B's balance of 32-bit throughput, external memory flexibility, and rugged 208-FQFP packaging for commercial environments. The 66 MHz ColdFire V3 core drives display handling, keypad scanning, and serial communication to barcode readers, receipt printers, and magnetic-stripe readers, while external Flash holds the localized firmware and transaction records. The 16 user I/O pins allow direct interface to peripheral enable signals without additional I/O expanders, simplifying the bill of materials. Compared with high-end application processors, the FT66B minimizes bill-of-materials cost and power consumption - critical for terminals powered from low-voltage supplies in retail point-of-sale installations.
Recommended
Legacy 68K Upgrade Platforms
One of the strongest fit areas for the MCF5307FT66B is as an upgrade platform for designs originally built on Motorola 68000 or 68EC000 processors. The ColdFire V3 ISA_B instruction set maintains a high degree of source compatibility with 68K code, allowing many C/assembly projects to recompile with minimal modification. The 208-FQFP package provides a generous pin budget for legacy address/data bus pinouts, easing mechanical drop-in onto retrofitted boards where the original 68K socket was a larger PGA or PLCC package. The 66 MHz clock, while slower than modern Cortex parts, delivers more throughput than the original 8-16 MHz 68K cores it replaces, providing a meaningful performance uplift during field upgrades.
Recommended
Medical Monitoring Devices (Non-Critical)
For non-critical medical monitoring peripherals - such as bedside data-loggers, patient-entertainment terminals, and equipment telemetry hubs - the MCF5307FT66B provides a deterministic 32-bit platform with external Flash storage for logs and parameter sets. The ColdFire V3 core handles serial polling of bedside sensors, simple status displays, and network uplinks to central monitoring stations. The wide external memory bus accommodates larger Flash parts for local data retention between network syncs. Designers must add external watchdog supervision (e.g., MAX705) for safety-class behaviors and validate IEC 60601 compliance independently; the FT66B itself is not qualified to medical safety standards.
Recommended
Recommended Products Summary
Engineering reference data for MCF5307FT66B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCF5307FT90B | MCF5307AI66B | IDT79RV4700-133DP |
|---|---|---|---|---|
| Package | 208-BFQFP (28x28 mm) | 208-BFQFP (28x28 mm) - same | 208-BFQFP (28x28 mm) - same | 208-BFQFP (28x28 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors (same family) | NXP Semiconductors (same family) | Renesas Electronics (IDT) |
| Core Architecture | ColdFire V3 | ColdFire V3 (same) | ColdFire V3 (same) | MIPS-based (different ISA) |
| Max Clock Frequency | 66 MHz | 90 MHz (+36%) | 66 MHz (equal) | 133 MHz (~+101%) |
| Program Memory Type | ROMless (external) | ROMless (same) | ROMless (same) | ROMless |
Key Differentiators
- Pin-compatible speed upgrade path within the same NXP family (vs MCF5307FT90B)
- Verified same-package parametric cross reference (vs MCF5307AI66B)
- Mature 68K-compatible toolchain (vs IDT79RV4700-133DP)
Design Notes
Place 0.1 uF decoupling capacitors as close as possible to every VDD/VSS pin pair on the 208-FQFP footprint, with one bulk 10 uF tantalum or ceramic per voltage domain. Maintain short, wide traces for the 3.3 V rail. The address/data bus pins are clustered along two opposing sides of the package; route them with matched length if connecting to SDRAM with tight timing windows. For 66 MHz operation, keep bus trace lengths short to limit reflections and consider series damping on heavily-loaded signals.
Estimated: at 66 MHz with typical VDD = 3.3 V and CMOS switching activity approximated at 0.5x load, the core dissipation sits in the low hundreds of milliwatts. The 208-FQFP (28x28 mm) package has typical theta_JA in the 30-50 C/W range. A modest copper-pour thermal pad under the package and adjacent ground plane provide sufficient heat spreading for industrial temperature grades; no external heatsink is required. Validate worst-case current with a thermal prototype when operating at the temperature grade upper limit.
Do not assume the MCF5307FT66B and MCF5307AI66B are electrically identical despite the same package - confirm peripheral pinout revisions against the latest NXP datasheet before reusing PCB layouts. The ColdFire V3 RESET line must be held low for the minimum reset duration specified in the datasheet; an external supervisor IC such as MAX705 is recommended to guarantee clean power-on reset and brown-out handling. Ensure the external oscillator drive level matches the device marking (some MCF5307 derivatives require 3.3 V CMOS clock, not 5 V TTL).
Compliance Information
Compliance data not present in the verified web snippets; refer to NXP product environmental compliance page for confirmation. AEC-Q100 is not applicable - this is an industrial-grade MCU, not automotive-qualified.
