MCIMX31CVKN5D - i.MX31 ARM1136 MPU 532MHz MAPBGA-457 | NXP
MPN: MCIMX31CVKN5D ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $19.8 | $19.80 |
| 10 | $17.82 | $178.20 |
| 100 | $15.84 | $1,584.00 |
| 500 | $13.86 | $6,930.00 |
| 1,000 | $11.88 | $11,880.00 |
MCIMX31CVKN5D Overview
An applications processor (AP) is a system-on-chip (SoC) optimized to run an operating system and to accelerate multimedia workloads such as video decode, image processing, audio playback, and 2D/3D graphics. The i.MX31 sits in the i.MX application-processor family and represents NXP's first i.MX device qualified to AEC-Q100 Grade 3 for automotive use - the engine behind the Ford SYNC infotainment platform. Within the broader silicon taxonomy it is an MPU (microprocessor unit) rather than a microcontroller, meaning it relies on external SDRAM and boot ROM rather than embedded flash.
Key features include the ARM1136JF-S core with Jazelle Java acceleration and floating-point support, an on-chip multimedia accelerator, an integrated LCD controller with TFT support, and a rich set of connectivity peripherals including USB, MMC/SD, I2C, I2S, UART, and a CMOS sensor interface. The processor is ROMless - boot media is supplied externally - which keeps die cost low but requires a companion boot NOR/NAND plus external SDRAM.
Architecturally the i.MX31 pairs the ARM11 core with a dedicated Smart Speed (a direct-to-display bus) interconnect, hardware video processing blocks, and an Image Processing Unit (IPU) that offloads display and camera pipelines. The result is a high-integration device that can drive QVGA to VGA panels while sustaining concurrent camera preview.
Typical applications include automotive infotainment head units, portable media players, industrial HMI panels, medical patient monitors, and point-of-sale terminals. The AEC-Q100 Grade 3 qualification makes it particularly attractive for in-cabin automotive electronics that must operate from -40C to +85C.
When designing with this device, plan for an external SDRAM interface, a boot ROM strategy, and adequate PCB thermal dissipation. The 14x14 mm BGA with 0.5 mm pitch demands careful escape routing and a multi-layer PCB.
This page synthesizes distributor availability, drop-in i.MX31 alternatives, and practical design notes not consolidated on the manufacturer product page.
Drop-in alternatives for MCIMX31CVKN5D — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCIMX31CVKN5D (same form factor and footprint) — differing in Core Architecture, Mounting Type, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCIMX31DVMN5D
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX31VMN5C
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX31CJKN5D
✅ Drop-In✓ In Stock
$15.9 / Unit
View Datasheet →MCIMX31LCVKN5D
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MCIMX31LCJMN5D
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MCIMX31CVKN5D Maximum Ratings & Electrical Characteristics
| Part Family | i.MX31 |
| Core Architecture | ARM1136JF-S |
| Core Count | 1 |
| Data Bus Width | 32-bit |
| Maximum Clock Frequency | 532 MHz |
| Cache Memory | 16 KB unified instruction/data |
| Program Memory Type | ROMless |
| External Memory Support | DDR / SDRAM (external) |
| Package | 457-LFBGA (MAPBGA-457) |
| Package Dimensions | 14 x 14 mm |
| Ball Pitch | 0.5 mm |
| Process Technology | 0.09 um CMOS |
| Operating Temperature Range | -40C to +85C (AEC-Q100 Grade 3 automotive) |
| Mounting Type | Surface Mount (SMD/SMT) |
| Automotive Qualification | AEC-Q100 Grade 3 (i.MX31 family) |
MCIMX31CVKN5D 14 x 14 mm Pin Configuration Guide
Pin configuration for MCIMX31CVKN5D (14 x 14 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCIMX31CVKN5D.
Refer to the datasheet for full pin configuration.
Typical Applications
MCIMX31CVKN5D is suitable for 7 applications: Automotive Infotainment Head Unit, Portable Media Player, Industrial HMI / Operator Panel, Medical Patient Monitor, Point-of-Sale (POS) Terminal, Connected Digital Signage / Kiosk, Industrial Vision / Smart Camera.
Automotive Infotainment Head Unit
The MCIMX31CVKN5D's 532 MHz ARM1136JF-S core and on-chip multimedia accelerator make it a strong fit for automotive infotainment main units, where it drives TFT LCD panels, decodes compressed audio, and bridges to CAN/LIN vehicle networks. The i.MX31 family's AEC-Q100 Grade 3 qualification - the first i.MX family to achieve this - directly supports in-cabin operating environments from -40C to +85C. The integrated Image Processing Unit (IPU) offloads display and camera pipelines so the ARM11 core can run the HMI and connectivity stacks concurrently. Place the device with external DDR SDRAM and a boot NOR/NAND; pair it with a companion NXP audio codec and CAN transceiver for a complete head-unit reference design.
Recommended
Portable Media Player
The MCIMX31CVKN5D's hardware video processing accelerators and integrated LCD controller suit portable media players that decode H.264/MPEG-4 video while driving a 320x240 to 640x480 panel. Its ROMless architecture allows designers to optimize boot time and memory cost against target use cases. At 532 MHz the ARM1136JF-S provides enough headroom for a Linux media stack with simultaneous video decode, UI rendering, and audio mixing. Pair the device with a low-power external DDR and a battery PMIC for typical 4-6 hour playback. Note that NXP's later i.MX27/i.MX51 families superseded this device for consumer PMP designs.
Recommended
Industrial HMI / Operator Panel
The MCIMX31CVKN5D suits industrial HMI operator panels thanks to its integrated TFT controller, touch-screen interface, and rich connectivity (USB, Ethernet MAC, I2C, SPI). The 532 MHz core is ample for Qt/Embedded or Linux-based HMI stacks with 2D graphics. AEC-Q100 Grade 3 qualification provides margin for factory-floor temperature swings. Pair with an external PHY for Ethernet, a resistive or capacitive touch controller, and optically-isolated digital I/O for industrial signaling. The 14x14 mm MAPBGA package with thermal vias supports sealed IP65 front-panel designs.
Recommended
Medical Patient Monitor
The MCIMX31CVKN5D's integrated display controller and multimedia peripherals make it appropriate for medical patient monitors that aggregate vital-sign data and render waveforms on TFT panels. The AEC-Q100 Grade 3 temperature range and ARM11 floating-point unit allow real-time DSP-style filtering of ECG/SpO2 waveforms on the CPU. Pair with a medical-grade analog front end, isolated serial interfaces, and a TFT panel sized from 5.7 to 10.4 inches. The ROMless architecture simplifies medical FDA/IEC 62304 software verification by isolating the bootloader.
Recommended
Point-of-Sale (POS) Terminal
The MCIMX31CVKN5D's rich peripheral mix - USB host/device, Ethernet MAC, I2S audio, MMC/SD, and a CMOS sensor interface - is ideal for compact POS terminals with barcode scanner, magnetic-stripe reader, printer, and customer-facing display. The 532 MHz ARM1136JF-S core runs a Linux POS application stack comfortably. External DDR and boot ROM support encrypted firmware for PCI-PTS compliance. Pair with a USB hub controller, an encryption accelerator, and a thermal printer driver interface for a complete POS reference platform.
Recommended
Connected Digital Signage / Kiosk
The MCIMX31CVKN5D is well suited to small-format digital signage and kiosk controllers that drive a single panel while streaming content over Ethernet. Its integrated LCD controller supports panels up to XGA, the JPEG/MPEG hardware accelerator eases media decode, and the Ethernet MAC with external PHY provides the network connection. The MAPBGA-457 package and external-DDR architecture make it cost-effective for high-volume commercial signage deployments. Pair with a power-over-Ethernet PD controller and a Wi-Fi/Bluetooth companion module for flexible installation.
Recommended
Industrial Vision / Smart Camera
The MCIMX31CVKN5D's integrated Image Processing Unit (IPU) and CSI (CMOS sensor interface) make it a credible platform for low-cost industrial smart cameras that capture, preprocess, and stream images over Ethernet. The 532 MHz ARM1136JF-S can run OpenCV-style image-processing pipelines for basic defect detection. Pair with a CMOS image sensor, an external DDR for frame buffers, and an Ethernet PHY for streaming. The 0.09 um process keeps the die area and power low enough for sealed camera enclosures.
Recommended
Recommended Products Summary
Engineering reference data for MCIMX31CVKN5D — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCIMX31DVMN5D | MCIMX31VMN5C | MCIMX31CJKN5D |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | MAPBGA-457 (14x14 mm) | MAPBGA-457 (14x14 mm) | MAPBGA-457 (14x14 mm) | MAPBGA-457 (14x14 mm) |
| Core | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S |
| Clock Frequency | 532 MHz | 532 MHz | 400 MHz | 532 MHz |
| Program Memory | ROMless (external boot) | ROMless (external boot) | ROMless (external boot) | ROMless (external boot) |
| Lifecycle Status | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL |
| Variant Family | i.MX31 standard power | i.MX31 automotive DVM | i.MX31 standard power | i.MX31 commercial CJK |
Key Differentiators
- First i.MX family with AEC-Q100 Grade 3 automotive qualification (vs MCIMX31CJKN5D)
- Highest speed bin in i.MX31 family (vs MCIMX31VMN5C)
- Standard i.MX31 power profile (vs i.MX31L low-power variant) (vs MCIMX31LCVKN5D)
Design Notes
The 457-ball MAPBGA with 0.5 mm pitch demands microvia or via-in-pad PCB technology and at least 4 routing layers for clean escape from inner-row balls. Use a 4-6 layer stack-up with 0.4-0.5 mm core thickness; place stitching ground vias around the BGA perimeter at 1.0 mm pitch to reduce ground bounce on the DDR bus. Assign the inner 4 ball rows first, then route outer rows to break-out layers. Impedance-controlled 50 ohm single-ended / 100 ohm differential routing is required for USB, Ethernet, and LVDS pairs.
Estimated: at 532 MHz with 1.0 V core supply, the i.MX31 draws approximately 400-500 mA active, dissipating 0.4-0.5 W. The MAPBGA-457 thermal resistance theta_JA is in the 25-35 C/W range when properly mounted with thermal vias under the die. Place an array of 0.3 mm thermal vias on a 100x100 grid under the central die region, stitch to internal ground/power planes, and consider a small copper heat spreader. Derate ambient by at least 10-15 C for sealed enclosures without forced airflow.
Do not assume the MCIMX31CVKN5D's DDR interface tolerates any DDR type - the i.MX31 supports mDDR (LPDDR) and standard DDR1, not DDR2/LPDDR2. Verify boot mode strapping resistors on the BOOT pins during PCB bring-up; incorrect straps will silently prevent boot. The JTAG chain must include the ARM1136JF-S core plus any companion test TAPs - omit pull-ups on TMS/TCK/TDI/TDO at your peril. External SDRAM traces must be length-matched within +/- 50 mil for the byte lanes.
Sequence the i.MX31 power rails in the order Vcore -> Vio -> Vdd_ddr to avoid latch-up. Use an NXP-recommended PMIC such as the MC34704/PCF50603 family and verify the power-good signal before de-asserting reset. Hold POR (power-on reset) low until all rails are within 5 percent of nominal. Decouple each power pin with a 0.1 uF X7R ceramic placed within 50 mil of the ball, plus a bulk 10 uF nearby.
Compliance Information
AEC-Q100 Grade 3 qualification applies at the i.MX31 family level per NXP's product overview. RoHS, REACH, lead-free, halogen-free, and conflict-mineral status were not present in the Verified Web Data and are marked unknown.
