MCIMX31LVKN5 - i.MX31 ARM1136 532MHz MPU | NXP | Multimedia
MPN: MCIMX31LVKN5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.85 | $2,185.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $15.75 | $15,750.00 |
MCIMX31LVKN5 Overview
An ARM application processor (or MPU) is a high-integration system-on-chip that combines a CPU core with peripherals, memory interfaces, and multimedia engines, sitting hierarchically above microcontrollers and below full discrete computer CPUs in the embedded systems pyramid. The i.MX31 family is the multimedia tier of NXP's (formerly Freescale) ARM portfolio, optimized for video, imaging, and human-machine-interface workloads.
Key features of the MCIMX31LVKN5 include: ARM1136JF-S CPU with Java acceleration and 16KB/16KB L1 caches, integrated MPEG-4/H.263 codec at VGA/D1 resolution, hardware Image Processing Unit for camera input and LCD output, a graphics accelerator that supports 2D/3D primitives via OpenGL ES 1.1, USB 2.0 High-Speed OTG host/device, and a DDR1 mobile memory controller. Unlike the i.MX31L variants (no GPU), the MCIMX31 silicon used in this part number includes the full graphics acceleration pipeline.
Architecture depth: the device uses a 90 nm CMOS process and supports 1.75 V to 3.1 V I/O with separate core and peripheral voltage rails. Three integrated co-processors reduce host CPU load: VFP (vector floating point), IPU (image pre/post-processing), and a dedicated multimedia engine. Hardware acceleration means the i.MX31 can sustain D1 (720x480) video encode/decode at 30 fps without offloading to external logic.
Typical applications include portable media players, in-vehicle infotainment head units, industrial HMI panels, point-of-sale terminals, and medical imaging displays. The 532 MHz ceiling and integrated peripherals let a single i.MX31 drive a 640x480 LCD while simultaneously decoding an MPEG-4 stream and serving a USB-connected storage device, replacing what would otherwise require a DSP plus a separate controller.
When designing with the MCIMX31LVKN5, allocate the LFBGA escape region carefully. The 0.8 mm ball pitch and 14x14 mm body demand 4-layer PCB stack-up with controlled-impedance traces for the DDR data lanes, plus a substantial copper pour under the package for thermal dissipation. A bypass network of 100 nF + 10 µF per power rail is mandatory near the device.
This page consolidates distributor pricing, drop-in i.MX31 family alternatives, and practical PCB-layout guidance not found in the manufacturer datasheet itself.
Drop-in alternatives for MCIMX31LVKN5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCIMX31LVKN5 (same form factor and footprint) — differing in Package / Case, Manufacturer, Operating Temperature Range, RoHS Status, USB Interface.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCIMX31VKN5C
✅ Drop-In✓ In Stock
$17.85 / Unit
View Datasheet →MCIMX31CJMN4C
✅ Drop-In✓ In Stock
$27.85 / Unit
View Datasheet →MCIMX31LVKN5C
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$15.95 / Unit
View Datasheet →MCIMX31VKN5
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$18.9 / Unit
View Datasheet →MCIMX31LCVMN4C
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$10.5 / Unit
View Datasheet →MCIMX515DJM8C
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6G2AVM07AB
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX31LVKN5 Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) |
| Series | i.MX31 |
| Core Processor | ARM1136JF-S |
| Number of Cores | 1 Core, 32-Bit |
| Maximum Clock Speed | 532 MHz |
| Co-Processors/DSP | Multimedia; GPU, IPU, MPEG-4, VFP |
| Graphics Acceleration | Yes |
| Display & Interface Controllers | Keyboard, LCD, Touchscreen support |
| RAM Controllers | DDR (Mobile DDR) |
| Ethernet | 10/100 Mbps MAC |
| USB | USB 2.0 OTG (High Speed) |
| Process Technology | 90 nm CMOS |
| I/O Voltage | 1.75 V to 3.1 V |
| Package / Case | 457-LFBGA (MAPBGA), 14x14 mm, 0.5 mm pitch |
| Mounting Type | Surface Mount, BGA |
| Packaging | Tray |
| Lifecycle Status | Obsolete |
MCIMX31LVKN5 Pin Configuration
| Pin A1 | VSS — Ground reference |
| Pin B14 | VDD — Core supply rail |
| Pin N20 | USB_DP — USB 2.0 OTG data plus |
| Pin P19 | USB_DM — USB 2.0 OTG data minus |
| Pin T2 | LCD_DATA0 — LCD parallel data bit 0 |
| Pin U1 | LCD_CLK — LCD pixel clock |
| Pin AA23 | DDR_DQS0 — DDR1 data strobe lane 0 |
| Pin AB1 | ETH_TXCLK — Ethernet MAC transmit clock |
Typical Applications
MCIMX31LVKN5 is suitable for 7 applications: Portable Media Player, Automotive Infotainment Head Unit, Industrial HMI / Touch Panel, Point-of-Sale / Retail Terminal, Medical Imaging Display, Smart Home Control Hub, Video VoIP / Surveillance Endpoint.
Portable Media Player
The MCIMX31LVKN5's 532 MHz ARM1136JF-S core, integrated MPEG-4/H.263 hardware codec, and Image Processing Unit (IPU) make it a direct fit for portable media players targeting D1 (720x480) video at 30 fps. The 457-LFBGA package plus DDR1 memory controller and USB 2.0 OTG host let the design accept external storage while the LCD interface drives a TFT panel up to VGA. Power dissipation stays manageable thanks to voltage scaling between the 1.75-3.1 V I/O and the internal core rail, enabling battery operation above 6 hours of video playback.
Recommended
Automotive Infotainment Head Unit
Automotive infotainment head units built around the MCIMX31LVKN5 benefit from its 32-bit ARM1136JF-S CPU, hardware-accelerated MPEG-4 decode, and integrated graphics engine that drives the in-dash TFT display. The 14x14 mm 457-LFBGA is compatible with HMI PCB layouts originally designed for the i.MX31 family. CAN and I2C peripherals allow direct connection to vehicle bus networks, while the touch-screen controller interfaces remove the need for a separate touch IC. Industrial temperature grade (-40 C to +85 C) and wide I/O range tolerate under-hood thermal variation.
Recommended
Industrial HMI / Touch Panel
Factory-floor HMI panels use the MCIMX31LVKN5's integrated LCD controller and touch-screen interface to drive 5- to 10-inch panels without an external graphics chip. The 532 MHz ARM1136 core sustains Qt/Embedded and lightweight HTML5 GUI stacks, while 10/100 Ethernet MAC enables networked PLC connectivity. Extended temperature operation aligns with NEMA-rated enclosures, and the BGA package supports conformal coating for harsh-environment deployments in chemical or washdown zones.
Recommended
Point-of-Sale / Retail Terminal
POS terminals use the MCIMX31LVKN5 to combine a touchscreen cash register display, barcode scanner input, and customer-facing secondary display in one board. The integrated USB 2.0 OTG host connects to barcode readers and receipt printers, while the SD card interface backs up transaction logs. Hardware MPEG-4 decoding supports promotional video loops on the customer-facing display, and the ARM1136 core runs embedded Linux or Windows CE point-of-sale applications comfortably above 400 MHz.
Recommended
Medical Imaging Display
Medical imaging displays leverage the MCIMX31LVKN5's Image Processing Unit (IPU) for real-time color-space conversion and scaling of ultrasound or endoscopy feeds onto high-resolution TFT panels. The hardware MPEG-4 codec captures and streams procedure video to archival storage via the on-board Ethernet MAC. Long-term availability concerns of this obsolete part are mitigated through NXP's product-change notification system and a mature second-source broker channel common in medical device procurement.
Recommended
Smart Home Control Hub
Smart home control hubs built on the MCIMX31LVKN5 take advantage of its USB host, Ethernet MAC, I2C/SPI peripherals, and LCD controller to serve as the local aggregation point for Zigbee, Z-Wave, and Wi-Fi bridges. The ARM1136 core runs embedded Linux distributions that expose MQTT or proprietary automation protocols, while the IPU drives the local 7-inch touchscreen. Low-cost idle power states (sub-50 mW) make the hub viable for always-on deployments on consumer-grade 5 V supplies.
Recommended
Video VoIP / Surveillance Endpoint
Video-over-IP surveillance endpoints pair the MCIMX31LVKN5's MPEG-4 encoder with a camera sensor and Ethernet MAC to deliver a self-contained streaming appliance. The integrated JPEG codec in newer i.MX parts is absent here, but a parallel CMOS camera interface plus the on-chip image processing unit support up to VGA streaming at 30 fps. Industrial temperature grade fits outdoor enclosure deployments, while the BGA's small footprint enables compact PoE-powered housings.
Recommended
Recommended Products Summary
Engineering reference data for MCIMX31LVKN5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCIMX31VKN5C | MCIMX31CJMN4C | MCIMX31LVKN5C | MCIMX515DJM8C |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 457-LFBGA (14x14) | 457-LFBGA (14x14) - same | MAPBGA-473 - same BGA family | 457-LFBGA (14x14) - same | BGA-400 - different |
| Core Processor | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM Cortex-A8 |
| Maximum CPU Clock | 532 MHz | 532 MHz | 400 MHz | 532 MHz | 800 MHz |
| Graphics Accelerator | Yes (i.MX31 silicon) | Yes | Yes | Yes | Yes (improved) |
| USB Controller | USB 2.0 OTG (High Speed) | USB 2.0 OTG | USB 2.0 OTG | USB 2.0 OTG | USB 2.0 OTG + EHCI |
| Memory Controller | DDR (Mobile DDR) | Mobile DDR | Mobile DDR | Mobile DDR | DDR2 |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 65 nm CMOS |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Key Differentiators
- Higher CPU clock (532 MHz) than MCIMX31CJMN4C (vs MCIMX31CJMN4C)
- Mature NXP i.MX31 software ecosystem (vs MCIMX515DJM8C)
- Integrated Image Processing Unit (IPU) (vs MCIMX31CJMN4C)
Design Notes
Estimated: The 457-ball LFBGA at 0.5 mm pitch demands a 4-layer PCB stack-up with 0.1 mm micro-vias on the fan-out. Match the NXP reference layout (see MCIMX31 datasheet section on PCB layout) to within +/- 0.05 mm to avoid joint opens during reflow. Route all DDR signals on the top layer with length matching to within 25 ps, and keep the core supply decoupling caps (100 nF + 10 uF) within 2 mm of each VDD ball.
Estimated: Under full MPEG-4 decode load at 532 MHz, the MCIMX31LVKN5 dissipates approximately 1.5-2 W. The 14x14 mm LFBGA has a theta_JA of roughly 25-30 C/W depending on the PCB copper area, giving a junction-to-ambient rise of 40-60 C. For sealed enclosures, ensure at least 10 sq cm of internal copper spreading under the package footprint, or specify an embedded thermal via array to the opposite PCB layer.
Use the NXP TPS65023 or equivalent PMIC to generate the i.MX31 core, I/O, and memory rails in the correct sequencing order (core before I/O, I/O before memory). The MCIMX31LVKN5 is sensitive to brownouts on the core rail - add a 47 uF bulk capacitor plus a 10 uF ceramic within 5 mm of the largest VDD ball. Verify the reset supervisor trip voltage matches the 1.2 V core rail minimum.
Estimated: The USB 2.0 OTG data pair on pins N20/P19 must be routed as a 90-ohm differential pair with no more than two vias total. Series common-mode chokes (e.g., 90 ohm at 100 MHz) are recommended near the connector to pass radiated emissions. The DDR data strobes (DQS) require matched routing within 50 ps of the data byte group - deviate only with extensive SI simulation.
Do not confuse the MCIMX31LVKN5 (i.MX31L, no GPU) with the MCIMX31VKN5 (i.MX31 with GPU) when ordering - the L suffix denotes the L variant. The C suffix on MCIMX31LVKN5C indicates the controlled-process / tighter-bin option used in medical and long-lifecycle designs. Always cross-check the ordering information table in the NXP datasheet before volume procurement.
Compliance Information
RoHS and REACH status for the obsolete MCIMX31LVKN5 are not consistently documented across distributors. NXP i.MX31 family BGA packages are generally lead-free per the package materials declaration, but engineers should request a current material declaration from the supplier before design-in for new RoHS-regulated markets.
