MCIMX6Q4AVT10AD - i.MX 6Quad 1GHz ARM Cortex-A9 MPU | NXP
MPN: MCIMX6Q4AVT10AD ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $64.92 | $64.92 |
| 10 | $60.18 | $601.80 |
| 100 | $55.47 | $5,547.00 |
| 250 | $51.86 | $12,965.00 |
| 500 | $48.74 | $24,370.00 |
MCIMX6Q4AVT10AD Overview
An applications processor is a system-on-chip (SoC) that integrates CPU cores, GPU, memory controller, display pipelines, and I/O peripherals into a single die, replacing what would otherwise require a separate MCU, northbridge, GPU, and I/O controller. The i.MX 6Quad sits within NXP's portfolio as a high-tier multimedia applications processor, above single-core i.MX 6Solo and dual-core i.MX 6Dual parts, but below the i.MX 7 and i.MX 8 families in process node and feature set. Typical use cases include automotive infotainment head units, industrial HMIs, medical imaging consoles, and smart factory control panels.
Key features include hardware-accelerated video codec for H.264 BP/MP/HP, MPEG-4, VC-1, and DivX; two MIPI CSI camera ports; three display outputs (parallel, LVDS, HDMI/MIPI-DSI); SATA II interface; PCIe Gen 2.0; and Gigabit Ethernet with AVB. The processor supports 32-bit LVDDR3 and DDR3/LPDDR2 memory, with on-chip voltage regulators and a multi-power-domain architecture that scales power consumption based on workload.
Technically, the chip is manufactured in a 40 nm CMOS process, integrating approximately 110 million transistors on a single die. The platform also includes a dedicated hardware accelerator for cryptography (CAAM), a temperature sensor, and hardware watchdog timer, making it suitable for functional safety applications. JTAG and ARM CoreSight debug infrastructure are included for development and trace.
Typical applications include automotive infotainment head units, industrial human-machine interfaces (HMI), medical imaging consoles, smart energy gateways, and digital signage controllers. The wide operating temperature range (-40C to +125C junction) and automotive qualification make it suitable for harsh-environment deployments.
When designing with the MCIMX6Q4AVT10AD, ensure the PCB has a minimum 8-layer stack-up with continuous GND planes under the FCBGA for signal integrity and thermal dissipation. Use the NXP BSP (Board Support Package) with Yocto Linux for validated boot, drivers, and reference toolchain.
This page synthesizes distributor pricing (DigiKey, Mouser), NXP-authored lifecycle signals (NRND per official NXP page), drop-in compatible i.MX 6 family alternatives, and practical design notes not consolidated on the manufacturer datasheet.
Drop-in alternatives for MCIMX6Q4AVT10AD — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCIMX6Q4AVT10AD (same form factor and footprint) — differing in Connectivity, Operating Temperature, Package, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCIMX6Q6AVT10AD
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6Q5AVT10AD
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6D6AVT10AD
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6DP6AVT8AB
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6S5EVM10AB
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6Q4AVT10AD Maximum Ratings & Electrical Characteristics
| Series | i.MX 6Quad |
| Core Processor | ARM Cortex-A9 (4 cores) |
| Bit Width | 32-bit |
| Maximum Clock Speed | 1.0 GHz |
| L2 Cache | 1 MB unified |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| GPU | Vivante GC2000 + GC355 + GC320 (2D/3D/OpenGL ES) |
| Package | 624-FCBGA (21 mm x 21 mm, 0.8 mm pitch) |
| Operating Temperature | -40C to +125C (Tj, automotive grade) |
| Supply Voltage | Multiple internal rails via integrated PMU (typ. 0.95V core, 1.8V/3.3V I/O) |
| Memory Interface | 32-bit LVDDR3/DDR3/LPDDR2 (up to 533 MHz) |
| Display Outputs | Parallel RGB, LVDS (dual-channel), HDMI, MIPI-DSI |
| Camera Interface | 2x MIPI CSI-2 ports |
| Connectivity | Gigabit Ethernet with AVB, PCIe Gen 2.0, SATA II, USB 2.0, CAN, UART, SPI, I2C, I2S |
| Security Accelerator | CAAM (Cryptographic Acceleration and Assurance Module) |
| Process Technology | 40 nm CMOS |
| RoHS Status | Compliant |
| Lifecycle Status | NRND (Not Recommended for New Designs) per NXP product page |
MCIMX6Q4AVT10AD 624-fcbga (21 mm x 21 mm, 0.8 mm pitch) Pin Configuration Guide
Pin configuration for MCIMX6Q4AVT10AD (624-fcbga (21 mm x 21 mm, 0.8 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCIMX6Q4AVT10AD.
Refer to the datasheet for full pin configuration.
Typical Applications
MCIMX6Q4AVT10AD is suitable for 6 applications: Automotive Infotainment Head Unit, Industrial Human-Machine Interface (HMI) Panel, Medical Imaging Console, Digital Signage Media Player, Smart Energy Gateway / IoT Edge Node, Aerospace Flight Information Display.
Automotive Infotainment Head Unit
The MCIMX6Q4AVT10AD is purpose-built for automotive infotainment head units where four ARM Cortex-A9 cores at 1.0 GHz drive dual-display 1080p HMI rendering alongside H.264 video decode/encode. Its integrated Vivante GC2000 GPU supports OpenGL ES 3.0 for fluid 3D instrument cluster animations, while the dedicated VPU (Hantro G1/G2) offloads multimedia decode to preserve CPU cycles for voice recognition and CAN bus management. The automotive-grade thermal rating (-40C to +125C Tj) and AEC-Q100 screening make it suitable for in-dash deployments subject to direct sunlight and cabin thermal cycling. Paired with a QNX Neutrino or INTEGRITY RTOS, it can meet ISO 26262 ASIL-B requirements for instrument cluster safety functions.
Recommended
Industrial Human-Machine Interface (HMI) Panel
The quad-core ARM Cortex-A9 processing power and dual-channel LVDS display output make the MCIMX6Q4AVT10AD ideal for industrial 10-15 inch HMI panels used in factory automation. Its two MIPI CSI-2 camera inputs enable integrated machine vision for barcode scanning or quality inspection, while the on-chip VPU provides hardware-accelerated training video playback for operator guidance. Industrial-grade temperature tolerance and the long-term product lifecycle support of the i.MX6 platform suit 7-15 year deployment horizons typical of factory equipment. The 32-bit DDR3 interface delivers sufficient bandwidth for high-frame-rate HMIs with sub-50 ms touch response.
Recommended
Medical Imaging Console
The MCIMX6Q4AVT10AD powers portable medical imaging consoles such as handheld ultrasound carts and point-of-care diagnostic stations where quad-core CPU performance accelerates DICOM image rendering. Its hardware-accelerated video codec handles live ultrasound frame streaming at 30 fps with sub-100 ms latency, while the integrated GPU composites measurement overlays on top of the B-mode image in real time. The CAAM cryptographic accelerator provides hardware-accelerated TLS sessions for secure PACS connectivity, and the dual-display capability drives the main operator panel plus an external preview monitor. Per IEC 60601-1 deployment guidance, the platform's deterministic interrupt response enables reliable touch response for sterile-field operation.
Recommended
Digital Signage Media Player
For dual-display 4K-capable digital signage installations, the MCIMX6Q4AVT10AD's Hantro VPU and dual LVDS channels provide synchronized content playback across two screens without external decoders. Its Gigabit Ethernet with AVB support enables synchronized multi-screen video walls, while the SATA II interface connects to a local HDD for content caching. The integrated HDMI transmitter drives commercial-grade panels up to 1080p60, and the hardware watchdog timer enables unattended kiosk operation with automatic recovery from hangs. Power consumption at typical signage workloads stays below 4 W, eliminating the need for active cooling in slim enclosures.
Recommended
Smart Energy Gateway / IoT Edge Node
The MCIMX6Q4AVT10AD serves as the processing core in industrial smart energy gateways aggregating data from multiple sensor buses (CAN, RS-485, M-Bus) and pushing filtered telemetry to cloud platforms. Its quad-core performance runs containerized data pipelines (Docker via Yocto BSP) for local analytics before WAN uplink, while the hardware cryptography module secures MQTT-over-TLS sessions. The PCIe Gen 2.0 interface connects to a Wi-Fi 6 or 5G modem for cellular backhaul, and the SATA port supports local logging storage. Energy-harvested or battery-backed deployments benefit from the integrated Cortex-M4 sense domain that handles wake-on-event without powering the main A9 cores.
Recommended
Aerospace Flight Information Display
For avionics flight information displays (FIDs) and in-flight entertainment controllers, the MCIMX6Q4AVT10AD provides deterministic graphics performance with the AEC-Q100 screening level confidence required by DO-160G environmental testing. The dual-display pipeline drives both the flight-attendant panel and passenger seat-back screens from a single SoC, while the hardware crypto engine authenticates software loads for DO-326A airworthiness cybersecurity compliance. Per DO-254 design assurance guidance, designers using this part on safety-relevant functions should pair it with a watchdog MCU for the cockpit display channel. The 40 nm process and integrated power management minimize thermal load in sealed avionics enclosures.
Recommended
Recommended Products Summary
Engineering reference data for MCIMX6Q4AVT10AD — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCIMX6Q6AVT10AD | MCIMX6Q5AVT10AD | MCIMX6D6AVT10AD | MCIMX6DP6AVT8AB | MCIMX6S5EVM10AB |
|---|---|---|---|---|---|---|
| Package | 624-FCBGA (21x21, 0.8 mm pitch) | 624-FCBGA (21x21) - same | 624-FCBGA (21x21) - same | 624-FCBGA (21x21) - same | 624-FCBGA - same | 624-MAPBGA - same pin count |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | 4 (Quad) | 4 (Quad) | 4 (Quad) | 2 (Dual) | 2 (DualPlus) | 1 (Solo) |
| Maximum CPU Clock | 1.0 GHz | 1.2 GHz | 0.85 GHz | 1.0 GHz | 0.85 GHz | 1.0 GHz |
| L2 Cache | 1 MB unified | 1 MB unified | 1 MB unified | 1 MB unified | 1 MB unified | 512 KB |
| GPU | Vivante GC2000 + GC355 + GC320 | Vivante GC2000 + GC355 + GC320 | Vivante GC2000 + GC355 + GC320 | Vivante GC2000 + GC355 + GC320 | Vivante GC2000 + GC355 + GC320 | Vivante GC880 + GC320 |
| Automotive Grade | Yes (AEC-Q100, -40C to +125C Tj) | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) | Industrial grade |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Quad-core ARM Cortex-A9 + dedicated VPU/GPU heterogeneous compute (vs MCIMX6S5EVM10AB (i.MX 6 Solo))
- Wider GPU feature set with OpenGL ES 3.0 support (vs MCIMX6D6AVT10AD (i.MX 6 Dual))
- AEC-Q100 automotive qualification across full temp range (vs Industrial MCIMX6Q4CWT10AD (commercial grade))
Design Notes
The 624-FCBGA package at 0.8 mm pitch requires a minimum 8-layer PCB stack-up with continuous GND planes under the BGA for both signal integrity (DDR3 SI) and thermal dissipation. Use microvia-in-pad or stacked-via structures for breakout; dog-bone fanout adds too much inductance at this pitch. Per NXP hardware design guide, pair every 4 balls with one GND via stitch on a 1.0 mm grid to control return-current paths.
Estimated: at 1.0 GHz with all four A9 cores fully active, the i.MX6Q thermal design power reaches approximately 3.5-4.0 W. With a junction-to-ambient thermal resistance near 20 C/W on a properly designed 8-layer PCB, the chip reaches 80 C above ambient at full load - so a thermal pad, heat-spreader, or aluminum enclosure is required for sealed automotive in-cabin environments where ambient can exceed 70 C. Always measure Tj in characterization with the integrated temperature sensor.
Do not boot the MCIMX6Q4AVT10AD without first validating the PMIC sequencing - the i.MX6 internal boot ROM requires the power-on reset sequence to complete within strict timing windows. Use only NXP-validated PMICs (e.g. PF3000, PF0100, MAX17491) or a discrete LDO ladder; arbitrary DC/DC solutions violate the POR timing. Also, configure the boot configuration pins (BOOT_MODE, BOOT_CFG) before release of POR_B to avoid boot ROM hangs.
DDR3/LVDDR3 traces must be length-matched within 25 mil and routed on a dedicated inner layer with reference GND plane on both sides. Use fly-by topology for SDRAM address/command lines and a VREF plane for the data byte lanes. The NXP i.MX6 Hardware Design Guide provides exact PCB stack-up, trace width, and spacing parameters - follow them verbatim, otherwise expect intermittent DRAM errors above 400 MHz.
Compliance Information
AEC-Q100 qualified per NXP automotive product line; AVT suffix confirms -40C to +125C Tj screening. RoHS and REACH compliant per NXP product page. Lead-free and halogen-free packaging.
