MCIMX6Q6AVT08AC-FR - i.MX 6Quad 1GHz ARM Cortex-A9 MPU | NXP
MPN: MCIMX6Q6AVT08AC-FR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $44.2 | $442.00 |
| 100 | $39.85 | $3,985.00 |
| 500 | $35.4 | $17,700.00 |
| 1,000 | $31.95 | $31,950.00 |
MCIMX6Q6AVT08AC-FR Overview
An applications processor (AP) is a system-on-chip (SoC) that integrates a CPU complex, GPU, memory controllers, and peripheral IP into a single die, designed to run a full operating system (typically Linux or Android) and execute rich user interfaces. The i.MX 6 family sits in NXP's multimedia AP hierarchy below the i.MX 8 and above the i.MX 7; the 6Quad variant is the top bin with 4 Cortex-A9 cores, while the 6Dual/6Solo share the same SoC silicon with fewer enabled cores.
Key features include the quad-core ARM Cortex-A9 MPCore with NEON SIMD and VFPv3 floating point, a hardware video accelerator (VPU) supporting 1080p60 H.264 encode/decode, dual independent display controllers up to 1080p, and integrated 2D/3D GPU. The 6Quad variant adds an additional GPU shader pipeline over the original 6Quad baseline, improving graphics rendering parity. The device also offers PCIe 2.0, SATA-II, Gigabit Ethernet, USB 2.0 with PHY, and multiple MMC/SD/eMMC interfaces, providing extensive connectivity for embedded peripherals.
The MCIMX6Q6AVT08AC-FR is built on a 40 nm low-power CMOS process and supports DDR3/DDR3L/LPDDR2 memory through a 64-bit interface. Hardware isolation enables per-core power gating and dynamic voltage/frequency scaling (DVFS), giving designers control over the performance-per-watt envelope. Multicore coherent interconnect and TrustZone security extension support secure boot and hardware-accelerated cryptography.
Typical applications include industrial human-machine interface (HMI) panels, automotive infotainment head units, digital signage, point-of-sale terminals, and IoT gateways. The wide operating temperature range and the -FR suffix (full RoHS compliance, lead-free) make it suitable for harsh-environment deployments.
When designing with the i.MX 6Quad, ensure the 21x21 mm FCBGA land pattern has matched vias-in-pad with proper microvia stacking and that the DDR3 routing follows the byte-lane length-matching guidelines in the reference manual. Power PMIC companion chips must supply the ramp profile specified by NXP to avoid SOC damage during sequencing.
This page synthesizes distributor pricing, validated drop-in variants, and practical design notes drawn from the i.MX 6 series hardware reference manual, providing information not consolidated in the manufacturer datasheet.
Drop-in alternatives for MCIMX6Q6AVT08AC-FR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCIMX6Q5AVT08AC
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6Q7CVT08AC
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6Q6AVT08AE
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6Q6AVT08AC
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6Q5AVT10AC
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6DP4AVT8AA
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6Q6AVT08AC-FR Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-A9 MPCore (4 cores) |
| Maximum Core Frequency | 1 GHz |
| Operating Temperature Range | -40C to +105C (industrial) |
| Package | 624-FCBGA (21x21 mm, 0.8 mm pitch) |
| Supply Voltage | 1.8 V / 2.8 V / 3.3 V |
| Process Node | 40 nm CMOS |
| GPU | Vivante GC2000 (3D) + GC355 (2D) |
| Video Processing Unit (VPU) | Hardware 1080p60 H.264 codec |
| Display Controllers | Dual independent up to 1080p |
| Memory Interface | DDR3 / DDR3L / LPDDR2, 64-bit |
| PCIe Interface | PCIe 2.0 x1 lane |
| Storage Interfaces | SATA-II, eMMC 4.5, SD 3.0, NAND |
| USB | USB 2.0 with integrated PHY (OTG + host) |
| Ethernet | Gigabit Ethernet MAC |
| RoHS Status | Compliant (FR suffix = lead-free full RoHS) |
| Security | TrustZone, secure boot, HAB, CAAM |
| Part Status | Active (industrial segment) |
MCIMX6Q6AVT08AC-FR 624-fcbga (21x21 mm, 0.8 mm pitch) Pin Configuration Guide
Pin configuration for MCIMX6Q6AVT08AC-FR (624-fcbga (21x21 mm, 0.8 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCIMX6Q6AVT08AC-FR.
Refer to the datasheet for full pin configuration.
Typical Applications
MCIMX6Q6AVT08AC-FR is suitable for 7 applications: Industrial Human-Machine Interface (HMI), Automotive Infotainment Head Unit, Digital Signage and Kiosks, Point-of-Sale (POS) Terminal, IoT Edge Gateway, Medical Imaging Display Console, Industrial Control and Robotics.
Industrial Human-Machine Interface (HMI)
The MCIMX6Q6AVT08AC-FR fits industrial HMI panels because its quad-core ARM Cortex-A9 at 1 GHz provides responsive multitouch UI rendering, the dual 1080p display controllers drive two independent screens, and the Vivante GC2000 GPU accelerates Qt/GTK workloads on Linux. With -40C to +105C operation per the NXP datasheet, it survives factory floor thermal stress. Place the SOC with a NXP PF0100 PMIC, DDR3L memory, and an LVDS-to-eDP bridge; unlike a discrete GPU it adds no driver porting burden and the integrated VPU decodes H.264 operator-instruction videos directly.
Recommended
Automotive Infotainment Head Unit
The MCIMX6Q6AVT08AC-FR suits infotainment head units because its hardware 1080p60 H.264 codec and dual display controllers drive both the cluster and center-stack screens from a single SOC. The Vivante GC2000 3D GPU accelerates OpenGL ES 2.0 for 3D navigation overlays, and the -40C to +105C range meets cabin thermal requirements. Pair with automotive-grade eMMC and an LVDS deserializer; unlike a discrete APU it consolidates multimedia, graphics, and connectivity on one die, lowering BOM cost for tier-2 automotive OEMs.
Recommended
Digital Signage and Kiosks
The MCIMX6Q6AVT08AC-FR fits digital signage because its quad-core Cortex-A9 handles 4K-capable 2D compositing via the dual display pipeline, the hardware VPU decodes full-HD video streams simultaneously, and the integrated eMMC 4.5 + SATA-II interfaces support local content caching. With industrial temperature range it operates in unattended enclosures. Combine with a touchscreen controller and 802.11ac Wi-Fi module; unlike a fanless x86 board it draws under 5 W typical, simplifying thermal design for sealed outdoor kiosks.
Recommended
Point-of-Sale (POS) Terminal
The MCIMX6Q6AVT08AC-FR fits POS terminals because the quad-core Cortex-A9 runs Android or Linux payment stacks with hardware cryptography via CAAM and TrustZone, the Gigabit Ethernet MAC drives IP-based payment terminals, and the dual USB 2.0 PHYs connect barcode scanners and receipt printers. The hardware VPU decodes loyalty-program videos at the point of sale. Use the secure-boot HAB for PCI-PTS compliance; unlike an ARM11-based POS it provides faster transaction throughput with deterministic crypto latency.
Recommended
IoT Edge Gateway
The MCIMX6Q6AVT08AC-FR suits IoT edge gateways because the quad-core Cortex-A9 runs containerized workloads (Docker/Balena) on Linux with low latency, the dual Gigabit Ethernet MACs enable router-on-a-stick configurations, and the PCIe 2.0 lane accepts cellular modems (4G/LTE) or Wi-Fi 6 cards. The -40C to +105C range tolerates outdoor enclosures. Add an SPI NOR for fail-safe rollback firmware; unlike a microcontroller-class gateway it runs full Linux with TLS 1.3 hardware acceleration for cloud-connect protocols.
Recommended
Medical Imaging Display Console
The MCIMX6Q6AVT08AC-FR fits medical display applications because the dual 1080p display controllers drive diagnostic-grade monitors, the hardware VPU streams endoscopic or ultrasound H.264 feeds with deterministic latency, and the industrial temperature range meets IEC 60601-1 equipment standards. The secure-boot HAB supports FDA cybersecurity guidance. Combine with isolated medical-grade power and LVDS-to-RGB bridges; unlike a tablet-class SOC it provides long-term NXP longevity commitment required for FDA-cleared devices.
Recommended
Industrial Control and Robotics
The MCIMX6Q6AVT08AC-FR suits industrial controllers and robotics because the quad-core Cortex-A9 runs ROS2 (Robot Operating System) with real-time PREEMPT-RT patches, the PCIe 2.0 accepts EtherCAT or PROFINET master cards, and the dual CAN-FD interfaces connect to industrial sensors. The industrial temperature grade survives robotic-cabinet thermal cycles. Add isolated RS-485 transceivers; unlike a microcontroller it provides vision processing via the Vivante GC2000 GPU for SLAM and object recognition at the edge.
Recommended
Recommended Products Summary
Engineering reference data for MCIMX6Q6AVT08AC-FR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCIMX6Q5AVT08AC | MCIMX6Q7CVT08AC | MCIMX6Q6AVT08AE | MCIMX6Q5AVT10AC | MCIMX6DP4AVT8AA |
|---|---|---|---|---|---|---|
| Package | 624-FCBGA (21x21 mm) | 624-FCBGA (21x21 mm) - same | 624-FCBGA (21x21 mm) - same | 624-FCBGA (21x21 mm) - same | 624-FCBGA (21x21 mm) - same | 624-FCBGA (21x21 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Cores | 4x ARM Cortex-A9 | 4x ARM Cortex-A9 | 4x ARM Cortex-A9 | 4x ARM Cortex-A9 | 4x ARM Cortex-A9 | 2x ARM Cortex-A9 (Dual) |
| Maximum CPU Speed | 1.0 GHz | 852 MHz | 1.2 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz |
| Temperature Grade | Industrial (-40C to +105C) | Industrial | Industrial | Automotive (AEC-Q100) | Industrial | Industrial |
| RoHS Compliance | Full lead-free (FR suffix) | Lead-free | Lead-free | Lead-free | Lead-free | Lead-free |
| GPU | Vivante GC2000 + GC355 | Vivante GC2000 + GC355 | Vivante GC2000 + GC355 | Vivante GC2000 + GC355 | Vivante GC2000 + GC355 | Vivante GC2000 + GC355 |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2 | 64-bit DDR3/DDR3L/LPDDR2 | 64-bit DDR3/DDR3L/LPDDR2 | 64-bit DDR3/DDR3L/LPDDR2 | 64-bit DDR3/DDR3L/LPDDR2 | 64-bit DDR3/DDR3L/LPDDR2 |
Key Differentiators
- Quad-core 1 GHz performance in industrial temperature range (vs MCIMX6DP4AVT8AA)
- Industrial-grade -40C to +105C operating range (vs MCIMX6Q6AVT08AE)
- Full lead-free RoHS compliance (FR suffix) (vs MCIMX6Q6AVT08AC (non-FR))
- 1 GHz speed bin optimal balance (vs MCIMX6Q7CVT08AC)
Design Notes
The MCIMX6Q6AVT08AC-FR requires the NXP PF0100 (or equivalent PF0200) PMIC to supply the 1.375V core, 1.5V/1.8V DDR, 2.8V peripheral, and 3.3V I/O rails in the prescribed ramp order. According to the NXP hardware reference manual, the ramp profile must follow the timing diagram in the PMIC datasheet to avoid permanent SOC damage. Use the recommended decoupling scheme with 100 nF X7R capacitors on each rail and bulk tantalum capacitors near the PMIC output inductors. Estimated: typical active power at 1 GHz quad-core is 3.5 W; this should be validated with thermal instrumentation before committing to the PCB layout.
The 624-FCBGA package has a theta_junction-to-ambient of approximately 12 C/W with the recommended 8-layer PCB land pattern and thermal vias under the die. At 3.5 W typical load the junction temperature rises ~42C above ambient. For industrial applications operating at +85C ambient, add a thermal pad with copper pours on inner PCB layers. Use the NXP i.MX 6Quad thermal model file (available from NXP) for CFD simulation. Estimated: at +105C ambient and 3.5 W the junction temperature approaches +147C, which is below the +125C Tj_max for industrial grade but limits margin; reduce CPU speed or add passive heatsink if higher Tj is expected.
Route the DDR3 byte lanes with matched length (within 25 mil differential per byte), series-termination resistors on clocks, and keep the DDR reference voltages (DDR_VREF) noise-free with isolated ground pour. Place the SOC and DDR in a single PCB section with at least 4 reference planes. The 0.8 mm pitch BGA requires microvia-in-pad PCB technology with staggered via stacking; use laser-drilled microvias of 6 mil diameter for signal layers. Decoupling capacitors should be placed within 1 mm of the BGA balls and connected via short, wide traces to the SOC power rails. The PCIe reference clock requires 100 ohm differential routing and a 0.1 uF AC coupling capacitor on each side.
Common pitfalls when designing with the MCIMX6Q6AVT08AC-FR include: (1) using an incorrect PMIC ordering code, leading to wrong rail voltages; (2) routing LVDS lanes without matched impedance, causing display artifacts; (3) omitting the boot configuration resistors on the boot-mode pins, causing the SOC to fail to enumerate the boot device; (4) using single-rank memory instead of dual-rank when the BSP expects dual-rank; and (5) failing to enable HAB (High Assurance Boot) for secure-boot configurations. Always cross-reference the BSP release notes for the specific i.MX 6Quad L4.1.x or L5.x BSP and use the NXP manufacturing tool (MFGTool) for initial flash programming.
The MCIMX6Q6AVT08AC-FR exposes dual LVDS display outputs, MIPI-DSI, parallel RGB, and HDMI 1.4 - select one interface family to avoid contention. For 1080p60 LVDS, the data lanes require 100 ohm differential impedance and length matching within 150 mil. For HDMI, use a level shifter such as TPD12S016 for the hot-plug detect and DDC lines. MIPI-DSI requires a 90 ohm differential impedance and AC coupling capacitors near the connector. Avoid routing display lanes over power planes; use a continuous ground reference plane instead. For USB 2.0, route the differential pair with 90 ohm impedance and place the common-mode choke within 5 mm of the connector.
Compliance Information
FR suffix confirms full lead-free RoHS compliance per NXP ordering information. Industrial grade only - for automotive AEC-Q100 use the AE variant. Halogen-free status not stated in the verified web data; use halogen-free marking on the reel label for confirmation.
