MPC8349ECZUAJDB - PowerQUICC II Pro 533MHz SoC | NXP
MPN: MPC8349ECZUAJDB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $33.2 | $332.00 |
| 100 | $27.8 | $2,780.00 |
| 500 | $22.1 | $11,050.00 |
| 1,000 | $18.4 | $18,400.00 |
MPC8349ECZUAJDB Overview
A PowerQUICC II Pro processor is a member of the communications SoC family that integrates a high-performance CPU core with networking peripherals on a single die. The product hierarchy is: PowerQUICC II Pro -> communications processor -> embedded MPU -> microprocessor -> IC. These parts historically served as the main CPU for routers, switches, and industrial control systems where deterministic peripheral integration reduced BOM cost and board area compared to discrete CPU-plus-coprocessor designs.
Key features include a 32-bit e300 core with MMU and FPU, hardware-accelerated security (SEC 2.0) for IPSec/SSL/TLS/WEP offload, integrated DDR1/DDR2 SDRAM controller with ECC, dual 10/100/1000 Mbps Ethernet MACs, two PCI interfaces, USB 2.0 full-speed host/device, four DMA channels, dual I2C, SPI, and UART. The integrated security engine differentiates the 'E' (encryption) suffix variants from non-E parts in the same family.
Architecturally, the device uses a 0.13 um CMOS process and operates from 1.2V (core) and 1.8V/2.5V/3.3V (I/O) supplies, providing flexible mixed-voltage interfacing to external memories and PHYs. The TBGA-672 35x35 mm package supports high-density board designs and provides sufficient thermal mass for industrial-grade operation.
Typical applications include industrial routers, secure VPN gateways, Wi-Fi access points, networked printers, and factory automation controllers. The SEC engine makes the 'E' variants especially suitable for IPsec-accelerated VPN, SSL offload, and content inspection appliances.
When designing with this part, allocate adequate power filtering for the four separate voltage rails (1.2V core, 1.8V/2.5V/3.3V I/O) and follow NXP's reference PCB layout for the TBGA-672 to maintain DDR2 signal integrity. The device is rated EOL (End-of-Life) per the NXP product page, so long-availability planning should consider Rochester Electronics or authorized aftermarket inventory.
This page synthesizes distributor pricing, same-package variants (TBGA-672), drop-in alternatives, and EOL design guidance not collated in the manufacturer datasheet alone.
Drop-in alternatives for MPC8349ECZUAJDB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8349ECZUAJDB (same form factor and footprint) — differing in Memory Controller, PCI Interfaces, RoHS Status, Core Architecture, Core Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8349ECZUAJDG
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8349CZUAJDB
✅ Drop-In✓ In Stock
$62.5 / Unit
View Datasheet →MPC8349ECVVAJFB
✅ Drop-In✓ In Stock
$52.4 / Unit
View Datasheet →MPC8349ECVVAGDB
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8349EECZUAJDB
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8349ECZUAJDB Maximum Ratings & Electrical Characteristics
| Core Architecture | PowerPC e300 (32-bit) |
| Core Frequency | 533 MHz |
| Number of Cores | 1 |
| Cache (L1) | 32 KB instruction / 32 KB data |
| Instruction Set | 32-bit Power Architecture |
| Memory Controller | DDR1 / DDR2 SDRAM with ECC |
| Ethernet | 2 x 10/100/1000 Mbps MAC |
| PCI Interfaces | 2 x PCI (32-bit, 66 MHz) |
| USB | USB 2.0 Full-Speed Host/Device |
| Security Engine | SEC 2.0 (IPSec/SSL/TLS/WEP) |
| DMA Channels | 4 |
| Serial Interfaces | 2 x I2C, SPI, 2 x UART |
| Core Voltage | 1.2 V |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V |
| Operating Temperature | -40C to +105C |
| Package | 672-pin TBGA (35 x 35 mm) |
| Mounting Type | Surface Mount |
| Process Technology | 0.13 um CMOS |
| RoHS Status | Compliant |
| Lifecycle Status | End-of-Life (per NXP product page) |
MPC8349ECZUAJDB 672-pin tbga (35 x 35 mm) Pin Configuration Guide
Pin configuration for MPC8349ECZUAJDB (672-pin tbga (35 x 35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8349ECZUAJDB.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8349ECZUAJDB is suitable for 6 applications: Industrial VPN Gateway, Secure Wireless Access Point, Industrial Router / Firewall, Networked Multifunction Printer, Factory Automation Controller, SSL/TLS-Accelerated Web Appliance.
Industrial VPN Gateway
The MPC8349ECZUAJDB fits industrial VPN gateways because the integrated SEC 2.0 engine delivers line-rate IPSec/SSL encryption that the 533 MHz e300 core alone cannot achieve in software. Placed as the main CPU, the processor drives the DDR2 memory, dual Gigabit Ethernet for WAN/LAN segmentation, and a PCI crypto accelerator daughter card. Estimated throughput reaches 200+ Mbps AES-256/IPSec at 533 MHz, eliminating a discrete crypto ASIC and shrinking BOM cost versus discrete CPU+coprocessor designs. Industrial -40C to +105C rating supports outdoor cabinet installations.
Recommended
Secure Wireless Access Point
The MPC8349ECZUAJDB powers secure enterprise Wi-Fi access points by combining the SEC 2.0 engine for 802.11i/WPA2-Enterprise acceleration with dual Gigabit Ethernet for wired uplinks and PCI for the 802.11 MAC/controller. Hardware-accelerated AES-CCMP offload allows the e300 core to focus on packet forwarding, RF management, and CAPWAP. The -40C to +105C industrial temperature rating supports plenum-rated ceiling installations, while the TBGA-672 package fits standard mini-PCI form factor carrier boards.
Recommended
Industrial Router / Firewall
The MPC8349ECZUAJDB is a strong fit for industrial routers and firewalls because the integrated dual 10/100/1000 Ethernet MACs handle WAN and LAN ports without external switches, while the SEC engine accelerates stateful packet inspection and IPsec tunnels. Compared to ARM Cortex-A SoCs at similar price, the e300 core's deterministic interrupt latency benefits real-time QoS. The TBGA-672 footprint with 1.0 mm ball pitch supports 6+ layer PCBs standard in industrial networking hardware, and dual PCI slots allow expansion with cellular modems or T1/E1 interfaces.
Recommended
Networked Multifunction Printer
The MPC8349ECZUAJDB supports networked multifunction printers by combining the e300 core for image rendering and job scheduling with USB 2.0 host/device for direct-print connectivity and dual Ethernet for office network and scanner workflows. The DDR2 controller with ECC handles large image buffers, while the dual PCI interfaces accept image-processing accelerator cards. Hardware SEC offload protects confidential print jobs via IPsec, addressing enterprise security requirements without an external crypto ASIC.
Recommended
Factory Automation Controller
The MPC8349ECZUAJDB fits factory automation controllers by integrating deterministic PCI interfaces for fieldbus cards (Profibus, EtherCAT, CANopen) with USB for programming ports and dual Ethernet for SCADA connectivity. The e300 PowerPC core runs deterministic RTOSes (VxWorks, QNX, Linux with PREEMPT_RT) better than Cortex-A alternatives due to its MMU design and consistent interrupt response. SEC 2.0 secures OT/IT boundary communications, and the -40C to +105C rating suits unconditioned cabinet installations near motors and drives.
Recommended
SSL/TLS-Accelerated Web Appliance
The MPC8349ECZUAJDB fits dedicated SSL/TLS-accelerated web appliances such as load balancers and reverse proxies because the SEC 2.0 engine handles RSA-2048 handshake and AES-256 bulk encryption at line rate, freeing the 533 MHz e300 core for HTTP parsing and connection pooling. Dual Gigabit Ethernet ports handle north-south traffic in a 1U appliance form factor. Compared to software-only SSL on Cortex-A9, the MPC8349E's hardware acceleration delivers 3-5x higher TLS throughput per watt, and the TBGA-672 package enables compact PCB layouts.
Recommended
Recommended Products Summary
Engineering reference data for MPC8349ECZUAJDB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8349ECZUAJDG | MPC8349CZUAJDB | MPC8349ECVVAJFB | MPC8349ECVVAGDB | MPC8349EECZUAJDB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 672-TBGA (35x35 mm) | 672-TBGA (35x35 mm) - same | 672-LBGA (35x35 mm) - same ball map | 672-TBGA (35x35 mm) - same | 672-TBGA (35x35 mm) - same | 672-TBGA (35x35 mm) - same |
| Core Frequency | 533 MHz | 533 MHz | 533 MHz | 533 MHz | 533 MHz | 533 MHz |
| Security Engine (SEC 2.0) | Yes | Yes | No (non-E variant) | Yes | Yes | Yes |
| DDR1/DDR2 Controller | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) | Yes (with ECC) |
| Ethernet MACs | 2 x 10/100/1000 | 2 x 10/100/1000 | 2 x 10/100/1000 | 2 x 10/100/1000 | 2 x 10/100/1000 | 2 x 10/100/1000 |
| PCI Interfaces | 2 x 32-bit/66 MHz | 2 x 32-bit/66 MHz | 2 x 32-bit/66 MHz | 2 x 32-bit/66 MHz | 2 x 32-bit/66 MHz | 2 x 32-bit/66 MHz |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Approx. Unit Price (qty 1) | $38.50 (EOL stock) | Similar EOL pricing | Slightly lower (no SEC) | Similar EOL pricing | Similar EOL pricing | Similar EOL pricing |
Key Differentiators
- Integrated SEC 2.0 hardware security engine (vs MPC8349CZUAJDB)
- 533 MHz e300 PowerPC core with MMU + FPU (vs MPC8349ECVVAJFB)
- RoHS/Green compliance with industrial temperature grade (vs MPC8349EECZUAJDB)
Design Notes
The MPC8349ECZUAJDB requires four separate voltage rails: 1.2V (core, ~3A peak), 1.8V/2.5V/3.3V (DDR2 I/O, dependent on memory), and 3.3V (general I/O). Use a multi-phase PWM controller (e.g., NXP MC34712 or equivalent) with sequencing: core must come up last after I/O to prevent latch-up. Bulk decoupling requires at least 4 x 22 uF MLCC per rail plus 0.1 uF bypass within 5 mm of each power ball. Estimated: at full SEC + dual GbE load, total power dissipation is approximately 4-5W, requiring the TBGA-672 thermal pad to be soldered to a 4x4 cm copper pour on the top layer.
The TBGA-672 1.0 mm ball-pitch package demands a minimum 6-layer PCB stackup with continuous reference planes under the BGA break-out region. Route DDR2 signals on the top layer directly under the BGA break-out with 50 ohm controlled impedance; matched-length pairs to within 25 mil for DQ/DQS. Per NXP AN3361, isolate the DDR2 clock region with a ground guard ring to prevent coupling into the analog PLL balls. Estimated trace width for 50 ohm on FR-4 (er=4.5) 4 mil dielectric is approximately 8 mil.
Three common pitfalls: (1) Confusing the MPC8349E (with SEC) with MPC8349 (without) - the 'E' suffix is critical for VPN/SSL designs; dropping in a non-E part silently disables all hardware crypto and breaks IPsec throughput. (2) Ignoring the EOL notice - this part is End-of-Life per NXP as of 2026-10-17, so new designs should source via Rochester Electronics and plan for 5-7 year aftermarket availability windows. (3) Using a non-NXP U-Boot fork - the e300 core requires NXP-specific U-Boot patches for DDR2 training; community mainline U-Boot since v2013.01 supports MPC8349E-MDS reference boards.
The TBGA-672 with 35x35 mm footprint provides adequate thermal mass for the ~5W typical dissipation. Estimated: theta_JA on a 4-layer PCB with thermal-via array (9 thermal vias at 0.3 mm pitch) under the die is approximately 8-10 C/W. At 85C ambient, junction temperature reaches 125-135C - within industrial spec but with limited margin. For enclosed IP65 outdoor cabinets, derate ambient by 10C or add a small heatsink with thermal interface material. Do not rely on the TBGA-672 alone at >7W dissipation - consider forced-air cooling.
Compliance Information
RoHS compliant per icsuperman listing. REACH, halogen-free, and conflict-minerals status should be verified per shipment lot via NXP material declaration certificates. AEC-Q100 not applicable - this is an MPU, not an automotive analog IC.
