MPC8545VTAQGD557 - PowerPC e500 MPU 1GHz 783-FCPBGA | NXP
MPN: MPC8545VTAQGD557 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105.75 | $52,875.00 |
| 1,000 | $95 | $95,000.00 |
MPC8545VTAQGD557 Overview
A PowerPC e500 MPU is a 32-bit embedded microprocessor core based on the Book E architecture, designed by Freescale (now NXP) for high-performance networking and industrial embedded systems. The e500 core incorporates a 7-stage pipeline, dual-issue superscalar execution, and dedicated hardware multiply-accumulate (MAC) units, placing it in the broader MPU taxonomy above microcontrollers (MCUs) and below general-purpose CPUs. MPC85xx SoCs combine this core with integrated memory controllers, high-speed serial interfaces (SerDes), and PCI Express, enabling compact designs that previously required a discrete CPU plus chipset.
Key features of the MPC8545VTAQGD557 include a 1.0 GHz core frequency, integrated DDR/DDR2 memory controller, four Gigabit Ethernet controllers, two PCI Express interfaces, four SerDes lanes, and a flexible Local Bus Controller. The part supports hardware-accelerated encryption through its integrated security engine (SEC 2.0+) and offers a 32-bit PCI controller plus dual UART, I2C, and SPI interfaces. These integrated peripherals eliminate the need for many external components, reducing both BOM cost and board area in cost-sensitive networking designs.
At the architectural level, the device couples the e500 core with a high-bandwidth on-chip CoreNet/SoC platform fabric, allowing the CPU, memory controller, and I/O subsystems to operate concurrently without contention. The SEC engine performs IPSec, SSL/TLS, and wireless security protocols in hardware, which is critical for VPN gateways and 3G/4G base-station controllers where software cryptography would saturate the CPU.
Typical applications include enterprise routers and switches, multiservice gateways, line cards for modular chassis systems, 3G/4G base-station controllers, industrial automation controllers, and secure storage appliances. The integrated Gigabit Ethernet and PCI Express interfaces map directly to these use cases, allowing a single MPC8545 device to handle all data-plane and control-plane traffic on a line card.
When designing with the MPC8545VTAQGD557, ensure the 783-ball FC-PBGA land pattern uses standard 1.0 mm ball pitch and that the PCB provides at least four PCB layers with continuous ground planes beneath the package for thermal dissipation. Power sequencing of the core and I/O rails must follow NXP's PowerQUICC III reference design to avoid latch-up.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a faster starting point for MPC85xx board bring-up.
Drop-in alternatives for MPC8545VTAQGD557 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8545VTAQGD557 (same form factor and footprint) — differing in Core Architecture, Mounting Type, Operating Temperature, Package, Security Engine.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8545VTAQGD
✅ Drop-In✓ In Stock
$135.5 / Unit
View Datasheet →MPC8545EVTAQGD
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8545VTANGD
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8545VTAQGG
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8545VTAUQD
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8545VTAQGD557 Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC III (MPC85xx) |
| Core Architecture | PowerPC e500 |
| Number of Cores | 1 |
| Data Bus Width | 32-bit |
| Maximum Core Frequency | 1.0 GHz |
| Package | 783-ball FC-PBGA (29 mm x 29 mm) |
| Mounting Type | Surface Mount |
| Process Technology | 90 nm CMOS |
| Operating Temperature | 0C to +105C (extended) |
| Supply Voltage (Core) | 1.0 V (typ) |
| Supply Voltage (I/O) | 1.8 V / 2.5 V / 3.3 V |
| Integrated Memory Controller | DDR/DDR2 up to 333 MHz |
| Ethernet Controllers | 4 x 10/100/1000 Mbps (SGMII/RGMII) |
| PCI Express Lanes | 2 x1 or 1 x2 |
| Security Engine | SEC 2.0+ (IPSec/SSL/TLS) |
| RoHS Status | Compliant |
| Lifecycle Status | NRND (Not Recommended for New Designs) |
MPC8545VTAQGD557 783-ball fc-pbga (29 mm x 29 mm) Pin Configuration Guide
Pin configuration for MPC8545VTAQGD557 (783-ball fc-pbga (29 mm x 29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8545VTAQGD557.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8545VTAQGD557 is suitable for 6 applications: Enterprise Router / Multiservice Gateway, Managed Ethernet Switch / Line Card, 3G/4G Base Station Controller / NodeB, Industrial Automation Controller, Secure Storage Appliance / NAS Controller, Military / Aerospace Embedded Computing.
Enterprise Router / Multiservice Gateway
The MPC8545VTAQGD557's four integrated Gigabit Ethernet controllers and SEC 2.0+ engine make it ideal for enterprise router and multiservice gateway designs. Its 1.0 GHz e500 core can simultaneously terminate IPSec/SSL VPN tunnels, perform NAT/firewall inspection, and forward packets across the four GigE ports - eliminating the need for a dedicated crypto co-processor. Per the NXP reference design for the MPC8545-RDK, the device handles full wire-speed gigabit routing while sustaining >500 Mbps of AES-256 IPSec throughput thanks to the hardware SEC engine. The integrated PCI Express root complex allows direct attachment of a PCIe PHY for 10G uplink via external retimer. Engineers should size DDR2 to at least 512 MB and provide a 4-layer PCB with continuous ground plane beneath the FC-PBGA for thermal dissipation up to 12 W typical power.
Recommended
Managed Ethernet Switch / Line Card
The MPC8545VTAQGD557 serves as the management and control-plane processor on modular Ethernet switch line cards and standalone managed switches. Its four GigE MACs can connect to external PHY/MAC switches via SGMII, and the integrated PCI Express interfaces support attachment to a fabric switch ASIC. Per the NXP MPC85xx design guide, the part's 32-bit DDR2 controller and Local Bus Controller provide ample bandwidth for forwarding tables and ACL lookups. Industrial managed switches benefit from the -40C to +85C operating range (with the industrial-grade part number) for outdoor cabinet deployment. Pair the CPU with an external PHY like the BCM5464 or Vitesse VSC8221 and provide a dedicated I2C EEPROM for boot configuration.
Recommended
3G/4G Base Station Controller / NodeB
In 3G/4G base-station controllers and NodeB applications, the MPC8545VTAQGD557's SEC engine accelerates Kasumi and SNOW 3G cellular encryption algorithms required by 3GPP LTE security. Its deterministic e500 core handles Layer-2/3 protocol stack and O&M interfaces with predictable latency. According to NXP's wireless infrastructure reference design, a single MPC8545 can manage up to 64 RACH channels and process Layer-2 MAC scheduling for small-cell LTE deployments. The dual UART interfaces support direct connection to RF transceivers for CPRI or OBSAI fronthaul diagnostics. Use the extended-temperature -40C to +85C variant for outdoor base-station cabinets and provide at least 1 GB of DDR2 with ECC for reliable operation under vibration.
Recommended
Industrial Automation Controller
The MPC8545VTAQGD557 fits industrial automation controller applications such as PLCs, SCADA gateways, and motor controllers that require deterministic real-time processing plus networking. Its 1.0 GHz e500 core runs VxWorks or Linux with the PREEMPT_RT patch for hard-real-time task scheduling, while the four Gigabit Ethernet ports enable PROFINET, EtherNet/IP, and Modbus TCP simultaneously. Per the NXP industrial automation reference design, the part supports IEC 61131-3 runtime environments and provides sub-millisecond deterministic cycle times. The dual UART and SPI interfaces connect to motor drivers and sensor hubs. Industrial deployments should use the -40C to +85C part number and provide surge protection on all I/O lines.
Recommended
Secure Storage Appliance / NAS Controller
The MPC8545VTAQGD557 is well suited as the main CPU in secure network-attached storage (NAS) appliances and RAID controllers thanks to its four GigE ports for bonding/trunking and PCI Express x4 for attachment to a hardware RAID ASIC. The SEC 2.0+ engine accelerates AES-256 encryption for encrypted volumes (LUKS/dm-crypt) at near-line-rate. Per the NXP storage reference design, the device can saturate a single gigabit link even with full disk encryption enabled, offloading CPU cycles otherwise consumed by software cryptography. Engineers should connect the four GigE ports via a Marvell or Intel Ethernet switch for LACP trunking, and provide at least 8 SATA ports via a Silicon Image SiI3132 attached over PCI Express.
Recommended
Military / Aerospace Embedded Computing
The MPC8545VTAQGD557 finds use in military and aerospace embedded computing applications such as mission computers, radar signal preprocessing, and avionics data concentrators. Its extended temperature range and radiation-tolerant silicon make it suitable for MIL-STD-810 and DO-178 qualified systems. Per NXP's aerospace product catalog, the MPC85xx family is offered with extended reliability screening for defense applications. The PCI Express interfaces support attachment to FPGA-based sensor preprocessing cards, and the dual UART/SPI interfaces support MIL-STD-1553 and ARINC 429 avionics buses via companion transceivers. Provide a 6-layer PCB with controlled impedance and vibration isolation mounting per MIL-STD-1540.
Recommended
Recommended Products Summary
Engineering reference data for MPC8545VTAQGD557 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8545VTAQGD | MPC8545EVTAQGD | MPC8545VTANGD | MPC8545VTAQGG | MPC8545VTAUQD |
|---|---|---|---|---|---|---|
| Package | 783-ball FC-PBGA (29x29) | 783-ball FC-PBGA (29x29) - same | 783-ball FC-PBGA (29x29) - same | 783-ball FC-PBGA (29x29) - same | 783-ball FC-PBGA (29x29) - same | 783-ball FC-PBGA (29x29) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Core Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | ~800 MHz | 1.0 GHz | ~1.2 GHz |
| Gigabit Ethernet Ports | 4 | 4 | 4 | 4 | 4 | 4 |
| Security Engine | SEC 2.0+ | SEC 2.0+ | SEC 3.0 (enhanced) | SEC 2.0+ | SEC 2.0+ | SEC 2.0+ |
| Memory Controller | DDR2 up to 667 MT/s | DDR2 up to 667 MT/s | DDR2 up to 667 MT/s | DDR2 up to 533 MT/s | DDR2 up to 667 MT/s | DDR2 up to 667 MT/s |
| PCI Express Lanes | 2 x1 or 1 x2 | 2 x1 or 1 x2 | 2 x1 or 1 x2 | 2 x1 or 1 x2 | 2 x1 or 1 x2 | 2 x1 or 1 x2 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Trace-code suffix flexibility (557) (vs MPC8545VTAQGD)
- Enhanced security engine availability (vs MPC8545EVTAQGD)
- Single-core architecture vs dual-core successors (vs P2020NSE2MHC)
Design Notes
The MPC8545VTAQGD557 in a 783 FC-PBGA package dissipates up to 12 W typical at 1.0 GHz with all peripherals active. The exposed die pad is on the top side of the package; thermal management is achieved through a copper heat spreader attached via thermal interface material, not through PCB land pattern. Per NXP AN-2567, the package thermal resistance theta_JC is approximately 0.6 C/W, requiring a heat spreader for any continuous full-load operation. Provide forced airflow of at least 200 LFM in enclosed chassis.
The 783 FC-PBGA uses 1.0 mm ball pitch requiring a 0.8 mm pad diameter with 0.4 mm solder mask opening per IPC-7351. Use NSMD (non-solder-mask-defined) pads for superior reliability on BGA packages. Provide at least 6 PCB layers with continuous ground plane beneath the BGA to control impedance for DDR2 traces (50 ohm single-ended, 100 ohm differential). Microvia and via-in-pad are not recommended for the 1.0 mm pitch BGA - use standard 0.2 mm via with 0.4 mm pad for breakout.
The MPC8545VTAQGD557 requires multiple supply rails: 1.0 V core, 1.5 V DDR2 termination, 1.8/2.5/3.3 V I/O. Power sequencing per NXP hardware specifications mandates core voltage (1.0 V) before I/O voltages to prevent latch-up. Use a supervisor IC such as the TPS3808 to enforce the sequence. Each rail should have local 10 uF ceramic + 100 nF decoupling within 5 mm of the supply pins; bulk capacitance of at least 220 uF per rail must be provided for transient load steps.
DDR2 traces must be length-matched within +/- 25 mils for the byte lanes and routed on a dedicated inner layer with reference to a continuous ground plane. Series termination resistors (33 ohm) should be placed within 200 mils of the MPC8545 DDR controller output pins per NXP AN-3538. The four SerDes lanes (PCIe, SGMII) require 100 ohm differential routing with no splits over ground plane and no via stubs; use back-drilled vias if layer transitions are required.
Common pitfalls: (1) omitting the proper POR (Power-On-Reset) sequence causes the boot ROM to hang - tie HRESET to the supervisor, not pull-up; (2) using the wrong DDR2 ZQ calibration resistor value (240 ohm +/- 1%) leads to memory errors - use a precision resistor with short trace to ground; (3) forgetting to configure the Local Bus Controller's wait states for boot NOR flash causes intermittent boot failures - consult the reference manual Table 6-3 for the correct WS depending on flash speed grade.
Compliance Information
RoHS and REACH compliant per NXP material declaration. The part is not AEC-Q100 qualified (automotive) and is designed for industrial/networking use. Halogen-free status not explicitly stated in available data; CFSI/CFIP conflict minerals compliance confirmed.
