MPC8568EVTAUJJ - PowerPC e500v2 MPU 1.333GHz | NXP
MPN: MPC8568EVTAUJJ ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $339.67 | $339.67 |
| 10 | $322.69 | $3,226.90 |
| 100 | $305.71 | $30,571.00 |
| 500 | $288.72 | $144,360.00 |
| 1,000 | $271.74 | $271,740.00 |
MPC8568EVTAUJJ Overview
A microprocessor (MPU) is the central processing unit of an embedded system, executing operating systems and application code while coordinating memory, I/O, and on-chip peripherals. The PowerQUICC III family is the second tier of NXP's Power Architecture roadmap below QorIQ, and the MPC8568E specifically sits between the MPC8567E and MPC8569E, sharing the e500v2 instruction set but adding hardware acceleration for security and packet processing. MPU variants differ from microcontrollers (MCU) by typically requiring external DRAM and boot ROM and by exposing richer memory management, ECC, and high-bandwidth I/O.
Key features include 32 KB L1 instruction cache, 32 KB L1 data cache, a 512 KB unified L2 cache with ECC, integrated DDR1/DDR2 memory controller, dual 10/100/1000 Ethernet MACs with hardware TCP/IP acceleration, PCI Express and Serial RapidIO interfaces, and four on-chip DMA channels. The device also integrates a security engine supporting IPSec, SSL/TLS, and bulk crypto offload, plus a programmable QUICC Engine block for HDLC, TDM, and ATM serial protocols used in legacy telecom infrastructure.
The MPC8568E is fabricated in a 90 nm CMOS process and operates from split 1.0 V core / 1.8 V / 2.5 V / 3.3 V supply rails. Thermal resistance and maximum junction temperature follow JEDEC JESD51 series for BGAs. Due to its high pin count and 1.333 GHz clock rate, the package demands careful PCB design with controlled-impedance routing, multiple decoupling capacitors, and thermal vias to maintain a junction temperature inside the safe operating envelope.
Typical applications include enterprise routers, multi-service switches, wireless base stations, IP-PBX systems, factory automation controllers, networked storage controllers, and industrial gateways. The part is widely deployed in long-life telecom and defense programs where its combination of Ethernet acceleration, security offload, and deterministic QUICC Engine protocols continues to deliver value. Designers frequently choose it when migrating from older PowerQUICC II designs to gain PCIe or SRIO fabric interfaces without porting firmware to a new ISA.
When designing with the MPC8568EVTAUJJ, ensure the boot configuration pins are pulled correctly at reset to select the correct POR (Power-on Reset) source and bus width. Allocate generous ground and 1.0 V core-plane copper with stitched thermal vias under the BGA, and follow NXP AN3534 layout and decoupling guidance to maintain signal integrity on DDR2 memory and SerDes lanes. Power sequencing between 1.0 V core and 1.8 V/3.3 V I/O must meet the datasheet-specified overlap and rise-time constraints to avoid latch-up.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for MPC8568EVTAUJJ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8568EVTAUJJ (same form factor and footprint) — differing in Core Architecture, L2 Cache, Memory Controller, Mounting Type, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8568EVTAUNN
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8567EVTAUJJ
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8569EVIJNN
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8572EVTARLF
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8568EVTAUJJ Maximum Ratings & Electrical Characteristics
| Core Architecture | PowerPC e500v2 |
| Family | MPC85xx (PowerQUICC III) |
| Number of Cores | 1 |
| Data Bus Width | 32-bit |
| Maximum Clock Speed | 1.333 GHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 512 KB unified with ECC |
| Memory Controller | DDR1/DDR2 with ECC |
| Ethernet | 2x 10/100/1000 MAC with TCP/IP acceleration |
| High-Speed Fabric | PCI Express and Serial RapidIO |
| Serial Protocols | QUICC Engine (HDLC/TDM/ATM) |
| Security Engine | IPSec/SSL/TLS bulk crypto offload |
| Supply Voltage - Core | 1.0 V |
| Supply Voltage - I/O | 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 90 nm CMOS |
| Package | 1023-ball FCBGA, 33 mm x 33 mm, 1 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +105C (extended industrial) |
| RoHS Status | Lead-free, RoHS compliant |
MPC8568EVTAUJJ 1023-ball fcbga, 33 mm x 33 mm, 1 mm pitch Pin Configuration Guide
Pin configuration for MPC8568EVTAUJJ (1023-ball fcbga, 33 mm x 33 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8568EVTAUJJ.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8568EVTAUJJ is suitable for 7 applications: Enterprise Multi-Service Routers, Wireless Base Station Controllers, Industrial Firewall and VPN Appliance, Network-Attached Storage Controllers, Factory Automation PLC Gateways, Medical Imaging and Diagnostic Equipment, Defense and Aerospace Avionics Backplanes.
Enterprise Multi-Service Routers
The MPC8568EVTAUJJ is ideal for enterprise multi-service routers that combine Layer-3 forwarding, IPSec VPN, and voice gateway functions. Its e500v2 core reaches 1.333 GHz with hardware TCP/IP acceleration across dual GbE ports, and the on-chip security engine handles IPSec/SSL/TLS bulk crypto without taxing the CPU. Designers place the part at the heart of a router line card with 1 GByte of DDR2 memory, PCIe-attached crypto expansion, and TDM-over-QUICC-Engine links back to legacy PBX infrastructure. Compared with a generic microcontroller, the integrated dual GbE MAC plus security engine shrinks the BOM and reduces bill-of-material cost by removing an external traffic manager. The 1023-ball FCBGA at 1 mm pitch demands controlled-impedance PCB stack-up and 1.0 V core rail sequencing, but rewards engineers with deterministic forwarding performance in long-life telecom programs.
Recommended
Wireless Base Station Controllers
The MPC8568EVTAUJJ fits wireless base station controller and Node-B applications where deterministic serial protocols meet Ethernet backhaul. The QUICC Engine block offloads HDLC, TDM, and ATM without CPU intervention, while the dual GbE MAC aggregates backhaul traffic with TCP/IP checksum offload. Operating junction temperature of -40C to +105C supports outdoor base-station enclosures and industrial-grade central-office racks. Engineers typically pair the device with a TDM framer on the local bus and an SGMII PHY on SerDes lane 0, achieving a hybrid T1/E1 plus Ethernet port map. The 90 nm process and 1.0 V core supply keep power dissipation within the 25-30 W envelope typical of these designs, with adequate thermal vias under the 33 mm x 33 mm BGA. Pin compatibility with the MPC8569E provides a transparent field upgrade path to higher speed bins.
Recommended
Industrial Firewall and VPN Appliance
Industrial firewall and VPN appliances rely on the MPC8568EVTAUJJ to deliver multi-gigabit IPSec and SSL inspection throughput. The integrated security engine performs 3DES/AES/SHA hardware offload at line rate across the dual GbE MACs, offloading bulk crypto from the 1.333 GHz e500v2 core. The PCI Express interface attaches to an additional crypto accelerator card for environments demanding FIPS-140 processing, and the 1023-ball FCBGA maintains routing density for two SGMII PHYs plus SATA storage. Compared with a non-crypto MPU, the part eliminates a discrete security processor and reduces system cost while preserving Linux VxWorks BSP support that simplifies the application stack.
Recommended
Network-Attached Storage Controllers
Network-attached storage (NAS) controllers benefit from the MPC8568EVTAUJJ's combination of dual GbE, PCI Express for downstream ASICs, and Serial RapidIO for inter-controller fabrics. The L2 cache of 512 KB with ECC supports RAID5/6 XOR calculations and metadata journaling in real time, while the DDR2 memory controller holds up to 2 GByte of DRAM for file-system caches. Engineers attach SATA or SAS controllers over PCIe to drive multi-terabyte arrays, and use QUICC Engine TDM channels for legacy SAN bridging. The 1.333 GHz clock speed keeps sequential throughput high under Microsoft SMB or Linux NFS workloads, and the same 1023-ball FCBGA as the MPC8572 dual-core upgrade enables painless capacity scaling.
Recommended
Factory Automation PLC Gateways
Factory automation gateways and protocol-converting PLCs leverage the MPC8568EVTAUJJ's broad peripheral set to bridge legacy fieldbuses with Ethernet. The QUICC Engine block handles HDLC and TDM over the local bus, while the dual GbE MAC provides Modbus-TCP, EtherNet/IP, and PROFINET gateways. Harsh factory floors demand the -40C to +105C industrial temperature grade, which the part supports, and the 1.0 V core plus 1.8 V/3.3 V I/O rails fit typical 24 V-backplane power architectures after point-of-load conversion. Compared with a small microcontroller, the e500v2 core runs a full Linux stack with deterministic interrupts, supporting trend logging, secure remote access, and fieldbus protocol conversion in one device.
Recommended
Medical Imaging and Diagnostic Equipment
Medical imaging systems and diagnostic equipment benefit from the MPC8568EVTAUJJ's deterministic interrupt response and long-life industrial availability. Ultrasound carts and bedside monitors use the dual GbE MACs to DICOM-stream images over hospital networks, while PCI Express attaches to image capture ASICs and high-speed serial RapidIO links multi-board systems. The hardware security engine supports HIPAA-compliant session encryption without software overhead. The 90 nm CMOS process and split-rail 1.0 V core supply keep power dissipation modest for fanless medical enclosures. The 1023-ball FCBGA at 1 mm pitch supports dense 8-layer boards with controlled-impedance DDR2 routing to large image-frame buffers.
Recommended
Defense and Aerospace Avionics Backplanes
Avionics backplanes and defense-grade networking equipment use the MPC8568EVTAUJJ because of its long-life industrial availability, dual-redundant Ethernet, and Crypto-IEEE 802.1AE MACsec offload. The 1023-ball FCBGA at industrial temperature grade supports harsh-environment backplane cards, and the QUICC Engine handles MIL-STD-1553 and ARINC-429 bridges commonly used in avionics. Software reuse from commercial PowerQUICC III BSPs drastically cuts certification effort versus migrating to a new ISA, an important consideration in DO-254 programs. Operating junction temperature of -40C to +105C aligns with typical avionics bay requirements, and the part's mature Linux and VxWorks ecosystem ports cleanly into defense development flows.
Recommended
Recommended Products Summary
Engineering reference data for MPC8568EVTAUJJ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8568EVTAUNN | MPC8567EVTAUJJ | MPC8569EVIJNN | MPC8572EVTARLF |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) |
| Core Clock Speed | 1.333 GHz | 1.0 GHz (-25%) | 1.333 GHz (same) | 1.5 GHz (+12%) | 1.5 GHz dual-core |
| Number of Cores | 1 | 1 | 1 | 1 | 2 |
| Ethernet MACs | 2x GbE | 2x GbE | 2x GbE | 2x GbE | Up to 4x GbE |
| Security Engine | Yes (IPSec/SSL/TLS) | Yes | Reduced | Yes (enhanced) | Yes |
| QUICC Engine | Yes (HDLC/TDM/ATM) | Yes | Yes | Yes | Yes |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR2 with ECC | DDR2/DDR3 with ECC |
Key Differentiators
- Higher clock bin at the same package (vs MPC8568EVTAUNN)
- Full security engine vs reduced set (vs MPC8567EVTAUJJ)
- Pin-compatible dual-core upgrade path (vs MPC8572EVTARLF)
Design Notes
Estimated thermal analysis based on the 33 mm x 33 mm FCBGA at ~1.333 GHz with 1.0 V core: expect 20-30 W system dissipation. The 1023-ball FCBGA at 1 mm pitch requires at least a 6-layer PCB stack-up with continuous 1.0 V core and ground planes under the package, plus a thermal-via array of 12-mil drills on 24-mil pitch directly under the die shadow per the NXP MPC8568E hardware design checklist.
Power sequencing between the 1.0 V core and the 1.8 V/2.5 V/3.3 V I/O rails must meet the Vcore-lead or Vcore-lag constraint specified in the NXP datasheet. Use a dedicated power-rail sequencer IC (e.g., TPS3808 or UCD9090) and keep the rise time under 50 ms to avoid latch-up. Decouple each voltage rail with 0.1 uF X7R MLCCs within 50 mil of every supply ball and one 10 uF bulk per voltage domain.
DDR2 routing must follow the NXP AN3534 layout checklist: matched 50 ohm single-ended impedance to the four DDR chips, length-matching within 25 mil between byte lanes, and a 200 mil max stub length. The 1.0 mm BGA pitch allows single-via fanout under the balls; use micro-vias or skip them for memory chips. Match the differential PCIe pairs within 5 mil and keep the SGMII traces length-matched to 1.5 inches.
Do not omit the CFG_RCW pull resistors during prototyping, because default boot mode may attempt to read from a non-existent I2C EEPROM and the board will silently fail to boot. Route the JTAG TCK/TMS/TDI/TDO/TRST pins to a 14-pin header on the board edge for boundary-scan and CodeWarrior debug access. Confirm the XIN/XOUT oscillator spec is met exactly because the on-chip PLLs are sensitive to reference jitter above 50 ps RMS.
Estimated theta_JA from the NXP package thermal model: roughly 8-10 C/W on a 6-layer JEDEC test board with thermal vias under the die. At 25 W dissipation and 70 C ambient, the junction rises 200 C - 250 C, so provide forced-air cooling on device variants above 1 GHz clock bin. Avoid placing the BGA directly adjacent to tall heat-spreader components that block airflow.
Compliance Information
Lead-free RoHS-compliant 1023-ball FCBGA package per NXP product environmental reports. AEC-Q100 not applicable - this is an industrial/communications grade MPU.
