MPC8572EVTAULB - PowerPC e500 MPU, 1.333GHz, 1023-FCBGA | NXP
MPN: MPC8572EVTAULB ✓ ActiveMPC8572EVTAULB Overview
A microprocessor (MPU) is an integrated circuit that contains one or more central processing units, caches, memory controllers and peripheral I/O in a single silicon die; in embedded systems the MPU is the system master, executing OS kernels, network stacks and protocol processing workloads. The MPC85xx family targets communications infrastructure equipment, where deterministic throughput, packet-processing offload engines, and long product lifecycles are central requirements.
Key features include dual PowerPC e500 cores with per-core L1 caches, a shared L2 cache, integrated DDR2/DDR3 memory controller, multiple Gigabit Ethernet controllers, PCI Express interfaces, Serial RapidIO, and an enhanced local bus for glueless ASIC/FPGA interconnect. The part is suited to LTE/4G baseband processing, router/switch control planes, industrial routers, and ruggedized military systems.
Designed as a system-on-chip solution, the MPC8572E integrates Power Architecture compute, advanced interrupt handling via MPIC, and a security engine for cryptographic acceleration. Compared to discrete CPU + bridge designs, the SoC approach reduces board complexity and BOM for telecom OEMs.
Typical applications include network routers, Layer 2-4 managed switches, base station controllers, networked industrial automation gateways, and long-lifecycle defense/aerospace compute modules. Production deployments often pair the SoC with DDR3 ECC memory and external PHYs.
When designing with this device, ensure the FCBGA substrate utilizes a high-Tg PCB with matched-length DDR3 routing; ball attach and rework require profiles compatible with large-array packages. Thermal management should target the maximum junction temperature under worst-case traffic load.
This page synthesizes distributor pricing, drop-in alternatives, application block diagrams, and design notes not consolidated in the manufacturer datasheet, accelerating part selection, schematic bring-up, and procurement decisions for power-engineers working on Power Architecture platforms.
Drop-in alternatives for MPC8572EVTAULB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
MPC8572EVTAULE
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8572ECVTAULB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8572EVTARLB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8572EPXAQALB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8572VRTAULB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8572EVTAULB Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) |
| Series | MPC85xx |
| Core Processor | PowerPC e500 |
| Number of Cores | 2 |
| Core Architecture | 32-Bit |
| Speed | 1.333 GHz |
| Package / Case | 1023-BFBGA, FCBGA (Flip-Chip BGA) |
| Package Size | 33 mm x 33 mm |
| Operating Temperature | 0 °C ~ 105 °C (TA) |
| Memory Type Supported | DDR2 / DDR3 SDRAM with ECC |
| Ethernet | Multiple 10/100/1000 Mbps Ethernet controllers |
| PCI Express | Yes (PCIe interfaces) |
| Serial RapidIO | Yes |
| Mounting Type | Surface Mount (BGA) |
| Packaging | Tray |
| Compliance | RoHS (status to be verified on official datasheet) |
MPC8572EVTAULB 33 mm x 33 mm Pin Configuration Guide
Pin configuration for MPC8572EVTAULB (33 mm x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8572EVTAULB.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8572EVTAULB is suitable for 6 applications: Mid-Range Network Routers, LTE Base Station Controllers, Industrial Automation Gateways, Defense and Aerospace Compute Modules, Network-Attached Storage Controllers, Managed Layer 2-4 Ethernet Switches.
Mid-Range Network Routers
The MPC8572EVTAULB is purpose-built for mid-range enterprise and carrier-grade routers that demand deterministic forwarding throughput across multiple gigabit ports. Its dual PowerPC e500 cores at 1.333 GHz deliver the compute headroom needed to run routing daemons (Quagga, BIRD or vendor stacks), ACL classification, NAT translation, and IPSec tunnel termination concurrently. The integrated DDR2/DDR3 controller with ECC provides jitter-free memory access for routing tables, while the native PCI Express and Serial RapidIO interfaces eliminate external bridge chips for line-card interconnect. Compared with single-core MPU designs, the dual-core architecture simplifies multi-queue QoS scheduling because each core can be statically partitioned to subscriber plane versus control plane, reducing software mutex contention. For an OEM building a 1U/2U rack-mount router, the MPC8572E consolidates CPU + memory controller + 4+ Ethernet MACs + crypto engine into a single 33x33 mm FCBGA, shrinking PCB area and BOM cost.
Recommended
LTE Base Station Controllers
The MPC8572EVTAULB's dual e500 cores supply the embedded compute capacity required for LTE baseband processing, Layer 2 protocol termination and OAM (Operations, Administration & Maintenance) workloads at the eNodeB. The integrated security engine accelerates AES/SHA operations for backhaul encryption, while the dedicated interrupt controller (MPIC) supports the deterministic response needed for HARQ feedback loops. With 4-8 gigabit Ethernet ports, the device can connect directly to RF front-end cards via SRIO or backhaul to the EPC core network via Ethernet. At 1.333 GHz clock rate, the part hits the typical 600 Mbps+ Layer 2 throughput required for small-cell baseband processing. The FCBGA package withstands the thermal profile of outdoor sealed enclosures when paired with a heat-spreader, making it fit for pole-mount or rooftop small-cell deployments.
Recommended
Industrial Automation Gateways
For Industry 4.0 gateways that aggregate protocols such as PROFINET, EtherCAT, Modbus TCP and OPC UA, the MPC8572EVTAULB offers the deterministic low-latency processing that field-bus masters demand. The dual e500 cores allow partitioning the gateway stack: one core handles real-time PROFINET IRT frames while the second runs the OPC UA server and edge analytics. Its extended 0-105 °C operating range covers control cabinet environments without additional thermal conditioning. The integrated DDR3 ECC controller protects against soft errors in electrically noisy industrial floors. With PCI Express, SRIO and multiple Ethernet controllers, the gateway can connect to multi-axis motion controllers while still pushing analytics upstream to the cloud - all from a single SoC, eliminating inter-chip bridge latencies.
Recommended
Defense and Aerospace Compute Modules
The MPC8572EVTAULB's long lifecycle commitment from NXP, combined with its cryptographic security engine and ruggedised FCBGA package, suits it to defence and aerospace compute modules. Extended-temperature screening (-40 to +105 °C) variants exist within the same family, enabling deployment in avionics and unmanned systems. The PowerPC architecture retains a mature software ecosystem with DO-178 and MIL-STD-1553 stacks, shortening certification cycles for safety-critical platforms. Dual-core e500 execution enables partitioned virtualisation for red/black separation of classified and unclassified traffic. The integrated memory controller with ECC satisfies the data-integrity requirements of radar and electronic warfare front-end processing, where a single bit-error could compromise track correlation.
Recommended
Network-Attached Storage Controllers
Storage controllers in mid-range NAS appliances benefit from the MPC8572EVTAULB's combination of multi-gigabit Ethernet, PCI Express for SAS/SATA host-bus adapters, and DDR3 ECC memory bandwidth. Running an embedded Linux or VxWorks stack with SMB/CIFS, NFS, and iSCSI daemons, the dual-core partition isolates storage protocol traffic from management-plane tasks, maximising IOPS under mixed workloads. The integrated security engine accelerates hardware-accelerated AES-XTS for self-encrypting drive (SED) management. At 1.333 GHz, the part comfortably handles 8-16 concurrent SMB clients without dropping CIFS signed-SMB integrity checks. For OEMs building 2U rack-mount NAS heads, the FCBGA-1023 pinout simplifies thermal design compared to socketed processors in this class.
Recommended
Managed Layer 2-4 Ethernet Switches
The MPC8572EVTAULB serves as the management and control CPU in managed Layer 2-4 enterprise switches, where it handles Spanning Tree, LLDP, SNMP, 802.1X authentication, and ACL compilation offloaded to a co-packaged switch fabric. Its dual e500 cores run the management stack independently of the data-plane forwarding ASIC, ensuring that CLI/Web latency does not impact wire-speed packet throughput. The integrated gigabit Ethernet ports support OOB (out-of-band) management, while PCI Express provides host-side connectivity to merchant switch ASICs. The DDR3 ECC controller safeguards configuration databases against corruption from power-loss events, which are common in PoE-enabled switch deployments. Compliance with long-term NXP supply commitments makes this MPU suitable for 7+ year product support cycles mandated by enterprise networking customers.
Recommended
Recommended Products Summary
Engineering reference data for MPC8572EVTAULB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8572EVTAULE | MPC8572ECVTAULB | MPC8572EVTARLB | MPC8572EPXAQALB | MPC8572VRTAULB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) |
| Core Speed | 1.333 GHz | 1.333 GHz | 1.333 GHz | 1.333 GHz | 1.0 GHz (lower speed grade) | 1.333 GHz |
| Operating Temperature | 0 °C to +105 °C | -40 °C to +105 °C | 0 °C to +70 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C |
| Security Engine | Yes | Yes | Yes | Yes | Yes | No |
| DDR Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| PCI Express | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Dual e500 cores vs single-core predecessors (vs MPC8544E)
- Integrated security engine available (vs MPC8572VRTAULB)
- 1.333 GHz top speed bin in family (vs MPC8572EPXAQALB)
Design Notes
The 1023-ball FCBGA at 33x33 mm presents a thermal interface that typically requires a heatsink or heat-spreader to maintain junction temperature below 105 °C at full 1.333 GHz dual-core load. Estimate based on FCBGA θJA of approximately 12-15 °C/W with forced-air cooling at 1 m/s: at dual-core max workload, internal power dissipation is ~10-15 W, resulting in 120-225 °C junction temperature rise above ambient. For sealed enclosures, derate the clock or add a copper heat-spreader across the package lid.
Layout the 1023-ball FCBGA using microvia-in-pad PCB technology with stacked microvias to escape the 1 mm pitch ball grid. Use a high-Tg (Tg > 170 °C) PCB substrate to match FCBGA coefficient of thermal expansion and survive reflow profiles. Matched-length routing for DDR3 data lanes must stay within ±25 ps to maintain controller timing margins, per the MPC85xx layout guidelines.
The MPC8572E requires multi-rail power: a core voltage (typically 1.0 V), a separate DDR3 voltage (1.5 V or 1.35 V for DDR3L), an auxiliary voltage (1.8 V), and an I/O voltage (3.3 V). Each rail must have low-ESR bulk decoupling within 50 mm of the BGA balls and high-frequency ceramic capacitors (0.1 µF + 1 nF) placed adjacent to the balls. Power-on sequencing must follow the MPC8572E datasheet order to avoid latch-up; use a sequencer IC if the rails cannot be guaranteed manually.
Route the PCI Express, Serial RapidIO, and SGMII SerDes lanes as 85-100 Ω differential pairs on the top layer under the BGA with continuous reference ground on layer 2. Avoid crossing SerDes lanes over power plane splits; place AC coupling capacitors within 200 mils of the TX pins per the SerDes reference design. For 10/100/1000 Ethernet MACs to PHYs, route MII/RGMII with length-matching of clock-to-data lanes of ±50 mil.
Common pitfalls: (1) Do not hot-plug the BGA without a sequencing controller; inrush can cause partial power-up and latch-up. (2) The e500 core requires boot code from a flash device on the local bus - verify boot configuration pins are strapped correctly. (3) Avoid mixing DDR3 and DDR2 on the same address space; the controller auto-detects mode at reset but an unstable reset can leave it in an undefined state.
Compliance Information
RoHS compliance stated in NXP product line. AEC-Q100 not applicable - this is an industrial/telecom-grade MPU.
