MPC860DECZQ50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP
MPN: MPC860DECZQ50D4 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.1 | $281.00 |
| 100 | $22.95 | $2,295.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $15.2 | $15,200.00 |
MPC860DECZQ50D4 Overview
An MPU (Microprocessor Unit) integrates a CPU core with peripheral and memory subsystems on a single die, while a PowerQUICC device extends this concept with a dedicated RISC-based communications processor that offloads DMA, HDLC, Ethernet, ATM, and serial protocol handling from the main CPU core. Within the broader taxonomy, PowerQUICC sits under Power Architecture SoC -> microprocessor -> embedded processor -> semiconductor, and combines deterministic I/O with a familiar programming model that simplifies firmware portability from earlier MPC8xx designs.
The MPC860DECZQ50D4 features include a single 32-bit core running at 50 MHz, dual 10 Mbps Ethernet MACs with MII interfaces, four serial communications controllers (SCCs), two serial management controllers (SMCs), a 4-channel DMA controller, and a memory controller supporting DRAM, SRAM, EPROM, Flash, and user-programmable machines. The 'C' suffix denotes a 4 Kbyte instruction cache, 4 Kbyte data cache, and integrated memory management unit (MMU) with translation tables, enabling protected-memory operating systems such as VxWorks and embedded Linux. Power consumption is reduced relative to legacy MPC860 designs through clock gating and selective peripheral power-down.
The part targets telecom infrastructure, industrial control, and embedded networking designs where deterministic communications throughput is required. Operating temperature range is -40 C to +95 C, suitable for industrial-grade enclosures but not full automotive. The 'D4' suffix indicates a tray packaging variant of the 357-PBGA, which is a lead-free but non-RoHS lead-bearing BGA per long-standing PowerQUICC data sheets.
Designers should consider the device's EOL lifecycle status, the need for legacy compiler toolchains, and the continued availability of NXP/Freescale reference BSPs. The MPC860DECZQ50D4 is appropriate for sustainment of existing designs and for new designs where long-term support outweighs raw clock speed requirements. Compared to a 50 MHz PowerQUICC, modern Cortex-R or Cortex-A SoCs deliver 10x to 100x the DMIPS per watt but require revalidation of firmware, drivers, and timing budgets.
Drop-in alternatives for MPC860DECZQ50D4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC860DECZQ50D4 (same form factor and footprint) — differing in Package, RoHS Status, Mounting Type, Packaging, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC860DEZQ50D4
✅ Drop-In✓ In Stock
$24.95 / Unit
View Datasheet →MPC860DEZQ66D4
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860DTCZQ50D4
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860SRCZQ50D4
✅ Drop-In✓ In Stock
$64.5 / Unit
View Datasheet →MPC855TZQ50D4R2
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860DECZQ50D4 Maximum Ratings & Electrical Characteristics
| Core Processor | MPC8xx PowerQUICC, 32-bit Power Architecture |
| Number of Cores | 1 |
| Bus Width | 32-bit |
| Core Speed | 50 MHz |
| Co-Processors / DSP | Communications; CPM (Communications Processor Module) |
| RAM Controllers | DRAM |
| On-Chip Cache | 4 KB instruction + 4 KB data |
| MMU | Yes (integrated, with translation tables) |
| Ethernet | 2x 10 Mbps MAC (MII) |
| Serial Communications Controllers (SCC) | 4 |
| Serial Management Controllers (SMC) | 2 |
| DMA Channels | 4 |
| Supply Voltage | 3.3 V (core 2.2 V, I/O 3.3 V) |
| Operating Temperature | -40 C to +95 C |
| Package | 357-PBGA, 25x25 mm |
| Mounting Type | Surface Mount (BGA) |
| Lead Status | Contains Lead |
| RoHS Status | Non-Compliant (legacy BGA with lead-bearing solder balls) |
| Packaging | Tray (D4 suffix) |
MPC860DECZQ50D4 357-pbga, 25x25 mm Pin Configuration Guide
Pin configuration for MPC860DECZQ50D4 (357-pbga, 25x25 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC860DECZQ50D4.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC860DECZQ50D4 is suitable for 7 applications: Telecom Line Cards and DSLAMs, Industrial Router and Gateway Controllers, Embedded Networking Controllers (Routers/Switches), SCADA and Remote Telemetry Units, Printers, Imaging, and Multi-function Peripherals, Legacy Avionics and Defense Communication, Point-of-Sale and Retail Backbone.
Telecom Line Cards and DSLAMs
The MPC860DECZQ50D4 is widely deployed in telecom line cards where its 50 MHz Power Architecture core supervises the system while the integrated CPM offloads HDLC framing, ATM SAR, and multi-port serial traffic. The dual 10/100 Ethernet MACs connect to upstream aggregation switches, while four SCCs and two SMCs carry T1/E1 or HDSL physical-layer data streams. The -40 C to +95 C industrial temperature range supports outdoor remote-terminal cabinets without additional thermal conditioning.
Recommended
Industrial Router and Gateway Controllers
In industrial routers and protocol-conversion gateways, the MPC860DECZQ50D4 provides deterministic serial and Ethernet throughput without external protocol ASICs. The on-chip CPM handles routing table maintenance and HDLC/PPP encapsulation, while the CPU runs the routing daemon, web management interface, and firewall policy. The integrated memory controller interfaces directly to commodity SDRAM and Flash, eliminating the need for an external memory controller and reducing BOM cost.
Recommended
Embedded Networking Controllers (Routers/Switches)
Designers use the MPC860DECZQ50D4 in low-to-mid port-count Ethernet switches and edge routers where deterministic forwarding latency matters more than raw packet throughput. The dual Ethernet MACs connect to PHY and switch-fabric ports, while the four SCCs handle TDM backhaul or console interfaces. The integrated DRAM controller with parity support and the 4 KB instruction cache improve sustained control-plane response under sustained line-rate forwarding loads.
Recommended
SCADA and Remote Telemetry Units
SCADA remote terminal units (RTUs) benefit from the MPC860DECZQ50D4's serial-heavy peripheral set: four SCCs and two SMCs deliver RS-232/RS-485 multi-drop polling for hundreds of field sensors, while the dual Ethernet MACs provide redundant SCADA-control-center links. The on-chip MMU supports VxWorks or embedded Linux, enabling secure partitioned firmware stacks for grid and substation automation.
Recommended
Printers, Imaging, and Multi-function Peripherals
High-end network printers and multi-function peripherals historically used the MPC860DECZQ50D4 to drive the page-description-language interpreter while the CPM manages scanner DMA and high-speed image piping. The 50 MHz core is sufficient for PostScript and PCL rasterization at 30+ pages per minute, and the MMU isolates the imaging stack from the operator-panel UI process. The 357-BGA package enables compact mainboards under the formatter housing.
Recommended
Legacy Avionics and Defense Communication
The MPC860DECZQ50D4 has a multi-decade pedigree in avionics databuses, where its deterministic serial controllers handle ARINC 429 and MIL-STD-1553 bridging alongside Ethernet. The -40 C to +95 C industrial range is acceptable for equipment bays, while the proven Power Architecture toolchain and BSP availability shorten DO-178/254 qualification cycles on legacy platforms that still receive sustainment updates.
Recommended
Point-of-Sale and Retail Backbone
Retail POS backbones and store-controller appliances used the MPC860DECZQ50D4 as a TCP/IP gateway that bridges POS terminals, scanners, and credit-card readers to the store LAN. The dual Ethernet MAC supports redundant uplinks, the four SCCs carry legacy RS-232 peripherals, and the CPM offloads encryption and packet framing. The 357-BGA footprint supports compact fanless enclosures typical of retail backroom installations.
Recommended
Recommended Products Summary
Engineering reference data for MPC860DECZQ50D4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC860DEZQ50D4 | MPC860DEZQ66D4 | MPC860DTCZQ50D4 | MPC860SRCZQ50D4 | MPC855TZQ50D4R2 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Speed | 50 MHz | 50 MHz | 66 MHz | 50 MHz | 50 MHz | 50 MHz |
| MMU | Yes | No | Yes | Yes | Yes | No |
| Instruction Cache | 4 KB | None (unified) | 4 KB | 16 KB unified | 4 KB | 4 KB |
| Data Cache | 4 KB | None (unified) | 4 KB | (unified) | 4 KB | 4 KB |
| Ethernet MACs | 2x 10 Mbps | 2x 10 Mbps | 2x 10 Mbps | 2x 10 Mbps | 2x 10 Mbps | 1x 10 Mbps |
| SCCs | 4 | 4 | 4 | 4 | 4 | 2 |
| PCMCIA Interface | No | No | No | Yes | No | No |
| Internal SRAM | 0 KB | 0 KB | 0 KB | 0 KB | 32 KB | 0 KB |
| Operating Temperature | -40 C to +95 C | -40 C to +95 C | -40 C to +95 C | -40 C to +95 C | -40 C to +95 C | -40 C to +95 C |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Obsolete |
Key Differentiators
- Balanced MMU + cache configuration for protected OS workloads (vs MPC860DEZQ50D4)
- Lower core voltage at 50 MHz enables cooler industrial operation (vs MPC860DEZQ66D4)
- Standard peripheral set without PCMCIA, ideal for compact designs (vs MPC860DTCZQ50D4)
Design Notes
The MPC860DECZQ50D4 in a 357-PBGA dissipates approximately 1.5 to 2.5 W at 50 MHz with the CPM active, depending on SCC/Ethernet utilization. The package thermal resistance (theta_JA) on a standard 4-layer JEDEC board is roughly 18 C/W, giving a 27 C to 45 C junction rise above ambient. In sealed enclosures, route thermal vias directly under the central ball grid to copper inner layers and confirm junction temperature stays below 125 C at the worst-case operating temperature (95 C ambient + load).
The 357-PBGA uses a 1.27 mm pitch with 25x25 mm body, so escape routing on a 4-layer stack-up requires at least 6 mil via-pad diameter and 12 mil trace/space on the top layer to fan out the inner rows. Use a controlled-impedance stack-up for the Ethernet MII traces (typically 50 ohm single-ended) and length-match the SCC differential pairs within 50 mil. Place SDRAM as close as possible to the data bus balls and isolate the analog PLL supply pin with a ferrite bead and 10 nF + 1 uF decoupling stack.
Do not confuse the ZQ suffix (lead-bearing, non-RoHS) with the PQ suffix (lead-free RoHS) when substituting - the BGA ball alloy differs and reflow profiles must be re-qualified. Avoid hot-plugging the Ethernet PHY reset sequence without configuring the MPC860's CPM reset configuration words; otherwise the SCC transmitters may drive glitches onto the line during firmware bring-up. Finally, ensure the BDM (Background Debug Mode) header is accessible on the first prototype spin - power-sequencing bugs are far easier to diagnose with the BDM than with logic analyzers alone.
Separate analog ground (PLL, PHY MII reference) from digital ground using a single-point bridge near the device's GND balls. Place the 32.768 kHz oscillator reference within 5 mm of the RTC pins with a guard ring tied to analog ground to minimize jitter coupling into the SCC clocking. Keep switching-mode power supply traces away from the MII transmit clock -100 mVpp ripple on this net will fail 100BASE-TX compliance masks.
Compliance Information
ZQ suffix indicates lead-bearing solder balls per NXP part number decoder - non-RoHS. PQ-suffix variant required for RoHS compliance. AEC-Q100 automotive qualification not applicable; industrial -40 C to +95 C temperature range only.
