Micron Technology

MT40A2G8JE-062E AAT:E - 16Gb DDR4-3200 Automotive SDRAM | Micron

MPN: MT40A2G8JE-062E AAT:E βœ“ Active
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1.2 V +/- 60 mV Vdss 78-ball FBGA (9 x 11 mm) Package DDR4-3200 (-062E) Speed DDR4 SDRAM Memory
From $9.85 USD / Unit
MOQ: 1 |
Price updated: 2026-09-01
Volume Pricing
Qty Unit Price Extended
1 $13.5 $13.50
10 $12.6 $126.00
100 $11.45 $1,145.00
500 $10.6 $5,300.00
1,000 $9.85 $9,850.00
ℹ️ All prices are in USD

Drop-in alternatives for MT40A2G8JE-062E AAT:E β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

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MT40A2G8JE-062E AIT:E

βœ… Drop-In
πŸ“¦ 78-FBGA (9x11)
Temperature grade -40C to +95C (industrial) vs -40C to +105C (AAT automotive); identical die, pinout, DDR4-3200 timing

πŸ“‹ Reference alternative (not in catalog)

MT40A2G8JE-062E AUT:E

βœ… Drop-In
πŸ“¦ 78-FBGA (9x11)
Automotive grade rated -40C to +95C vs AAT +105C; same Z32D die and package, pin-to-pin

πŸ“‹ Reference alternative (not in catalog)

MT40A2G8JE-062E AIT:E

βœ… Drop-In
πŸ“¦ 78-FBGA (9x11)
Cross-brand second source: identical 16Gbit 2G x 8 DDR4-3200, 78-FBGA, industrial temp; Alliance drop-in replacement for Micron DRAM

πŸ“‹ Reference alternative (not in catalog)

MT40A2G8JE-062E AAT:E

βœ… Drop-In
Micron Technology
πŸ“¦ 78-FBGA (9x11)
DDR4 SDRAM Β· 16 Gbit Β· 2G x 8 Β· DDR4-3200 (-062E) Β· 1600 MHz Β· 19 ns Β· 1.2 V +/- 60 mV Β· 1.2 V (-125 mV / +250 mV)

βœ“ In Stock

$9.85 / Unit

View Datasheet β†’

MT40A2G8JE-062E AAT:E Maximum Ratings & Electrical Characteristics

Memory Type DDR4 SDRAM
Density 16 Gbit
Organization 2G x 8
Speed Grade DDR4-3200 (-062E)
Clock Frequency 1600 MHz
Access Time 19 ns
Supply Voltage VDD 1.2 V +/- 60 mV
Supply Voltage VPP 1.2 V (-125 mV / +250 mV)
I/O Type POD12 (1.2V pseudo open-drain)
Internal Banks 16 (x8: 4 groups of 4)
VREFDQ On-die, internal, adjustable generation
Operating Temperature -40C to +105C (AAT automotive)
Package 78-ball FBGA (9 x 11 mm)
FBGA Code D8BHT
Die Z32D
Mounting Type Surface Mount
Automotive Qualification Yes (AAT automotive grade)

MT40A2G8JE-062E AAT:E 78-ball fbga (9 x 11 mm) Pin Configuration Guide

Complete pinout information for MT40A2G8JE-062E AAT:E (78-ball fbga (9 x 11 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

78-ball fbga (9 x 11 mm) package pinout diagram for MT40A2G8JE-062E AAT:E

No detailed pinout data available for MT40A2G8JE-062E AAT:E.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for MT40A2G8JE-062E AAT:E Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

MT40A2G8JE-062E AAT:E is suitable for 6 applications: Automotive ADAS Compute, Telematics and Gateway Modules, Industrial Edge Computing, Networking Line Cards, Medical Imaging and Diagnostics, Test and Measurement Instruments.

πŸš—

Automotive ADAS Compute

The MT40A2G8JE-062E AAT:E fits ADAS domain controllers that buffer multi-camera video and run perception workloads. Its 16Gbit density in a single x8 component supports frame buffering for 4-8 camera inputs, while DDR4-3200 provides 25.6 GB/s peak bandwidth per 64-bit bus for ISP pipelines and CNN inference. The -40C to +105C AAT rating covers enclosed ECUs with limited airflow, and automotive qualification simplifies OEM approval. Placed on a fly-by addressed 64-bit bus, four x8 devices give 8 GByte at full bandwidth; the POD12 interface keeps termination power modest, an important trade-off in always-on, ignition-switched systems where quiescent drain and thermal budget are tightly controlled.

🌐

Telematics and Gateway Modules

Connected telematics boxes and vehicle gateways need dense, reliable memory that survives wide cabin and engine-bay-adjacent temperatures. The MT40A2G8JE-062E AAT:E provides 2 GB per x8 device, sufficient for packet buffering, map caching, and OTA staging, with the -40C to +105C range covering under-dash and near-heat mounting locations. DDR4-3200 timing supports modem and network co-processors without becoming the bottleneck; 16 internal banks (4 groups of 4) sustain mixed read/write traffic from concurrent LTE/5G and CAN traffic. Using the AUT:E or AIT:E footprint-compatible siblings lets one PCB design span industrial and automotive programs without layout changes.

🏭

Industrial Edge Computing

Factory edge controllers, machine-vision nodes, and industrial PCs use 16Gbit DDR4 as main memory for real-time analytics. The MT40A2G8JE-062E AAT:E operates from -40C to +105C, tolerating unconditioned cabinets, and its x8 organization allows flexible 32- or 64-bit bus widths. At DDR4-3200, a 64-bit bus delivers 25.6 GB/s, adequate for vision inference plus protocol handling; on-die adjustable VREFDQ removes an external reference rail, simplifying 4-8 layer stackups. For industrial programs without the +105C requirement, the same board accepts the pin-compatible AIT:E industrial variant, giving sourcing flexibility and cost options within one validated footprint.

πŸ–₯️

Networking Line Cards

Enterprise switch and router line cards use deep packet buffers, and 16Gbit DDR4 provides cost-effective buffering density. The MT40A2G8JE-062E x8 organization lets buffer managers build 72-bit or wider ECC buses from multiple devices, and DDR4-3200 with bank-group interleaving sustains the short, random access patterns typical of queuing. POD12 termination reduces interface power compared with DDR3 at equivalent data rate, easing airflow-limited chassis design. Although the AAT:E is automotive-qualified, its -40C to +105C range also covers harsh outdoor telecom cabinets; the commercial-grade MT40A2G8JE-062E substitutes in temperature-controlled central offices on the same footprint.

πŸ’Š

Medical Imaging and Diagnostics

Ultrasound, digital radiography, and lab analyzers buffer high-rate sensor streams in DRAM before processing. The 16Gbit MT40A2G8JE-062E AAT:E handles multi-second acquisitions at DDR4-3200 bandwidth, and the wide -40C to +105C automotive rating comfortably exceeds clinical ambient requirements, adding derating margin for reliability-focused medical designs. On-die VREFDQ generation and 1.2V POD12 I/O simplify power-supply design in noise-sensitive analog-digital mixed systems. Designers should implement ECC at the controller for diagnostic data integrity and choose the AIT:E variant when cost matters and the temperature profile is controlled, since both share the identical 78-ball FBGA footprint.

πŸ”§

Test and Measurement Instruments

Oscilloscopes, logic analyzers, and signal generators require deep acquisition memory with sustained write bandwidth. The MT40A2G8JE-062E AAT:E at DDR4-3200 delivers 25.6 GB/s per 64-bit bank, letting acquisition ASICs stream ADC samples without drops, and 2 GByte per x8 device extends record length cost-effectively. The wide temperature rating and automotive qualification translate into high-reliability components suited to instruments with warm chassis interiors; four to eight devices give 8-16 GByte of capture memory. Its 78-ball FBGA layout matches industry-standard DDR4 routing guidelines, and VREFDQ training is handled automatically by mainstream FPGA and ASIC memory controllers.

Recommended Products Summary

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What are the key specifications of MT40A2G8JE-062E AAT:E?
The MT40A2G8JE-062E AAT:E is a 16Gbit automotive DDR4 SDRAM organized 2G x 8, running at DDR4-3200 (19 ns access time) from a 1.2V VDD/VDDQ supply with a 1.2V VPP rail. It uses POD12 pseudo open-drain I/O, 16 internal banks in 4 groups of 4, on-die adjustable VREFDQ generation, and comes in a 78-ball FBGA (9 x 11 mm) rated -40C to +105C. These values come from Micron's automotive DDR4 datasheet for the Z32D die (FBGA code D8BHT).
What is the operating temperature range of MT40A2G8JE-062E AAT:E?
The AAT:E variant operates from -40C to +105C, which is Micron's automotive (AAT) temperature rating for DDR4 SDRAM. According to Micron's datasheet, at the extended TC temperature range the refresh interval is adjusted accordingly, and the part carries automotive qualification. Commercial (0C to +85C) and industrial (-40C to +95C) equivalents exist under the same base part number with different suffixes (AIT:E and AUT:E), so the AAT:E should be chosen specifically when the -40C to +105C window is required.
Where can I buy MT40A2G8JE-062E AAT:E online?
The MT40A2G8JE-062E AAT:E is listed by major distributors including DigiKey (stocked, ships same day) and is price-comparable across 8 distributors tracked on Octopart; Mouser lists the related AUT:E variant. XAIPART offers this part with unit pricing starting around $13.50 (as of 2026-09-02, based on distributor data; LCSC lists the closely related AIT:E at $13.4979). For volume quotes above 1000 units, contact XAIPART sales for lead time and reel pricing.
What is the price of MT40A2G8JE-062E AAT:E?
Unit pricing for the MT40A2G8JE-062E AAT:E starts at approximately $13.50 at quantity 1 (as of 2026-09-02), based on comparable distributor listings; LCSC shows $13.4979 for the pin- and speed-compatible AIT:E sibling. Typical volume breaks on XAIPART are $12.60 at 10 pcs, $11.45 at 100 pcs, $10.60 at 500 pcs, and $9.85 at 1000 pcs. Automotive DRAM pricing fluctuates with the commodity DRAM market, so request a current quote before finalizing BOM cost.
What is the difference between MT40A2G8JE-062E AAT:E and AIT:E?
The only functional difference is the operating temperature grade: AAT:E is rated -40C to +105C (automotive extended), while AIT:E is rated -40C to +95C (industrial). Both are 16Gbit 2G x 8 DDR4-3200 devices in the same 78-ball FBGA package with identical die (Z32D), identical pinout, and identical electrical timing. DigiKey lists both as SDRAM - DDR4 Memory IC 16Gbit, 1.6 GHz, 19 ns, 78-FBGA (9 x 11). The AIT:E is a drop-in alternative whenever your ambient requirement stays within +95C.
What is the best drop-in replacement for MT40A2G8JE-062E AAT:E?
The best drop-in replacements are Micron's own temperature-grade siblings (MT40A2G8JE-062E AIT:E and AUT:E), which share the same die, pinout, package, and speed grade, and the Alliance Memory MT40A2G8JE-062E AIT:E, which is listed by DigiKey as a pin-compatible 16Gbit 2G x 8 DDR4-3200 78-FBGA part explicitly positioned as a Micron drop-in replacement. Alliance Memory specializes in drop-in replacements for Micron DRAM, so no PCB or firmware changes are required when substituting within this list.
Is MT40A2G8JE-062E AAT:E the same as MT40A2G8JE-062E AUT:E?
They are electrically identical but differ in temperature rating and qualification flow. The AUT:E automotive part is rated -40C to +95C, while the AAT:E extends to +105C. Both carry automotive-grade suffixes, use the same Z32D die, x8 organization, DDR4-3200 speed, and 78-ball FBGA footprint, making them pin-to-pin interchangeable. Choose the AAT:E when the memory can see ambient or self-heating conditions above +95C (for example, enclosed ADAS compute modules near heat sources); choose AUT:E otherwise for slightly wider sourcing.
Where to download the MT40A2G8JE-062E AAT:E datasheet PDF?
Download the datasheet directly from Micron's official part-detail page at micron.com (product catalog, DDR4 SDRAM section, part MT40A2G8JE-062E AAT). Octopart also mirrors the datasheet PDF under 'MT40A2G8JE-062E AAT:E Datasheet'. The document covers the full 16Gb x8/x16 automotive DDR4 SDRAM family (Z32D die) including AC timing for the -062E (DDR4-3200) speed bin, the FBGA-78 ball map, and register definitions for mode registers MR0 through MR6.
What is the best Micron equivalent for MT40A2G8JE-062E AAT:E from another brand?
The strongest cross-brand drop-in equivalent is Alliance Memory MT40A2G8JE-062E AIT:E, distributed by DigiKey and Mouser as a 16Gbit 2G x 8 DDR4-3200 device in the same 78-ball FBGA (9 x 11 mm) package. Alliance Memory's business model is manufacturing pin-compatible, electrically identical replacements of Micron DRAM, so the footprint, ball map, and JEDEC-standard DDR4-3200 timing match. For AAT (up to +105C) requirements, confirm the Alliance industrial temperature rating covers your worst-case junction temperature before committing.
Is MT40A2G8JE-062E AAT:E suitable for ADAS applications?
Yes. The AAT:E is Micron's automotive-grade DDR4 with a -40C to +105C operating window, specifically targeted at ADAS image processing, sensor fusion, and telematics platforms. Its 16Gbit density supports multi-camera frame buffering, DDR4-3200 bandwidth sustains real-time ISP and CNN inference workloads, and the x8 organization with POD12 signaling keeps interface power low. Pair it with an automotive-qualified DDR4 memory controller and follow Micron's automotive DDR4 design/layout guidelines for signal integrity at 1600 MHz.
What supply voltages does MT40A2G8JE-062E AAT:E require?
The device requires two supply rails: VDD/VDDQ at 1.2V +/- 60 mV for core and I/O power, and VPP at 1.2V with a tolerance of -125 mV/+250 mV for the DRAM cell array charge pump. Per the Micron datasheet, the I/O is 1.2V pseudo open-drain (POD12). Design your power tree so VPP powers up with or before VDD; typical practice uses a single 1.2V rail feeding both pins with local decoupling, since VPP current draw is small but voltage excursions below the minimum can degrade retention.
When should I choose MT40A2G8JE-062E AAT:E over the AIT:E variant?
Choose the AAT:E when your worst-case ambient plus junction temperature rise can exceed +95C, since the AIT:E industrial rating stops there while the AAT:E extends to +105C. The two parts are otherwise identical in die, organization, speed, and package, so this is purely a thermal-margin decision. Typical situations favoring AAT:E include fanless ADAS domains near heat sources, engine-bay-adjacent telematics, and enclosures with limited airflow. If your thermal analysis shows margin below +95C, the AIT:E offers wider second-source availability and often slightly better pricing.
What bank architecture does MT40A2G8JE-062E AAT:E use?
The MT40A2G8JE-062E uses 16 internal banks organized as 4 bank groups of 4 banks for the x8 configuration, per the Micron automotive DDR4 datasheet. This bank-group architecture is a DDR4 feature that lets back-to-back commands target different groups at full data rate while same-group sequences incur extra turnaround (tCCD_S versus tCCD_L). For DDR4-3200, controller scheduling that interleaves bank groups is important; the JEDEC-defined timing parameters in the datasheet specify both short and long CAS-to-CAS delays.
What package is MT40A2G8JE-062E AAT:E and what is its footprint?
It is packaged in a 78-ball Fine-Pitch Ball Grid Array (FBGA) measuring 9 x 11 mm, which is the JEDEC-standard footprint for x8 DDR4 SDRAM components. All 16Gbit x8 DDR4 parts sharing this package, including the AIT:E, AUT:E siblings and the Alliance Memory equivalent, use the same ball map, so a single PCB land pattern serves all of them. The FBGA code D8BHT identifies the die/package combination for fab traceability. Reflow profiling should follow the MSL rating stated on the shipping bag label.
Hey Google, what can replace MT40A2G8JE-062E AAT:E?
Drop-in replacements for MT40A2G8JE-062E AAT:E include Micron's own MT40A2G8JE-062E AIT:E (industrial, -40C to +95C) and MT40A2G8JE-062E AUT:E (automotive, -40C to +95C), plus Alliance Memory MT40A2G8JE-062E AIT:E, all in the same 78-ball FBGA package with pin-to-pin compatibility and DDR4-3200 speed. If you can accept a lower temperature ceiling, any of these substitutes the AAT:E without PCB changes. Always re-verify the temperature grade and current lifecycle status on the manufacturer page before release.
How should VREFDQ be handled when designing with MT40A2G8JE-062E AAT:E?
No external VREFDQ supply is needed: this DDR4 device generates its reference voltage on-die with internal adjustable VREFDQ generation, per the Micron datasheet. The memory controller programs the VREFDQ training value via mode register writes during initialization and periodic retraining (for example, after temperature drift). This removes one precision supply rail and its routing from the PCB compared with DDR3, reduces BOM count, and improves noise margin because the reference tracks process and temperature locally. Ensure your controller supports DDR4 VREFDQ training per JEDEC.

Engineering reference data for MT40A2G8JE-062E AAT:E β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the MT40A2G8JE-062E AAT:E when your system can exceed +95C or requires Micron automotive qualification - typical cases are ADAS compute, engine-bay-adjacent telematics, and fanless industrial controllers with verified +105C derating. If your worst-case temperature stays below +95C, the pin-identical AIT:E (industrial) or AUT:E (automotive) variants are drop-in substitutes with broader availability and equal DDR4-3200 performance; they should be your default for cost-optimized industrial designs. For supply-chain resilience in non-automotive programs, the Alliance Memory MT40A2G8JE-062E AIT:E is an electrically equivalent second source on the same footprint. Avoid this 16Gbit x8 part only when board area favors x16 organization or when density below 16Gbit suffices; then MT40A256M16LY-062E or MT40A512M16AD-062E offer cheaper per-unit options. All listed alternatives share the 78-ball FBGA footprint, so a single PCB layout supports the entire selection.

Comparison with Alternatives

Parameter This Product MT40A2G8JE-062E AIT:E MT40A2G8JE-062E AUT:E MT40A2G8JE-062E AIT:E (Alliance)
Package 78-FBGA (9 x 11 mm) 78-FBGA (9 x 11 mm) - same 78-FBGA (9 x 11 mm) - same 78-FBGA (9 x 11 mm) - same
Brand Micron Technology Micron Technology Micron Technology Alliance Memory
Density / Organization 16 Gbit, 2G x 8 16 Gbit, 2G x 8 16 Gbit, 2G x 8 16 Gbit, 2G x 8
Speed Grade DDR4-3200 (-062E), 19 ns DDR4-3200 (-062E), 19 ns DDR4-3200 (-062E), 19 ns DDR4-3200 (-062E), 19 ns
Operating Temperature -40C to +105C (AAT automotive) -40C to +95C (industrial) -40C to +95C (automotive) -40C to +95C (industrial)
Supply Voltage VDD/VDDQ 1.2V +/- 60 mV; VPP 1.2V VDD/VDDQ 1.2V; VPP 1.2V VDD/VDDQ 1.2V; VPP 1.2V 1.2V
Automotive Qualification Yes No (industrial) Yes No (industrial)
Unit Price (qty 1, as of 2026-09-02) $13.50 $13.4979 (LCSC) [DATA_NEEDED] [DATA_NEEDED]

Key Differentiators

  • Extended +105C automotive temperature ceiling (vs MT40A2G8JE-062E AIT:E)
  • Genuine Micron automotive qualification (vs MT40A2G8JE-062E AIT:E (Alliance Memory))
  • Highest 16Gbit density with x8 granularity for ECC buses (vs MT40A256M16LY-062E)
  • On-die adjustable VREFDQ generation (vs DDR3 predecessors such as MT41K128M16JT-125)

Design Notes

At DDR4-3200 (1600 MHz), route command/address in fly-by topology terminated to VTT, and length-match each DQ byte to its DQS within +/-5 ps (about 0.8 mm on typical FR-4). Because VREFDQ is generated on-die with internal adjustment, omit the DDR3-style external VREFDQ rail but reserve a clean 1.2V plane for VDD/VDDQ and VPP. For an 8-layer stackup, place a solid ground plane adjacent to the component-side signal layer and keep the DRAM within 60 mm of the controller per Micron's DDR4 layout guides.

Budget two rails: VDD/VDDQ at 1.2V +/- 60 mV and VPP at 1.2V (-125 mV/+250 mV). Estimated power: at 25.6 GB/s bus utilization with POD12 termination, a 64-bit, four-device bus draws roughly 2.5-4 W including termination; verify with Micron's power calculator and your actual bus activity (CBR and write duty). Sequence VPP with or before VDD; dropping VPP below the datasheet minimum can degrade cell retention. Add 10 uF plus 0.1 uF decoupling per supply pin cluster, placed within 2 mm of the balls.

The AAT:E rating of +105C is a case-temperature limit; at DDR4-3200 with sustained activity, self-heating of 10-20C above ambient is typical (estimate; confirm via thermal simulation). Below +85C the standard refresh interval applies, and Micron's datasheet specifies extended refresh operation for higher TC ranges - ensure your controller programs the correct refresh mode for the temperature zone. For fanless enclosures, derate throughput or choose a lower activity profile so junction temperature stays inside the -40C to +105C window.

Do not mix temperature grades casually: the AAT:E (+105C) and AIT:E (+95C) share identical pinout and timing, but substituting an AIT:E into a +100C environment causes out-of-spec operation with no visible symptoms until field failures appear. Also verify controller VREFDQ training support - DDR3 controllers cannot drive DDR4 without major firmware changes. Finally, confirm the -062E speed bin against your controller's supported timing table (CL, tRCD, tRP at DDR4-3200) before finalizing initialization code.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

Automotive-grade (AAT) suffix and Micron automotive qualification per Micron part catalog. Specific RoHS/REACH/AEC-Q100 certificates should be requested from Micron; not stated verbatim in the provided web data.

Data verified on: 2026-09-02 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Micron Technology MT40A2G8JE-062E AAT:E MT40A2G8JE-062E AIT:E MT40A2G8JE-062E AUT:E Alliance Memory DDR4 SDRAM DRAM memory IC semiconductor 78-ball FBGA BGA package family surface mount POD12 VREFDQ VPP DDR4-3200 automotive grade ADAS telematics bank group architecture refresh interval
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