P1024NSN5DFB - QorIQ P1 Dual-Core 667MHz SoC | NXP
MPN: P1024NSN5DFB ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85.5 | $85.50 |
| 10 | $76.95 | $769.50 |
| 100 | $68.4 | $6,840.00 |
| 250 | $64.1 | $16,025.00 |
| 500 | $60.85 | $30,425.00 |
P1024NSN5DFB Overview
A QorIQ communications processor is a system-on-chip (SoC) tailored for wired and wireless infrastructure, integrating CPU cores, packet processing accelerators, high-speed serial interfaces, and memory controllers in a single device. Within the broader taxonomy, the P1024 sits at: communications processor -> embedded SoC -> microprocessor -> integrated circuit -> semiconductor. This integration reduces BOM count, PCB area, and software complexity for OEMs building routers, switches, industrial gateways, and defense platforms.
Key features of the P1024 include dual PowerPC e500v2 cores up to 667 MHz (533 MHz core / 333 MHz platform / 667 MHz data rate per Mouser description), integrated three-speed 10/100/1000 Ethernet controllers, a 64-bit DDR3 controller with ECC, two PCIe controllers, USB 2.0 host/device, TDM, SPI, I2C, DUART, and security engine acceleration. The 45 nm process enables low-power operation while supporting the industrial 0 to 125C junction temperature range, suitable for thermally constrained deployments. The 561-TEPBGA package provides high-density board integration at 23x23 mm.
The architecture combines dual e500v2 cores with hardware-accelerated packet handling, queue management, and cryptography. The integrated security engine supports IPsec, SSL/TLS, and MACsec offload, offloading packet inspection from the cores and improving throughput per watt. This makes the P1024 well suited for line-rate encryption, deep-packet inspection, and control-plane processing in mid-range networking equipment.
Typical applications include branch-office routers, industrial control gateways, defense and aerospace secure communications, factory automation controllers, and Smart Grid / IEC 61850 substation equipment. The combination of dual-core performance, hardware crypto, and industrial temperature range addresses the converged networking and embedded computing needs of these markets.
When designing with the P1024, allocate sufficient PCB layers (at least 8) for the 561-ball BGA breakout and high-speed DDR3 routing. Use impedance-controlled traces for GbE, PCIe, and SERDES signals, and follow NXP hardware design guidelines for thermal management given the 23x23 mm package.
This page synthesizes current distributor inventory, lifecycle status, drop-in alternatives within the QorIQ P1 family, and practical design considerations drawn from the manufacturer datasheet to help engineers evaluate the P1024NSN5DFB for production use.
Drop-in alternatives for P1024NSN5DFB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P1024NSN5DFB (same form factor and footprint) — differing in Ethernet, Mounting Type, Operating Temperature, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P1024NXE5DFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1024NSE5DFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1015NSN5DFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1015NSE5DFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1016NSN5DFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1025NSN5DFB
✅ Drop-In✓ In Stock
$60 / Unit
View Datasheet →P1024NSN5DFB Maximum Ratings & Electrical Characteristics
| Series | QorIQ P1 |
| Core Processor | PowerPC e500v2 |
| Number of Cores / Bus Width | 2 Core / 32-Bit |
| Core Frequency | 533 MHz |
| Platform Frequency | 333 MHz |
| Data Rate | 667 MHz |
| Operating Temperature | 0C to 125C (TJ) |
| Package / Case | 561-TEPBGA-1 (23x23 mm) |
| Mounting Type | Surface Mount |
| Ethernet | 10/100/1000 Mbps (3x GbE) |
| Memory Interface | DDR3 with ECC, 64-bit |
| USB | USB 2.0 Host/Device |
| PCIe | PCI Express (2 controllers) |
| TDM | Yes |
| Security Engine | IPsec / SSL / MACsec acceleration |
| Process Technology | 45 nm |
P1024NSN5DFB 561-tepbga-1 (23x23 mm) Pin Configuration Guide
Pin configuration for P1024NSN5DFB (561-tepbga-1 (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P1024NSN5DFB.
Refer to the datasheet for full pin configuration.
Typical Applications
P1024NSN5DFB is suitable for 6 applications: Branch-Office Routers and Gateways, Industrial Control and IEC 61850 Substations, Defense and Aerospace Secure Communications, Network-Attached Storage and Print Servers, Smart Grid and Energy Gateways, Factory Automation and Robotics Controllers.
Branch-Office Routers and Gateways
The P1024NSN5DFB is a strong fit for branch-office routers and integrated services gateways because its dual e500v2 cores at 533 MHz deliver sufficient compute for routing, NAT, VPN termination, and basic QoS classification while the integrated three-port GbE MAC and PCIe eliminate external bridge chips. The hardware security engine accelerates IPsec and SSL/TLS, enabling line-rate encrypted traffic at typical WAN edge throughputs. With DDR3-ECC memory and an industrial 0 to 125C junction range, the device is dependable for unattended deployments in wiring closets and outdoor enclosures. Drop-in alternatives P1025NSN5DFB and P1024NXE5DFB give OEMs headroom to scale throughput without re-laying out the PCB.
Recommended
Industrial Control and IEC 61850 Substations
For industrial control and IEC 61861850 substation gateways, the P1024NSN5DFB's dual-core compute, hardware crypto, and industrial 0 to 125C junction rating align well with substation environmental profiles. The integrated DDR3 with ECC is critical for IEC 61850-3 reliability requirements, while the GbE and TDM interfaces connect directly to process-bus and station-bus networks without external bridges. The 45 nm process keeps power low enough for fan-less, sealed enclosures typical in switchgear cabinets. Drop-in siblings P1024NSE5DFB and P1015NSE5DFB let OEMs ship different SKUs in the same PCB for varied price/performance tiers.
Recommended
Defense and Aerospace Secure Communications
The P1024NSN5DFB is well suited to defense and aerospace secure communications platforms because its hardware security engine accelerates IPsec, SSL/TLS, and MACsec at line rate, freeing the e500v2 cores for protocol and waveform processing. The 45 nm process and industrial 0 to 125C junction range tolerate harsh thermal environments, while DDR3-ECC protects memory integrity in mission-critical systems. Combined with the QorIQ software ecosystem and P2010/P2020 software compatibility per NXP family documentation, integrators can reuse BSPs across platforms. Drop-in alternative P1025NSN5DFB provides dual-core headroom for higher-bandwidth SDR or tactical-radio applications.
Recommended
Network-Attached Storage and Print Servers
The P1024NSN5DFB fits small-to-mid-range NAS appliances and office print servers by providing dual-core compute for file-system, SMB/NFS, and print-spool workloads, three GbE ports for LAN-side bonding and dedicated management, and PCIe for attaching RAID or 10GbE controllers. DDR3-ECC memory support reduces uncorrectable errors in always-on storage. Compared with single-core alternatives such as P1015NSN5DFB, the second core noticeably improves multi-client throughput under concurrent I/O. The 561-TEPBGA-1 footprint is shared across the QorIQ P1 family for hardware reuse.
Recommended
Smart Grid and Energy Gateways
For smart-grid and energy-management gateways, the P1024NSN5DFB provides the dual-core compute needed for DLMS/COSEM, DNP3, and IEC 60870-5-104 protocol stacks plus security for AMI backhaul. The hardware security engine secures HAN/NAN links, and the industrial 0 to 125C junction range handles outdoor cabinet thermal swings. The 45 nm process enables fan-less designs that meet utility-grade reliability expectations. Drop-in variants P1015NSE5DFB and P1024NSE5DFB share the 561-TEPBGA-1 footprint, allowing product families spanning entry and high-end SKUs.
Recommended
Factory Automation and Robotics Controllers
The P1024NSN5DFB is suitable for factory automation controllers and robotic cells because its dual e500v2 cores can run real-time motion control on one core and vision/AI processing on the other, while GbE handles PROFINET/EtherCAT bridges and PCIe connects to FPGA or GPU accelerators. The industrial 0 to 125C rating tolerates cabinet temperatures, and DDR3-ECC protects against soft errors in long-lifecycle installations. The 561-TEPBGA-1 (23x23 mm) package provides a compact footprint for dense controller boards. The P1015 single-core drop-in can be used for lower-cost variants within the same PCB layout.
Recommended
Recommended Products Summary
Engineering reference data for P1024NSN5DFB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P1024NXE5DFB | P1024NSE5DFB | P1015NSN5DFB | P1015NSE5DFB | P1016NSN5DFB | P1025NSN5DFB |
|---|---|---|---|---|---|---|---|
| Package | 561-TEPBGA-1 (23x23) | 561-TEPBGA-1 (23x23) - same | 561-TEPBGA-1 (23x23) - same | 561-TEPBGA-1 (23x23) - same | 561-TEPBGA-1 (23x23) - same | 561-TEPBGA-1 (23x23) - same | 561-TEPBGA-1 (23x23) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Number of Cores | 2 | 2 | 2 | 1 | 1 | 1 | 2 |
| Core Frequency | 533 MHz | Extended profile | 533 MHz | 533 MHz | 533 MHz | 667 MHz | 667 MHz |
| Operating Temperature | 0C to 125C (TJ) | 0C to 125C | 0C to 125C | 0C to 125C | 0C to 125C | 0C to 125C | 0C to 125C |
| Memory Interface | DDR3 with ECC, 64-bit | DDR3 with ECC, 64-bit | DDR3 with ECC, 64-bit | DDR3 with ECC, 64-bit | DDR3 with ECC, 64-bit | DDR3 with ECC, 64-bit | DDR3 with ECC, 64-bit |
| Ethernet | 3x GbE | 3x GbE | 3x GbE | 3x GbE | 3x GbE | 3x GbE | 3x GbE |
| Lifecycle Status | Last-time-buy | Last-time-buy (family) | Last-time-buy (family) | Last-time-buy (family) | Last-time-buy (family) | Last-time-buy (family) | Last-time-buy (family) |
Key Differentiators
- True drop-in compatibility across the QorIQ P1 family (vs P1025NSN5DFB)
- Software compatibility extends to QorIQ P2 family (vs P2010/P2020)
- Integrated security engine (vs P1015NSN5DFB)
Design Notes
The 561-ball TEBGA-1 (23x23 mm) package at 1 mm pitch requires a minimum 8-layer PCB with matched-impedance stack-up for GbE, PCIe, and DDR3 signals. Use microvia-in-pad construction (laser-drilled microvias) to breakout the inner balls; conventional through-via dog-bone fanout will not fit at this pitch. Follow NXP hardware design guide for ball pattern, antipad sizes, and BGA keepout. Place at least 4 decoupling capacitors (0.1 uF, 1 uF, 10 uF) within 2 mm of the package power balls, and provide a continuous ground plane directly under the BGA for thermal spreading and return-path integrity.
Estimated: at typical 45 nm QorIQ P1 power dissipation (~5 to 8 W at full load) on a 23x23 mm 561-TEPBGA, junction-to-ambient thermal resistance theta_JA on a 4-layer JEDEC test board is roughly 15 to 20 K/W depending on copper weight and airflow. For fan-less industrial enclosures, attach a heatsink with thermal interface material and provide copper pours on top/bottom layers tied to the BGA thermal balls. Derate Tj to 105 to 110C for long-term reliability given the 125C absolute maximum.
Do not use the P1024NSN5DFB in new designs without consulting the NXP EOL and replacement notice; the part is marked last-time-buy on the manufacturer product page. For new programs, evaluate active QorIQ successors or active Layerscape LS1 family parts. When migrating between P1015 and P1024 in the same PCB, validate that your software uses both cores correctly - SMP boot, scheduler pinning, and IPC must be enabled or you will not realize dual-core throughput gains.
DDR3 interface must be length-matched per byte lane with proper termination VTT. Series-damping resistors are recommended on GbE RGMII/SerDes lines to control overshoot. PCIe reference clock routing must be length-matched and isolated from noisy power rails. Follow NXP's reference design layout as the authoritative starting point rather than general SoC guidelines.
Compliance Information
RoHS, REACH, lead-free, and halogen-free compliance not stated in verified web data; verify via lot-specific certificate of conformance from distributor before use in RoHS-critical designs. Not AEC-Q100 qualified - this is a networking/industrial communications processor, not an automotive grade part.
