P1024NXE5BFB - QorIQ P1 Dual-Core 400MHz SoC | NXP
MPN: P1024NXE5BFB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $198.5 | $198.50 |
| 10 | $185 | $1,850.00 |
| 100 | $168 | $16,800.00 |
| 500 | $152 | $76,000.00 |
| 1,000 | $138.5 | $138,500.00 |
P1024NXE5BFB Overview
What is a QorIQ communications processor? The QorIQ family is NXP's line of Power Architecture-based system-on-chip devices that integrate CPU cores, memory controllers, networking peripherals, and security engines for wired/wireless infrastructure. In the hierarchy, a communications SoC like the P1024 sits above a generic microprocessor (MPU) and below a full network processor (NPU), filling the role of intelligent control plane and modest data-plane processing in routers, switches, base stations, and industrial gateways.
Key features include dual e500 cores with 36-bit physical addressing, 32 KB I-cache and 32 KB D-cache per core, integrated SEC 4.0 security engine, dual 10/100/1000 Mbps Ethernet controllers, 32-bit DDR3/DDR3L memory controller with ECC, two PCIe controllers, one USB 2.0 with PHY, TDM serial interface, eSPI, and four I2C controllers. The device operates from -40C to +125C junction temperature and is targeted at industrial-grade extended-temperature networking equipment.
Technically, the P1024NXE5BFB uses a high-performance superscalar e500v2 core with out-of-order execution, hardware table-walk MMU, and a 256 KB shared CoreNet platform cache. The Coherent Fabric crossbar eliminates main-memory access contention between cores, while the SEC block accelerates IPsec, SSL/TLS, and 3GPP wireless cipher suites for secure data-plane operations.
Typical applications include industrial routers and gateways, LTE/small-cell base stations, defense and aerospace networking, network-attached storage (NAS) controllers, and secure VPN concentrators. The extended temperature range also suits outdoor industrial switches and grid infrastructure.
When designing with the P1024NXE5BFB, plan a six-layer PCB for DDR3 routing with matched 50 ohm impedance. Use the on-chip SEC engine to offload IPsec processing and reserve e500 cycles for control-plane software.
This page synthesizes distributor pricing, parameter analysis, and design considerations not found in the manufacturer datasheet alone, supporting engineers evaluating communications SoC alternatives.
Drop-in alternatives for P1024NXE5BFB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P1024NXE5BFB (same form factor and footprint) — differing in Ethernet, Operating Temperature, Memory Controller, USB, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P1024NSE5BFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1015NXN2FFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1025NSE5BFB
✅ Drop-In✓ In Stock
$43.2 / Unit
View Datasheet →P1024NXE5MFB
✅ Drop-In📋 Reference alternative (not in catalog)
P2020NSN2MFC
✅ Drop-In✓ In Stock
$31.2 / Unit
View Datasheet →P1024NXE5BFB Maximum Ratings & Electrical Characteristics
| Processor Family | QorIQ P1 |
| Core Architecture | Power Architecture e500v2 |
| Core Count | 2 (dual-core) |
| Core Frequency | 400 MHz |
| Manufacturing Process | 45 nm SOI |
| Package | 561-TEPBGA (23x23 mm) |
| Operating Temperature | -40C to +125C |
| Memory Controller | 32-bit DDR3/DDR3L with ECC |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| Platform Cache | 256 KB CoreNet shared |
| Ethernet | Dual 10/100/1000 Mbps GbE |
| PCIe | 2x PCIe controllers |
| USB | USB 2.0 with integrated PHY |
| Security Engine | SEC 4.0 (IPsec/SSL/TLS/3GPP) |
| TDM Interface | Yes |
| eSPI | Yes |
| I2C Controllers | 4 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | RoHS Compliant |
| Lead-Free Status | Lead Free |
| Revision | Rev 1.1 |
P1024NXE5BFB 561-tepbga (23x23 mm) Pin Configuration Guide
Pin configuration for P1024NXE5BFB (561-tepbga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P1024NXE5BFB.
Refer to the datasheet for full pin configuration.
Typical Applications
P1024NXE5BFB is suitable for 7 applications: Industrial Routers and Gateways, LTE and Small-Cell Base Stations, Defense and Aerospace Networking, Network Attached Storage Controllers, Secure VPN Concentrators, Industrial IoT Gateways, Power Grid Substation Communications.
Industrial Routers and Gateways
The P1024NXE5BFB fits industrial routing equipment because two e500 cores at 400 MHz sustain forwarding and OSPF/BGP work, while the integrated SEC 4.0 engine handles IPsec VPN tunnels at line rate. Dual GbE ports eliminate external MAC chips and the DDR3 with ECC controller protects routing tables against single-bit faults in 24x7 field deployments. Placed as the control plane CPU, it interfaces with external switch ASICs over PCIe and supports fanless thermal envelopes up to +125C junction. Compared with smaller ARM Cortex-A SoCs, the QorIQ P1 delivers deterministic Book-E performance under network stack load.
Recommended
LTE and Small-Cell Base Stations
In small-cell and femtocell base stations, the P1024NXE5BFB provides the real-time control plane for the Layer-2/Layer-3 stack plus MAC scheduling. Its SEC engine accelerates 3GPP cipher suites (SNOW 3G, AES, Kasumi) required for LTE air interface security, offloading cores from cipher work that would otherwise cut user-plane throughput. The TDM interface connects to RF front-ends, while PCIe attaches DSP co-processors for PHY acceleration. Extended temperature grade -40C to +125C lets the device operate in pole-mount outdoor enclosures without active cooling.
Recommended
Defense and Aerospace Networking
Defense programs adopt the P1024NXE5BFB for rugged tactical routers and secure gateways because the part operates from -40C to +125C and integrates IPsec acceleration essential for HAIPE encryptors. Two e500 cores partition the control plane from the data plane and run certified real-time operating systems such as VxWorks MILS. The same QorIQ P1 family powers DoD-sourced Communications-Electronics Command (CECOM) applications, with supply-chain path available through Rochester Electronics. The TEPBGA package resists vibration better than ceramic equivalents in MIL-STD-810 environments.
Recommended
Network Attached Storage Controllers
The P1024NXE5BFB serves as the storage controller in entry-to-mid-range NAS appliances, supporting SATA controllers via PCIe and using the integrated GbE for client-side file services. DDR3 with ECC is mandatory for RAID parity computations; bit error correction is critical because undetected DRAM errors corrupt file system metadata and cause silent data loss. Two cores handle concurrent SMB/NFS/iSCSI sessions while the SEC block accelerates SMB3 encryption. The 400 MHz per core power envelope is well suited to fanless home/SOHO NAS enclosures.
Recommended
Secure VPN Concentrators
VPN concentrators rely on the P1024NXE5BFB's SEC 4.0 engine to terminate hundreds of IPsec tunnels with AES-256-GCM and SHA-256 at line rate, freeing the e500 cores for IKE key exchange and policy management. Dual GbE ports split WAN and DMZ segments, and the DDR3 controller with ECC buffers cryptographic state for thousands of concurrent SAs. The QorIQ P1 architecture is purpose-built for secure network appliances; competing ARM SoCs typically require external crypto ASICs that increase BOM cost and PCB area.
Recommended
Industrial IoT Gateways
The P1024NXE5BFB underpins industrial IoT gateways that aggregate Modbus, EtherCAT, and OPC-UA traffic into cloud uplinks. Dual cores run the deterministic control-side stack on one core and a Linux userspace with MQTT/MQTT-SN brokers on the other. The USB 2.0 with integrated PHY connects cellular modems for backhaul, while PCIe attaches Wi-Fi 6 cards for local Wi-Fi. Extended -40C to +125C temperature range lets the gateway mount directly on factory floors without climate-controlled cabinets, supporting Industry 4.0 deployments.
Recommended
Power Grid Substation Communications
In IEC 61850 substations, the P1024NXE5BFB enables the rugged communication processor in Merging Units, Intelligent Electronic Devices (IEDs), and bay controllers. Its extended temperature range and lead-free TEPBGA package qualify it for substation environments with high electromagnetic interference, and dual GbE drives redundant PRP/HSR network topologies required by IEC 61850-3. Integrated SEC 4.0 provides authenticated multicast for GOOSE messaging protection and is compliant with NERC-CIP critical infrastructure protocols.
Recommended
Recommended Products Summary
Engineering reference data for P1024NXE5BFB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P1024NSE5BFB | P1015NXN2FFB | P1025NSE5BFB | P1024NXE5MFB | P2020NSN2MFC |
|---|---|---|---|---|---|---|
| Package | 561-TEPBGA (23x23) | 561-TEPBGA (23x23) - same | 561-TEPBGA (23x23) - same | 561-TEPBGA (23x23) - same | 561-TEPBGA (23x23) - same | 561-TEPBGA (23x23) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | 2 (dual-core) | 2 (dual-core) | 1 (single-core) | 2 (dual-core) | 2 (dual-core) | 2 (dual-core) |
| Core Frequency | 400 MHz | 400 MHz | 667 MHz | 1.0-1.5 GHz | 533 MHz (mid-bin) | 1.2 GHz |
| Operating Temperature | -40C to +125C | 0C to +105C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +105C |
| Memory Controller | DDR3/DDR3L 32-bit with ECC | DDR3/DDR3L 32-bit with ECC | DDR3/DDR3L 32-bit with ECC | DDR3/DDR3L 64-bit with ECC | DDR3/DDR3L 32-bit with ECC | DDR3 64-bit with ECC |
| Ethernet | Dual GbE | Dual GbE | Dual GbE | Triple GbE | Dual GbE | Triple GbE + 10GbE |
| Security Engine | SEC 4.0 | SEC 4.0 | SEC 4.0 | SEC 5.0 | SEC 4.0 | SEC 4.0 |
| Process Technology | 45 nm SOI | 45 nm SOI | 45 nm SOI | 45 nm SOI | 45 nm SOI | 45 nm SOI |
| Lifecycle Status | EOL (Discontinued) | EOL (Discontinued) | EOL (Discontinued) | Active | EOL (Discontinued) | EOL (Discontinued) |
Key Differentiators
- Dual-core at 400 MHz with hardware SEC 4.0 in same chip (vs P1015NXN2FFB)
- Extended temperature grade -40C to +125C (vs P1024NSE5BFB)
- Pin-compatible family for upward migration (vs P1025NSE5BFB)
- 45 nm SOI for predictable latency (vs P2020NSN2MFC)
Design Notes
Estimated: with P = (VIN - VOUT) * ILOAD low for DDR termination rails, the P1024NXE5BFB typically dissipates 6-9 W under full CPU + GbE load at 400 MHz dual-core. The 23x23 mm TEPBGA requires a thermal interface material to the chassis heat spreader; use thermal vias under the center pad array and a copper coin on top of the package for adequate theta_JB (~5 C/W). For fanless designs targeting +85C ambient, derate the workload or use the P1024NXE5MFB mid-bin.
DDR3 routing for the P1024NXE5BFB must follow QorIQ P1 layout guidelines: matched 50 ohm single-ended impedance, length-matching within 25 mils byte-to-byte, and minimum via transitions to the inner stripline layers. Place the 32-bit byte groups on adjacent layers. The 561-TEPBGA has 1.0 mm ball pitch, requiring 0.4 mm laser-drilled micro vias. Use 6 signal layers + 2 plane layers minimum. Decoupling requires 0402 or 0201 ceramics within 1 mm of each ball, with a bulk 220 uF tantalum capacitor per rail.
Do not confuse the NXE5 (extended temp) speed bin with NSE5 (commercial) when sourcing replacements - both share the same die but only NXE5 supports the -40C to +125C range. The BGA requires X-ray or endoscopic inspection after reflow because the 1.0 mm pitch hides solder joint defects. Watch for errata in revision 1.1 silicon: A-010498 documents a PCIe link training state machine quirk under aggressive ASPM - apply the latest NXP errata patches and avoid enabling L1 ASPM during initial validation.
The dual GbE RGMII interfaces run at DDR 125 MHz and require source-synchronous timing closure. Place the PHY no more than 3 inches from the processor, route the RX clock on a separate layer with ground shielding, and use series 22 ohm resistors at the P1024 side to dampen reflections. The SEC engine shares the DDR bus with the CPU cores, so memory accesses during encryption bursts can cause jitter; isolate sensitive analog/RF traces from the DDR controller's switching currents and provide a dedicated ground island near the TDM interface.
The TEPBGA has dedicated coreset module balls - lay out the SerDes lanes (PCIe + GbE) as point-to-point with reference ground stitches every 4 ball pitches. Power rails must come up in the sequence specified by NXP's QorIQ P1 hardware specification: VDD_core first, then VDD_PLAT, then VDD_SerDes. Failure to observe the sequence can latch up the device. Add a POR reset supervisor such as the NXP MC34674 to manage warm-boot after brownouts and to drive HRESET under software control.
Compliance Information
RoHS compliant per distributor listings. AEC-Q100 not applicable - MPU is not automotive grade. Halogen-free status unknown because NXP datasheet does not explicitly declare IEC 61249-2-21 on public product page.
