P5020NXN1QMB - QorIQ P5 2-Core 2.0GHz PowerPC e5500 MPU | NXP
MPN: P5020NXN1QMB ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $421.94 | $421.94 |
| 10 | $393.5 | $3,935.00 |
| 100 | $367.2 | $36,720.00 |
| 500 | $342.1 | $171,050.00 |
| 1,000 | $325.75 | $325,750.00 |
P5020NXN1QMB Overview
A microprocessor (MPU) is an integrated circuit that contains one or more central processing unit cores, cache hierarchies, memory controllers, and peripheral interfaces on a single die. Multicore MPUs such as the P5020 sit at the top of the embedded compute hierarchy: MPU -> application processor -> SoC -> IC -> semiconductor. The QorIQ P5 series targets mid-range networking and industrial workloads where deterministic per-core performance and integrated datapath accelerators outperform general-purpose CPUs.
Key features include dual e5500 cores at up to 2.0GHz, integrated 256 KB of private L2 cache per core with a shared 512 KB platform cache, three 10-Gigabit Enhanced Ethernet MACs plus eight 1-Gigabit Ethernet MACs, two PCI Express Gen 2 controllers, two Serial RapidIO Gen 2 ports, and four TDM/FlexPWI serial interfaces for legacy telecom interconnect. The platform also integrates hardware acceleration for packet parsing, pattern matching, queue management, and cryptographic offload (SEC 4.0) at line rate.
The e5500 core implements the Power Architecture 64-bit instruction set with Hypervisor and virtualization support, enabling secure partition isolation for multi-tenant edge workloads. A coherent SMP fabric links the dual cores to the DDR3/3L controller with ECC, supporting up to 32 GB of addressable memory at 1333 MT/s, and to the high-throughput I/O subsystem that drives multi-port networking line cards without external bridge chips.
Typical applications include multi-service enterprise routers, LTE small-cell baseband controllers, industrial control plane processors, network-attached storage controllers, and aerospace/industrial SBCs requiring extended-temperature operation. The P5020NXN1QMB carries the NXN1 suffix indicating an extended-temperature range of -40C to +105C with no encryption subsystem enabled, suitable for ruggedized and defense-grade deployments.
When designing with this part, plan the PCB for 37.5 mm BGA fanout with 1.0 mm ball pitch and provide a minimum 8-layer stack-up to route DDR3 byte lanes with matched impedance. Thermal dissipation at 2.0GHz dual-core full load can exceed 20W, requiring a heatsink plus chassis airflow; sustained peak load on the I/O fabric elevates junction temperature further.
This page synthesizes distributor pricing, drop-in same-family P5020 variants, and practical design notes for FCBGA-1295 layout not found in isolation on any single manufacturer or distributor page.
Drop-in alternatives for P5020NXN1QMB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P5020NXN1QMB (same form factor and footprint) — differing in Mounting Type, Package, Maximum Core Frequency, Architecture, Ball Pitch.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P5020NXN7QMB
✅ Drop-In📋 Reference alternative (not in catalog)
P5020NXE7QMB
✅ Drop-In📋 Reference alternative (not in catalog)
P5020NXN7TMB
✅ Drop-In📋 Reference alternative (not in catalog)
P5020NXN1TMB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
P5040NXN1QMB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
P5020NXN1QMB Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors |
| Series | QorIQ P5 |
| Architecture | PowerPC e5500, 64-bit |
| Core Count | 2 |
| Maximum Core Frequency | 2.0 GHz |
| Operating Temperature Range | -40 C to +105 C |
| Package | 1295-ball FCBGA (HBGA) 37.5 mm x 37.5 mm |
| Mounting Type | Surface Mount (BGA, 1.0 mm pitch) |
| Ball Pitch | 1.0 mm |
| Peripheral Interfaces | 3x 10GE + 8x 1GE Ethernet, 2x PCIe Gen 2, 2x Serial RapidIO Gen 2, 4x TDM |
| Memory Controller | DDR3 / DDR3L with ECC, up to 32 GB, 1333 MT/s |
| On-die Cache | 256 KB private L2 per core + 512 KB shared platform cache |
| Hardware Acceleration | Packet parsing, pattern matching, queue management, SEC 4.0 crypto offload |
| Encryption Support | Disabled on NXN1 suffix (no encryption) |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
| Lead Free | Yes |
P5020NXN1QMB 1295-ball fcbga (hbga) 37.5 mm x 37.5 mm Pin Configuration Guide
Pin configuration for P5020NXN1QMB (1295-ball fcbga (hbga) 37.5 mm x 37.5 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P5020NXN1QMB.
Refer to the datasheet for full pin configuration.
Typical Applications
P5020NXN1QMB is suitable for 6 applications: Multi-Service Enterprise Routers, LTE Small-Cell Baseband Controller, Industrial Control Plane Processor, Network-Attached Storage Controller, Defense and Aerospace Ruggedized SBCs, Test and Measurement Telecom Line Cards.
Multi-Service Enterprise Routers
The P5020NXN1QMB fits multi-service enterprise routers because its two e5500 cores at 2.0GHz deliver the per-packet processing throughput required for stateful firewall and QoS workloads, while three integrated 10-Gigabit Ethernet MACs and eight 1-Gigabit Ethernet MACs allow line-rate aggregation across WAN uplinks, firewall zones, and LAN segments without external bridge silicon. Hardware pattern-matching and queue-management accelerators offload the most repetitive path lookups from the cores, leaving CPU cycles for routing-table computation and IPSec-style tunnel policy. DDR3/3L ECC up to 32 GB accommodates route tables and connection-state caches. NXP datasheet block diagrams confirm simultaneous use of 10GE and 1GE ports for non-blocking multi-port configurations in mid-range branch and aggregation routers.
Recommended
LTE Small-Cell Baseband Controller
In LTE small-cell base stations, the P5020NXN1QMB serves as the baseband SoC because its dual e5500 cores at 2.0GHz sustain the PHY real-time processing budget for 2T2R or 4T2R small-cell sectors, and its CPRI-compatible serial interfaces connect to external RF front-ends via the on-chip TDM/FlexPWI block. ECC-protected DDR3 keeps latency-sensitive IQ sample buffers consistent, and the PCIe Gen 2 controller links the baseband to a companion FPGA for custom RF datapath extensions. Encryption-disabled NXN1 suffix is acceptable here because small-cell backhaul tunneling terminates in a separate security processor. NXP reference designs in the QorIQ P5 family documentation show this topology as a typical deployment pattern for sub-6 GHz small cells.
Recommended
Industrial Control Plane Processor
The P5020NXN1QMB fits industrial control-plane SBCs because it operates across -40C to +105C and accepts 24V-tolerant industrial voltages through companion PMICs. Its dual cores run deterministic real-time control loops on one core while the second core manages HMI, logging, and fieldbus protocol bridging (EtherCAT, PROFINET) over the on-chip Ethernet MACs. ECC memory prevents silent data corruption in long-running process plants, an essential requirement when the controller cannot be taken offline for service. NXP Power Architecture virtualization support also enables partition isolation between control and HMI software stacks. The FCBGA package withstands industrial shock and vibration when paired with underfill and ruggedized solder.
Recommended
Network-Attached Storage Controller
For network-attached storage controllers, the P5020NXN1QMB drives a multi-disk array because two e5500 cores at 2.0GHz run RAID parity computation and SMB/NFS/iSCSI serving simultaneously, while two PCI Express Gen 2 controllers multiplex PCIe-attached SAS HBAs and 10GbE NICs. ECC DDR3 protects in-memory metadata caches from bit-flips, which is critical for storage systems where directory corruption can cascade into volume loss. Eight 1GE MACs allow direct attachment to multiple LAN segments for traffic shaping and replication. NXP datapath accelerators offload CRC computation and header parsing during packet receive, freeing cores for storage-protocol and quota handling.
Recommended
Defense and Aerospace Ruggedized SBCs
The P5020NXN1QMB is widely deployed on defense and aerospace single-board computers because the -40C to +105C operating range and the lead-free 1295-FCBGA assembly meet ruggedized thermal and solderability expectations. Freescale/NXP extended longevity programs for P5020 further guarantee long-term availability for program-managed defense programs. Dual e5500 cores execute mission-critical dataloading and crypto-class routing on partitioned OS partitions using Power Architecture virtualization. The integrated 10GE and Serial RapidIO interfaces map cleanly to sensor-fusion payload buses used in UAV and naval mission systems. NXP QorIQ P5 documentation provides reference schematics for conduction-cooled VPX- and VME-based SBCs targeting defense platforms.
Recommended
Test and Measurement Telecom Line Cards
In telecom test and measurement line cards, the P5020NXN1QMB acts as the protocol-aware traffic generator and analyzer because the dual e5500 cores sustain line-rate TDM/IP conversion at 1G/10G speeds using the on-chip TDM and 10GE MACs. ECC memory preserves counters and statistics across long burn-in captures where a single bit-flip could invalidate a conformance test result. PCIe Gen 2 connects to FPGA-based protocol-aware probes for non-intrusive tapping. NXP reference designs show the P5020 platform supporting telecom load generators with simultaneous multiple egress interfaces, which is essential for stress-testing carrier equipment during conformance certification.
Recommended
Recommended Products Summary
Engineering reference data for P5020NXN1QMB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P5020NXN7QMB | P5020NXE7QMB | P5020NXN7TMB | P5020NXN1TMB | P5040NXN1QMB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1295-FCBGA (37.5x37.5) | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same | 1295-FCBGA (37.5x37.5) - same |
| Core Count | 2 e5500 cores | 2 e5500 cores | 2 e5500 cores | 2 e5500 cores | 2 e5500 cores | 4 e5500 cores |
| Maximum Frequency | 2.0 GHz | 2.0 GHz | 2.0 GHz | 2.0 GHz | 2.0 GHz | 2.0 GHz |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Encryption (SEC 4.0) | Disabled (NXN1) | Enabled (NXN7) | Enabled (NXE7) | Enabled (NXN7) | Disabled (NXN1) | Disabled (NXN1) |
| Memory Controller | DDR3/3L ECC, 32 GB, 1333 MT/s | DDR3/3L ECC, 32 GB, 1333 MT/s | DDR3/3L ECC, 32 GB, 1333 MT/s | DDR3/3L ECC, 32 GB, 1333 MT/s | DDR3/3L ECC, 32 GB, 1333 MT/s | DDR3/3L ECC, 32 GB, 1600 MT/s |
| Packaging Form | Tape & Reel (Q) | Tape & Reel (Q) | Tape & Reel (Q) | Tray (T) | Tray (T) | Tape & Reel (Q) |
Key Differentiators
- Encryption-disabled SKU variant for export-control-friendly deployments (vs P5020NXN7QMB)
- Lower unit cost in 100-piece quantities than four-core P5040 (vs P5040NXN1QMB)
- Extended-temperature grade for industrial and defense deployments (vs P5020NXN1VMB (commercial temp variant))
Design Notes
Estimated: at 2.0GHz dual-core full-load on the e5500 cores plus saturated 10GE I/O, junction power dissipation on the P5020NXN1QMB typically sits between 14W and 22W depending on workload. Designers should provide a heatsink rated for at least 1.0 C/W thermal resistance with chassis airflow of 200 LFM or more, or a cold-plate interface for conduction-cooled VPX deployments. Thermal vias in the FCBGA land pattern are mandatory to keep junction-to-case delta within the 105C ambient ceiling.
The 1295-ball FCBGA at 1.0 mm pitch requires 8 to 12 PCB layers with matched-impedance routing for DDR3 byte lanes and a microvia stack-up such as 1-2-3-4 staggered. Use the NXP P5020 design checklist (AN4717) for via-in-pad recommendations and escape routing; place decouplers on the bottom side of the BGA within the package footprint using microvia transitions. Ground and power plane cuts must not cross DDR3 address/clock regions, or signal integrity will degrade beyond ECC tolerance.
Do not leave any P5020NXN1QMB boot configuration pins floating: tie HRESET, cfg_reset_source pins through the documented reset word resistors, otherwise the RCW boot loader may stall. Use ECC-supported DIMM population rules; non-ECC parts will not pass power-on memory initialization on QorIQ P5 silicon. Ensure the SEC 4.0 disable fuse is consistent across P5020NXN1 variants - mixing NXN1 (no encryption) with NXN7 (encryption enabled) on the same board is allowed but firmware image changes must be tracked.
Route each 10GbE differential pair with 100-ohm differential impedance and length matching within 0.127 mm (5 mil) per NXP layout guidelines; place AC coupling capacitors at the PHY side of the connector. Power delivery requires a 6-phase VRM at minimum for the VDD core rail, with bulk and ceramic decoupling distributed uniformly under the FCBGA. Reference NXP QorIQ P5 hardware design guide, AN4110 for power-rail sequencing during cold boot.
Compliance Information
NXP QorIQ P5 family is RoHS compliant and lead-free per NXP product page; extended-temperature parts (QMB suffix) are not AEC-Q100 since AEC-Q100 targets automotive-grade semiconductors with discrete power ratings.
