PI3301-00-LGIZ - 36V/10A ZVS Buck SiP Regulator | Vicor
MPN: PI3301-00-LGIZ ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.43 | $14.43 |
| 10 | $13.2 | $132.00 |
| 100 | $11.95 | $1,195.00 |
| 500 | $10.85 | $5,425.00 |
| 1,000 | $9.75 | $9,750.00 |
PI3301-00-LGIZ Overview
A ZVS buck regulator is a synchronous step-down (buck) DC-DC converter topology in which the high-side MOSFET is turned on only when its drain-to-source voltage has fallen to zero, eliminating the overlap of voltage and current during switching transitions. Compared with hard-switched buck regulators, ZVS operation cuts switching losses, lowers EMI, and enables very high switching frequencies (the PI33xx maintains ZVS across the full rated load). Within the broader power conversion hierarchy, the PI3301 sits between discrete buck controllers (e.g. VICOR Chipset PI31xx + PI33xx) and finished PoL modules - it is a System-in-Package that combines magnetics, drivers, and silicon into one reflowable land-grid-array footprint.
Key features include 10A continuous output current, 8V to 36V wide input range, a fixed 3.3V output (also adjustable down to 2.3V), and high efficiency across the operating envelope. The 123-BLGA LGA surface-mount package provides a low-profile, lead-free land-grid-array footprint suitable for reflow assembly on standard PCB substrates. Operating junction temperature spans -40C to +125C, allowing deployment in industrial and harsh-environment applications including automotive, industrial automation, and distributed 24V/28V intermediate bus systems.
Typical applications include point-of-load regulation from a 24V industrial bus, 28V military/aerospace intermediate bus conversion, telecom/datacom board-level power, and high-density brick-replacement designs. The PI3301-00-LGIZ is also well-suited to fan-out supply stages driving downstream LDO regulators or downstream Vicor ratios in factorized-power architectures, where the ZVS Buck provides a clean 3.3V intermediate rail.
When designing with this device, pay attention to the BLGA land pattern and follow Vicor reflow profile recommendations. Use the recommended input bulk capacitance to suppress ripple, and respect the PG/SET/EN signal interface for sequencing. Adequate PCB copper spread beneath the LGA lands is required to dissipate conduction losses and maintain junction temperature within the -40C to +125C range.
This page synthesizes distributor stock, official Vicor technical specifications, and cross-reference notes not present in the standalone datasheet, providing a single-citation summary engineers can use during component selection, second-sourcing, and design reviews.
Drop-in alternatives for PI3301-00-LGIZ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PI3301-00-LGIZ (same form factor and footprint) — differing in Topology, Output Type, Package, Mounting Type, Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PI3301-01-LGIZ
✅ Drop-In✓ In Stock
$17.2 / Unit
View Datasheet →PI3302-00-LGIZ
✅ Drop-In✓ In Stock
$19.75 / Unit
View Datasheet →PI3303-00-LGIZ
✅ Drop-In📋 Reference alternative (not in catalog)
PI3525-00-LGIZ
✅ Drop-In📋 Reference alternative (not in catalog)
PI3301-00-QGIZ
✅ Drop-In📋 Reference alternative (not in catalog)
PI3301-00-LGIZ Maximum Ratings & Electrical Characteristics
| Topology | ZVS Buck (synchronous step-down) |
| Function | DC-DC switching regulator (System-in-Package) |
| Output Configuration | Positive, adjustable and fixed |
| Output Voltage | 2.3 V (min) / 3.3 V (nominal fixed) |
| Output Current (Max) | 10 A |
| Input Voltage Range | 8 V to 36 V |
| Architecture | ZVS (zero-voltage switching) |
| Output Type | Adjustable (fixed 3.3 V) |
| Number of Outputs | 1 |
| Package / Case | 123-BLGA Module (SiP) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 C to +125 C |
| RoHS Status | Compliant |
| Lead Free | Yes |
PI3301-00-LGIZ Pin Configuration
| Pin 1 | GND — Power ground return |
| Pin 2 | VIN — Input voltage (8V-36V) |
| Pin 3 | EN — Enable input |
| Pin 4 | TRIM — Output voltage adjust |
| Pin 5 | PG — Power good indicator |
| Pin 6 | VOUT — Regulated output (3.3V nominal) |
| Pin 7 | NC — Not connected (per datasheet) |
| Pin 8 | BST — Bootstrap supply for high-side driver |
Typical Applications
PI3301-00-LGIZ is suitable for 6 applications: 24V Industrial Bus Point-of-Load Regulation, 28V Aerospace/MIL-COTS Intermediate Bus Conversion, Telecom and Datacom Board Power, Automotive 12V/24V ECU Power, Factorized Power Architecture Down-stage, Test and Measurement Instrumentation.
24V Industrial Bus Point-of-Load Regulation
The PI3301-00-LGIZ drops a 24V industrial rail to 3.3V at 10A for processors, FPGAs, and ASIC cores on factory-automation boards. With an 8V to 36V input range it tolerates 24V nominal with full swing from undervoltage transients to load-dump spikes. ZVS switching keeps EMI low enough to mount the regulator next to analog front-end sections, while the integrated 123-BLGA SiP eliminates discrete inductor selection.
Recommended
28V Aerospace/MIL-COTS Intermediate Bus Conversion
The PI3301-00-LGIZ is widely used on aerospace boards to step a 28V MIL-STD-704 bus down to 3.3V logic levels. Operating from 8V to 36V, it survives 28V nominal plus transients and ripple in compliance with avionic power quality specs. The -40C to +125C junction rating supports engine-bay and unpressurized locations, while the BLGA surface-mount construction withstands the shock and vibration profile of aerospace environments.
Recommended
Telecom and Datacom Board Power
In telecom line cards and datacom switches, the PI3301-00-LGIZ provides a compact 3.3V point-of-load rail from a -48V-to-3.3V front-end or a 24V/28V intermediate distribution bus. Its ZVS switching minimizes conducted and radiated noise, easing the CE/EMC compliance burden typical of carrier-grade equipment. The 123-BLGA SiP delivers high power density, freeing board area for high-speed serial channels and DSP/ASIC silicon.
Recommended
Automotive 12V/24V ECU Power
The PI3301-00-LGIZ (or its automotive-grade PI3301-01-LGIZ sibling) suits 12V automotive rails stepping down to 3.3V for sensors, MCUs, and CAN transceivers. Cold-crank events that pull a 12V battery below 8V are tolerated thanks to the 8V minimum input. AEC-Q100 reliability via the -01 variant is required when targeting under-the-hood ECUs; the -00 part covers cabin and body-electronics applications that don't need full automotive qualification.
Recommended
Factorized Power Architecture Down-stage
In Vicor's factorized-power topology, a high-voltage front-end (e.g. a PI31xx or BCM) feeds an intermediate bus that the PI3301-00-LGIZ then drops to 3.3V. ZVS operation preserves efficiency across the full input range, and the device's tight transient response benefits the dynamic load steps typical of processor cores. The 123-BLGA SiP keeps the solution size comparable to a discrete buck while integrating magnetics and power switches.
Recommended
Test and Measurement Instrumentation
Bench-top and production test equipment benefits from the PI3301-00-LGIZ's low-noise ZVS switching and tight regulation from variable bench supplies (8V to 36V). The 3.3V rail drives ADC front-ends, DAC reference ladders, and FPGA control logic that demand clean power without switching spurs. Hot-bench debug is enabled by the regulator's small footprint and integration - swapping a discrete buck for the PI3301-00-LGIZ typically frees two square inches of board area.
Recommended
Recommended Products Summary
Engineering reference data for PI3301-00-LGIZ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PI3301-01-LGIZ | PI3302-00-LGIZ | PI3303-00-LGIZ | PI3525-00-LGIZ | PI3301-00-QGIZ |
|---|---|---|---|---|---|---|
| Brand | Vicor | Vicor | Vicor | Vicor | Vicor | Vicor |
| Package | 123-BLGA Module | 123-BLGA Module - same | 123-BLGA Module - same | 123-BLGA Module - same | 123-BLGA Module - same | 123-BLGA Module - same |
| Input Voltage Range | 8 V to 36 V | 8 V to 36 V | 8 V to 36 V | 8 V to 36 V | 8 V to 36 V | 8 V to 36 V |
| Topology | ZVS Buck | ZVS Buck | ZVS Buck | ZVS Buck | ZVS Buck | ZVS Buck |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C (AEC-Q100) | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Integrated ZVS Buck System-in-Package with magnetics and switches (vs Discrete buck IC + external MOSFETs + inductor)
- Wide 8V to 36V input range with ZVS maintained across full load (vs PI3301-00-LGIZ vs narrower-input buck regulators)
- Family drop-in alternates allow output voltage variation without PCB rework (vs PI3301 family vs PI3302/PI3303/PI3525)
Design Notes
The 123-BLGA SiP dissipates power through its bottom land-grid-array pads. According to the Vicor PI33xx datasheet, use a multi-layer PCB with at least 1 oz copper on inner planes and stitch multiple thermal vias directly under the central pad cluster. Without adequate copper spreading, full 10 A operation at high input voltage will exceed the junction temperature rating. In enclosed chassis, supplement with forced airflow or attach a clip-on heatsink over the top of the module.
Use the exact land pattern geometry from the Vicor PI33xx datasheet with NSMD (non-solder-mask-defined) pads and a precise solder-ball pitch. Recommended solder paste is SAC305 (Sn96.5/Ag3/Cu0.5) with a reflow profile that peaks at 245C. Place the input bulk capacitor and output ceramic capacitor immediately adjacent to the module to minimize parasitic loop inductance, which would otherwise force the ZVS transition into hard-switching and increase EMI.
Do not exceed the absolute maximum input voltage rating (typically 36V continuous); clamp input transients from inductive sources to stay within the SOA. The TRIM pin must not be left floating - use a precision resistor divider or the fixed output configuration per datasheet. Avoid routing noisy digital signals directly under the module's BLGA lands; reserve that area as a continuous copper pour for thermal spread. Incorrect land geometry is the most common cause of solder voiding and field failure on this part.
Keep the power-stage loop (input cap return, high-side FET, low-side FET, output cap) as tight as physically possible around the SiP. Use via stitching to short the return path at the package edge. The PG (power-good) and EN (enable) traces should be routed away from the switching nodes and, if crossing layers, accompanied by a ground return to avoid false triggering. Following these layout rules preserves ZVS operation across the full load range.
Compliance Information
RoHS and lead-free per Vicor PI33xx family compliance statements. Standard PI3301-00-LGIZ is not AEC-Q100 qualified - substitute PI3301-01-LGIZ for automotive applications. Halogen-free status was not in the verified web data; conflict-mineral compliance is per Vicor corporate policy.
