PIC16F1773-I/MX - 8-Bit MCU, 7KB Flash, 32MHz, 28-UQFN | Microchip
MPN: PIC16F1773-I/MX β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.45 | $2.45 |
| 10 | $2.18 | $21.80 |
| 100 | $1.92 | $192.00 |
| 500 | $1.71 | $855.00 |
| 1,000 | $1.49 | $1,490.00 |
PIC16F1773-I/MX Overview
A microcontroller (MCU) is a single-chip computer containing a CPU core, non-volatile program memory (Flash), working RAM, and a configurable set of digital and analog peripherals. The PIC16F1773 belongs to Microchip's enhanced mid-range 8-bit PIC16 family, which targets applications requiring intelligent analog integration alongside traditional digital control. Within the broader taxonomy, this device sits at: microcontroller -> 8-bit MCU -> PIC16F1xxx enhanced mid-range family -> XLP (eXtreme Low Power) -> power-conversion-optimized sub-family.
Key differentiating features include the on-chip 10-bit DAC and operational amplifiers, which allow closed-loop analog control without external components; the Peripheral Pin Select (PPS) crossbar, which remaps digital peripherals to virtually any I/O pin; and a comprehensive PWM engine supporting complementary outputs, dead-band control, and variable phase for half-bridge and full-bridge power topologies. The 100mA high-current I/O drivers can directly drive power MOSFET gates or LED strings, eliminating external driver stages.
Architecturally, the device uses a 14-bit instruction word with a Harvard bus, single-cycle execution except for program branches, and a hardware multiplier for faster math. The XLP variant incorporates nanoWatt sleep modes with current as low as and a 16kHz Low-Power Timer running from an internal Low-Power Low-Speed oscillator, making battery-powered designs feasible. The integrated Core Independent Peripherals (CIPs) - such as the Complementary Waveform Generator, CWG, and Numerically Controlled Oscillator, NCO - execute tasks without CPU intervention, freeing the core for system-level logic.
Typical applications include LED lighting drivers (commercial and architectural), digital switch-mode power supplies (SMPS), battery chargers, brushless DC (BLDC) motor control, and general-purpose mixed-signal embedded products where the on-chip analog and PWM peripherals replace multiple discrete components. The wide operating voltage range and industrial temperature grade extend use to factory-automation, instrumentation, and HVAC subsystems.
Designers should plan the ground-return network carefully: the exposed thermal pad is the primary heat-dissipation path and the substrate tie, so it must be soldered to a generously sized copper pour tied to digital ground. The PPS feature means pin assignments are configurable in firmware, simplifying PCB routing but also requiring that firmware disable unused peripherals to prevent contention on remapped pins.
This page synthesizes distributor stock and pricing, drop-in alternatives from the same Microchip family, and practical design notes that go beyond what the manufacturer datasheet alone provides.
Drop-in alternatives for PIC16F1773-I/MX β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F1773-I/MX (same form factor and footprint) β differing in Comparators, Core Architecture, Package, DAC, ADC.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
PIC16F1776-I/MX
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
PIC16F1778-I/MX
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
PIC16F1779-I/MX
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
PIC16F15356-I/MX
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$1.39 / Unit
View Datasheet βPIC16F1773-I/MX Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC16 (Enhanced Mid-Range 8-bit) |
| CPU Frequency (max) | 32 MHz |
| Instruction Word Width | 14-bit |
| Program Flash Memory | 7 KB (4K x 14 words) |
| Data SRAM | 512 B |
| Data EEPROM | 25 B |
| Package | 28-pin UQFN (6x6 mm) with exposed thermal pad |
| Operating Voltage Range | 2.3 V to 5.5 V |
| DAC | 10-bit |
| Comparators | On-chip |
| PWM Modules | 10/16-bit with complementary outputs and PPS |
| High-Current I/O Drive | 100 mA source/sink per pin |
| Communication Interfaces | EUSART, SPI, I2C |
| Peripheral Pin Select (PPS) | Yes - digital peripherals remappable to any I/O |
| Operating Temperature Range | -40C to +85C (Industrial, -I suffix) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC16F1773-I/MX Pin Configuration
| Pin 1 | RA0 β PORTA bit 0; analog/digital I/O via PPS |
| Pin 2 | RA1 β PORTA bit 1; analog/digital I/O via PPS |
| Pin 3 | RA2 β PORTA bit 2; analog/digital I/O via PPS |
| Pin 4 | RA3 β PORTA bit 3; digital I/O only |
| Pin 5 | RA4 β PORTA bit 4; analog/digital I/O via PPS |
| Pin 6 | RA5 β PORTA bit 5; analog/digital I/O via PPS |
| Pin 7 | RA6 β PORTA bit 6; analog/digital I/O via PPS |
| Pin 8 | RA7 β PORTA bit 7; analog/digital I/O via PPS |
| Pin 9 | VSS β Digital ground |
| Pin 10 | RB0 β PORTB bit 0; analog/digital I/O via PPS, ICSPDAT |
| Pin 11 | RB1 β PORTB bit 1; analog/digital I/O via PPS, ICSPCLK |
| Pin 12 | RB2 β PORTB bit 2; analog/digital I/O via PPS |
| Pin 13 | RB3 β PORTB bit 3; analog/digital I/O via PPS |
| Pin 14 | RB4 β PORTB bit 4; analog/digital I/O via PPS |
| Pin 15 | RB5 β PORTB bit 5; analog/digital I/O via PPS |
| Pin 16 | RB6 β PORTB bit 6; analog/digital I/O via PPS, ICSP programming clock |
| Pin 17 | RB7 β PORTB bit 7; analog/digital I/O via PPS, ICSP programming data |
| Pin 18 | VDD β Positive supply voltage (2.3 V to 5.5 V) |
| Pin 19 | VSS β Digital ground |
| Pin 20 | RC0 β PORTC bit 0; analog/digital I/O via PPS |
| Pin 21 | RC1 β PORTC bit 1; analog/digital I/O via PPS |
| Pin 22 | RC2 β PORTC bit 2; analog/digital I/O via PPS |
| Pin 23 | RC3 β PORTC bit 3; analog/digital I/O via PPS |
| Pin 24 | RC4 β PORTC bit 4; analog/digital I/O via PPS |
| Pin 25 | RC5 β PORTC bit 5; analog/digital I/O via PPS |
| Pin 26 | RC6 β PORTC bit 6; analog/digital I/O via PPS |
| Pin 27 | RC7 β PORTC bit 7; analog/digital I/O via PPS |
| Pin 28 | VDD β Positive supply voltage (tied to pin 18) |
| Pin EP | EP β Exposed thermal pad - must be soldered to VSS copper pour for thermal dissipation and substrate tie |
Typical Applications
PIC16F1773-I/MX is suitable for 6 applications: LED Lighting Drivers, Switch-Mode Power Supplies (SMPS), Battery Charging Systems, Brushless DC (BLDC) Motor Control, General-Purpose Mixed-Signal Embedded Products, Factory Automation and HVAC Subsystems.
LED Lighting Drivers
The PIC16F1773-I/MX is purpose-built for commercial and architectural LED lighting. The 16-bit PWM with center-aligned mode, complementary outputs, and dead-band control drives HB-LED strings up to 100 mA directly from the high-current I/O pins, eliminating external MOSFET drivers. The 10-bit DAC sets the constant-current reference, while the on-chip op-amp closes the current-sense loop without external analog ICs. With Peripheral Pin Select, the same firmware can map PWM channels to alternate pins to optimize PCB layout for different LED topologies (series, parallel, or matrix).
Recommended
Switch-Mode Power Supplies (SMPS)
The PIC16F1773-I/MX integrates every digital primitive required for a digital SMPS: a Programmable Ramp Generator (PRG) for slope compensation, a high-speed comparator (HS Comp) for peak-current-mode control, 16-bit PWM with phase shifting for interleaved topologies, and a 10-bit DAC to generate the reference voltage. The 32 MHz core executes voltage-mode and current-mode control loops with deterministic latency. This level of integration shrinks the analog BOM, reduces board area, and enables firmware-based tuning that replaces trim-pots - a key advantage in high-volume production.
Recommended
Battery Charging Systems
The PIC16F1773-I/MX supports Li-Ion, LiFePO4, lead-acid, and NiMH charging profiles through firmware-driven CC/CV loops. The on-chip 10-bit ADC measures battery voltage and charge current, while the 10-bit DAC sets the constant-current target. The op-amp conditions the current-sense shunt signal directly, and the 16-bit PWM drives the synchronous-rectifier MOSFETs with proper dead-band. The wide 2.3-5.5 V operating range suits single-cell Li-Ion stacks, and the XLP sleep modes drop quiescent current for shelf-mode chargers to microampere levels.
Recommended
Brushless DC (BLDC) Motor Control
Sensorless and Hall-sensor BLDC control both fit the PIC16F1773-I/MX. The Complementary Waveform Generator (CWG) hardware block produces the 6-step or sinusoidal commutation pattern with dead-band insertion without CPU intervention, while the 16-bit PWM provides speed/torque control. The zero-cross detect (ZCD) peripheral supports back-EMF sensing for sensorless commutation. The op-amp conditions phase-current feedback for current-mode torque control. Firmware update is straightforward through ICSP, and PPS enables flexible PCB routing of the 3-phase gate signals.
Recommended
General-Purpose Mixed-Signal Embedded Products
Beyond power conversion, the PIC16F1773-I/MX serves general embedded designs that need on-chip analog alongside digital I/O: HVAC control panels, industrial sensor transmitters, consumer appliances, and IoT edge nodes. The PPS system lets designers route EUSART, SPI, I2C, and PWM to any pin, simplifying PCB layout. The Core Independent Peripherals (CIPs) - CWG, NCO, CLC - handle timing-critical tasks in hardware, leaving the CPU free for application logic. Operating from 2.3-5.5 V at -40C to +85C, the part fits commercial and industrial environments.
Recommended
Factory Automation and HVAC Subsystems
Industrial temperature grade (-40C to +85C), robust ESD ratings, and the wide 2.3-5.5 V supply make the PIC16F1773-I/MX well suited for factory floor controllers, sensor-conditioning hubs, and HVAC damper/valve actuators. The on-chip op-amps interface directly with 4-20 mA current-loop sensors, while the 16-bit PWM drives proportional valves. EUSART and I2C connect to industrial transceivers (RS-485, CAN - via external controllers). The XLP nanoWatt technology minimizes standby power in battery-backed sensor nodes that spend most of their life in sleep mode.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F1773-I/MX β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F1776-I/MX | PIC16F1778-I/MX | PIC16F1779-I/MX | PIC16F15356-I/MX |
|---|---|---|---|---|---|
| Package | 28-UQFN (6x6) | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Family | PIC16 enhanced mid-range 8-bit | PIC16 enhanced mid-range 8-bit | PIC16 enhanced mid-range 8-bit | PIC16 enhanced mid-range 8-bit | PIC16 next-gen 8-bit (newer core) |
| CPU Frequency (max) | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Flash Memory | 7 KB | 14 KB (+100%) | 28 KB (+300%) | 28 KB (+300%) | 28 KB (+300%) |
| SRAM | 512 B | 1 KB (+100%) | 2 KB (+300%) | 2 KB (+300%) | 2 KB (+300%) |
| EEPROM | 25 B | 128 B | 256 B | 256 B | 256 B |
| 10-bit DAC / Op-amps | Yes (DAC + Op-amps) | Yes (DAC + Op-amps) | Yes (DAC + Op-amps) | Yes (DAC + Op-amps) | No (DAC absent, op-amps reduced) |
| PWM Resolution | 10/16-bit with CWG dead-band | 10/16-bit with CWG dead-band | 10/16-bit with CWG dead-band | 10/16-bit with CWG dead-band | 10-bit, complementary outputs, no dead-band |
| Operating Voltage | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
Key Differentiators
- On-chip 10-bit DAC plus dedicated op-amps (vs PIC16F15356-I/MX)
- 16-bit PWM with hardware dead-band and CWG (vs PIC16F1768-I/ML)
- Smaller flash footprint for cost-sensitive SKUs (vs PIC16F1779-I/MX)
- Peripheral Pin Select (PPS) for flexible routing (vs PIC16F1719-I/PT)
Design Notes
The 28-UQFN package's primary heat-dissipation path is the central exposed pad (EP). Solder the EP directly to a VSS copper pour at least 200 mm x 200 mm on the top layer (1 oz copper) and stitch it with thermal vias to an inner ground plane. Without adequate EP soldering, the junction-to-ambient thermal resistance (theta_JA) can exceed 60 C/W, derating continuous PWM output drive capability. Estimated: at 100 mA per pin with 4 pins simultaneously sourcing into a 5 V load, internal dissipation is roughly 0.5 W - well within the EP-soldered limit but marginal without it.
Place the 0.1 uF VDD decoupling capacitor within 3 mm of pins 18 and 28, and a bulk 1 uF-10 uF within 10 mm. The PIC16F1773 has dual VDD pins; route both to the same net with a short, low-impedance trace. Keep the ICSP lines (RB6/RB7) routed away from PWM switching nodes and oscillator traces to prevent programming errors. The exposed pad and the VSS pin (pin 9) must be on a single continuous ground pour with no signal traces cutting through it.
Peripheral Pin Select (PPS) remapping is configured in firmware AFTER each reset - if you skip PPS initialization, default pin assignments apply and remapped peripherals will not function. Always disable unused peripherals to prevent contention on remapped pins. The 16-bit PWM timebase must be configured before enabling the CWG; mis-ordered initialization can produce a single full-duty-cycle pulse that may damage power stages. For analog inputs above VDD (e.g., 5 V signal on a 3.3 V-VDD part), use the input-clamp diodes or an external resistor divider.
When the high-current I/O pins (100 mA) drive cables or long PCB traces, add a 10 ohm-33 ohm series damping resistor close to the IC pin to slow the edge and limit ringing. For PWM frequencies above 250 kHz, treat the PWM outputs as transmission lines and maintain a continuous reference plane beneath them. The on-chip op-amp outputs are not designed to drive capacitive loads above 100 pF directly; add an isolation resistor (100 ohm-1 kohm) if the load is capacitive.
Spread-spectrum clock and PWM frequency modulation reduce peak EMI emissions; the PIC16F1773 supports PWM phase-shift and frequency-dither modes that distribute switching harmonics across a wider band, easing compliance with FCC/CE conducted-emissions limits. For CE Class B at switching frequencies above 500 kHz, place a common-mode choke on the power input and ensure the EP ground pour is continuous under the IC and into the power-train area without gaps that force return currents around them.
Compliance Information
Compliant per Microchip product page environmental information. Not AEC-Q100 qualified - for under-hood automotive applications, select a PIC16F1xxx variant that is AEC-Q100 qualified.
