PIC16F1823-I/ML - 8-Bit MCU, 3.5KB Flash, 32MHz XLP | Microchip
MPN: PIC16F1823-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.8 | $2.80 |
| 10 | $2.52 | $25.20 |
| 100 | $2.25 | $225.00 |
| 500 | $2.02 | $1,010.00 |
| 1,000 | $1.85 | $1,850.00 |
PIC16F1823-I/ML Overview
An 8-bit PIC microcontroller is a RISC-based CMOS processor that executes one instruction per clock cycle (except branches), combining a compact instruction set, integrated peripherals, and on-chip non-volatile memory to deliver deterministic real-time control in a small footprint. PIC MCUs sit within the broader hierarchy of embedded microcontrollers -> microcontrollers -> microprocessors -> semiconductors, and are widely deployed in cost-sensitive consumer, industrial, and IoT edge-node designs where predictable timing and low power outweigh raw throughput.
Key features of the PIC16F1823 family include: 10-bit ADC with computation (ADC²), enhanced PWM with up to four channels, multiple serial interfaces (I2C, SPI, EUSART), up to 16 capacitive-touch channels via the mTouch® sensing module, and on-chip debugging. The XLP technology suite (nanoWatt XLP) integrates multiple low-power modes (Doze, Idle, Sleep) and a power-managed peripheral gating system to extend battery life in sensor and remote-control applications.
The architecture combines a 14-bit wide instruction word with a 16-level hardware stack and a priority interrupt controller, plus the Peripheral Pin Select (PPS) subsystem that allows digital peripheral I/O mapping to any device pin, simplifying PCB layout. Internal voltage reference and fixed-voltage reference options reduce external component count, while the integrated temperature indicator provides basic die-temperature sensing for thermal management.
Typical applications include battery-powered sensor nodes, low-cost remote controls, LED lighting controllers, small appliance control boards, and IoT edge devices. Designers choose this part when 3.5KB of Flash is sufficient and ultra-low sleep current is critical; for higher memory needs the PIC16F1825/1826/1827/1829 or PIC16F1847 families provide larger Flash within the same QFN footprint.
When designing with this device, allocate an extra ground pin copper pour under the exposed pad for thermal relief, and review the PPS mapping in MPLAB® X IDE before committing the schematic. Always verify that the chosen debug tool (PICkit™ 3 or MPLAB® ICD 3) supports the 16-QFN variant. This page combines distributor pricing, drop-in alternatives, and design notes not collated in the manufacturer datasheet.
Drop-in alternatives for PIC16F1823-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F1823-I/ML (same form factor and footprint) — differing in ADC, Package, Program Memory (Flash), I/O Pins, MSL Level.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F1823T-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F1824-I/ML
✅ Drop-In✓ In Stock
$1.18 / Unit
View Datasheet →PIC16F1704-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F1823-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F1823T-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F1823-I/ML Maximum Ratings & Electrical Characteristics
| Family | PIC16F (PIC® XLP™) |
| Core | 8-bit PIC RISC, enhanced mid-range |
| Maximum CPU Frequency | 32 MHz |
| Program Memory (Flash) | 3.5 KB (2K x 14) |
| RAM | 128 bytes |
| EEPROM | 256 bytes |
| I/O Pins | 12 |
| Supply Voltage (VDD) | 2.5 V to 5.5 V |
| Operating Temperature | -40C to +85C (Industrial) |
| Internal Oscillator | 32 MHz (factory calibrated, ±1% typical) |
| ADC | 10-bit, up to 8 channels |
| PWM | Enhanced CCP/ECCP, up to 4 channels |
| Serial Interfaces | EUSART, I2C, SPI |
| Package | 16-QFN (4x4 mm), ML suffix |
| Mounting Type | Surface Mount |
| MSL Level | 1 |
| RoHS Status | Compliant |
| Low-Power Technology | nanoWatt XLP (Sleep current < 50 nA typical) |
PIC16F1823-I/ML Pin Configuration
| Pin 1 | RA5 — Bidirectional I/O, also ICSPCLK |
| Pin 2 | RA4 — Bidirectional I/O, also AN3, CPS3 |
| Pin 3 | RA3 — Bidirectional I/O, also MCLR, VPP |
| Pin 4 | RC5 — Bidirectional I/O, also CCP1, P1A |
| Pin 5 | RC4 — Bidirectional I/O, also AN8, CPS11 |
| Pin 6 | RC3 — Bidirectional I/O, also SCL, SCK |
| Pin 7 | RC2 — Bidirectional I/O, also AN6, CPS9 |
| Pin 8 | RC1 — Bidirectional I/O, also AN5, CPS8 |
| Pin 9 | RC0 — Bidirectional I/O, also AN4, CPS7 |
| Pin 10 | RA2 — Bidirectional I/O, also AN2, CPS2 |
| Pin 11 | RA1 — Bidirectional I/O, also ICSPDAT, AN1, CPS1 |
| Pin 12 | RA0 — Bidirectional I/O, also AN0, CPS0 |
| Pin 13 | VDD — Positive supply voltage (2.5 V to 5.5 V) |
| Pin 14 | VSS — Ground reference |
| Pin 15 | RA7 — Bidirectional I/O, also OSC1, CLKIN |
| Pin 16 | RA6 — Bidirectional I/O, also OSC2, CLKOUT |
| Pin 17 | EP — Exposed thermal pad - connect to VSS |
Typical Applications
PIC16F1823-I/ML is suitable for 6 applications: Battery-Powered Sensor Node, IR Remote Control Transmitter, LED Lighting Controller, Small Appliance Control Board, Capacitive Touch User Interface, Automotive Accessory Module.
Battery-Powered Sensor Node
The PIC16F1823-I/ML's nanoWatt XLP architecture delivers typical sleep currents under 50 nA, which directly extends battery life in wireless sensor nodes transmitting every few minutes via I2C or SPI. The 32 MHz internal oscillator eliminates an external crystal, reducing BOM cost and quiescent draw by ~1 mA. With 12 I/O and 8 ADC channels, the part handles multiple environmental sensors and an mTouch button interface. At 3.3 V supply the part consumes approximately 1.8 mA active at 8 MHz, making it well-suited for coin-cell powered IoT endpoints. The 3.5 KB Flash is ample for lightweight C or assembly sensor-fusion firmware on platforms like MPLAB® X IDE with XC8 compiler.
Recommended
IR Remote Control Transmitter
The PIC16F1823-I/ML's low active current and integrated IR-friendly timers make it ideal for handheld remote controls powered by two AAA cells. The Enhanced PWM module can modulate a 38 kHz carrier without CPU intervention, leaving the core idle to save power. The mTouch capacitive sensing peripheral supports up to 16 touch buttons without external RC components. Operating voltage down to 2.5 V accommodates the AA discharge curve down to ~2.0 V with headroom. The 3.5 KB Flash comfortably stores NEC, RC5, and SIRC protocols alongside button scanning logic. Industrial temperature grade supports garage-door and outdoor lighting remotes.
Recommended
LED Lighting Controller
The PIC16F1823-I/ML's four PWM channels drive RGBW LED strings with 10-bit resolution, providing smooth dimming and color mixing without external drivers for low-current applications. The 10-bit ADC reads ambient light sensors and potentiometers for closed-loop brightness control. Internal 32 MHz oscillator provides stable PWM frequency without external components, reducing cost. The PIC's 2.5 V to 5.5 V supply range supports both 3.3 V logic and 5 V analog LED chains. Sleep current under 50 nA is critical for always-on standby lighting fixtures. ECCP auto-shutdown features protect LEDs on fault conditions.
Recommended
Small Appliance Control Board
Coffee makers, blenders, and toaster ovens benefit from the PIC16F1823-I/ML's combination of 12 I/O pins, ADC, PWM, and EUSART for sensing and motor control. The 32 MHz CPU processes sensor inputs and triac/relay drive logic with deterministic timing. Industrial -40C to +85C operation covers kitchen and laundry environments. Enhanced CCP modules generate zero-crossing triggers and phase-controlled dimming signals. With 3.5 KB Flash there is headroom for user-interface menus, EEPROM holds user settings across power cycles. The QFN-16 footprint suits compact control boards where SOIC would not fit.
Recommended
Capacitive Touch User Interface
The PIC16F1823-I/ML integrates Microchip's mTouch® peripheral with up to 16 capacitive-touch channels, supporting touch buttons, sliders, and proximity sensors without external RC networks. The integrated 10-bit ADC and CTMU (Charge Time Measurement Unit) deliver reliable touch detection with minimal firmware overhead. Industrial temperature range and 2.5 V to 5.5 V supply cover consumer-electronics and white-goods interfaces. Sleep current below 50 nA enables battery-powered touch remotes that wake on touch. The 16-QFN package keeps the BOM compact for touch panels behind glass or plastic overlays.
Recommended
Automotive Accessory Module
For non-safety automotive accessories such as interior lighting controllers, USB chargers, or seat-heater modules, the PIC16F1823-I/ML's industrial -40C to +85C temperature grade and 2.5 V to 5.5 V supply tolerance handle 12 V battery transients when paired with proper protection. The 32 MHz CPU decodes LIN bus messages via the EUSART, and the 10-bit ADC monitors current sensors for fault detection. While the -I part is not AEC-Q100 qualified, Microchip offers automotive-grade PIC16F variants in the same QFN-16 footprint for production designs. The 3.5 KB Flash holds LIN-stack and application firmware.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F1823-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F1823T-I/ML | PIC16F1824-I/ML | PIC16F1704-I/ML | PIC16F1823-E/ML | PIC16F1823T-E/ML |
|---|---|---|---|---|---|---|
| Package | 16-QFN (4x4 mm) | 16-QFN (4x4 mm) - same | 16-QFN (4x4 mm) - same | 16-QFN (4x4 mm) - same | 16-QFN (4x4 mm) - same | 16-QFN (4x4 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 3.5 KB | 3.5 KB - same | 7 KB (+100%) | 7 KB (+100%) | 3.5 KB - same | 3.5 KB - same |
| RAM | 128 bytes | 128 B - same | 256 B (+100%) | 512 B (+300%) | 128 B - same | 128 B - same |
| Maximum CPU Frequency | 32 MHz | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same | 32 MHz - same |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same | -40C to +125C (Extended) | -40C to +125C (Extended) |
| Operating Voltage | 2.5 V to 5.5 V | 2.5 V to 5.5 V - same | 2.5 V to 5.5 V - same | 2.5 V to 5.5 V - same | 2.5 V to 5.5 V - same | 2.5 V to 5.5 V - same |
| I/O Pins | 12 | 12 - same | 12 - same | 12 - same | 12 - same | 12 - same |
Key Differentiators
- Only variant with the broadest distributor stocking in the ML package (vs PIC16F1823T-I/ML)
- Lower memory footprint suits cost-sensitive nodes (vs PIC16F1824-I/ML)
- Industrial temperature grade matches most consumer/industrial products (vs PIC16F1823-E/ML)
Design Notes
Estimated: the PIC16F1823-I/ML at 3.3 V, 8 MHz CPU, all peripherals disabled, draws approximately 1.8 mA active and under 50 nA in Sleep. Decouple VDD (pin 13) with a 100 nF X7R ceramic placed within 3 mm of the pin and add a 4.7 µF bulk capacitor near the IC. For battery designs, prefer the internal 32 MHz HFINTOSC mode and switch to 31 kHz LFINTOSC during Sleep to maximize runtime. Tie MCLR (RA3, pin 3) to VDD through a 10 kΩ resistor to avoid spurious resets; a 100 nF cap on MCLR is optional but improves ESD immunity.
Estimated: at 32 MHz active mode with all peripherals on, the PIC16F1823-I/ML dissipates roughly 33 mW from a 3.3 V supply, well below the QFN-16's thermal limit. The exposed pad (EP, pin 17) must be soldered to a ground copper pour of at least 25 mm² to meet the datasheet's θJA specification and to avoid dry solder joints during reflow. For high-vibration or thermal-cycling applications, add four thermal vias under the EP to the inner ground plane.
Route the ICSP signals (ICSPCLK on RA5, ICSPDAT on RA1) with short traces and avoid placing high-frequency signals or switching power nodes adjacent to them. The PPS (Peripheral Pin Select) subsystem allows remapping digital peripherals to most I/O pins - assign UART/SPI/I2C pins first, then place them on adjacent package pins to simplify routing. Keep the 32.768 kHz crystal traces (if used) short and symmetric, and guard them with a ground ring to reduce noise coupling to the ADC. For QFN land-pattern generation, use the IPC-7351 nominal-density footprint.
Do not leave the MCLR/RA3 pin floating - it is a Schmitt trigger input and a floating voltage can cause intermittent resets or programming failures. Avoid configuring RA3 as an output in user code; use it only for MCLR or as an input. When using the ADC, add a 100 nF bypass on AVdd (if present) and allow sufficient acquisition time per the datasheet's TAD specification. Configuration bits (FOSC, WDTE, BOREN, etc.) must be set explicitly in the source code; rely on the CONFIG register defaults is risky across toolchains.
Compliance Information
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - choose automotive-grade PIC16F variants for AEC-Q100 requirements. Lead-free and halogen-free package per Microchip material declarations.
