PIC16F1824T-I/JQ - 8-bit MCU, 7KB Flash, 32MHz, UQFN-16 | Microchip
MPN: PIC16F1824T-I/JQ β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.45 | $1.45 |
| 10 | $1.28 | $12.80 |
| 100 | $1.05 | $105.00 |
| 500 | $0.92 | $460.00 |
| 1,000 | $0.81 | $810.00 |
PIC16F1824T-I/JQ Overview
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, RAM, non-volatile program memory (Flash/ROM), data EEPROM, and peripheral interfaces on one die. The PIC16F1824 belongs to the enhanced mid-range family (PIC16F/LF1824/1828), positioned above baseline PIC10/12/16 cores and below the PIC18 and dsPIC families. Its Enhanced Mid-Range core adds hardware multiply, deeper hardware stack, and 49 instruction-word linear program space, providing a balance of deterministic behavior, low cost, and rich peripherals.
Key features include XLP nanoWatt technology with < 50 nA typical sleep current, an integrated 32 MHz high-precision internal oscillator, multiple communication peripherals (I2C, SPI, EUSART), and Core Independent Peripherals such as Complementary Waveform Generator (CWG), Numerically Controlled Oscillator (NCO), and Configurable Logic Cells (CLC). The device supports in-circuit serial programming (ICSP) and in-circuit debugging via PICkit 3, MPLAB ICD 3, or MPLAB Snap without requiring a separate debug header on most variants.
Typical applications include low-power IoT sensor nodes, consumer electronics human-interface controls (capacitive mTouch buttons/sliders), LED lighting controllers, battery-powered remote controls, and small appliance control boards. The wide voltage range and XLP sleep modes allow months to years of operation from a single coin cell. The CWG + NCO + CLC combo enables advanced waveform synthesis and custom digital logic without CPU intervention.
When designing with this device, place a 0.1uF decoupling capacitor within 3 mm of the VDD pin and a bulk 1uF-10uF capacitor near the exposed pad. For ICSP, dedicate PGC and PGD to dedicated pins with no series resistors above 100 ohm to ensure reliable programming. The UQFN exposed pad must be soldered to a sufficient copper pour (>= 4 mm^2) for thermal dissipation and electrical ground.
This page synthesizes distributor pricing, drop-in UQFN-16 alternatives, XLP power-mode design notes, and ICSP/debug guidance not consolidated in the manufacturer datasheet.
Drop-in alternatives for PIC16F1824T-I/JQ β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F1824T-I/JQ (same form factor and footprint) β differing in Package, ADC, Program Memory (Flash), Core, Internal Oscillator.
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PIC16F1824-I/JQ
β Drop-Inβ In Stock
$1.05 / Unit
View Datasheet βPIC16F1824T-E/JQ
β Drop-Inπ Reference alternative (not in catalog)
PIC16F1824T-I/JQ Maximum Ratings & Electrical Characteristics
| Core | Enhanced Mid-Range 8-bit PIC |
| Program Memory (Flash) | 7 KB (4K x 14) |
| Data SRAM | 256 bytes |
| Data EEPROM | 256 bytes |
| Maximum CPU Speed | 32 MHz |
| Supply Voltage (VDD) | 1.8 V to 5.5 V |
| I/O Pins | 12 |
| ADC | 10-bit, up to 8 channels |
| PWM / CCP | CCP and Enhanced CCP modules |
| Communication Peripherals | I2C, SPI, EUSART |
| Internal Oscillator | 32 MHz high-precision, factory calibrated |
| Core Independent Peripherals | CWG, NCO, CLC |
| Low-Power Technology | nanoWatt XLP |
| Operating Temperature (I grade) | -40 C to +85 C |
| Package | 16-pin UQFN (JQ) 4x4 mm with Exposed Pad |
| Mounting Type | Surface Mount |
| Programming/Debug | ICSP via PICkit 3, MPLAB ICD 3, MPLAB Snap |
| RoHS Status | Compliant |
PIC16F1824T-I/JQ Pin Configuration
| Pin 1 | VDD β Positive supply voltage (1.8 V to 5.5 V) |
| Pin 2 | RA5 β GPIO / ICSPCLK / IOC |
| Pin 3 | RA4 β GPIO / AN3 / IOC |
| Pin 4 | RA3 β GPIO / AN2 / MCLR weak pull-up |
| Pin 5 | RC5 β GPIO / AN11 / CCP |
| Pin 6 | RC4 β GPIO / AN10 / IOC |
| Pin 7 | RC3 β GPIO / AN9 / SCL |
| Pin 8 | RC2 β GPIO / AN8 / SDA |
| Pin 9 | RC1 β GPIO / AN7 / SDI |
| Pin 10 | RC0 β GPIO / AN6 / SDO |
| Pin 11 | RA2 β GPIO / AN1 / IOC |
| Pin 12 | RA1 β GPIO / AN0 / ICSPDAT |
| Pin 13 | RA0 β GPIO / ICSP_PGC |
| Pin 14 | VSS β Ground reference |
| Pin 15 | RB7 β GPIO / TX / CK |
| Pin 16 | RB6 β GPIO / RX / DT |
| Pin EP | EP β Exposed thermal pad - solder to VSS pour for thermal dissipation and ground |
Typical Applications
PIC16F1824T-I/JQ is suitable for 6 applications: IoT Wireless Sensor Node, Capacitive mTouch HMI Controller, LED Lighting and Backlight Controller, Battery-Powered Remote Control, Small Appliance Control Board, Automotive Body Control (Sub-Node).
IoT Wireless Sensor Node
The PIC16F1824T-I/JQ fits battery-powered IoT sensor nodes because of its nanoWatt XLP sleep current under 50 nA at 1.8 V and integrated 32 MHz high-precision oscillator that eliminates external crystal cost. The 7 KB Flash comfortably hosts a sensor driver, ADC scheduler, and a small RF control state machine; 256 B SRAM is sufficient for transient telemetry frames. Used in conjunction with an SPI-attached sensor (e.g., MCP9700A analog temp or TC77 SPI sensor) and a low-power sub-GHz transmitter such as CC1101, the PIC16F1824 sleeps 99%+ of the time and wakes via WDT or IOC to read and transmit. Designers benefit from the wide 1.8-5.5 V supply - the same part runs on a 3 V CR2032 coin cell or a 3.7 V Li-Ion cell.
Recommended
Capacitive mTouch HMI Controller
The PIC16F1824T-I/JQ is well suited as a capacitive touch HMI controller because of its mTouch peripheral support, integrated 10-bit ADC for CTMU charge-time measurement, and Core Independent Peripherals (CLC, NCO, CWG) that offload button scanning and LED feedback generation from the CPU. With 12 I/O the device can scan 8-10 touch buttons plus drive 2-3 LED indicators without external logic. The UQFN-16 4x4 mm footprint fits inside small handheld enclosures. Designers typically configure the PIC16F1824 as a USB-less HID-over-UART or I2C touch controller, using the CLC to implement a wake-on-touch interrupt that returns the device from XLP sleep before the CPU even wakes up.
Recommended
LED Lighting and Backlight Controller
The PIC16F1824T-I/JQ drives LED lighting modules effectively through its Enhanced CCP and Complementary Waveform Generator (CWG) peripherals, which generate PWM and complementary PWM waveforms without CPU intervention - freeing the core for higher-level commands. At 32 MHz the device produces PWM resolution high enough for 16-bit color dimming when used with the NCO. The 1.8-5.5 V supply range is convenient for 3.3 V logic-level LED drivers; for 5 V analog dimming rails the part runs at full speed. Typical use is a small RGB fixture or a backlight controller for a 4-6 inch TFT panel, where the UQFN-16 footprint fits on the flex tail.
Recommended
Battery-Powered Remote Control
The PIC16F1824T-I/JQ is an excellent fit for handheld remote controls (TV, fan, lighting) thanks to its XLP deep-sleep current under 50 nA, integrated 32 MHz internal oscillator (no external crystal), and on-chip EUSART for IR PWM encoding at 38 kHz carrier. The 7 KB Flash comfortably fits NEC, RC5, and SIRC protocols; the CCP/ECCP produces the IR carrier in hardware while the CPU sets duty cycle via shadow register. The 16-pin UQFN allows the PCB to be smaller than a CR2032 coin cell. Battery life estimates: 3-5 years of typical remote use from a single CR2032 thanks to < 50 nA sleep and 1-2 mA active at 32 MHz.
Recommended
Small Appliance Control Board
The PIC16F1824T-I/JQ is appropriate for small household appliances (coffee makers, fans, humidifiers) where the MCU must read a few sensors, drive a PWM motor or heater, and display status. Its 10-bit ADC reads temperature, humidity, or potentiometer inputs; ECCP drives a TRIAC or low-side MOSFET; EUSART connects to a Wi-Fi/BLE module for IoT-enabled variants. Operating from 1.8-5.5 V, the part can be powered directly from a 3.3 V LDO fed by a rectified mains input. The UQFN-16 package supports compact appliance PCBs where every mm^2 of board counts.
Recommended
Automotive Body Control (Sub-Node)
The PIC16F1824T-I/JQ fits automotive sub-node body controllers (mirror switch, seat-position indicator, ambient lighting node) where temperature requirements allow the -40 C to +85 C industrial-grade part. Its 12 I/O scan a small button matrix or LIN bus interface and drive LED PWM via CWG/ECCP. For under-hood and high-temperature underhood applications, migrate to the AEC-Q100 qualified PIC16F1824T-E/JQ (extended temperature grade) drop-in replacement. Designers value the 1.8-5.5 V range for direct operation from a 12 V battery derated through a regulator.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F1824T-I/JQ β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F1824-I/JQ | PIC16F1824T-E/JQ | PIC16F1823T-I/SL |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | UQFN-16 (JQ) 4x4 mm | UQFN-16 (JQ) 4x4 mm - same | UQFN-16 (JQ) 4x4 mm - same | SOIC-14 (SL) - different footprint |
| Core | Enhanced Mid-Range 8-bit | Enhanced Mid-Range 8-bit | Enhanced Mid-Range 8-bit | Enhanced Mid-Range 8-bit |
| Flash (KB) | 7 | 7 | 7 | 7 |
| SRAM (Bytes) | 256 | 256 | 256 | 256 |
| Max CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage (V) | 1.8 to 5.5 | 1.8 to 5.5 | 1.8 to 5.5 | 1.8 to 5.5 |
| I/O Pins | 12 | 12 | 12 | 12 |
| Operating Temperature | -40 C to +85 C (I grade) | -40 C to +85 C (I grade) | -40 C to +125 C (E grade, extended) | -40 C to +85 C (I grade) |
Key Differentiators
- Smaller 4x4 mm UQFN-16 footprint vs SOIC alternatives (vs PIC16F1823T-I/SL)
- Same silicon die as PIC16F1824-I/JQ (vs PIC16F1824-I/JQ)
- Extended-temperature drop-in available for hot-zone designs (vs PIC16F1824T-E/JQ)
Design Notes
Estimated: Place a 0.1 uF X7R ceramic decoupling capacitor within 3 mm of the VDD pin (pin 1) and route it directly to the VSS exposed pad. Add a bulk 1 uF-10 uF X5R capacitor on the same VDD rail within 10 mm. For UQFN-16 (4x4 mm), the exposed thermal pad (EP) MUST be soldered to a copper pour of at least 4 mm^2 on the top layer and stitched to the VSS plane with at least 4 thermal vias (0.3 mm drill, 0.5 mm pitch). Without EP soldering, junction-to-ambient thermal resistance rises significantly and ground reference shifts.
For ICSP and in-circuit debugging, dedicate PGC/PGD to PIC ICSP pins (pin 12/13 on UQFN-16). Do not place series resistors above 100 ohm in the PGC/PGD lines, and add 4.7 kohm pull-up resistors on MCLR (pin 4) to VDD. Routing these signals away from high-noise PWM outputs (CCP/ECCP) and analog-sensitive ADC inputs improves programming reliability. For production programmers, ensure the ICSP header is accessible or use Microchip's recommended 2x3 0.1-inch header footprint.
Common pitfalls with PIC16F1824T-I/JQ: (1) Configuring the internal oscillator to 32 MHz at VDD below 2.7 V causes unreliable operation - derate to 16 MHz max at 1.8 V per datasheet. (2) Forgetting to clear the IOSCFAIL flag in BOR/reset routines can lead to silent clock drift if the PLL loses lock. (3) Using the ADC in sleep mode without the dedicated FRC oscillator wastes 1-2 uA - configure ADC via FOSC. (4) The UQFN EP must be soldered or thermal/electrical performance degrades. (5) Configuring IOC wake-up on RA0 without first enabling the internal weak pull-up causes false wake events.
Compliance Information
RoHS and REACH compliant per Microchip product page. Industrial-grade (-40 C to +85 C) only; choose PIC16F1824T-E/JQ extended grade for higher temperatures. AEC-Q100 qualification not applicable to the standard I grade part.
