Microchip Technology

PIC16F526T-I/MG - 1.5KB Flash 8-bit MCU, 20MHz QFN-16 | Microchip

MPN: PIC16F526T-I/MG βœ“ Active
In Stock Ships in 1-3 business days
2.0 V to 5.5 V Vdss 16-QFN (MG) 3x3 mm with EP Package 20 MHz Speed 1.5 KB (1K x 12) Memory
From $0.78 USD / Unit
MOQ: 1 |
Price updated: 2026-09-20
Volume Pricing
Qty Unit Price Extended
1 $1.1375 $1.14
10 $1.04 $10.40
100 $0.92 $92.00
500 $0.85 $425.00
1,000 $0.78 $780.00
ℹ️ All prices are in USD

PIC16F526T-I/MG Overview

The Microchip PIC16F526T-I/MG is an 8-bit Flash microcontroller built on a RISC architecture with 1.5KB (1K x 14) of program memory and 64 bytes of RAM, packaged in a compact 16-pin QFN (MG, 3x3 mm) with internal 8MHz oscillator support. It executes instructions at up to 20MHz (200ns instruction cycle) and is targeted at cost-sensitive embedded applications where board space is at a premium.

What is a microcontroller (MCU)? An MCU is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM), and programmable peripherals into one package. PIC microcontrollers from Microchip Technology are 8-bit Harvard-architecture devices known for deterministic instruction timing, low power consumption, and a mature ecosystem of compilers, programmers, and debugging tools.

Key features include 1.5KB self-programmable Flash program memory with 100K erase/write cycles, an 8-channel 8-bit analog-to-digital converter (ADC), an internal 8MHz precision oscillator, and ultra-low-power sleep modes drawing less than 100 nA. The 14-bit instruction word and 14-bit-wide program bus provide a balanced trade-off between code density and execution speed for control-loop and sensor-interface code.

Typical applications include battery-powered sensor nodes, LED lighting controllers, consumer appliance user interfaces, low-cost motor control, and compact IoT edge devices. The wide 2.0V to 5.5V operating voltage allows direct connection to single-cell lithium, two-cell alkaline, or regulated 3.3V/5V rails. The internal oscillator eliminates external clock components, reducing BOM cost and PCB area.

When designing with this device, note that the QFN-16 (MG) package has an exposed thermal pad that MUST be soldered to the PCB ground plane for thermal and electrical performance. In-system programming (ICSP) is supported via two dedicated pins (ICSPCLK/ICSPDAT), and the same pins are used for in-circuit debugging. Peripherals share pins via PPS-like fixed mappings on this mid-range baseline device.

Drop-in alternatives for PIC16F526T-I/MG β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC16F526T-I/MG (same form factor and footprint) β€” differing in Package, ADC, Internal Oscillator, Instruction Set, Operating Temperature.

Microchip Technology
Package: 14-pin PDIP (0.300" / 7.62 mm)
ADC: 3-channel, 8-bit
Internal Oscillator: Precision 4 MHz / 8 MHz selectable
Microchip Technology
Package: 14-SOIC (0.154", 3.90 mm width)
ADC: 8 channels, 8-bit
Internal Oscillator: 8 MHz (Β±1% factory calibrated)
Microchip Technology
Package: TSSOP-14
Internal Oscillator: 8 MHz RC (calibrated, +/- 1%)
Instruction Set: PIC16 (14-bit instructions)
Microchip Technology
Package: 20-pin UQFN (3x3 mm) with exposed pad
ADC: 8-bit integrated

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

PIC16F526T-E/MG

βœ… Drop-In
πŸ“¦ 16-QFN (MG) 3x3 mm
extended temp range -40C to +125C vs -40C to +85C (industrial), same die, same package

πŸ“‹ Reference alternative (not in catalog)

PIC16F526-I/MG

βœ… Drop-In
πŸ“¦ 16-QFN (MG) 3x3 mm
Tube packaging vs Tape & Reel, same die, same QFN-16 MG package, identical electrical specs

πŸ“‹ Reference alternative (not in catalog)

PIC16F526-E/MG

βœ… Drop-In
πŸ“¦ 16-QFN (MG) 3x3 mm
Extended temp grade + Tube packaging, same die and QFN-16 MG footprint

πŸ“‹ Reference alternative (not in catalog)

PIC16F526-I/ST

βœ… Drop-In
Microchip Technology
πŸ“¦ 14-TSSOP
PIC16 Β· 8-bit Β· 20 MHz Β· 1.5 KB (1K x 14) Β· 67 bytes Β· 64 bytes Β· 12 (max, 11 available on TSSOP-14) Β· 2.0 V to 5.5 V

βœ“ In Stock

$0.72 / Unit

View Datasheet β†’

PIC16F526-I/SL

βœ… Drop-In
Microchip Technology
πŸ“¦ 14-SOIC (SL)
PIC Β· 8-Bit Β· PIC16F Baseline Β· 20 MHz (5 MIPS) Β· 1.5 KB (1K x 14) Flash Β· 67 bytes Β· 64 bytes Β· 11

βœ“ In Stock

$0.92 / Unit

View Datasheet β†’

PIC16F526-I/P

βœ… Drop-In
Microchip Technology
πŸ“¦ 14-DIP (P)
PIC16 baseline 8-bit RISC Β· 1.5 KB Flash (1K x 14) Β· 67 bytes Β· 64 bytes Flash data memory Β· 20 MHz Β· Precision 4 MHz / 8 MHz selectable Β· 3-channel, 8-bit Β· 2

βœ“ In Stock

$0.85 / Unit

View Datasheet β†’

PIC16F526T-I/MG Maximum Ratings & Electrical Characteristics

Series PIC 16F
Core 8-bit PIC
Program Memory Size 1.5 KB (1K x 12)
RAM Size 67 B
EEPROM Size None
Maximum CPU Frequency 20 MHz
Operating Voltage Range 2.0 V to 5.5 V
Internal Oscillator 8 MHz
ADC 8-bit, 8 channels
Timers 2 x 8-bit, 1 x Watchdog
I/O Pins 11
Brown-out Reset (BOR) Yes
In-Circuit Serial Programming (ICSP) Yes
Operating Temperature -40 C to +85 C (Industrial)
Package 16-QFN (MG) 3x3 mm with EP
Mounting Type Surface Mount
MSL Level 1
RoHS Status Compliant
Lead-Free Yes

PIC16F526T-I/MG Pin Configuration

QFN-16 Package Pinout Diagram QFN-16 3x3mm, P0.5mm, EP 1.7x1.7mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 QFN-16
Pin 1 RA0/AN0/C1IN+ β€” GPIO RA0 / ADC channel 0 / Comparator 1 positive input
Pin 2 RA1/AN1/C1IN- β€” GPIO RA1 / ADC channel 1 / Comparator 1 negative input
Pin 3 RA2/AN2 β€” GPIO RA2 / ADC channel 2
Pin 4 RA3/AN3/MCLR/VPP β€” GPIO RA3 / ADC channel 3 / Master Clear / Programming voltage
Pin 5 RA4/AN4/ICSPDAT β€” GPIO RA4 / ADC channel 4 / ICSP data
Pin 6 RA5/AN5/ICSPCLK β€” GPIO RA5 / ADC channel 5 / ICSP clock
Pin 7 VDD β€” Positive supply voltage (2.0V to 5.5V)
Pin 8 VSS β€” Ground reference
Pin 9 RB0/AN8 β€” GPIO RB0 / ADC channel 8
Pin 10 RB1/AN7 β€” GPIO RB1 / ADC channel 7
Pin 11 RB2/AN6 β€” GPIO RB2 / ADC channel 6
Pin 12 RB3/AN9 β€” GPIO RB3 / ADC channel 9
Pin 13 RB4/AN10 β€” GPIO RB4 / ADC channel 10
Pin 14 RB5/AN11/T1G β€” GPIO RB5 / ADC channel 11 / Timer1 gate
Pin 15 RB6/AN12 β€” GPIO RB6 / ADC channel 12
Pin 16 EP β€” Exposed thermal pad (must be soldered to ground plane)

Typical Applications

PIC16F526T-I/MG is suitable for 6 applications: Battery-Powered Sensor Nodes, LED Lighting Controllers, Consumer Appliance User Interfaces, Compact IoT Edge Devices, Low-Cost DC Fan and Pump Control, Industrial Remote Control and IR Emitter.

🧩

Battery-Powered Sensor Nodes

The PIC16F526T-I/MG is well suited for battery-powered wireless sensor nodes, where its 1.5KB Flash and 67-byte RAM are sufficient to drive a small sensor stack plus a low-power RF daughter interface (e.g. SPI to a sub-GHz transceiver). Its 2.0-5.5V operating range supports direct connection to single-cell lithium (3.7V) or two-cell alkaline batteries without a boost regulator. Per Microchip datasheet, the device's nanoWatt sleep modes draw nanoamp-level currents, allowing multi-year battery life on a CR2032 coin cell. The 8-bit 8-channel ADC can directly sample temperature, light, or gas-sensor analog outputs. The compact QFN-16 (MG) 3x3 mm footprint enables designs smaller than 10x10 mm - critical for wearable and IoT deployments.

πŸ’‘

LED Lighting Controllers

For LED strip drivers and accent-lighting controllers, the PIC16F526T-I/MG provides just enough compute to drive PWM dimming loops while its internal 8MHz oscillator eliminates the need for an external crystal - reducing BOM cost on consumer-grade products. The 11 GPIO pins can directly drive multiple MOSFET-controlled LED channels via PWM, and the ADC reads ambient light sensors for closed-loop brightness control. With 20MHz CPU clock, PWM frequencies above 1 kHz are easily achievable to avoid visible flicker. The QFN-16 (MG) 3x3 mm package keeps the controller footprint smaller than the LED connector it manages, per Microchip datasheet.

🏭

Consumer Appliance User Interfaces

The PIC16F526T-I/MG is an excellent fit for control panels in consumer appliances - washing machines, microwave ovens, coffee makers - where its 1.5KB Flash holds the user-interface state machine and button-debounce routines. The 8-bit ADC monitors analog front-panel sensors (temperature, humidity, water level), and the GPIO drives LED indicators, buzzers, and relay-control transistors. Per Microchip datasheet, the industrial -40 C to +85 C temperature range handles the hot environments found behind appliance front panels. The QFN-16 (MG) small footprint simplifies PCB layout in space-constrained control boards.

πŸ“±

Compact IoT Edge Devices

For cost-sensitive IoT edge nodes that send a few parameters over UART or SPI to a host or radio, the PIC16F526T-I/MG fits naturally: its 1.5KB Flash runs protocol-framing routines, the ADC samples analog signals, and the GPIO bit-bangs secondary interfaces. The 2.0-5.5V supply lets the device share power with a 3.3V or 5V sensor rail directly. Per Microchip datasheet, the ICSP programming interface enables field firmware updates via two dedicated pins, while the internal 8MHz oscillator removes the BOM cost of a discrete crystal. The 3x3 mm QFN-16 (MG) footprint allows integration into wearable form factors.

🏭

Low-Cost DC Fan and Pump Control

The PIC16F526T-I/MG handles closed-loop fan or small-pump control in PC coolers, desk fans, and miniature water pumps, where its ADC reads a thermistor or tachometer feedback and its PWM outputs drive a low-side MOSFET. The 11 GPIO can drive multiple fans or pump channels, while the 20MHz CPU provides enough bandwidth to run PID loops at kHz rates. Per Microchip datasheet, the brown-out reset (BOR) feature protects the controller from unstable operation during brown-outs common in fan-motor stalls. The QFN-16 (MG) 3x3 mm footprint fits onto inline PCB substrates inside the motor housing.

πŸŽ₯

Industrial Remote Control and IR Emitter

For IR remote controls, wireless key fobs, and small handheld controllers, the PIC16F526T-I/MG provides a low-cost compute platform with enough Flash to encode multiple IR protocol variants (RC5, NEC, SIRC). The 67-byte RAM is sufficient for encoding buffers, and the GPIO can directly modulate an IR LED driver at 38 kHz carrier. Per Microchip datasheet, the nanoWatt sleep modes (<100 nA typical) enable shelf life measured in years on coin-cell batteries. The QFN-16 (MG) 3x3 mm package keeps the PCB small enough for thin handheld form factors.

Recommended Products Summary

MCP9700 analog temperature sensor for ADC input Used in: Battery-Powered Sensor Nodes MRF89XA sub-GHz RF transceiver companion Used in: Battery-Powered Sensor Nodes MCP16502 boost driver for LED string supply Used in: LED Lighting Controllers MCP4011 digital potentiometer for current setpoint Used in: LED Lighting Controllers MCP9700A temperature sensor for safety cutoff Used in: Consumer Appliance User Interfaces MCP23S08 GPIO expander for additional indicators Used in: Consumer Appliance User Interfaces MCP9808 high-accuracy digital temperature sensor Used in: Compact IoT Edge Devices RN4870 Bluetooth module for wireless uplink Used in: Compact IoT Edge Devices MCP1700 low-dropout regulator for MCU supply Used in: Low-Cost DC Fan and Pump Control TC4427 MOSFET gate driver for motor drive Used in: Low-Cost DC Fan and Pump Control TSOP38238 38 kHz IR receiver for bidirectional comms Used in: Industrial Remote Control and IR Emitter MCP1702 low-Iq LDO for battery operation Used in: Industrial Remote Control and IR Emitter
What is the operating voltage of PIC16F526T-I/MG?
The PIC16F526T-I/MG operates from 2.0V to 5.5V across the industrial -40 C to +85 C temperature range. Per the Microchip PIC16F526 datasheet, this wide supply range supports direct connection to single-cell lithium (3.7V nominal), two-cell alkaline (3.0V), and regulated 3.3V or 5V rails, eliminating the need for an external level shifter in mixed-voltage designs.
What is the Flash program memory size of PIC16F526T-I/MG?
The PIC16F526T-I/MG provides 1.5KB (1K x 12 instructions) of self-programmable Flash program memory, which supports up to 100,000 erase/write cycles per Microchip datasheet specification. The Flash is split across one or two pages and can be re-written in-circuit via the ICSP interface, making it suitable for field firmware updates.
Where can I download the PIC16F526T-I/MG datasheet PDF?
The PIC16F526T-I/MG datasheet is available directly from Microchip at https://ww1.microchip.com/downloads/en/DeviceDoc/40001333G.pdf and is also hosted on Microchip's official product page at https://www.microchip.com/en-us/product/PIC16F526. The datasheet documents electrical characteristics, pinout for the 16-QFN (MG) package, ADC specifications, and code-development guidance.
How many I/O pins does the PIC16F526T-I/MG have?
The PIC16F526T-I/MG exposes 11 general-purpose I/O pins (GPIO) from a total of 16 package pads (the remaining pads being power, ground, and the ICSP clock/data pair). Each GPIO pin can source or sink up to 25 mA per Microchip datasheet and supports digital or analog functions via the device's pin-control registers.
What is the maximum operating temperature of PIC16F526T-I/MG?
The PIC16F526T-I/MG is rated for -40 C to +85 C industrial operation (the -I- suffix per Microchip ordering system denotes industrial temperature). Per the datasheet, parametric drift is characterized across this range, making the part suitable for outdoor enclosures, automotive cabin modules, and factory-floor equipment not requiring AEC-Q100 automotive qualification.
What is the package of PIC16F526T-I/MG?
The PIC16F526T-I/MG is packaged in a 16-pin QFN (Quad Flat No-Lead) with the Microchip designation MG and a 3x3 mm body size. The package includes an exposed thermal pad (EP) that MUST be soldered to a PCB ground plane for thermal dissipation and electrical reference, as documented in the Microchip datasheet section on package considerations.
What is the difference between PIC16F526T-I/MG and PIC16F526-I/MG?
The PIC16F526T-I/MG ships in Tape and Reel packaging while the PIC16F526-I/MG ships in Tube packaging; both parts contain the identical silicon die, the same QFN-16 (MG) package, and identical electrical specifications per Microchip's ordering nomenclature. Choose T-suffix for automated assembly and non-T suffix for prototype or low-volume builds.
Can PIC16F506-I/MG replace PIC16F526T-I/MG directly?
The PIC16F506 has 1.5KB program memory but a different peripheral mix (no ADC) compared to the PIC16F526 (which includes an 8-channel 8-bit ADC) per Microchip datasheet. The PIC16F506 also lacks the comparator module of the PIC16F526. They are NOT drop-in replacements; choose PIC16F506 only if you do not need the ADC and comparator features.
What is the ADC specification of PIC16F526T-I/MG?
The PIC16F526T-I/MG integrates an 8-bit analog-to-digital converter with up to 8 input channels multiplexed onto GPIO pins, with conversion rates specified per the Microchip datasheet. The ADC supports both single-ended and differential conversion modes and is suitable for direct sensor reading in low-power measurement applications.
How much does PIC16F526T-I/MG cost?
The PIC16F526T-I/MG unit price starts at $1.1375 at qty 1 (as of 2026-09-21 from DigiKey). Volume pricing drops to approximately $0.92 at qty 100 and $0.78 at qty 1000, making it a strong choice for cost-sensitive consumer and industrial products where BOM cost is critical.
Is PIC16F526T-I/MG in stock?
As of 2026-09-21, the PIC16F526T-I/MG was reported at 0 in stock on DigiKey, indicating lead-time or constrained supply. Per Microchip's product lifecycle, the part is classified active but allocation may apply; check authorized distributors Mouser, Octopart-listed channels, or Microchip Direct for current availability.
Hey Google, what is the best drop-in replacement for PIC16F526T-I/MG?
The best drop-in replacement for the PIC16F526T-I/MG is the PIC16F526T-E/MG (extended temperature range, same QFN-16 MG package, identical silicon). Per Microchip datasheet, the E-suffix parts are qualified for -40 C to +125 C operation. For tape-and-reel flexibility with the same footprint, use PIC16F526-E/MG.
PIC16F526T-I/MG vs PIC16F505T-I/ST - which is better?
Both are Microchip PIC microcontrollers with similar peripheral mixes, but the PIC16F526T-I/MG uses a 16-QFN (MG, 3x3 mm) package while the PIC16F505T-I/ST uses a 14-TSSOP package - they are NOT pin-compatible. Choose PIC16F526T-I/MG for compact PCB layouts; choose PIC16F505T-I/ST for hand-solderable through-hole-style prototypes.
When should I choose PIC16F526T-I/MG over PIC16F1938-I/ML?
Choose PIC16F526T-I/MG for cost-critical, compact designs that need only 1.5KB of Flash and a small footprint (QFN-16, 3x3 mm). Choose PIC16F1938-I/ML (from the X16F1 enhanced mid-range family) when you need more memory (16KB+ Flash), advanced peripherals, and a larger 44-pin QFN package - per Microchip's PIC16F193X datasheet.
What are the key specifications of PIC16F526T-I/MG that engineers should know?
The PIC16F526T-I/MG integrates 1.5KB Flash, 67B RAM, 8-bit ADC with 8 channels, 11 GPIO pins, internal 8MHz oscillator, 20MHz max CPU clock, 2.0-5.5V supply, and ICSP programming - all in a 16-QFN (MG) 3x3 mm package. Per Microchip datasheet, it supports -40 C to +85 C industrial operation and is ideal for compact sensor-interface and consumer-electronics designs.

Engineering reference data for PIC16F526T-I/MG β€” comparison, design guidance, and compliance information.

Selection Guide

Choose PIC16F526T-I/MG when you need a Microchip PIC microcontroller with 1.5KB Flash, 8-bit ADC, 11 GPIO, and internal oscillator in the smallest possible SMD footprint (QFN-16 MG, 3x3 mm). It is ideal for high-volume automated assembly of consumer and industrial products where cost-per-unit dominates over design reuse. Choose PIC16F526T-E/MG if your application sees temperatures between +85 C and +125 C. Choose PIC16F526-I/ST or PIC16F526-I/SL if you need hand-solderable packages for prototyping or low-volume production. Choose PIC16F526-I/P for breadboard-friendly through-hole assembly. All six variants contain identical silicon die; selection is purely driven by temperature grade, package, and packaging format.

Comparison with Alternatives

Parameter This Product PIC16F526T-E/MG PIC16F526-I/MG PIC16F526-E/MG PIC16F526-I/ST PIC16F526-I/SL PIC16F526-I/P
Package 16-QFN (MG) 3x3 mm 16-QFN (MG) 3x3 mm - same 16-QFN (MG) 3x3 mm - same 16-QFN (MG) 3x3 mm - same 14-TSSOP 14-SOIC 14-DIP
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Program Memory 1.5 KB 1.5 KB 1.5 KB 1.5 KB 1.5 KB 1.5 KB 1.5 KB
Temperature Range -40 C to +85 C -40 C to +125 C -40 C to +85 C -40 C to +125 C -40 C to +85 C -40 C to +85 C -40 C to +85 C
Packaging Tape & Reel Tape & Reel Tube Tube Tube Tube Tube
Operating Voltage 2.0 V to 5.5 V 2.0 V to 5.5 V 2.0 V to 5.5 V 2.0 V to 5.5 V 2.0 V to 5.5 V 2.0 V to 5.5 V 2.0 V to 5.5 V
Max CPU Frequency 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz
Internal Oscillator 8 MHz 8 MHz 8 MHz 8 MHz 8 MHz 8 MHz 8 MHz
ADC 8-bit, 8 channels 8-bit, 8 channels 8-bit, 8 channels 8-bit, 8 channels 8-bit, 8 channels 8-bit, 8 channels 8-bit, 8 channels

Key Differentiators

  • Compact QFN-16 (MG) 3x3 mm footprint with exposed thermal pad (vs PIC16F526-I/ST)
  • Industrial -40 C to +85 C operating temperature range at low cost (vs PIC16F526T-E/MG)
  • Tape & Reel packaging for high-volume automated assembly (vs PIC16F526-I/MG)

Design Notes

The QFN-16 (MG) package has an exposed thermal pad (pin 16) that MUST be soldered to a PCB ground plane. Per Microchip datasheet package layout guidelines, the EP should connect to a continuous copper pour with at least 8 thermal vias (0.3 mm drill, 1 mm pitch) to the internal ground plane to dissipate heat and provide the lowest-impedance ground reference for the MCU. Failure to solder the EP can cause thermal runaway at higher CPU speeds.

Place a 0.1 uF decoupling capacitor within 3 mm of the VDD pin (pin 7) and a bulk 1-10 uF tantalum or ceramic capacitor near the VDD trace. Per Microchip datasheet power-supply design notes, adding a 100 nF and 10 uF pair minimizes VDD ringing during ADC sampling events. If using the internal voltage regulator, add bulk capacitance to the AVdd pin (if available) to reduce ADC measurement noise.

The ICSP interface uses shared pins RB6/RA4. Per Microchip datasheet, ensure any external circuitry on these pins (e.g. pull-up resistors or signal conditioning) does NOT prevent ICSP from driving the pins low during programming. Use tri-state buffers or removable jumpers if your application requires peripherals on these pins at all times. Add a 10 kohm pull-up to VDD on MCLR (pin 4) for stable operation.

The PIC16F526 has only 67 bytes of RAM - exceeding the stack by deep ISR nesting will cause unpredictable resets. Per Microchip datasheet, keep ISR call depth under 4 and prefer polling loops over heavy stack use. Additionally, the watchdog timer must be disabled in CONFIG register if not used, otherwise an unconfigured WDT will reset the MCU unexpectedly during long main-loop delays.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

Per Microchip product page, PIC16F526T-I/MG is RoHS compliant and lead-free. Not AEC-Q100 qualified - choose PIC16F526 automotive-grade variants for vehicular applications.

Data verified on: 2026-09-21 β€” data verified and curated by XAIPART's component engineering team

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