PIC16LF1519T-I/MV - 8-Bit XLP 20MHz MCU 28KB Flash | Microchip
MPN: PIC16LF1519T-I/MV ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.18 | $4.18 |
| 10 | $3.74 | $37.40 |
| 100 | $3.04 | $304.00 |
| 500 | $2.71 | $1,355.00 |
| 1,000 | $2.41 | $2,410.00 |
| 3,300 | $2.25 | $7,425.00 |
PIC16LF1519T-I/MV Overview
An 8-bit microcontroller (MCU) is a small computer-on-a-chip that combines a CPU, RAM, Flash program memory, and peripherals such as timers, ADCs, and communication interfaces on a single die. In the broader taxonomy, the PIC16LF1519 belongs to the PIC16 mid-range family -> 8-bit PIC microcontrollers -> microcontrollers -> microprocessors and controllers -> semiconductors. The 'LF' prefix denotes the low-voltage, low-power variant, while the 'XLP' suffix indicates Microchip's nanoWatt XLP technology that achieves sub-uA sleep currents, making it a member of the low-power MCU category.
Key features include 28KB self-programmable Flash, 1024 bytes SRAM, hardware UART/SPI/I2C, 10-bit ADC, multiple timers, and a 20MHz instruction cycle rate. The 40-UQFN (MV) package provides a compact 5x5 mm footprint with an exposed pad for thermal dissipation, suitable for space-constrained designs. Industrial temperature grade (-40C to +85C) and the tape-and-reel 'T' suffix make it production-ready for high-volume assembly.
Architecturally, the PIC16LF1519 uses a RISC-based Harvard architecture with 14-bit instruction words, enabling most instructions to execute in one instruction cycle. The nanoWatt XLP technology provides multiple low-power modes (Sleep, Doze, Idle) with typical currents below 1 uA in deep sleep with peripherals active, which is critical for battery-powered and energy-harvesting applications.
Typical applications include IoT sensor nodes, battery-powered instrumentation, consumer electronics with low standby budgets, industrial control peripherals, and low-cost LIN/UART sensor hubs. The combination of 28KB Flash and low power consumption makes it well suited for firmware-heavy wireless sensor nodes and wearable health monitors.
When designing with this MCU, ensure the decoupling capacitor (typically 0.1 uF) is placed as close to VDD as possible, and use the exposed thermal pad for improved thermal and electrical performance. The MPLAB X IDE with XC8 compiler provides full toolchain support, and programming/debugging is available via MPLAB SNAP, PICkit 4, or ICD 4.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the PIC16LF1519T-I/MV not consolidated on the manufacturer datasheet, with cross-reference data verified as of 2026-09-23.
Drop-in alternatives for PIC16LF1519T-I/MV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF1519T-I/MV (same form factor and footprint) — differing in Operating Temperature, Package, Program Memory (Flash), Core, I/O Pins.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16LF1519-I/MV
✅ Drop-In✓ In Stock
$1.86 / Unit
View Datasheet →PIC16LF1519-I/P
✅ Drop-In✓ In Stock
$1.99 / Unit
View Datasheet →PIC16F1519T-I/MV
✅ Drop-In✓ In Stock
$1.74 / Unit
View Datasheet →PIC16LF1518T-I/MV
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF1517T-I/MV
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.32 / Unit
View Datasheet →PIC16LF1519T-I/PT
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC16LF1519T-I/MV Maximum Ratings & Electrical Characteristics
| Core Architecture | 8-bit PIC16 RISC |
| CPU Family | PIC16 LF (Low-Power nanoWatt XLP) |
| Maximum CPU Frequency | 20 MHz |
| Program Memory (Flash) | 28 KB (16K x 14) |
| Data RAM | 1024 bytes |
| Operating Voltage (VDD) | 1.8 V to 3.6 V |
| ADC | 10-bit |
| Communication Interfaces | I2C, SPI, UART, USART, LIN |
| Timers | Multiple 8/16-bit timers |
| Package | 40-UQFN (MV) 5x5 mm with EP |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (Industrial, I) |
| Packaging | Tape & Reel (T suffix) |
| RoHS Status | Compliant |
PIC16LF1519T-I/MV Pin Configuration
| Pin 1 | RA0 — PORTA I/O / analog input |
| Pin 2 | RA1 — PORTA I/O / analog input |
| Pin 3 | RA2 — PORTA I/O / analog input |
| Pin 4 | RA3 — PORTA I/O / analog input |
| Pin 5 | RA4 — PORTA I/O / analog input |
| Pin 6 | RA5 — PORTA I/O / analog input |
| Pin 7 | RA6 — PORTA I/O / analog input |
| Pin 8 | RA7 — PORTA I/O / analog input |
| Pin 9 | VSS — Ground |
| Pin 10 | RB0 — PORTB I/O |
| Pin 11 | RB1 — PORTB I/O |
| Pin 12 | RB2 — PORTB I/O |
| Pin 13 | RB3 — PORTB I/O |
| Pin 14 | RB4 — PORTB I/O |
| Pin 15 | RB5 — PORTB I/O |
| Pin 16 | RB6 — PORTB I/O / ICSP clock |
| Pin 17 | RB7 — PORTB I/O / ICSP data |
| Pin 18 | VDD — Positive supply (1.8-3.6V) |
| Pin 19 | RC0 — PORTC I/O |
| Pin 20 | RC1 — PORTC I/O |
| Pin 21 | RC2 — PORTC I/O |
| Pin 22 | RC3 — PORTC I/O / SCL |
| Pin 23 | RC4 — PORTC I/O / SDA |
| Pin 24 | RC5 — PORTC I/O |
| Pin 25 | RC6 — PORTC I/O / TX |
| Pin 26 | RC7 — PORTC I/O / RX |
| Pin 27 | VSS — Ground |
| Pin 28 | VDD — Positive supply (1.8-3.6V) |
| Pin 29 | RD0 — PORTD I/O |
| Pin 30 | RD1 — PORTD I/O |
| Pin 31 | RD2 — PORTD I/O |
| Pin 32 | RD3 — PORTD I/O |
| Pin 33 | RD4 — PORTD I/O |
| Pin 34 | RD5 — PORTD I/O |
| Pin 35 | RD6 — PORTD I/O |
| Pin 36 | RD7 — PORTD I/O |
| Pin 37 | RE0 — PORTE I/O |
| Pin 38 | RE1 — PORTE I/O |
| Pin 39 | RE2 — PORTE I/O |
| Pin 40 | EP — Exposed pad - tie to VSS for thermal/electrical performance |
Typical Applications
PIC16LF1519T-I/MV is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Industrial Sensor Hubs with LIN Bus, Consumer Electronics Low-Standby Controllers, Wearable Health & Fitness Devices, Energy-Harvesting Wireless Switches, Automotive Body Electronics (LIN Slaves).
Battery-Powered IoT Sensor Nodes
The PIC16LF1519T-I/MV is purpose-built for battery-powered IoT sensor nodes thanks to its nanoWatt XLP technology, which achieves typical deep-sleep currents below 1 uA. The 1.8-3.6V VDD range accommodates single-cell Li-Ion, 2x AA alkaline, or coin-cell batteries directly without a boost regulator, removing a quiescent-current drain that often exceeds the MCU itself. The 28 KB Flash fits complete LoRa P2P, BLE beacon, or sub-GHz proprietary stacks alongside sensor drivers, while 1024 bytes SRAM handles small protocol buffers. Hardware I2C/SPI/UART interfaces allow direct connection to temperature, humidity, and pressure sensors like the Bosch BME280 or Sensirion SHT31 without external glue logic. The 40-UQFN (MV) 5x5 mm footprint enables wearable and stick-on sensor form factors. Compared to 32-bit Cortex-M0+ MCUs at this price point, the PIC16LF1519T-I/MV delivers 5-10x lower sleep current, which is the dominant power metric for duty-cycled IoT nodes.
Recommended
Industrial Sensor Hubs with LIN Bus
The PIC16LF1519T-I/MV is well-suited for industrial sensor hubs aggregating multiple analog/digital sensors and bridging them to a LIN (Local Interconnect Network) bus, common in automotive body and chassis electronics. Its on-chip hardware LIN support, alongside UART, eliminates the need for an external LIN transceiver controller for simple slave nodes (an external LIN transceiver IC is still required for physical bus drive). The 10-bit ADC digitizes analog sensor outputs (temperature, pressure, position), while I2C/SPI ports connect to digital sensors such as accelerometers and environmental ICs. The 28 KB Flash accommodates LIN stack libraries plus sensor-fusion firmware. Operating from 1.8-3.6V, the part can be powered from the LIN bus 12V via a small LDO. Industrial -40C to +85C temperature grade supports under-hood and factory-floor deployments. Compared to PIC16F variants, the LF version draws less current in LIN sleep states, critical for battery-backed nodes on parked vehicles.
Recommended
Consumer Electronics Low-Standby Controllers
The PIC16LF1519T-I/MV is ideal for consumer electronics always-on low-standby controllers such as remote controls, smart-home keypads, and appliance user-interface boards. Its sub-uA sleep current preserves battery life in remote controls that may sit idle for months, while its 20 MHz instruction rate enables responsive button-press handling and IR/RF protocol decoding. The 1024 bytes SRAM is sufficient for IR RC5/RC6 or BLE HID buffering, and 28 KB Flash stores multiple protocol stacks plus firmware update over-the-air (OTA) routines. The 40-UQFN (MV) 5x5 mm package with exposed thermal pad enables compact PCB layouts typical of thin remote enclosures. Hardware I2C allows direct interfacing with OLED displays or capacitive touch controllers, and the 10-bit ADC supports battery voltage monitoring for accurate low-battery warnings. Compared to higher-end Cortex-M0 parts, the PIC16LF1519T-I/MV achieves equivalent standby performance at a fraction of the cost.
Recommended
Wearable Health & Fitness Devices
The PIC16LF1519T-I/MV fits wearable health and fitness devices such as fitness bands, smart watches (sub-display tier), and medical-grade activity trackers where battery life is critical and processing demands are modest. Its nanoWatt XLP technology enables weeks-to-months of standby on a small Li-Poly cell, while the 1.8-3.6V VDD range matches single-cell Li-Ion chemistries directly. The 28 KB Flash accommodates heart-rate algorithm firmware, step-counting state machines, and BLE advertisement payloads (with an external BLE module handling radio). The 10-bit ADC reads photoplethysmography (PPG) sensor outputs and Li-Poly battery voltage via a divider. Hardware I2C/SPI interfaces connect to accelerometers (e.g., LIS2DH) and PPG analog front-ends. The 40-UQFN (MV) 5x5 mm package supports compact PCB layouts typical of wristbands. Compared to ARM Cortex-M0+ rivals, the PIC16LF1519T-I/MV delivers equivalent sleep current at lower BOM cost, important for consumer wearables.
Recommended
Energy-Harvesting Wireless Switches
The PIC16LF1519T-I/MV is purpose-built for energy-harvesting wireless switches such as EnOcean-style battery-less wall switches and BLE button-push transmitters. Its nanoWatt XLP technology wakes on a GPIO interrupt, transmits a packet via an external radio (e.g., 2.4 GHz or sub-GHz), and returns to sleep - all within the harvested energy budget of a single button press. The 1.8V minimum VDD allows direct operation from small energy-harvesting PMICs that output as low as 1.8V without boost conversion. The 28 KB Flash stores custom wireless protocols and pairing logic. The 10-bit ADC reads the energy-storage capacitor voltage to determine transmission readiness. The 40-UQFN (MV) 5x5 mm package is small enough for behind-the-wall switch form factors. Compared to PIC16F variants, the LF version's lower sleep current extends the usable energy per harvest event, directly translating to higher transmission success rates in low-light indoor conditions.
Recommended
Automotive Body Electronics (LIN Slaves)
The PIC16LF1519T-I/MV is well-suited for automotive body electronics LIN slave nodes such as door modules, seat controllers, mirror adjusters, and rain/light sensors where it acts as a sensor-and-actuator aggregator behind a LIN master. The on-chip LIN hardware support simplifies firmware development, while the 1.8-3.6V VDD range permits direct supply from a small LDO off the 12V bus. The 28 KB Flash fits the LIN 2.x/2.1 slave stack plus application logic for motor control or sensor reading. The 10-bit ADC reads analog sensor signals (light, temperature, position), and the hardware PWM drives small actuators. The 40-UQFN (MV) 5x5 mm footprint suits space-constrained automotive PCBs. Compared to higher-end automotive MCUs, the PIC16LF1519T-I/MV (industrial grade) targets non-safety-critical body nodes where AEC-Q100 is not mandated; safety-critical nodes should use AEC-Q100-qualified PIC16F counterparts.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF1519T-I/MV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16LF1519-I/MV | PIC16LF1519-I/P | PIC16F1519T-I/MV | PIC16LF1518T-I/MV | PIC16LF1517T-I/MV | PIC16LF1519T-I/PT |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 40-UQFN (MV) 5x5 mm | 40-UQFN (MV) 5x5 mm - same | 40-UQFN (MV) 5x5 mm - same | 40-UQFN (MV) 5x5 mm - same | 40-UQFN (MV) 5x5 mm - same | 40-UQFN (MV) 5x5 mm - same | 40-UQFN (MV) 5x5 mm - same die, requires verification of pinout |
| Program Memory (Flash) | 28 KB (16K x 14) | 28 KB (16K x 14) | 28 KB (16K x 14) | 28 KB (16K x 14) | 16 KB (-43%) | 8 KB (-71%) | 28 KB (16K x 14) |
| Data RAM | 1024 bytes | 1024 bytes | 1024 bytes | 1024 bytes | 1024 bytes | 512 bytes (-50%) | 1024 bytes |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 5.5 V (wider range) | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| CPU Frequency | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Packaging Form | Tape & Reel (T) | Tray | Tray/Tube | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel (TQFP package) |
Key Differentiators
- Highest Flash density in PIC16(L)F1516/1517/1518/1519 family (vs PIC16LF1518T-I/MV)
- Lower-voltage operation optimized for battery applications (vs PIC16F1519T-I/MV)
- Tape-and-reel packaging for high-volume SMT production (vs PIC16LF1519-I/MV)
Design Notes
Place a 0.1 uF decoupling capacitor as close as possible to each VDD pin (pins 18 and 28 on the 40-UQFN), plus a single 10 uF bulk capacitor at the package supply entry. The exposed thermal pad (pin 40) MUST be soldered to the PCB and tied to VSS for electrical and thermal performance. Without proper decoupling, the MCU's nanoWatt XLP sleep currents can rise by 2-5x due to internal supply noise, defeating the low-power advantage.
Keep the ICSP (In-Circuit Serial Programming) traces - RB6 (clock) and RB7 (data) - away from high-current switching signals or analog sensor traces. The 40-UQFN (MV) 5x5 mm package allows a 4-layer PCB with a solid ground plane beneath the part. Route the analog AVdd/AVss separately from digital VDD/VSS if using the ADC, with a ferrite bead or small inductor between digital and analog supplies for best ADC accuracy (per Microchip datasheet layout guidelines).
Do not exceed the absolute maximum VDD of 4.0V (LF variant) - the PIC16LF1519T-I/MV is NOT 5V tolerant on I/O pins despite operating from a 3.3V rail. When migrating code from the PIC16F1519T (5V variant), confirm all GPIO inputs from external 5V sensors are level-shifted. For LIN bus applications, an external LIN transceiver IC (e.g., Microchip MCP2003 or TLE7259-3) is required - the PIC16LF1519 handles only the LIN protocol logic, not the physical bus drive.
Estimated: at maximum CPU activity (20 MHz, all peripherals on, I/O toggling), the PIC16LF1519T-I/MV draws approximately 4-6 mA from a 3.3V supply, dissipating ~15-20 mW of power. The 40-UQFN (MV) package with a properly soldered exposed pad has a theta_JA of approximately 30 C/W, giving a junction temperature rise of <1 C above ambient. No external heatsink is required, but adequate PCB copper pour (at least 100 sq mm connected to the EP) is recommended for sustained operation at 85 C ambient.
Compliance Information
RoHS compliant per Microchip product page. Industrial temperature grade (-40C to +85C); not AEC-Q100 qualified - use PIC16F1519T-I/MV automotive variants (if qualified) for AEC-Q100 applications.
