PIC16LF1708-E/ML - 8-bit 32MHz XLP MCU 7KB Flash | Microchip
MPN: PIC16LF1708-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.95 | $1.95 |
| 10 | $1.72 | $17.20 |
| 100 | $1.42 | $142.00 |
| 500 | $1.18 | $590.00 |
| 1,000 | $0.95 | $950.00 |
| 3,000 | $0.85 | $2,550.00 |
PIC16LF1708-E/ML Overview
What is a PIC16 microcontroller? The PIC16 family is Microchip's mid-range 8-bit RISC microcontroller line, sitting between the baseline PIC10/PIC12 and the enhanced PIC18/PIC24. PIC16 devices use a 14-bit instruction word, support up to 28-56 pins, and integrate peripherals such as 10/12-bit ADC, op amps, comparators, and Core Independent Peripherals (CIPs) including Configurable Logic Cells (CLC), Complementary Output Generator (COG), and Zero-Cross Detect. The PIC16LF1708 specifically adds on-chip op amps, multiple 10-bit ADC channels, and Peripheral Pin Select (PPS), placing it in the 'advanced analog' tier of the family.
Key features of the PIC16LF1708 include 7 KB Flash, 512 bytes RAM, 256 bytes EEPROM, 18 I/O pins, two on-chip op amps, one 8-bit DAC, two 10-bit DACs, a 10-bit ADC with up to 17 channels, two comparators, and the XLP sleep current as low as 50 nA typical. The QFN-20 (ML) package offers a compact 4x4 mm footprint suitable for space-constrained PCB designs while exposing the exposed pad for thermal dissipation and ground connection.
Architecturally, the PIC16LF1708 uses a Harvard RISC core with a 14-bit instruction set, single-cycle ALU, and direct/indirect addressing modes. The XLP technology combines nanoWatt XLP sleep modes, peripheral module disable, and dynamic oscillator switching to enable multi-year battery life on a single coin cell. The integrated op amps and 10-bit DAC enable closed-loop analog control without external components.
Typical applications include battery-powered sensor nodes, LED lighting control, consumer electronics with capacitive touch, low-cost motor control (via COG), smoke detectors, remote controls, IoT edge devices, and portable medical instruments. The combination of op amps, DACs, and PWM makes it especially suited for sensor conditioning and closed-loop analog feedback.
When designing with this part, note the -E/ML suffix indicates the -40C to +125C extended operating temperature grade and the QFN-20 (4x4) package. Decoupling capacitors must be placed close to VDD/AVDD and the exposed pad must be soldered to a sufficiently large copper pour for thermal performance. Unused I/O pins should be configured as outputs low to minimize current draw in sleep mode.
This page synthesizes drop-in alternatives, design notes, and comparison data not found in the standalone datasheet, helping engineers evaluate PIC16LF1708-E/ML against competing MCUs in the same footprint and voltage class.
Drop-in alternatives for PIC16LF1708-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF1708-E/ML (same form factor and footprint) — differing in Package, ADC, I/O Pins, Comparators, DAC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16LF1708-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF1707-I/ML
✅ Drop-In✓ In Stock
$0.55 / Unit
View Datasheet →PIC16F1708-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F1708-E/MLVAO
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF1507-E/ML
✅ Drop-In✓ In Stock
$0.55 / Unit
View Datasheet →PIC16F1825-I/ML
✅ Drop-In✓ In Stock
$0.92 / Unit
View Datasheet →PIC16LF1708-E/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC16 8-bit RISC, 14-bit instruction word |
| CPU Speed (max) | 32 MHz |
| Program Memory (Flash) | 7 KB (4K x 14) |
| Data RAM | 512 bytes |
| EEPROM | 256 bytes |
| I/O Pins | 18 |
| ADC | 10-bit, up to 17 channels |
| DAC | Two 10-bit + one 8-bit |
| Comparators | 2 |
| On-chip Op Amps | 2 |
| Operating Voltage Range | 1.8V to 3.6V (LF family) |
| Operating Temperature Range | -40C to +125C (E suffix) |
| XLP Sleep Current | 50 nA typical |
| Package | 20-pin QFN (ML) 4x4 mm with exposed pad |
| Mounting Type | Surface Mount |
| MSL Level | 1 |
| RoHS Status | Compliant |
| Core Independent Peripherals | CLC, COG, Zero-Cross Detect, PPS |
PIC16LF1708-E/ML Pin Configuration
| Pin 1 | RA5 — Digital I/O / analog input / op-amp output |
| Pin 2 | RA4 — Digital I/O / analog input / op-amp inverting input |
| Pin 3 | RA3 — Digital I/O / analog input / MCLR (reset) |
| Pin 4 | RA2 — Digital I/O / analog input / op-amp non-inverting input |
| Pin 5 | RA1 — Digital I/O / analog input / DAC1 output |
| Pin 6 | RA0 — Digital I/O / analog input / DAC2 output |
| Pin 7 | VSS — Ground |
| Pin 8 | VDD — Power supply |
| Pin 9 | RB7 — Digital I/O / ICSPDAT |
| Pin 10 | RB6 — Digital I/O / ICSPCLK |
| Pin 11 | RB5 — Digital I/O / analog input |
| Pin 12 | RB4 — Digital I/O / analog input |
| Pin 13 | RB3 — Digital I/O / analog input |
| Pin 14 | RB2 — Digital I/O / analog input |
| Pin 15 | RB1 — Digital I/O / analog input |
| Pin 16 | RB0 — Digital I/O / analog input |
| Pin 17 | RA7 — Digital I/O / analog input / DAC3 output |
| Pin 18 | RA6 — Digital I/O / analog input / op-amp output |
| Pin 19 | VSS — Ground (additional VSS) |
| Pin 20 | VDD — Power supply (additional VDD) |
Typical Applications
PIC16LF1708-E/ML is suitable for 7 applications: Battery-Powered IoT Sensor Nodes, LED Lighting Control, Consumer Capacitive Touch Interfaces, Smoke and CO Detectors, Low-Cost Motor Control, Portable Medical Instruments, Remote Controls and RF Key Fobs.
Battery-Powered IoT Sensor Nodes
The PIC16LF1708-E/ML suits battery-powered IoT sensor nodes because its 50 nA XLP sleep current and 1.8V-3.6V operation enable multi-year battery life on a single CR2032 cell. The two on-chip op amps condition analog sensor signals directly without external components, while the 10-bit ADC with up to 17 channels handles multiple sensor inputs simultaneously. Its Core Independent Peripherals (CLC, COG) wake the core only when a threshold is crossed, minimizing average current draw to under 100 nA in duty-cycled operation. Compared to larger Cortex-M0+ alternatives, the LF1708 dramatically reduces BOM cost while keeping firmware simple in the 4K-word Flash range.
Recommended
LED Lighting Control
The PIC16LF1708-E/ML is well-matched for LED lighting control applications thanks to its Complementary Output Generator (COG), which provides hardware PWM generation for high-resolution dimming without CPU intervention. Its two 10-bit DACs and one 8-bit DAC generate smooth color-mixing curves for RGB or tunable-white lighting. With 32 MHz CPU speed, the MCU can manage multiple lighting zones, color-temperature feedback loops using the on-chip op amps, and DMX-512 or DALI communication. The QFN-20 (ML) 4x4 mm footprint fits inside compact bulb and downlight form factors where PCB area is at a premium.
Recommended
Consumer Capacitive Touch Interfaces
The PIC16LF1708-E/ML enables cost-effective capacitive touch interfaces in consumer electronics through its mTouch peripheral, on-chip comparators, and Core Independent Peripherals (CLC) that handle touch decoding without CPU wake. Its 10-bit ADC with up to 17 channels can scan a matrix of touch electrodes in sequence, while the 1.8V-3.6V operating range matches single-cell lithium or coin-cell power. Compared to dedicated touch ICs, the LF1708 reduces the BOM by integrating touch, main MCU, and LED driver PWM into a single 20-pin QFN. Wake-on-touch is achieved in just 50 nA sleep current.
Recommended
Smoke and CO Detectors
The PIC16LF1708-E/ML fits smoke and CO detector designs because its dual on-chip op amps amplify ionization chamber and electrochemical sensor signals directly, while the Zero-Cross Detect peripheral enables AC-line zero-crossing sensing for line-powered detectors with battery backup. The 256-byte EEPROM stores calibration and end-of-life indicators without external memory. Its -40C to +125C extended temperature range handles harsh detector environments (UL 217 compliance testing). The PIC16F1708-E/MLVAO automotive-grade variant supports AEC-Q100 in-cabin air-quality applications with the same pinout.
Recommended
Low-Cost Motor Control
The PIC16LF1708-E/ML provides an effective platform for low-cost brushed DC and stepper motor control via its Complementary Output Generator (COG), which generates anti-phase PWM with dead-band control without software overhead. The on-chip op amps implement closed-loop current sensing with shunt resistors, while the comparators handle back-EMF zero-cross detection for sensorless commutation. At 32 MHz CPU speed, the LF1708 handles trapezoidal BLDC commutation up to a few hundred RPM. The QFN-20 (ML) 4x4 mm package suits compact motor-driver daughter boards.
Recommended
Portable Medical Instruments
The PIC16LF1708-E/ML suits portable medical instruments such as pulse oximeters, glucose meters, and digital thermometers where its 1.8V-3.6V operation, 50 nA XLP sleep current, and on-chip op amps for photodiode or thermocouple amplification simplify BOM and extend battery life. Its 10-bit ADC with 17 channels manages multiple biosensors, while EEPROM stores calibration data persistently. The extended -40C to +125C operating range handles field-temperature variations. For IEC 60601-1 compliant designs, the LF1708's deterministic interrupt latency and fixed instruction timing support real-time medical signal processing without RTOS overhead.
Recommended
Remote Controls and RF Key Fobs
The PIC16LF1708-E/ML is ideal for remote controls and RF key fobs due to its 50 nA sleep current enabling multi-year battery life on a CR2032 coin cell, plus its small 4x4 mm QFN package fitting into key-fob enclosures. The CLC peripheral can wake the MCU on a button-press event without polling, while the PWM peripheral can drive an IR LED directly. For RF key fobs, the LF1708 interfaces with sub-GHz transceivers like the Microchip MICRF112 over SPI. Compared to dedicated low-end remote-control MCUs, the LF1708 offers more Flash and peripherals at similar cost.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF1708-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16LF1708-I/ML | PIC16LF1707-I/ML | PIC16F1708-E/ML | PIC16LF1507-E/ML |
|---|---|---|---|---|---|
| Package | QFN-20 (ML) 4x4 mm | QFN-20 (ML) 4x4 mm - same | QFN-20 (ML) 4x4 mm - same | QFN-20 (ML) 4x4 mm - same | QFN-20 (ML) 4x4 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 7 KB | 7 KB | 3.5 KB (-50%) | 7 KB | 2 KB (-71%) |
| Operating Voltage | 1.8V - 3.6V | 1.8V - 3.6V | 1.8V - 3.6V | 2.3V - 5.5V | 1.8V - 3.6V |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +125C |
| On-chip Op Amps | 2 | 2 | 2 | 2 | 0 |
| Automotive Qualified | No | No | No | No | No |
| XLP Sleep Current | 50 nA typical | 50 nA typical | 50 nA typical | 50 nA typical | 20 nA typical |
| Approx. Price (qty 1000) | $0.95 | ~$0.85 | ~$0.80 | ~$0.95 | ~$0.75 |
Key Differentiators
- Dual on-chip op amps with COG peripheral for hardware PWM (vs PIC16LF1507-E/ML)
- Extended temperature range for industrial/automotive-style use (vs PIC16LF1708-I/ML)
- Low-voltage LF family optimized for coin-cell batteries (vs PIC16F1708-E/ML)
- Larger Flash for application code headroom (vs PIC16LF1707-I/ML)
Design Notes
Decouple the PIC16LF1708-E/ML with a 100 nF ceramic capacitor placed within 5 mm of each VDD pin (pins 8 and 20), and a 10 uF bulk capacitor near the IC. Add a separate 100 nF for AVSS/AVDD if precision analog is used. Use a low-ESR ceramic (X5R/X7R) to handle the high-frequency transient demands of the 32 MHz core. Estimated: a single 100 nF ceramic per supply pin provides ~20 dB of high-frequency rejection up to 100 MHz, which is adequate for the LF1708's clock harmonics.
The QFN-20 (ML) 4x4 mm exposed pad must be soldered to a ground copper pour of at least 1 square inch (645 mm^2) on the PCB. The pad is the primary thermal path and ground reference; poor soldering causes thermal stress and erratic operation. The exposed pad also reduces ground impedance for EMC. Follow IPC-7351 land-pattern guidelines and use 0.10 mm-0.15 mm via arrays under the pad for multi-layer boards. Estimated: with 1 sq in copper, theta_JA is approximately 35 C/W, supporting operation up to ~50 mA at 1.8V without heatsinking.
Common pitfalls when designing with the PIC16LF1708-E/ML: (1) The MCLR pin (RA3) must be tied to VDD through a 10 kohm pull-up resistor for normal operation; leaving it floating causes intermittent reset events. (2) Unused I/O pins must be configured as outputs low (not inputs) to minimize current draw in sleep mode. (3) The ADC requires a stable VREF source; do not connect AVSS to a noisy ground plane. (4) ICSP programming pins (RB6/RB7) must not be loaded with high capacitance or pulled low during programming. (5) The 14-bit instruction word Flash supports 4K words of code, not 7 KB of free space - compile/link must respect this boundary.
The PIC16LF1708-E/ML's 32 MHz core generates clock harmonics up to ~500 MHz on the supply rail. Place a 100 nF ceramic capacitor close to each VDD pin to provide high-frequency decoupling. The internal FOSC/4 output on an I/O pin should not drive long PCB traces; add a series 100 ohm resistor for traces longer than 25 mm. Analog signals (ADC, op amps) should be routed on a separate PCB layer with ground shielding if mixed-signal precision is required. The on-chip op amps have a 10 MHz gain-bandwidth product suitable for most sensor-amplifier tasks but not for high-speed video or RF.
Follow Microchip's QFN-20 (ML) 4x4 mm land pattern recommendation: 0.30 mm pad width, 0.20 mm gap, with an 0.40 mm center thermal pad. Use a 1:1 solder paste stencil with apertures covering 100% of each pad; reduce the thermal-pad aperture to 60-80% to avoid solder starvation. Reflow profile should follow JEDEC J-STD-020 with peak temperature 245C for lead-free SAC305. Avoid hand-soldering; QFN packages require precise reflow for reliable joints. After reflow, inspect the thermal pad solder joint via X-ray or optical cross-section per IPC-A-610 acceptance criteria.
Compliance Information
RoHS and REACH compliant per Microchip product page. Standard -E grade is NOT AEC-Q100 qualified; choose the PIC16F1708-E/MLVAO suffix for AEC-Q100 automotive applications. Lead-free and halogen-free per Microchip's environmental compliance documentation.
