PIC16LF18313-E/RF - 8-bit XLP MCU, 3.5KB Flash, 32MHz | Microchip
MPN: PIC16LF18313-E/RF ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.0248 | $1.02 |
| 10 | $0.97 | $9.70 |
| 100 | $0.86 | $86.00 |
| 500 | $0.77 | $385.00 |
| 1,000 | $0.7 | $700.00 |
PIC16LF18313-E/RF Overview
What is an 8-bit microcontroller? An 8-bit MCU is a self-contained computing engine that integrates a CPU, non-volatile program memory, working RAM, data EEPROM, and a rich set of peripherals (timers, ADC, comparators, communication ports) into a single IC. Within the broader semiconductor taxonomy, an MCU belongs to the microcontroller family, which sits under embedded processors and digital ICs. The PIC16F/LF183xx family targets low-power and general-purpose designs where deterministic RISC execution, ultra-low sleep current, and small package footprint are decisive selection criteria.
Key features include Peripheral Pin Select (PPS) for flexible signal routing, a 10-bit ADC with computation, multiple communication peripherals (EUSART, I2C, SPI), and the eXtreme Low Power technology that achieves nanoWatt-class sleep currents. The device integrates Core Independent Peripherals such as CWG, NCO, and PWM, allowing complex functions to run without CPU intervention.
The PIC16LF18313 employs a Harvard RISC architecture with a 14-bit instruction word optimized for C-compiled and assembly code. Its 32 MHz internal oscillator eliminates external crystals in cost-sensitive designs, while the PPS module re-maps digital peripherals onto most I/O pins to ease PCB layout. The integrated temperature indicator and windowed watchdog further reduce external component count.
Typical applications include IoT sensor nodes, wearable health monitors, remote controls, low-power wireless sensor endpoints, battery management for primary-cell systems, and general-purpose logic replacement. Designers choose the LF (low-voltage) variant when the supply is constrained to 1.8V-3.6V and sleep current is critical. When designing, observe decoupling guidelines: place a 0.1uF ceramic capacitor close to VDD and use the exposed pad as the primary thermal and electrical ground. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement the manufacturer datasheet.
Drop-in alternatives for PIC16LF18313-E/RF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF18313-E/RF (same form factor and footprint) — differing in ADC, Package, DAC, I/O Pins, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F18313-E/RFVAO
✅ Drop-In✓ In Stock
$0.55 / Unit
View Datasheet →PIC16LF18313-I/RF
✅ Drop-In✓ In Stock
$0.66 / Unit
View Datasheet →PIC16LF18313-E/P
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$0.72 / Unit
View Datasheet →PIC16LF18323-E/RF
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF15324-E/RF
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC16LF18313-E/RF Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC16 8-bit RISC |
| Program Memory (Flash) | 3.5 KB (2K x 14) |
| SRAM | 256 bytes |
| EEPROM | 256 bytes |
| Maximum CPU Speed | 32 MHz |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| I/O Pins | 6 |
| Package | 8-UDFN Exposed Pad (3x3 mm) |
| Operating Temperature | -40 C to +125 C (E temp grade) |
| ADC | 10-bit, multiple channels |
| Communication Peripherals | EUSART, I2C, SPI |
| PWM Modules | Yes (10-bit PWM) |
| Peripheral Pin Select (PPS) | Yes |
| Low-Power Technology | nanoWatt XLP |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC16LF18313-E/RF Pin Configuration
| Pin 1 | VDD — Positive supply voltage (1.8 V to 3.6 V) |
| Pin 2 | RA5 — Bidirectional I/O, analog input, PPS-mappable |
| Pin 3 | RA4 — Bidirectional I/O, analog input, PPS-mappable |
| Pin 4 | RA3/MCLR — Input only / Master Clear (reset), weak pull-up |
| Pin 5 | RC5 — Bidirectional I/O, PPS-mappable |
| Pin 6 | RC4 — Bidirectional I/O, PPS-mappable |
| Pin 7 | RC3 — Bidirectional I/O, PPS-mappable |
| Pin 8 | VSS/EP — Ground and exposed thermal pad (must be soldered to ground plane) |
Typical Applications
PIC16LF18313-E/RF is suitable for 7 applications: Battery-Powered IoT Sensor Node, Wearable Health Monitor, Industrial Remote Control / Wireless Endpoint, Primary-Cell Battery Management, Logic Replacement / Glue Controller, Automotive Under-hood Sensor Node, Smart Home Edge Sensor.
Battery-Powered IoT Sensor Node
The PIC16LF18313-E/RF fits battery-powered IoT sensor nodes because its nanoWatt XLP sleep current below 1 uA and 1.8-3.6 V supply directly support 2x AA alkaline or coin-cell chemistries. Its 10-bit ADC, integrated temperature indicator, and PPS-routed EUSART/SPI/I2C let the MCU wake, take a reading, transmit, and return to sleep with minimal firmware overhead. Compared with discrete low-power designs, the LF18313's Core Independent Peripherals (CWG, NCO) execute timing-critical tasks without the CPU, preserving battery life. Place a 0.1uF decoupling capacitor adjacent to VDD and tie the UDFN exposed pad to a continuous ground pour so that the device meets its 100 nA sleep-current specification. Typical companion parts include the MCP9700 temperature sensor, ATA8520 SIGFOX modem, and MCP73831 Li-ion charger.
Recommended
Wearable Health Monitor
For wearable health monitors, the PIC16LF18313-E/RF's 3x3 mm UDFN package and sub-microamp sleep current make it ideal for wristbands and patch devices where board area and battery life dominate BOM decisions. Its 6 PPS-routed I/O pins can drive LEDs, scan capacitive touch buttons, and host an I2C link to a biometric sensor (e.g., heart-rate or SpO2 AFE). The 32 MHz HFINTOSC and DMA-free architecture simplify deterministic response while the 10-bit ADC supports battery monitoring without a separate fuel gauge. Pair the LF18313 with the MCP73831 single-cell Li-Po charger and a low-quiescent LDO such as the MCP1700 for an end-to-end wearable reference design. The E temp grade (-40 to +125 C) tolerates body heat and recharging warm-up cycles.
Recommended
Industrial Remote Control / Wireless Endpoint
Industrial remote controls benefit from the PIC16LF18313-E/RF because its E temperature grade (-40 to +125 C) and 1.8-3.6 V supply tolerate harsh factory-floor environments. The EUSART/SPI/I2C peripherals interface easily with sub-GHz transceivers such as the MRF89XA or LoRa modules, while PPS allows the designer to reassign TX/RX paths to free I/O pins for button scanning. With 256 bytes of EEPROM, the device stores pairing keys and configuration without external memory, and the 10-bit PWM can drive IR LEDs or buzzer tones for feedback. Compared with 32-bit Cortex-M0 competitors, the PIC16LF18313 trades raw MIPS for deterministic interrupts and a much smaller idle-current envelope, which is the dominant metric in battery-powered remote controls.
Recommended
Primary-Cell Battery Management
Primary-cell battery management is a sweet spot for the PIC16LF18313-E/RF because its 1.8 V minimum supply supports a single 1.5 V alkaline or lithium-thionyl chloride cell, and the nanoWatt XLP sleep extends shelf life to over 10 years. The on-chip ADC monitors battery voltage against a precision 1.024 V internal reference to predict end-of-life, while the 256 B EEPROM logs cumulative runtime for warranty analytics. The exposed-pad UDFN-8 package allows the design to fit inside a AA-cell form factor battery holder cavity. A typical reference design pairs the LF18313 with the MCP1640 boost converter to drive a wireless transmitter at 3.3 V from a single AA cell, achieving months of unattended operation on a 2.4 Ah primary cell.
Recommended
Logic Replacement / Glue Controller
Designers often replace discrete 74HC logic with the PIC16LF18313-E/RF to consolidate timing, PWM, and I/O-expansion functions into one programmable device. Its 6 PPS-routed I/O pins, multiple timers, and Core Independent Peripherals (CWG, NCO, PWM) can synthesize waveforms, debounce inputs, and chain state machines without CPU intervention. With 3.5 KB of Flash, designers can iterate on sequencing logic in firmware rather than re-spinning 7400-series gates. The LF variant's 1.8 V minimum VDD lets the MCU share a 1.8 V rail with a companion SoC's GPIO domain. Compared with hard-wired logic, the LF18313 reduces PCB area and provides field-upgradeable behavior at minimal incremental cost.
Recommended
Automotive Under-hood Sensor Node
The PIC16LF18313-E/RF's -40 to +125 C extended temperature range qualifies it for automotive under-hood sensor nodes that monitor fluid levels, temperatures, or pressures. Its 32 MHz CPU and PPS-mapped EUSART can drive a LIN or CAN stack via an external transceiver (e.g., MCP2515, MCP2003) for body-electronics or chassis subsystems. The 10-bit ADC reads analog sensors directly while the 256 B EEPROM stores calibration constants across power cycles. The exposed-pad UDFN-8 package tolerates the thermal-cycling stress typical of under-hood environments when properly soldered to a 1 square-inch copper pour. For AEC-Q100 qualified alternatives, Microchip offers the PIC16F18313-E/RF automotive grade in the same UDFN-8 footprint.
Recommended
Smart Home Edge Sensor
Smart-home edge sensors, including occupancy detectors, leak sensors, and environmental monitors, benefit from the PIC16LF18313-E/RF's tiny 3x3 mm UDFN footprint and sub-microamp XLP sleep current. The MCU's PPS-routed I2C bus connects to MEMS sensors (e.g., MCP9808 temperature, SHT21 humidity) while its 10-bit PWM drives status LEDs without a separate LED driver. The 256 B EEPROM retains configuration when the battery is replaced, and the EUSART can stream data to a low-energy Bluetooth or Sub-GHz radio module. Compared with Zigbee SoC modules, the LF18313-based design lets the engineer pick the lowest-cost radio and reuse firmware across sensor variants. Battery life typically exceeds 3 years on a single CR2032 for periodic-reporting use cases.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF18313-E/RF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F18313-E/RF | PIC16LF18313-I/RF | PIC16LF18323-E/RF | PIC16LF18313-E/P |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 8-UDFN (3x3 mm) | 8-UDFN (3x3 mm) - same | 8-UDFN (3x3 mm) - same | 8-UDFN (3x3 mm) - same | 8-UDFN (3x3 mm) - same |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 5.5 V (wider) | 1.8 V to 3.6 V (same) | 1.8 V to 3.6 V (same) | 1.8 V to 3.6 V (same) |
| Flash Program Memory | 3.5 KB (2K x 14) | 3.5 KB (same) | 3.5 KB (same) | 7 KB (larger) | 3.5 KB (same) |
| SRAM | 256 bytes | 256 B (same) | 256 B (same) | 512 B (larger) | 256 B (same) |
| Maximum CPU Speed | 32 MHz | 32 MHz (same) | 32 MHz (same) | 32 MHz (same) | 32 MHz (same) |
| Operating Temperature | -40 C to +125 C (E grade) | -40 C to +125 C (E grade) | -40 C to +85 C (I grade) | -40 C to +125 C (E grade) | -40 C to +125 C (E grade) |
| I/O Pins | 6 | 6 (same) | 6 (same) | 6 (same) | 6 (same) |
| Peripheral Pin Select (PPS) | Yes | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
| Unit Price (qty 1, as of 2026-09-24) | USD 1.02 | USD ~1.02 | USD ~1.05 | USD ~1.20 | USD ~1.02 |
Key Differentiators
- 1.8 V minimum VDD versus 2.0 V on competing 8-bit MCUs (vs PIC16F18313-E/RF)
- nanoWatt XLP sleep current below 1 uA with RAM retention (vs PIC16LF15324-E/RF)
- Larger memory option in the same UDFN-8 footprint (vs PIC16LF18323-E/RF)
- PPS allows I/O rerouting without re-spinning the PCB (vs PIC16F18313-E/RF (no PPS))
Design Notes
Estimated: at VDD = 3.3 V, 32 MHz active current is roughly 2 mA and sleep current is below 1 uA per the datasheet XLP figures. Place a 0.1 uF X7R ceramic bypass capacitor within 3 mm of the VDD pin, and a 10 uF bulk capacitor if the supply is shared with a radio module. For primary-cell designs, switch to the internal 32 kHz LFINTOSC and use Sleep + Watchdog Timer wakeups to keep average current below 5 uA.
The 8-UDFN package relies on the exposed pad (EP) for ground and thermal dissipation. Solder the EP directly to a continuous ground pour covering at least 0.25 square inches of copper to keep theta_JA within datasheet limits. Estimated: with the EP properly soldered, theta_JA drops from approximately 90 C/W (no copper) to roughly 40 C/W (1 sq-in pour), keeping junction temperature rise well below 30 C at typical 8 mA active current.
Route the ICSPDAT/ICSPCLK lines (RA4/RA5 by default on this family) to a 2x3 or 1x6 header for MPLAB ICD programming and in-circuit debugging. Keep the MCLR line free of capacitive loads greater than 470 pF, otherwise the device may fail to enter programming mode. Maintain at least 0.2 mm clearance between the exposed pad and the nearest signal trace so that the solder pad does not wick away from the EP during reflow.
Do not exceed 3.6 V on VDD - this is the LF variant, not the F variant. Adding a 5 V supply will damage the silicon or trigger internal brown-out resets. When migrating from PIC16F18313 to PIC16LF18313, double-check that any 5 V peripherals are level-shifted to 3.3 V. Avoid leaving unused I/O pins floating; configure them as outputs driving low or enable the internal weak pull-ups to minimize sleep-current leakage.
Peripheral Pin Select routing must be re-asserted after each POR or BOR event in firmware. Lock the PPS registers once configured to prevent runaway writes from corrupting the peripheral mapping. For I2C or SPI buses running above 1 MHz, place 4.7 kohm pull-ups on SDA/SCL and keep trace lengths under 50 mm to avoid ringing on the UDFN package's small internal bond wires.
Compliance Information
RoHS compliant per Microchip product page. E temperature grade (-40 to +125 C) supports automotive under-hood environments but is not AEC-Q100 qualified; choose the F variant with automotive Q1 suffix for AEC-Q100 designs.
