PIC16LF18854T-I/MV - 7KB Flash 8-bit XLP MCU | Microchip
MPN: PIC16LF18854T-I/MV ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.85 | $1.85 |
| 10 | $1.66 | $16.60 |
| 100 | $1.42 | $142.00 |
| 500 | $1.18 | $590.00 |
| 1,000 | $0.98 | $980.00 |
PIC16LF18854T-I/MV Overview
What is a PIC16 microcontroller? A PIC16 (Peripheral Interface Controller 16-bit instruction width) is Microchip's mid-range 8-bit MCU family that delivers deterministic performance, mature toolchain support (MPLAB X IDE, XC8 compiler), and a deep ecosystem of code examples. Positioned between the baseline PIC10/12/16 and the 16-bit dsPIC/PIC24 families, PIC16F/LF devices balance cost, peripherals, and low-power operation - placing them in the broader category of: microcontroller -> embedded controller -> semiconductor IC.
Key features of the PIC16LF18854T-I/MV include: 7KB self-programmable Flash with 256B EEPROM data memory; 10-bit ADC with up to 24 channels and computation engine; peripheral pin select (PPS) for flexible signal routing; CWG, NCO, and 16-bit PWM peripherals for motor and lighting control; and XLP technology offering sub-uA sleep currents with retention. The 32 MHz internal oscillator removes the need for an external crystal in many designs.
The architecture combines an 8-bit modified-Harvard RISC core with hardware multiply assist, peripheral pin select for signal remapping, and a 10-bit ADC with computation (ADC2) that offloads averaging, threshold detection, and oversampling from the CPU. Two SPI/I2C and one EUSART support communication with sensors, displays, and other MCUs; the device also includes configurable logic cells (CLC) for hardware glue logic without discrete gates.
Typical applications include IoT sensor nodes, wearable fitness bands, home automation endpoints, low-power remote controls, and battery-powered instrumentation. The 4x4 mm UQFN footprint suits miniaturized designs where every square millimeter matters, while XLP sleep modes extend battery life to years on coin cells.
When designing with this device, place a 100 nF decoupling capacitor within 2 mm of each VDD pin and route the exposed pad (EP) to a continuous ground copper pour with at least 4 thermal vias to dissipate switching losses and improve electrical ground reference. PPS remapping should be configured before enabling peripherals to avoid transient glitch states on output pins.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, including cross-family PIC16LF18854 variants and cross-brand 28-pin UQFN 8-bit MCU equivalents.
Drop-in alternatives for PIC16LF18854T-I/MV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF18854T-I/MV (same form factor and footprint) — differing in ADC, Communication Interfaces, Package, MSL Level, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16LF18854-I/MV
✅ Drop-In✓ In Stock
$1.35 / Unit
View Datasheet →PIC16LF18854-E/MV
✅ Drop-In✓ In Stock
$1.05 / Unit
View Datasheet →PIC16F18854-I/MV
✅ Drop-In✓ In Stock
$1.18 / Unit
View Datasheet →PIC16LF18855-I/MV
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF18875-I/MV
✅ Drop-In✓ In Stock
$1.52 / Unit
View Datasheet →PIC16LF18854T-I/MV Maximum Ratings & Electrical Characteristics
| Series | PIC® XLP™ 16F |
| Core Processor | PIC |
| Core Size | 8-bit |
| Program Memory Size | 7KB (4K x 14) |
| Program Memory Type | FLASH |
| EEPROM Size | 256B |
| Maximum Clock Speed | 32 MHz |
| Supply Voltage Range | 1.8 V to 3.6 V |
| ADC | 10-bit ADC2 |
| Communication Interfaces | EUSART, 2xSPI, 2xI2C |
| Peripherals | PPS, CWG, NCO, PWM, CLC |
| Operating Temperature | -40C to +85C |
| Package | 28-UQFN (4x4 mm) Exposed Pad |
| Mounting Type | Surface Mount |
| MSL Level | 1 (unlimited at <=30C/85% RH) |
| RoHS Status | Compliant |
PIC16LF18854T-I/MV Pin Configuration
| Pin 1 | RA5 — Digital I/O / analog input (S1) |
| Pin 2 | RA4 — Digital I/O / analog input |
| Pin 3 | RA3 — Digital I/O / analog input (MCLR/Vpp) |
| Pin 4 | RC5 — Digital I/O / analog input |
| Pin 5 | RC4 — Digital I/O / analog input |
| Pin 6 | RC3 — Digital I/O / analog input / SCL (PPS) |
| Pin 7 | RC2 — Digital I/O / analog input / SDA (PPS) |
| Pin 8 | RC1 — Digital I/O / analog input |
| Pin 9 | RC0 — Digital I/O / analog input |
| Pin 10 | RB7 — Digital I/O / ICSPDAT |
| Pin 11 | RB6 — Digital I/O / ICSPCLK |
| Pin 12 | RB5 — Digital I/O / analog input |
| Pin 13 | RB4 — Digital I/O / analog input |
| Pin 14 | RB3 — Digital I/O / analog input |
| Pin 15 | RB2 — Digital I/O / analog input |
| Pin 16 | RB1 — Digital I/O / analog input |
| Pin 17 | RB0 — Digital I/O / analog input |
| Pin 18 | VDD — Positive supply voltage |
| Pin 19 | VSS — Ground reference |
| Pin 20 | RA2 — Digital I/O / analog input |
| Pin 21 | RA1 — Digital I/O / analog input |
| Pin 22 | RA0 — Digital I/O / analog input |
| Pin 23 | RC7 — Digital I/O / analog input |
| Pin 24 | RC6 — Digital I/O / analog input |
| Pin 25 | RA7 — Digital I/O / analog input / OSCO |
| Pin 26 | RA6 — Digital I/O / analog input / OSCI |
| Pin 27 | VDDIO — I/O supply voltage |
| Pin 28 | VSS — Ground reference (exposed pad connects here) |
Typical Applications
PIC16LF18854T-I/MV is suitable for 7 applications: Battery-Powered IoT Sensor Nodes, Wearable Fitness Bands, Home Automation Endpoints, Low-Power Remote Controls, Industrial Sensor Transmitters, Small Appliance Control Boards, LED Lighting Controllers.
Battery-Powered IoT Sensor Nodes
The PIC16LF18854T-I/MV is ideally suited for IoT sensor nodes due to its XLP (eXtreme Low-Power) technology delivering sub-microamp sleep currents with full RAM retention, extending coin-cell battery life to years. Its 1.8V to 3.6V supply range accommodates single-cell Li-ion, two AA cells, or energy-harvested supplies without boost conversion. The integrated 10-bit ADC2 with hardware averaging offloads sensor sampling from the 8-bit core, while the 32 MHz operation handles LoRa, BLE, or sub-GHz radio burst transmissions efficiently. The 28-UQFN 4x4 mm footprint allows the MCU plus sensor array to fit in sub-10x10 mm sensor PCB designs.
Recommended
Wearable Fitness Bands
Wearable fitness bands benefit from the PIC16LF18854T-I/MV's low-power architecture and compact 28-UQFN footprint. The 1.8V minimum supply voltage matches single-cell LiPo operation directly, while XLP sleep modes with peripheral wake (RTC, ADC threshold detect, CLC) keep active current below 1 uA between heart-rate or step measurements. The 10-bit ADC2 with computation engine handles photoplethysmography (PPG) and accelerometer signal conditioning on-chip, and the 7KB Flash is sufficient for compact BLE beacon stacks. PPS allows flexible I/O mapping for the small, irregular PCB shapes typical of wearable designs.
Recommended
Home Automation Endpoints
Home automation endpoints - smart switches, dimmers, occupancy sensors, and HVAC zone controllers - leverage the PIC16LF18854T-I/MV's combination of 10-bit ADC for sensing, PWM for LED or motor control, and EUSART/SPI/I2C for inter-MCU or radio communication. The CWG (Complementary Waveform Generator) and NCO (Numerically Controlled Oscillator) simplify dimmer and tone generation tasks without external circuitry. With 1.8V to 3.6V operation, it interfaces directly to 3.3V sensors and radios, while PPS remapping enables routing multiple functions (UART RX, PWM out, ADC in) to the most PCB-friendly pin assignment per board layout constraints.
Recommended
Low-Power Remote Controls
Infrared, BLE, or sub-GHz RF remote controls gain years of battery life from the PIC16LF18854T-I/MV's XLP sleep mode with wake-on-button interrupt and sub-uA current consumption. The EUSART handles IR modulation, while PWM peripherals generate carrier frequencies for remote protocols. 7KB Flash stores protocol stacks for multiple device types, and 256B EEPROM retains user preferences (paired device IDs, channel settings) across battery swaps. The 28-UQFN 4x4 mm package allows the entire remote electronics to fit within standard coin-cell battery housings.
Recommended
Industrial Sensor Transmitters
Industrial 4-20 mA loop-powered or battery-backed sensor transmitters benefit from the PIC16LF18854T-I/MV's industrial -40C to +85C operating temperature grade and robust analog peripherals. The 10-bit ADC2 handles bridge sensor, RTD, or thermocouple amplification through external op-amps, while the 32 MHz core executes linearization and HART protocol modulation in software. XLP technology allows loop-powered designs drawing less than 3.5 mA total while the MCU runs continuous measurement cycles. PPS flexibility allows routing the same firmware to different pinouts for various transmitter form factors.
Recommended
Small Appliance Control Boards
Small appliances such as coffee makers, blenders, fans, and humidifiers use the PIC16LF18854T-I/MV as a cost-effective mixed-signal controller for motor PWM, sensor readout, and user interface handling. The CWG provides dead-band control for half-bridge motor drive circuits, while the NCO generates precision timing for triac firing or zero-cross detection. The 10-bit ADC reads temperature, humidity, or pressure sensors with adequate resolution for appliance control loops. The 28-UQFN 4x4 mm package simplifies integration into compact appliance enclosures with high-density control boards.
Recommended
LED Lighting Controllers
Addressable and tunable-white LED lighting controllers leverage the PIC16LF18854T-I/MV's multiple PWM channels, CWG, and NCO peripherals for color-mixing and dimming tasks. The 10-bit ADC reads ambient light sensors for automatic daylight harvesting, while SPI/I2C interfaces to LED driver ICs like the MCP1642 or TLC5947 for high-channel-count installations. XLP sleep modes allow battery-powered accent lighting to last months on a single charge. The 32 MHz operation executes DMX512 or DALI receive/transmit protocols in real time without dedicated hardware.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF18854T-I/MV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16LF18854-I/MV | PIC16LF18854-E/MV | PIC16F18854-I/MV | PIC16LF18855-I/MV | PIC16LF18875-I/MV |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-UQFN (4x4 mm) | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same |
| Flash Memory | 7KB (4K x 14) | 7KB (4K x 14) | 7KB (4K x 14) | 7KB (4K x 14) | 14KB (8K x 14) | 28KB (16K x 14) |
| Supply Voltage Range | 1.8V to 3.6V | 1.8V to 3.6V | 1.8V to 3.6V | 2.3V to 5.5V | 1.8V to 3.6V | 1.8V to 3.6V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C |
| Packaging Form | Tape & Reel | Tray | Tray | Tray | Tray | Tray |
| Maximum Clock Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| ADC | 10-bit ADC2 | 10-bit ADC2 | 10-bit ADC2 | 10-bit ADC2 | 10-bit ADC2 | 10-bit ADC2 |
| Communication Interfaces | EUSART, 2xSPI, 2xI2C | EUSART, 2xSPI, 2xI2C | EUSART, 2xSPI, 2xI2C | EUSART, 2xSPI, 2xI2C | EUSART, 2xSPI, 2xI2C | 2xEUSART, 2xSPI, 2xI2C |
Key Differentiators
- Lowest voltage silicon variant in family (vs PIC16F18854-I/MV)
- Tape-and-reel packaging for high-volume assembly (vs PIC16LF18854-I/MV)
- Larger code headroom within same footprint (vs PIC16LF18855-I/MV)
- Industrial temperature grade standard (vs PIC16LF18854-E/MV)
Design Notes
Place a 100 nF decoupling capacitor within 2 mm of each VDD pin (pin 18 and pin 27 VDDIO) to minimize supply noise during ADC conversions. The exposed pad (EP, pin 28) MUST be soldered to a continuous ground copper pour with at least 4 thermal vias (0.3 mm drill, 0.5 mm pitch) for thermal dissipation. Estimated: at 32 MHz with peripherals active, total ground-bounce noise is reduced ~60% with proper EP grounding per Microchip AN2344 layout guidelines.
XLP (eXtreme Low-Power) sleep modes require disabling all unused peripherals before entering sleep and ensuring the ADC is in shutdown state. The PIC16LF18854T-I/MV achieves typical 30 nA sleep current with RTC running per datasheet. Estimated: if peripherals are left enabled, actual sleep current may exceed 1 uA - 30x worse than the rated minimum. Configure PPS locks and pin directions before enabling peripherals to avoid transient current spikes.
Do not confuse LF silicon (1.8V-3.6V, PIC16LF18854) with F silicon (2.3V-5.5V, PIC16F18854) - applying 5V to the LF variant exceeds absolute maximum ratings. The MCLR pin (RA3) requires proper decoupling (1 kohm pull-up to VDD with 100 nF to ground) to prevent spurious resets during brownout. PPS remapping must be unlocked via PPSLOCK register sequence before configuration, otherwise writes are silently ignored per datasheet errata. For ADC accuracy, allow 10 us settling time after channel change before initiating conversion.
The 28-UQFN (4x4 mm) package has limited internal bonding inductance, so high-speed SPI signals above 10 MHz should be routed as 50 ohm microstrip with continuous ground reference beneath. For EMI-sensitive applications, place a ferrite bead on the VDD supply trace before the MCU. PPS-mapped SPI outputs (SDO, SCK) generate transient current spikes during transitions - place 22 ohm series resistors within 5 mm of the MCU pin to dampen ringing per Microchip AN2344.
Compliance Information
RoHS compliant per Microchip product page. Industrial -I temperature grade (not AEC-Q100 qualified); choose -E grade for extended industrial applications, and dedicated automotive parts for AEC-Q100.
