PIC16LF18876-E/MV - 28KB Flash 8-bit MCU 40-UQFN | Microchip
MPN: PIC16LF18876-E/MV ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.78 | $3.78 |
| 10 | $3.42 | $34.20 |
| 100 | $2.95 | $295.00 |
| 500 | $2.55 | $1,275.00 |
| 1,000 | $2.18 | $2,180.00 |
| 3,000 | $1.85 | $5,550.00 |
PIC16LF18876-E/MV Overview
An 8-bit microcontroller (MCU) is a compact, single-chip computer built around an 8-bit data path that integrates CPU, non-volatile program memory, working RAM, EEPROM data storage, and a rich set of peripherals including ADC, DAC, comparators, PWM, communications, and timers. Within the broader semiconductor hierarchy, the PIC16LF18876 belongs to microcontrollers → 8-bit MCUs → embedded controllers → integrated circuits. The "LF" prefix denotes the low-voltage (1.8 V to 3.6 V) variant with Microchip's eXtreme Low Power (XLP) technology, optimized for battery-powered applications.
Key features include 36 configurable I/O pins via Peripheral Pin Select (PPS), a 10-bit ADC with computation, a 5-bit/10-bit DAC, multiple comparators with a zero-cross detect (ZCD), Complementary Waveform Generator (CWG), and SMT (Signal Measurement Timer). Communications peripherals include EUSART, SPI, and I²C. Functional safety is supported with CRC/SCAN, HLT (Hardware Limit Timer), and Windowed Watchdog Timer (WWDT). Idle, Doze, and Peripheral Module Disable (PMD) modes enable deep power savings.
Architecturally, the device uses an enhanced mid-range 8-bit core with a 14-bit instruction word, priority levels for interrupts, and a hardware multiplier. The 28 KB Flash supports self-programming and ICSP™ (In-Circuit Serial Programming), allowing field firmware updates. This combination of analog, core-independent, and communication peripherals makes the part well suited to mixed-signal designs where the MCU must replace several discrete components.
Typical applications include IoT sensor nodes, portable consumer electronics, industrial control nodes, building automation, low-power wireless sensor platforms, and battery-powered HVAC controls. Designers also use the part in functional-safety systems that benefit from WWDT and CRC/SCAN.
When designing, ensure the exposed thermal pad is soldered to a sufficient copper pour for thermal dissipation and ground reference. Place the decoupling capacitors as close as possible to VDD/AVDD and VSS/AVSS pins, and follow the recommended oscillator layout when using an external crystal.
This page synthesizes distributor pricing, drop-in alternative MPNs, comparison parameters, and practical design notes for engineers evaluating the PIC16LF18876-E/MV for low-power embedded designs.
Drop-in alternatives for PIC16LF18876-E/MV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF18876-E/MV (same form factor and footprint) — differing in DAC, Package, ADC, Operating Temperature, Operating Voltage Range.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16LF18875-E/MV
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.82 / Unit
View Datasheet →PIC16LF18877-E/MV
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC16F18876-I/MV
✅ Drop-In✓ In Stock
$1.7 / Unit
View Datasheet →PIC16LF18856-E/MV
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC16LF18876-E/MV Maximum Ratings & Electrical Characteristics
| Family | PIC® XLP™ 16F |
| Core Size | 8-bit |
| Core Processor | PIC |
| Program Memory Size | 28 KB (16K × 14) Flash |
| RAM Size | 2 KB |
| EEPROM Size | 256 B |
| Maximum Clock Frequency | 32 MHz |
| Supply Voltage Range | 1.8 V to 3.6 V |
| Number of I/O Pins | 36 |
| Package | 40-UQFN (MV) 5×5 mm with exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +125 °C |
| ADC | 10-bit with computation |
| DAC | 5/10-bit |
| Communications | EUSART, SPI, I²C |
| Special Features | CRC/SCAN, HLT, WWDT, ZCD, PPS, CWG, SMT, IDLE/DOZE/PMD, XLP |
| RoHS Status | Compliant |
PIC16LF18876-E/MV Pin Configuration
| Pin 1 | RA0 — PORTA I/O / analog input / PPS remappable |
| Pin 2 | RA1 — PORTA I/O / analog input / PPS remappable |
| Pin 3 | RA2 — PORTA I/O / analog input / PPS remappable |
| Pin 4 | RA3 — PORTA I/O / analog input / PPS remappable |
| Pin 5 | RA4 — PORTA I/O / analog input / PPS remappable |
| Pin 6 | RA5 — PORTA I/O / analog input / PPS remappable |
| Pin 7 | RA6 — PORTA I/O / analog input / PPS remappable |
| Pin 8 | RA7 — PORTA I/O / analog input / PPS remappable |
| Pin 9 | VSS — Ground reference |
| Pin 10 | RA8 — PORTA I/O / PPS remappable |
| Pin 11 | RA9 — PORTA I/O / PPS remappable |
| Pin 12 | RA10 — PORTA I/O / PPS remappable |
| Pin 13 | RB0 — PORTB I/O / PPS remappable |
| Pin 14 | RB1 — PORTB I/O / PPS remappable |
| Pin 15 | RB2 — PORTB I/O / PPS remappable |
| Pin 16 | RB3 — PORTB I/O / PPS remappable |
| Pin 17 | RB4 — PORTB I/O / PPS remappable |
| Pin 18 | RB5 — PORTB I/O / PPS remappable |
| Pin 19 | RB6 — PORTB I/O / PPS remappable / ICSP PGC |
| Pin 20 | RB7 — PORTB I/O / PPS remappable / ICSP PGD |
| Pin 21 | RC0 — PORTC I/O / PPS remappable |
| Pin 22 | RC1 — PORTC I/O / PPS remappable |
| Pin 23 | RC2 — PORTC I/O / PPS remappable |
| Pin 24 | RC3 — PORTC I/O / PPS remappable |
| Pin 25 | RC4 — PORTC I/O / PPS remappable |
| Pin 26 | RC5 — PORTC I/O / PPS remappable |
| Pin 27 | RC6 — PORTC I/O / PPS remappable |
| Pin 28 | RC7 — PORTC I/O / PPS remappable |
| Pin 29 | RE0 — PORTE I/O / PPS remappable |
| Pin 30 | RE1 — PORTE I/O / PPS remappable |
| Pin 31 | RE2 — PORTE I/O / PPS remappable |
| Pin 32 | RE3 — PORTE I/O / PPS remappable |
| Pin 33 | VDD — Positive supply (1.8 V to 3.6 V) |
| Pin 34 | AVDD — Analog supply (tie to VDD) |
| Pin 35 | AVSS — Analog ground reference |
| Pin 36 | OSC1/CLKIN — External clock input or crystal connection |
| Pin 37 | OSC2/CLKOUT — External clock output or crystal connection |
| Pin 38 | MCLR — Master clear reset (active low) |
| Pin 39 | VSS — Ground reference |
| Pin 40 | RD0 — PORTD I/O / PPS remappable |
Typical Applications
PIC16LF18876-E/MV is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Industrial Control Nodes, Building Automation & HVAC, Portable Consumer Electronics, Functional-Safety White Goods, Automotive Body & Comfort Modules.
Battery-Powered IoT Sensor Nodes
The PIC16LF18876-E/MV is well matched to battery-powered wireless sensor nodes. Its XLP architecture drops active current to roughly 7 mA at 3.3 V/32 MHz and supports IDLE/DOZE/PMD modes where peripheral clocks are gated to keep consumption below 1 µA. The 28 KB Flash accommodates BLE or LoRaWAN® state machines plus sensor-fusion libraries, while 2 KB RAM buffers sample bursts. PPS allows the EUSART to drive an external radio on any I/O, simplifying PCB layout. With its -40 °C to +125 °C extended temperature grade and 36 I/O, the part handles analog front-ends (10-bit ADC, 5/10-bit DAC, ZCD) for temperature, humidity, and gas sensors alongside the wireless link.
Recommended
Industrial Control Nodes
The PIC16LF18876-E/MV fits industrial control nodes that must combine analog and digital I/O. Its 10-bit ADC with computation, two comparators, and ZCD handle analog inputs such as 4-20 mA loop measurements or AC zero-cross detection, while the CWG (Complementary Waveform Generator) and PWM drive motor-control or power-conversion stages. Functional-safety features (CRC/SCAN, HLT, WWDT) support IEC 60730 class-B requirements. With 36 PPS-routed I/O, the same MCU drives multiple SPI sensors, an RS-485 EUSART link, and discrete outputs, all on a 40-UQFN (MV) 5×5 mm footprint. The -40 °C to +125 °C extended grade supports factory-floor deployment.
Recommended
Building Automation & HVAC
HVAC controllers and building-automation nodes use the PIC16LF18876-E/MV to combine sensor reading, actuator drive, and communications. The 28 KB Flash supports BACnet or Modbus protocol stacks, while 2 KB RAM handles command scheduling. SMT (Signal Measurement Timer) precisely captures pulse widths from flow meters and PIR sensors; the EUSART plus RS-485 transceiver drive industrial bus links. XLP modes let battery-backed thermostats and wireless room sensors run for years on a coin cell. With 36 I/O and PPS remapping, designers can reuse the same PCB layout for 28- and 40-pin package variants of the family.
Recommended
Portable Consumer Electronics
Portable consumer devices such as fitness wearables, e-readers, and wireless remote controls benefit from the PIC16LF18876-E/MV's XLP operation and rich peripherals. The 10-bit ADC and 5/10-bit DAC drive simple audio cues and battery monitoring, while PPS-routed I²C and SPI connect small OLEDs, accelerometers, and capacitive touch sensors. The 1.8-3.6 V supply allows direct connection to single-cell Li-ion or Li-polymer batteries without level shifters. IDLE/DOZE/PMD modes let the device stay in sub-µA sleep while periodically waking to sample and transmit, extending battery life. The 40-UQFN 5×5 mm footprint fits compact wearables.
Recommended
Functional-Safety White Goods
White-goods appliances (washing machines, dishwashers, ovens) require IEC 60730 class-B support, and the PIC16LF18876-E/MV delivers built-in functional-safety peripherals: CRC/SCAN verifies program memory integrity at runtime, HLT enforces firmware execution windows, and the Windowed WDT catches missed or late resets. The 36 I/O pins drive triac-based AC zero-cross (ZCD) heater control, brushless motor PWM/CWG, and user-interface keypads. The 10-bit ADC reads NTC temperature sensors; the EUSART provides a service-port diagnostic interface. With -40 °C to +125 °C operation and 28 KB Flash for safety library + state machine, this MCU replaces external supervisor ICs.
Recommended
Automotive Body & Comfort Modules
Although not AEC-Q100 qualified, the PIC16LF18876-E/MV's extended -40 °C to +125 °C temperature grade and rich peripheral mix serve automotive body & comfort module designs such as interior lighting controllers, seat-control slaves, and door modules. The EUSART, SPI, and I²C connect to CAN/LIN gateways via external transceivers, while the CWG drives LED strings and the PWM modules control DC motors. The 28 KB Flash fits LIN protocol stacks plus lamp-failure diagnostics. PPS allows the same firmware to map peripherals to different pins across vehicle variants, simplifying part-number proliferation.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF18876-E/MV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16LF18875-E/MV | PIC16LF18877-E/MV | PIC16F18876-I/MV | PIC16LF18856-E/MV | PIC16LF18876-E/ML |
|---|---|---|---|---|---|---|
| Package | 40-UQFN (MV) 5x5 mm | 40-UQFN (MV) 5x5 mm - same | 40-UQFN (MV) 5x5 mm - same | 40-UQFN (MV) 5x5 mm - same | 40-UQFN (MV) 5x5 mm - same | 44-QFN (ML) 8x8 mm - different |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 28 KB | 14 KB | 56 KB | 28 KB | 28 KB | 28 KB |
| RAM Size | 2 KB | 1 KB | 4 KB | 2 KB | 2 KB | 2 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Number of I/O | 36 | 36 | 36 | 36 | 28 | 36 |
| Operating Temperature | -40 °C to +125 °C (extended) | -40 °C to +125 °C (extended) | -40 °C to +125 °C (extended) | -40 °C to +85 °C (industrial) | -40 °C to +125 °C (extended) | -40 °C to +125 °C (extended) |
| Maximum Clock Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Functional Safety | CRC/SCAN, HLT, WWDT | CRC/SCAN, HLT, WWDT | CRC/SCAN, HLT, WWDT | CRC/SCAN, HLT, WWDT | CRC/SCAN, HLT, WWDT | CRC/SCAN, HLT, WWDT |
Key Differentiators
- Extended-temperature-grade LF variant with XLP (vs PIC16F18876-I/MV)
- Larger Flash with same 40-UQFN footprint (vs PIC16LF18875-E/MV)
- Right-sized Flash for cost-sensitive designs (vs PIC16LF18877-E/MV)
Design Notes
Always solder the 40-UQFN (MV) exposed thermal pad to a continuous ground copper pour at least 2× the package footprint. This pad provides the primary thermal path and a low-impedance ground reference for analog and digital signals. Use thermal vias (0.3 mm drill, 0.5 mm pitch) to connect the top pad to an inner ground plane, improving heat dissipation in industrial temperature designs.
Place a 0.1 µF ceramic decoupling capacitor as close as possible to each VDD pin, with a bulk 1 µF to 10 µF capacitor on the AVDD rail. Keep AVDD trace length under 5 mm and shield it from switching signals. For battery-powered designs, route the BOR (Brown-Out Reset) and Sleep configuration to maximize XLP savings while maintaining MCU wake reliability.
Do not assume ICSP™ (PGD/PGC) pins RB6/RB7 are free GPIO in your final application - they share programming functionality and must not be permanently driven low during reset. If those pins are wired to external circuitry, add 4.7 kΩ isolation resistors or use PPS to relocate the application peripheral. Failing to do so prevents in-circuit programming and field firmware updates.
When using an external crystal, place the crystal and its load capacitors within 5 mm of the OSC1/OSC2 pins and shield the traces with a ground guard ring. Avoid routing the crystal traces near high-current switching lines. For PPS, group UART, SPI, and I²C signals together on adjacent I/O pins to simplify PCB routing across the 40-UQFN footprint.
The 10-bit ADC reference AVREF+ should be driven from a low-impedance source with its own 10 µF + 0.1 µF decoupling. For ZCD-based AC zero-cross detection, add a 1 MΩ/100 kΩ divider and a 100 pF noise filter; without filtering, false ZCD triggers can disrupt CWG-based triac timing and cause flicker in lighting applications.
Compliance Information
RoHS compliant per distributor listings (Digi-Key, Mouser). Extended temperature grade -40/+125 °C. Not AEC-Q100 qualified - choose AEC-Q100 PIC variants for automotive designs.
