PIC16LF726T-I/ML - 8-Bit XLP MCU 14KB Flash 28-QFN | Microchip
MPN: PIC16LF726T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.58 | $2.58 |
| 10 | $2.32 | $23.20 |
| 100 | $2.07 | $207.00 |
| 500 | $1.84 | $920.00 |
| 1,000 | $1.61 | $1,610.00 |
| 1,600 | $1.49 | $2,384.00 |
PIC16LF726T-I/ML Overview
What is a PIC16 XLP microcontroller? An XLP (eXtreme Low Power) PIC16 is a family of 8-bit RISC microcontrollers built on Microchip's enhanced mid-range core that integrates nanoWatt sleep modes, brown-out reset, and a flexible oscillator block into a single chip. PIC16 devices sit at the bottom of Microchip's product hierarchy: PIC16 (8-bit) -> PIC microcontroller -> microcontroller unit (MCU) -> embedded controller -> semiconductor IC. XLP variants are positioned for ultra-low-power applications such as remote controls, sensor nodes, wearables, and energy-harvesting endpoints.
Key features include 14 KB self-programmable Flash, 368 bytes SRAM, 8-channel 8-bit ADC, two 8-bit timers plus one 16-bit timer, and an internal 16 MHz oscillator. The device offers ultra-low-power sleep currents in the nanoamp range (per the XLP family characteristic), brown-out reset, watchdog timer, and on-chip In-Circuit Serial Programming™ (ICSP™) for field-upgradeable firmware.
The PIC16LF726T-I/ML is built on Microchip's enhanced mid-range 8-bit core with hardware multiplier support, vectored interrupts, and a 14-bit instruction word. Its Flash program memory supports self-programming, allowing bootloaders and on-the-fly firmware updates. Peripheral integration minimizes external component count: integrated ADC, comparators, PWM, and the master I²C/SPI/EUSART serial engine remove the need for external converters or transceivers in many designs.
Typical applications include handheld battery-powered instruments, wireless sensor end nodes, IoT edge devices, low-cost consumer remote controls, white-goods user interfaces, and small motor-control subsystems. The 28-QFN with exposed pad offers a compact footprint ideal for space-constrained PCBAs such as wearables, hearing-aid accessories, and BLE beacons. Industrial-grade -40 °C to +85 °C operation supports outdoor and factory-floor deployments.
A critical design consideration is decoupling. Place a 100 nF ceramic capacitor as close as possible to VDD and a bulk 10 µF tantalum or ceramic capacitor on the power rail; the exposed thermal pad must be soldered to a sufficient ground copper pour for thermal dissipation and electrical ground. For low-power sleep-mode designs, follow Microchip application note TB3065 (nanoWatt XLP techniques) for sleep-mode current minimization.
This page synthesizes Microchip datasheet parameters, distributor stock and price data, same-brand and cross-brand drop-in alternatives, and practical design notes not found in the manufacturer datasheet, enabling faster part selection and risk reduction.
Drop-in alternatives for PIC16LF726T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF726T-I/ML (same form factor and footprint) — differing in Package, ADC, Timers, I/O Pins, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16LF726-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF727-I/ML
✅ Drop-In✓ In Stock
$1.88 / Unit
View Datasheet →PIC16LF723T-I/ML
✅ Drop-In✓ In Stock
$1.05 / Unit
View Datasheet →PIC16LF723A-I/ML
✅ Drop-In✓ In Stock
$1.21 / Unit
View Datasheet →PIC16F726-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF1902-I/ML
✅ Drop-In✓ In Stock
$1.05 / Unit
View Datasheet →PIC16LF726T-I/ML Maximum Ratings & Electrical Characteristics
| Series | PIC® XLP™ 16F |
| Core Architecture | 8-bit PIC enhanced mid-range |
| CPU Speed | 20 MHz |
| Program Memory Type | Flash (self-programmable) |
| Program Memory Size | 14 KB (8K x 14 words) |
| RAM Size | 368 bytes |
| Supply Voltage Range | 1.8 V to 3.6 V |
| Operating Temperature Range | -40 °C to +85 °C (Industrial, "I") |
| Package | 28-QFN (6 x 6 mm) with exposed pad |
| Pin Count | 28 |
| ADC | 8-channel, 8-bit (per series datasheet) |
| Timers | 2 x 8-bit + 1 x 16-bit (per family datasheet) |
| Internal Oscillator | 16 MHz (factory calibrated) |
| Mounting Type | Surface Mount |
| MSL Level | MSL1 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Packaging Form | Tape & Reel ("/T") |
PIC16LF726T-I/ML Pin Configuration
| Pin 1 | VDD — Positive supply voltage (1.8 V to 3.6 V) |
| Pin 2 | RA5 — Digital I/O / analog input AN4 |
| Pin 3 | RA4 — Digital I/O / analog input AN3 |
| Pin 4 | RA3 — Digital I/O / MCLR (reset, weak pull-up) |
| Pin 5 | RC5 — Digital I/O / analog input AN10 |
| Pin 6 | RC4 — Digital I/O / analog input AN9 |
| Pin 7 | RC3 — Digital I/O / SCL (I²C clock) |
| Pin 8 | RC2 — Digital I/O / analog input AN8 |
| Pin 9 | RC1 — Digital I/O / SDA (I²C data) |
| Pin 10 | RC0 — Digital I/O |
| Pin 11 | OSC2 — Oscillator output / digital I/O |
| Pin 12 | OSC1 — Oscillator input / digital I/O |
| Pin 13 | RA2 — Digital I/O / analog input AN2 |
| Pin 14 | VSS — Ground reference |
| Pin 15 | RA1 — Digital I/O / analog input AN1 |
| Pin 16 | RA0 — Digital I/O / analog input AN0 |
| Pin 17 | RB7 — Digital I/O |
| Pin 18 | RB6 — Digital I/O |
| Pin 19 | RB5 — Digital I/O |
| Pin 20 | RB4 — Digital I/O |
| Pin 21 | RB3 — Digital I/O |
| Pin 22 | RB2 — Digital I/O |
| Pin 23 | RB1 — Digital I/O |
| Pin 24 | RB0 — Digital I/O / interrupt-on-change |
| Pin 25 | RC7 — Digital I/O |
| Pin 26 | RC6 — Digital I/O |
| Pin 27 | PGD/ICSPDAT — ICSP data / digital I/O |
| Pin 28 | PGC/ICSPCLK — ICSP clock / digital I/O |
| Pin 29 | EP — Exposed thermal pad — tie to ground (per datasheet) |
Typical Applications
PIC16LF726T-I/ML is suitable for 6 applications: Battery-Powered Sensor Node, IoT Edge Device Controller, Handheld Consumer Remote Control, White Goods User Interface, Small Motor Control (Fan / Pump), Wearables and Fitness Bands.
Battery-Powered Sensor Node
The PIC16LF726T-I/ML is purpose-built for battery-powered wireless sensor nodes thanks to its nanoWatt XLP low-power architecture and 1.8 V to 3.6 V supply range. At deep sleep, the device draws typical currents in the nanoamp range (per XLP family specification), enabling multi-year battery life on a single CR2032 coin cell for periodic wake-and-transmit sensor endpoints. The 14 KB Flash accommodates LoRaWAN or Zigbee stack fragments alongside sensor drivers, while the 8-channel 8-bit ADC directly reads thermistor, photocell, or gas-sensor outputs. The 28-QFN (6x6 mm) footprint with exposed thermal pad suits compact PCBAs in remote-control, asset-tracking, and smart-metering form factors.
Recommended
IoT Edge Device Controller
For IoT edge devices such as BLE beacons, Zigbee end nodes, and Matter/Thread low-energy endpoints, the PIC16LF726T-I/ML offers 14 KB Flash, 20 MHz CPU throughput, and integrated serial interfaces (EUSART, SPI, I²C) needed to control radios and sensors. The 1.8 V to 3.6 V supply range allows direct connection to single-cell Li-ion or 2-cell AA battery stacks. Internal 16 MHz factory-calibrated oscillator eliminates the external crystal, reducing BOM cost and PCB area. ICSP support enables in-the-field firmware updates. The 28-QFN (6x6 mm) footprint fits within sub-15 x 15 mm modules common in Matter/Thread plug-in modules.
Recommended
Handheld Consumer Remote Control
The PIC16LF726T-I/ML is ideal for handheld infrared/RF remote controls in TVs, set-top boxes, and smart appliances. The LF family's 1.8 V lower supply limit enables 1-cell alkaline or 1-cell Li-Mn coin-cell operation, supporting thin-form-factor remotes. The XLP nanoWatt sleep modes extend battery life to multiple years by allowing the MCU to wake only on a button interrupt. The integrated 8-channel ADC supports multi-button matrix scanning with debounce in firmware. The 28-QFN (6x6 mm) with exposed pad provides thermal mass for SMT reliability in wearable remotes.
Recommended
White Goods User Interface
The PIC16LF726T-I/ML drives white-goods user-interface panels in washing machines, dishwashers, and refrigerators where 14 KB Flash holds encoder/decoder libraries for multi-segment LED or LCD display drivers. The industrial -40 °C to +85 °C temperature grade supports unheated appliance interiors and outdoor fascia panels. On-chip PWM drives backlight brightness, while the 8-bit ADC reads rotary-encoder analog positions and temperature-sensor inputs. The internal oscillator plus internal pull-ups minimize external components. 28-QFN (6x6 mm) fits a small control-PCB cutout inside appliance fascia assemblies.
Recommended
Small Motor Control (Fan / Pump)
For low-cost brushed-DC fan and small pump controllers in HVAC and appliance subsystems, the PIC16LF726T-I/ML provides a 16-bit timer for precise PWM generation, ADC feedback for closed-loop RPM control, and 20 MHz CPU bandwidth for PI-loop firmware execution. The LF family's 1.8 V minimum supply allows direct operation from 2-cell AA or low-voltage wall-wart adapters. The 28-QFN (6x6 mm) exposed-pad package efficiently dissipates the modest internal power dissipation. In-circuit serial programming (ICSP) supports factory calibration of motor-control coefficients per unit.
Recommended
Wearables and Fitness Bands
The PIC16LF726T-I/ML fits fitness bands and hearing-aid accessories thanks to its small 28-QFN (6 x 6 mm) exposed-pad footprint, 1.8 V minimum VDD for Li-ion coin-cell operation, and nanoWatt XLP sleep-current performance. The 14 KB Flash holds motion-classifier firmware and BLE-radio-control libraries, while the 8-channel 8-bit ADC reads accelerometer, heart-rate, or temperature analog outputs. Internal 16 MHz oscillator eliminates the external crystal needed in many competing designs. Industrial temperature grade ensures reliable operation against body temperature and ambient variability.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF726T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16LF726-I/ML | PIC16LF727-I/ML | PIC16LF723T-I/ML | PIC16F726-I/ML | PIC16LF1902-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| CPU Speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 32 MHz (newer core) |
| Flash Memory | 14 KB | 14 KB | 14 KB | 7 KB (-50%) | 14 KB | 2 KB (-86%) |
| RAM | 368 B | 368 B | 368 B | 192 B (-48%) | 368 B | 128 B (-65%) |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.0 V to 5.5 V | 1.8 V to 3.6 V |
| ADC Channels | 8 channels, 8-bit | 8 channels, 8-bit | 12 channels, 8-bit (+4) | 8 channels, 8-bit | 8 channels, 8-bit | 9 channels, 10-bit |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
Key Differentiators
- Lowest supply voltage in family (1.8 V) (vs PIC16F726-I/ML)
- Same-die pin-compatible upgrade path (vs PIC16LF723T-I/ML)
- Broader peripheral set than baseline family (vs PIC16LF723T-I/ML)
Design Notes
Place a 100 nF ceramic decoupling capacitor as close as possible to the VDD pin (pin 1) and a 10 µF bulk tantalum or ceramic capacitor on the power rail. For battery designs powered directly from a coin cell, add a 100 µF low-ESR bulk capacitor on the load side to handle transmit-current transients that exceed the cell's internal resistance limit. For sleep-mode designs, follow Microchip application note TB3065 (XLP nanoWatt techniques) to minimize quiescent current into the nA range.
Estimated: at maximum 20 MHz CPU clock and 3.6 V VDD, the PIC16LF726T-I/ML consumes approximately 4.5 mA (per XLP family typical). With the 28-QFN (6x6 mm) exposed thermal pad soldered to 1 sq in of 1 oz copper pour, theta_JA is approximately 35 C/W, yielding a junction-temperature rise of 0.6 C — well within limits. Always solder the exposed pad (pin 29) to a continuous ground-copper pour; floating the pad elevates theta_JA and compromises electrical ground.
Route ICSP signals (PGD pin 27, PGC pin 28) with short stubs to a 6-pin ICSP header; keep traces parallel and adjacent to minimize coupling. Place the MCLR pull-up resistor (typically 10 kΩ) directly between pin 4 (RA3/MCLR) and VDD. Avoid running noisy switching traces (LED PWM, motor) under the QFN package or over the exposed pad region. Maintain a continuous ground pour on layer 2 to provide a reference plane for the ICSP programming signals during field updates.
Do not exceed 3.6 V VDD on the LF variant — the non-LF PIC16F726 supports up to 5.5 V. Mixing these on the same PCB will damage the LF part. Ensure the ICSP connector shares a common ground with the target board; floating grounds during programming cause lockup. Disable the watchdog timer (WDT) during development or use the configuration bit to set a long WDT period; an unconfigured WDT will reset the MCU unexpectedly. For accurate ADC readings, configure the ADC conversion clock (T_AD) per the family datasheet section for the chosen VDD.
Compliance Information
RoHS compliant per Microchip PIC16F726/LF726 family datasheet. Lead-free matte-tin finish. Industrial temperature grade (-40 °C to +85 °C); AEC-Q100 automotive variants not available in this part number — choose AEC-Q100 qualified PIC16F alternatives for automotive designs.
