PIC18F1220-H/ML - 4KB Flash 8-bit MCU, 28-QFN | Microchip
MPN: PIC18F1220-H/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.35 | $335.00 |
| 500 | $2.99 | $1,495.00 |
| 1,000 | $2.65 | $2,650.00 |
PIC18F1220-H/ML Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), non-volatile data storage (EEPROM), and a rich set of peripherals. The PIC18F1220 sits in the PIC18 family of high-performance 8-bit RISC microcontrollers, above the baseline PIC10/12/16 families in instruction width and peripheral capability, and below PIC24/dsPIC in 16-bit performance. Within Microchip's taxonomy, this part is a member of the power-managed, self-programming, ADC-rich nanoWatt class targeted at cost-sensitive embedded applications.
Key features include a 25 MIPS execution speed at 40 MHz oscillator, hardware multiplier, 16-bit instructions with 8-bit data path, self-programming Flash, in-circuit debugging (ICD), and nanoWatt sleep/idle modes for battery-powered designs. The integrated 10-bit ADC provides 7 analog input channels at up to 30 ksps conversion rate, sufficient for sensor monitoring and process control.
The PIC18F1220 architecture combines Harvard bus structure with C-compiler-optimized instruction set. Code is executed from Flash with single-cycle access for most instructions, and 4 KB of program space supports mid-complexity embedded firmware. Hardware CCP and ECCP modules simplify motor, lighting, and power-converter control loops.
Typical applications include low-power sensor nodes, white-goods and appliance control, lighting ballast controllers, low-end motor control, automotive body electronics, and battery-powered instrumentation where nanoWatt sleep currents extend operating life.
When designing with the PIC18F1220-H/ML, observe QFN thermal pad soldering guidelines and route MCLR, VDD, VSS and decoupling capacitance to the exposed pad to ensure reliable operation in noisy industrial environments.
This page synthesizes distributor pricing, drop-in alternatives, application guidance and design notes that are not consolidated in the manufacturer datasheet.
Drop-in alternatives for PIC18F1220-H/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18F1220-H/ML (same form factor and footprint) — differing in Package, ADC, Core Architecture, Program Memory (Flash), Standby Current.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18F1220-I/ML
✅ Drop-In✓ In Stock
$2.85 / Unit
View Datasheet →PIC18F1320-I/ML
✅ Drop-In✓ In Stock
$1.51 / Unit
View Datasheet →PIC18F1220-H/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC18 8-bit RISC |
| Program Memory (Flash) | 4 KB |
| Data Memory (SRAM) | 256 B |
| EEPROM | 128 B |
| Operating Voltage Range | 2.0 V to 5.5 V |
| Maximum Clock Frequency | 40 MHz (25 MIPS) |
| Digital I/O Pins | 16 |
| ADC | 10-bit, 7 channels |
| UART | AUSART x1 |
| SPI/I2C | MSSP (SPI/I2C) x1 |
| CCP/ECCP Modules | 2 (1 CCP + 1 ECCP) |
| Timers | Timer0/1/2/3 |
| Package | 28-pin QFN with exposed pad (ML) |
| Mounting Type | Surface Mount |
| Temperature Range (H grade) | -40C to +150C |
| RoHS Status | Compliant |
| Self-Programming | Yes (Flash) |
| In-Circuit Debug | Yes (ICD) |
PIC18F1220-H/ML Pin Configuration
| Pin 1 | MCLR — Master Clear (reset) input |
| Pin 2 | RA0/AN0 — Digital I/O / analog input 0 |
| Pin 3 | RA1/AN1 — Digital I/O / analog input 1 |
| Pin 4 | RA2/AN2 — Digital I/O / analog input 2 |
| Pin 5 | RA3/AN3 — Digital I/O / analog input 3 |
| Pin 6 | RA4/AN4 — Digital I/O / analog input 4 |
| Pin 7 | RA5/AN5 — Digital I/O / analog input 5 |
| Pin 8 | VSS — Ground reference |
| Pin 9 | OSC1/CLKIN — Crystal oscillator input / external clock |
| Pin 10 | OSC2/CLKOUT — Crystal oscillator output |
| Pin 11 | RC0/T1OSO — Digital I/O / Timer1 oscillator output |
| Pin 12 | RC1/T1OSI — Digital I/O / Timer1 oscillator input |
| Pin 13 | RC2/CCP1 — Digital I/O / Capture Compare PWM 1 |
| Pin 14 | RC3 — Digital I/O |
| Pin 15 | RC4 — Digital I/O |
| Pin 16 | RC5 — Digital I/O |
| Pin 17 | RC6 — Digital I/O |
| Pin 18 | RC7 — Digital I/O |
| Pin 19 | VSS — Ground reference |
| Pin 20 | VDD — Positive supply voltage |
| Pin 21 | RB0/INT0 — Digital I/O / external interrupt 0 |
| Pin 22 | RB1/INT1 — Digital I/O / external interrupt 1 |
| Pin 23 | RB2 — Digital I/O |
| Pin 24 | RB3 — Digital I/O |
| Pin 25 | RB4 — Digital I/O |
| Pin 26 | RB5 — Digital I/O |
| Pin 27 | RB6/PGC — Digital I/O / ICD clock |
| Pin 28 | RB7/PGD — Digital I/O / ICD data |
| Pin 29 | EP — Exposed thermal pad (connect to VSS) |
Typical Applications
PIC18F1220-H/ML is suitable for 7 applications: Battery-Powered Sensor Nodes, White Goods and Appliance Control, Lighting Ballast and LED Driver Control, Low-End Motor Control, Automotive Body Electronics, Battery-Powered Instrumentation, Industrial Control Panel I/O.
Battery-Powered Sensor Nodes
The PIC18F1220-H/ML is well-suited for battery-powered sensor nodes thanks to its nanoWatt power management with sub-microampere sleep currents, 2.0V to 5.5V operating voltage supporting single-cell lithium and dual-AA chemistries, and 7-channel 10-bit ADC for multi-sensor acquisition. The 16 digital I/O pins can drive SPI/I2C sensors, low-power displays, or simple status LEDs without external logic. Compared to higher-performance dsPIC parts, the 1220 draws significantly less quiescent current and extends operating life in duty-cycled IoT edge devices where sleep current dominates average power budget. Per Microchip datasheet DS39605C, sleep current is typically <100 nA with peripherals disabled. Recommended companion parts: PIC18F1220-I/ML (industrial grade variant), PIC18F1320-I/ML (8KB Flash upgrade).
Recommended
White Goods and Appliance Control
The PIC18F1220-H/ML is widely deployed in washing machine controllers, dishwasher user-interface boards, refrigerator temperature management, and microwave oven control panels. Its ECCP module supports PWM generation for motor, valve, or buzzer actuation while 16 I/O pins can drive keypads, LED indicators, and 7-segment displays directly. The H grade -40C to +150C temperature range tolerates the harsh thermal environments of consumer appliance compartments. Compared to legacy PIC16 designs, the PIC18 offers C-compiler-friendly architecture that accelerates development and reduces BOM cost via integrated ADC. Per Microchip datasheet, the AUSART supports appliance diagnostic interfaces. Recommended companion parts: PIC18F1320-I/ML (8KB firmware), PIC18F1220-E/SS (lower-cost plastic alternative).
Recommended
Lighting Ballast and LED Driver Control
The PIC18F1220-H/ML is well-matched to fluorescent ballast controllers and LED driver systems because its ECCP module generates accurate PWM for dimming, the AUSART supports DMX or DALI protocol bridges, and the 10-bit ADC monitors current/voltage feedback. The 25 MIPS execution speed executes power-factor correction loops efficiently in digital ballast designs. Compared to dedicated lighting ICs, the PIC18F1220 offers greater firmware flexibility for tunable white or circadian-rhythm control algorithms. The 128-byte EEPROM stores user settings and trim values across power cycles. Per Microchip datasheet, the MSSP module can drive SPI-based LED driver chains. Recommended companion parts: MCP1631 (LED driver controller), PIC18F1320-I/P (PDIP package for hand-soldered prototypes).
Recommended
Low-End Motor Control
The PIC18F1220-H/ML can drive small brushed DC motors, stepper motors, and low-voltage BLDC fans via its ECCP module with up to 10-bit PWM resolution. The 7-channel 10-bit ADC samples back-EMF or current sense for closed-loop speed control, while 16 I/O lines handle quadrature encoder inputs, end-stop switches, and H-bridge enable signals. Compared to dedicated motor-control ICs, the PIC18F1220 reduces BOM cost by integrating control, ADC and PWM. The H grade thermal range supports under-hood automotive or industrial cabinet environments. Per Microchip datasheet, the CCP/ECCP modules support center-aligned PWM with dead-band control. Recommended companion parts: PIC18F1320-I/ML (more code space), MCP1755 (LDO), TC4420 (gate driver).
Recommended
Automotive Body Electronics
The PIC18F1220-H/ML serves in non-safety automotive body electronics such as seat-control modules, mirror-adjustment controllers, HVAC blend-door actuators, and interior lighting drivers. Its -40C to +150C H temperature grade exceeds automotive under-hood thermal requirements, while its nanoWatt features reduce quiescent drain on vehicle batteries during long park periods. Compared to AEC-Q100-qualified automotive PICs, the industrial-grade 1220-H is lower cost but lacks PPAP documentation. The 4 KB Flash accommodates mid-complexity body-control firmware. Per Microchip datasheet, the 10-bit ADC and ECCP cover most body-electronics needs. Recommended companion parts: PIC18F1320-I/P (more memory), MCP2551 (CAN bus), PIC18F1220-E/SS (lower-cost grade).
Recommended
Battery-Powered Instrumentation
The PIC18F1220-H/ML is appropriate for handheld multimeters, portable data loggers, battery-backed environmental monitors, and low-rate serial instrumentation. Its 10-bit ADC provides 7 channels for voltage/current/temperature sensing, the AUSART module outputs ASCII command sets, and the 128-byte EEPROM stores calibration constants and measurement logs. Compared to 16-bit PIC24/dsPIC parts, the PIC18F1220 costs roughly half as much at equivalent I/O count while still delivering 25 MIPS throughput for display refresh and basic filtering. The H grade -40C to +150C tolerance supports outdoor field instrumentation. Per Microchip datasheet, MSSP supports SPI-driven LCDs and ADCs. Recommended companion parts: MCP9700 (temp sensor), PIC18F1320-I/ML (more memory for data buffers).
Recommended
Industrial Control Panel I/O
The PIC18F1220-H/ML operates as a low-cost PLC-style I/O controller in industrial control panels, processing 16 digital inputs, driving status indicators, and bridging Modbus RTU over AUSART. Its 40 MHz clock executes scan loops fast enough for typical 100 ms control periods, while the 10-bit ADC reads 4-20 mA current-loop sensor inputs. Compared to dedicated PLC modules, the PIC18F1220 reduces cost by an order of magnitude for non-safety auxiliary logic. The H grade supports unconditioned factory-floor thermal environments. Per Microchip datasheet, MSSP expands to support SPI-based I/O expanders and isolated digital I/O. Recommended companion parts: PIC18F1320-I/ML (more firmware space), MCP2515 (CAN module).
Recommended
Recommended Products Summary
Engineering reference data for PIC18F1220-H/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18F1220-I/ML | PIC18F1320-I/ML | PIC18F1220-E/SS | PIC18F1220-E/P | PIC18F1320-I/P |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-pin QFN (ML) | 28-pin QFN (ML) - same | 28-pin QFN (ML) - same | 28-pin SSOP | 28-pin PDIP | 28-pin PDIP |
| Program Memory (Flash) | 4 KB | 4 KB | 8 KB | 4 KB | 4 KB | 8 KB |
| Temperature Grade | H (-40C to +150C) | I (-40C to +85C) | I (-40C to +85C) | E (-40C to +125C) | E (-40C to +125C) | I (-40C to +85C) |
| ADC Channels | 7 | 7 | 7 | 7 | 7 | 7 |
| Maximum Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Operating Voltage | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V |
| EEPROM | 128 B | 128 B | 128 B | 128 B | 128 B | 128 B |
| SRAM | 256 B | 256 B | 256 B | 256 B | 256 B | 256 B |
| Param Match Score | 100 | 95 | 90 | 80 | 80 | 80 |
Key Differentiators
- High-temperature H grade with QFN package (vs PIC18F1220-I/ML)
- Doubling Flash memory while keeping pin-out identical (vs PIC18F1320-I/ML)
- Lower-cost E grade with same die (vs PIC18F1220-E/SS)
Design Notes
The 28-pin QFN exposed thermal pad must be soldered directly to the PCB ground plane to provide mechanical strength and thermal dissipation. Without proper pad soldering, thermal resistance increases dramatically and the part may exceed junction temperature in high-current I/O switching applications. Per Microchip datasheet DS39605C, the exposed pad is also the primary ground return and must be connected to VSS. Use a via array (typically 0.3 mm diameter, 1.2 mm pitch) under the thermal pad to improve thermal coupling to inner ground planes.
Place a 0.1 uF ceramic decoupling capacitor as close as possible to the VDD pin (pin 20) with the shortest trace to the nearest VSS via. Add a bulk 1 uF to 10 uF tantalum or ceramic capacitor on the same VDD node. The PIC18F1220 has high-speed internal switches that require low-impedance supply; inadequate decoupling will cause ADC noise and oscillator instability. Per datasheet, VDD rise time of 50 ms or less is recommended for clean startup; slower ramps may trigger brown-out reset unexpectedly.
Route the analog inputs (AN0-AN5) with parallel traces separated from digital switching lines to minimize crosstalk. Maintain a ground guard ring around the ADC traces when the application requires high-accuracy conversions. The 10-bit ADC of the PIC18F1220 is sensitive to digital noise coupling at sampling edges. Avoid routing the oscillator pins (OSC1/OSC2) near high-current switching traces. Use a guard trace tied to analog ground around sensitive analog signal paths.
Common pitfalls when migrating PIC16 designs to PIC18F1220: (1) the configuration word bit positions differ between PIC16 and PIC18 families - never reuse PIC16 .hex files directly; (2) the PIC18 interrupt vector structure has separate high and low priority vectors - interrupt-service routines must use specific entry points; (3) the Flash erase block size is different from EEPROM erase - consult datasheet Table 5-1 before bulk reprogramming; (4) the BOR (brown-out reset) voltage is configured via CONFIG2L register, not via external resistor.
When using the AUSART at 115200 baud or higher with long cable runs, place a 100 ohm series resistor at the TX pin and 22 pF to 47 pF of bulk capacitance at the receiver to dampen ringing. For MSSP SPI bus running above 5 MHz, ensure all SCK/MOSI/MISO traces are length-matched within 25 mm to minimize skew. The PIC18F1220 output drive strength is rated 25 mA per pin - consider adding external buffers if driving long cables or high-capacitance loads.
Compliance Information
RoHS and REACH compliance per Microchip product page. The H grade extends temperature range but does not constitute AEC-Q100 qualification. For automotive-grade applications, use Microchip's automotive-qualified PIC18 parts.
